TWI607198B - Three-dimensional measuring device - Google Patents

Three-dimensional measuring device Download PDF

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Publication number
TWI607198B
TWI607198B TW105107856A TW105107856A TWI607198B TW I607198 B TWI607198 B TW I607198B TW 105107856 A TW105107856 A TW 105107856A TW 105107856 A TW105107856 A TW 105107856A TW I607198 B TWI607198 B TW I607198B
Authority
TW
Taiwan
Prior art keywords
measurement
images
phase
types
predetermined
Prior art date
Application number
TW105107856A
Other languages
English (en)
Chinese (zh)
Other versions
TW201713919A (zh
Inventor
Akihiro Imaeda
Tsuyoshi Ohyama
Norihiko Sakaida
Original Assignee
Ckd Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ckd Corp filed Critical Ckd Corp
Publication of TW201713919A publication Critical patent/TW201713919A/zh
Application granted granted Critical
Publication of TWI607198B publication Critical patent/TWI607198B/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW105107856A 2015-10-05 2016-03-15 Three-dimensional measuring device TWI607198B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015197516A JP6027204B1 (ja) 2015-10-05 2015-10-05 三次元計測装置

Publications (2)

Publication Number Publication Date
TW201713919A TW201713919A (zh) 2017-04-16
TWI607198B true TWI607198B (zh) 2017-12-01

Family

ID=57326555

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105107856A TWI607198B (zh) 2015-10-05 2016-03-15 Three-dimensional measuring device

Country Status (4)

Country Link
JP (1) JP6027204B1 (ja)
CN (1) CN107532889B (ja)
TW (1) TWI607198B (ja)
WO (1) WO2017061131A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7000380B2 (ja) * 2019-05-29 2022-01-19 Ckd株式会社 三次元計測装置及び三次元計測方法
JP2021060326A (ja) * 2019-10-09 2021-04-15 興和株式会社 表面検査装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5450204A (en) * 1992-03-30 1995-09-12 Sharp Kabushiki Kaisha Inspecting device for inspecting printed state of cream solder
US7525669B1 (en) * 2004-07-09 2009-04-28 Mohsen Abdollahi High-speed, scanning phase-shifting profilometry using 2D CMOS sensor
JP2010281665A (ja) * 2009-06-04 2010-12-16 Yamaha Motor Co Ltd 位相シフト画像撮像装置、部品移載装置および位相シフト画像撮像方法
JP2014055815A (ja) * 2012-09-11 2014-03-27 Keyence Corp 形状測定装置、形状測定方法および形状測定プログラム

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2528791A1 (en) * 2005-12-01 2007-06-01 Peirong Jia Full-field three-dimensional measurement method
CN100567884C (zh) * 2008-05-06 2009-12-09 哈尔滨工业大学 基于移相干涉的二次共焦测量方法与装置
JP2010164424A (ja) * 2009-01-15 2010-07-29 Kurabo Ind Ltd 非接触形状計測装置及び非接触形状計測方法
DE102010064593A1 (de) * 2009-05-21 2015-07-30 Koh Young Technology Inc. Formmessgerät und -verfahren
JP5443303B2 (ja) * 2010-09-03 2014-03-19 株式会社サキコーポレーション 外観検査装置及び外観検査方法
JP5643241B2 (ja) * 2012-02-14 2014-12-17 Ckd株式会社 三次元計測装置
EP2869023B1 (en) * 2013-10-30 2018-06-13 Canon Kabushiki Kaisha Image processing apparatus, image processing method and corresponding computer program

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5450204A (en) * 1992-03-30 1995-09-12 Sharp Kabushiki Kaisha Inspecting device for inspecting printed state of cream solder
US7525669B1 (en) * 2004-07-09 2009-04-28 Mohsen Abdollahi High-speed, scanning phase-shifting profilometry using 2D CMOS sensor
JP2010281665A (ja) * 2009-06-04 2010-12-16 Yamaha Motor Co Ltd 位相シフト画像撮像装置、部品移載装置および位相シフト画像撮像方法
JP2014055815A (ja) * 2012-09-11 2014-03-27 Keyence Corp 形状測定装置、形状測定方法および形状測定プログラム

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Tak-Wai Hui, Grantham Kwok-Hung Pang, "3-D Measurement of Solder Paste Using Two-Step Phase Shift Profilometry", IEEE Transactions on Electronics Packaging Manufacturing, Vol. 31, No. 4, October 2008 *

Also Published As

Publication number Publication date
CN107532889B (zh) 2020-01-24
JP6027204B1 (ja) 2016-11-16
TW201713919A (zh) 2017-04-16
WO2017061131A1 (ja) 2017-04-13
JP2017072385A (ja) 2017-04-13
CN107532889A (zh) 2018-01-02

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