TWI605734B - Differential signal transmitting circuit board - Google Patents

Description

Differential signal transmission board

The present invention relates to a signal transmission circuit board, and more particularly to a differential signal transmission circuit board for transmitting a differential signal.

In the design of the circuit, electrical signals can be transmitted by a single line. However, this electrical signal may be affected by an external electric or magnetic field, resulting in signal distortion. Therefore, a transmission method using a double conductive line to transmit a differential signal has been developed. When the differential signal is to be transferred from one circuit layer to another, the conductive element is usually used to electrically connect the two layers of the circuit.

However, since the wiring layout space of the circuit on the substrate is usually limited, the selection of the implementable size of the conductive element is also limited. As a result, the equivalent characteristic impedance of the conductive element will not match the equivalent characteristic impedance of the conductive line. Since the equivalent characteristic impedance of the conductive line and the conductive element are different, when the differential signal travels from the circuit layer to the conductive element, or when the conductive element passes through the circuit layer, signal reflection occurs, which causes signal transmission distortion and attenuation. Especially when the differential signal is a high-speed signal, the occurrence of signal distortion and attenuation will be more serious. In today's demand, when the amount of signals to be transmitted is getting larger and larger, reducing the amount of signal reflection during the signal transmission process will be a problem that must be solved.

The invention provides a differential signal transmission circuit board, so that the equivalent characteristic impedance of the conductive element is matched to a specific value, thereby reducing the signal distortion and attenuation problem.

One embodiment of the present invention provides a differential signal transmission circuit board including a substrate, at least two conductive elements, and at least one insulating element. The conductive element is disposed within the substrate. The insulating member is disposed within the substrate and adjacent to or in contact with the conductive member. The material of the substrate has a first equivalent dielectric constant. The material of the insulating member has a second equivalent dielectric constant. The first equivalent dielectric coefficient is different from the second equivalent dielectric coefficient

The differential signal transmission circuit board according to an embodiment of the present invention can appropriately adjust the design value of the equivalent characteristic impedance of the conductive element by providing a structural arrangement in which the insulating element is adjacent to or in contact with the conductive element, so as to make the conductive The equivalent characteristic impedance of the component can be matched to a specific value. Therefore, the reflection phenomenon of the differential signal transmitted to the conductive element can be reduced, and the differential signal transmission distortion and attenuation problem can be alleviated, so that it can be applied to the transmission of the high-speed or high-frequency differential signal.

The above description of the present invention and the following description of the embodiments of the present invention are intended to illustrate and explain the spirit and principles of the invention.

The detailed features and advantages of the embodiments of the present invention are set forth in the Detailed Description of the Detailed Description. The objects and advantages of the present invention can be readily understood by those of ordinary skill in the art in the <RTIgt; The following examples are intended to describe the present invention in further detail, but are not intended to limit the scope of the invention.

In the so-called schematic diagrams of the present specification, the dimensions, ratios, angles, and the like may be exaggerated, but are not intended to limit the present invention. Various changes can be made without departing from the gist of the invention. The words and the like in the drawings are used for convenience of description and are not intended to limit the invention. "Substantially" as used in the specification may mean a deviation caused by tolerances at the time of manufacture.

1 and FIG. 2, FIG. 1 is a schematic top plan view of a differential signal transmission circuit board 10 according to an embodiment of the present invention, and FIG. 2 is a side cross-sectional view of the differential signal transmission circuit board 10 of FIG. . In this embodiment, the differential signal transmission circuit board 10 includes a substrate 11 , two first conductive lines 121 , two second conductive lines 122 , two conductive elements 13 , an insulating element 14 , and two first conductive pads 151 . Two second conductive pads 152.

The material of the substrate 11 has a first equivalent dielectric constant. In this embodiment, the substrate 11 can be a single-layer substrate, and the first equivalent dielectric constant is the same as the dielectric constant of the material of the single-layer substrate, but is not limited thereto. In other embodiments, the substrate 11 can also be a composite substrate of a multilayer material. At this time, the first equivalent dielectric constant is a result of calculating the equivalent dielectric constant of the multilayer material in the composite substrate according to its weight.

The second conductive lines 121 are disposed on the first surface 11 a of the substrate 11 and extend in the horizontal direction of the substrate 11 . The second conductive lines 122 are disposed on the second surface 11b of the substrate 11 and extend in the horizontal direction of the substrate 11. The horizontal direction here may be substantially parallel to the direction on the XY plane in the figure. The first conductive line 121 and the second conductive line 122 are used to transmit a differential signal.

The two conductive elements 13 are disposed within the substrate 11 and extend in the vertical direction of the substrate 11. The vertical direction here may be substantially parallel to the direction of the Z axis in the figure. The first conductive pads 151 are electrically connected to the upper ends of the two conductive elements 13, respectively. The two first conductive lines 121 are electrically connected to the two first conductive pads 151, respectively. The second conductive pads 152 are electrically connected to the lower ends of the two conductive elements 13, respectively. The second conductive lines 122 are electrically connected to the second conductive pads 152, respectively. The outer diameters of the first conductive pad 151 and the second conductive pad may be larger than the outer diameter of the conductive element 13. The conductive element 13 can be a columnar solid conductor, but is not limited thereto. The conductive element 13 may also be a columnar hollow conductor, or the conductive element 13 may also include a columnar hollow conductor and a hole-filling body filled in the hollow conductor. The material of the hole-filling body may be a colloid, an insulating material or a conductive material.

The insulating member 14 is disposed within the substrate 11 and between the two conductive members 13. In other words, the insulating member 14 may be located inside the two conductive members 13 from the viewpoint of relative position. The material of the insulating component 14 has a second equivalent dielectric constant, and the second equivalent dielectric constant is different from the first equivalent dielectric constant of the material of the substrate 11. The second equivalent dielectric constant may be from 1 to 50. In this embodiment, the insulating member 14 may be filled with a single dielectric material, but is not limited thereto. In other embodiments, the insulating member 14 can also be filled with a variety of dielectric materials. The insulating element 14 can be in contact with the two conductive elements 13. In this embodiment, the material of the insulating member 14 may be solid, but not limited thereto. In other embodiments, the insulating element 14 can also be filled with a fluid, wherein the fluid can be ambient air.

Please refer to FIG. 3 , which is a schematic diagram showing the equivalent characteristic impedance of the differential signal transmission circuit board 10 of FIG. 1 . The figure shows the simulation result of the equivalent characteristic impedance encountered by the differential signal when the differential signal is input from one end of the first conductive line 121 of the differential signal transmission circuit board 10. The area R1 in the figure represents the equivalent characteristic impedance encountered when the differential signal passes through the first conductive line 121, the area R2 represents the equivalent characteristic impedance encountered when the differential signal passes through the conductive element 13, and the area R3 represents the differential signal. The equivalent characteristic impedance encountered when passing through the second conductive line 122.

As shown in FIG. 3, it is assumed that the first equivalent dielectric constant of the material of the substrate 11 is 3.4, and when the second equivalent dielectric constant of the material of the insulating member 14 is 1, the simulation result is indicated by a thin solid line. When the second equivalent dielectric constant of the material of the insulating member 14 is 3.4, the simulation result is indicated by a thick solid line. When the second equivalent dielectric constant of the material of the insulating member 14 is 15, the simulation result is indicated by a broken line. Therefore, as can be seen from FIG. 3, when the second equivalent dielectric constant of the material of the insulating member 14 is smaller than the first equivalent dielectric constant of the material of the substrate 11, the equivalent characteristic impedance of the conductive member 13 can be increased. On the contrary, when the second equivalent dielectric constant of the material of the insulating member 14 is greater than the first equivalent dielectric constant of the material of the substrate 11, the equivalent characteristic impedance of the conductive member 13 can be lowered.

In general, in the case where no insulating element is provided, the greater the distance between the two conductive elements, the greater the equivalent characteristic impedance of the conductive element, and the smaller the distance between the two conductive elements, the equivalent characteristic impedance of the conductive element. The smaller. Therefore, when designing the differential signal transmission circuit board, if the equivalent characteristic impedance of the conductive component is too large if the insulating component is not provided, the material can be set as shown in FIG. 1 and FIG. 2 to have a larger second equivalent. The insulating element 14 of the electrical coefficient reduces the equivalent characteristic impedance of the conductive element 13. On the contrary, when designing the differential signal transmission circuit board, if the equivalent characteristic impedance of the conductive element is too small if the insulating element is not provided, the material can be set as shown in FIG. 1 and FIG. 2 to have a smaller second equivalent medium. The insulating element 14 of electrical coefficient increases the equivalent characteristic impedance of the conductive element 13. Thereby, the equivalent characteristic impedance of the conductive element 13 can be matched to the equivalent characteristic impedance of the first conductive line 121 and the second conductive line 122. In FIG. 3, if the second equivalent dielectric constant of the material of the insulating member 14 is 6-7, the equivalent characteristic impedance of the conductive member 13 may be about 100 ohms.

Referring to FIG. 4 and FIG. 5, FIG. 4 is a side cross-sectional view showing a semi-finished product of the differential signal transmission circuit board 20 according to another embodiment of the present invention, and FIG. 5 is a diagram showing the differential signal transmission circuit board 20 of FIG. A side view of the cross section. The differential signal transmission circuit board 20 in this embodiment is similar to the differential signal transmission circuit board 10 shown in FIG. The difference between the two is as follows. The differential signal transmission circuit board 20 further includes a first conductive layer 261 and a second conductive layer 262. The first conductive layer 261 and the second conductive layer 262 are disposed within the substrate 21 . The first conductive layer 261 is substantially parallel to the first conductive line 221, and the second conductive layer 262 is substantially parallel to the first conductive layer 261. The second conductive lines 221 may also be disposed within the substrate 21. The conductive element 23 penetrates through the first conductive layer 261 and the second conductive layer 262. The conductive element 23 and the first conductive layer 261 may be electrically insulated from each other via the substrate 21. The conductive element 23 and the second conductive layer 262 may be electrically insulated from each other via the substrate 21. One of the first conductive layer 261 and the second conductive layer 262 may be grounded, and the other may be electrically connected to a power source. Alternatively, the first conductive layer 261 and the second conductive layer 262 can be grounded. In other embodiments, the first conductive layer 261 located at the center of the substrate 21 may be disposed, and the second conductive layer 262 may be omitted.

In addition, in this embodiment, the conductive element 23 of the differential signal transmission circuit board 20 may be a columnar hollow conductor, but is not limited thereto. The conductive element 23 may also include a columnar hollow conductor and a hole-filling body filled in the hollow conductor. The material of the hole-filling body may be a colloid, an insulating material or a conductive material. The conductive element 13 may also be a cylindrical solid conductor.

In this embodiment, the substrate 21 of the differential signal transmission circuit board 20 can be a composite substrate of a multi-layer material, and the materials of the layers can be different from each other according to requirements. As shown in FIG. 4, the volatile material 240 may be first disposed at a predetermined position of the insulating member 24 in FIG. The volatile material 240 penetrates the first conductive layer 261 and the second conductive layer 262. The substrate 21 has at least one opening 211. The opening 211 communicates from the first surface 21a of the substrate 21 to the volatile material 240. After forming the opening 211, the manufacturer can heat the differential signal transmission circuit board 20 by 250 degrees Celsius to 280 degrees Celsius. The volatile material 240 of FIG. 4 can now exit the differential signal transmission circuit board 20 along the opening 211, while other fluids can be filled into the position occupied by the original volatile material 240 via the opening 211. Thus, the differential signal transmission circuit board 20 can be as shown in FIG. 5, and the insulating member 24 can be filled with a fluid, wherein the fluid can be ambient air. If the differential signal transmission circuit board 20 is in a vacuum environment, the second equivalent dielectric constant of the material of the insulating member 24 may be one.

Referring to FIG. 6, a side cross-sectional view of a differential signal transmission circuit board 20a according to another embodiment of the present invention is shown. The differential signal transmission circuit board 20a in this embodiment is similar to the differential signal transmission circuit board 10 shown in FIG. 2, and is similar to the differential signal transmission circuit board 20 shown in FIG. The differential signal transmission circuit board 20a of the present embodiment may further include a first conductive layer 261 and a second conductive layer 262 disposed within the substrate 21 and substantially parallel to the first conductive line 221 . The conductive element 23 can penetrate the substrate 21 from the first surface 21a to the second surface 21b, and the insulating element 24a can be buried within the substrate 21.

Please refer to FIG. 7 and FIG. 8. FIG. 7 is a schematic top view of the differential signal transmission circuit board 30 according to another embodiment of the present invention, and FIG. 8 is a side cross-sectional view of the differential signal transmission circuit board 30 of FIG. schematic diagram. The differential signal transmission circuit board 30 in this embodiment is similar to the differential signal transmission circuit board 10 shown in FIGS. 1 and 2. The difference between the two is that the number of insulating elements 34 of the differential signal transmission circuit board 30 is two. The two insulating elements 34 are located between the two conductive elements 33. In other words, the two insulating members 34 may be located inside the two conductive members 33 from the viewpoint of relative position. Each of the insulating elements 34 can be in contact with each of the conductive elements 33.

9 and FIG. 10, FIG. 9 is a top plan view of a differential signal transmission circuit board 40 according to another embodiment of the present invention, and FIG. 10 is a side cross-sectional view of the differential signal transmission circuit board 40 of FIG. schematic diagram. The differential signal transmission circuit board 40 in this embodiment is similar to the differential signal transmission circuit board 10 shown in FIGS. 1 and 2. The difference between the two is that the number of insulating elements 44 of the differential signal transmission circuit board 40 is two. Two conductive elements 43 are located between the two insulating elements 44. In other words, the two insulating members 44 may be located on the outer side of the two conductive members 43 from the viewpoint of relative position. Each of the insulating elements 44 can be in contact with each of the conductive elements 43.

Referring to FIG. 11 and FIG. 12, FIG. 11 is a top plan view of a differential signal transmission circuit board 50 according to another embodiment of the present invention, and FIG. 12 is a side elevational view of the differential signal transmission circuit board 50 of FIG. schematic diagram. The differential signal transmission circuit board 50 in this embodiment is similar to the differential signal transmission circuit board 10 shown in FIGS. 1 and 2. The difference between the two is that the differential signal transmission circuit board 50 includes two first insulating members 541 and two second insulating members 542. The two first insulating members 541 are located between the two conductive members 53. The two conductive elements 53 are located between the two second insulating elements 542. In other words, from the viewpoint of relative position, the two first insulating members 541 may be located inside the two conductive members 53, and the second insulating members 542 may be located outside the two conductive members 53. Each of the first insulating elements 541 and each of the second insulating elements 542 can be in contact with each of the conductive elements 53.

13 and FIG. 14, FIG. 13 is a top plan view of a differential signal transmission circuit board 60 according to another embodiment of the present invention, and FIG. 14 is a side cross-sectional view of the differential signal transmission circuit board 60 of FIG. schematic diagram. The differential signal transmission circuit board 60 in this embodiment is similar to the differential signal transmission circuit board 10 shown in FIGS. 1 and 2. The difference between the two is that the insulating member 64 of the differential signal transmission circuit board 60 can be adjacent to the two conductive members 63 without being in contact with the conductive member 63. For example, the distance D between the outer surface of the sidewall of the insulating member 64 and the outer surface of the sidewall of the two conductive members 63 is greater than zero and smaller than the outer diameter of each of the conductive members 63. Even in the configuration of the present embodiment, the same effects as the differential signal transmission circuit board 10 shown in FIGS. 1 and 2 can be achieved.

Similarly, in the differential signal transmission circuit board 20 shown in FIG. 5, the insulating member 24 is in contact with the conductive member 23, but is not limited thereto. In other embodiments, the insulating member 24 may also be adjacent to the conductive member 23 without contact. Even in such a configuration, the same effect as the differential signal transmission circuit board 20 shown in Fig. 5 can be achieved.

In the differential signal transmission circuit board 20a shown in FIG. 6, the insulating member 24a is in contact with the conductive member 23, but is not limited thereto. In other embodiments, the insulating member 24a may also be adjacent to the conductive member 23 without contact. Even in such a configuration, the same effect as the differential signal transmission circuit board 20a shown in Fig. 6 can be achieved.

In the differential signal transmission circuit board 30 shown in FIG. 7 and FIG. 8, each of the insulating elements 34 is in contact with each of the conductive elements 33, but is not limited thereto. In other embodiments, each of the insulating elements 34 may also be adjacent to each of the conductive elements 33 without contact. Even in such a configuration, the same effects as the differential signal transmission circuit board 30 shown in Figs. 7 and 8 can be achieved.

In the differential signal transmission circuit board 40 shown in FIG. 9 and FIG. 10, each of the insulating elements 44 is in contact with each of the conductive elements 43, but is not limited thereto. In other embodiments, each of the insulating elements 44 may also be adjacent to each of the conductive elements 43 without contact. Even in such a configuration, the same effects as the differential signal transmission circuit board 40 shown in Figs. 9 and 10 can be achieved.

In the differential signal transmission circuit board 50 shown in FIG. 11 and FIG. 12, each of the first insulating elements 541 and the second insulating elements 542 are in contact with each of the conductive elements 53, but are not limited thereto. In other embodiments, each of the first insulating elements 541 and each of the second insulating elements 542 may also be adjacent to each of the conductive elements 53 without contacting. Even in such a configuration, the same effects as the differential signal transmission circuit board 50 shown in FIGS. 11 and 12 can be achieved.

Referring to FIG. 15, a side cross-sectional view of a differential signal transmission circuit board 70 in accordance with another embodiment of the present invention is shown. The differential signal transmission circuit board 70 in this embodiment is similar to the differential signal transmission circuit board 20a shown in FIG. The difference between the two is as follows. The differential signal transmission circuit board 70 of the present embodiment may further include a first conductive layer 761 and a second conductive layer 762 disposed within the substrate 71 and substantially parallel to the first conductive line 721. The substrate 71 is a composite substrate including the first layer body 711, the second layer body 712, and the third layer body 713. The conductive element 73 and the insulating element 74 may penetrate the first layer body 711. The second layer body 712 and the third layer body 713 can cover the conductive element 73 and the insulating element 74, so that the conductive element 73 and the insulating element 74 can be buried within the substrate 71. A conductive wiring layer 77 may be further disposed on the surface of the second layer body 712 and the surface of the third layer body 713.

In addition, in the embodiment, the conductive element 73 of the differential signal transmission circuit board 70 may include a columnar hollow conductor 730 and a hole-filling body 731 filled in the hollow conductor 730. The material of the hole-filling body 731 may be a gel, an insulating material or a conductive material. The conductive element 73 is not limited thereto. Conductive element 73 can also be a cylindrical solid conductor.

Referring to FIG. 16, a side cross-sectional view of a differential signal transmission circuit board 80 in accordance with another embodiment of the present invention is shown. The differential signal transmission circuit board 80 in this embodiment is similar to the differential signal transmission circuit board 10 shown in FIG. The difference between the two is as follows. The conductive element 83 of the differential signal transmission circuit board 80 of the present embodiment is a columnar hollow conductor, and the first conductive pad 851 and the second conductive pad 852 may also be hollow. The shape of the conductive member 83 is not limited thereto. The conductive element 83 may also be a columnar solid conductor, or the conductive element 83 may also include a columnar hollow conductor and a hole-filling body filled in the hollow conductor. The material of the hole-filling body may be a colloid, an insulating material or a conductive material.

Similarly, in the differential signal transmission circuit board 30 shown in FIG. 8, the conductive member 33 may be a columnar hollow conductor. The shape of the conductive member 33 is not limited thereto. The conductive member 33 may also include a columnar hollow conductor and a hole-filling body filled in the hollow conductor. The material of the hole-filling body may be a colloid, an insulating material or a conductive material.

In the differential signal transmission circuit board 40 shown in FIG. 10, the conductive member 43 may also be a columnar hollow conductor. The shape of the conductive member 43 is not limited thereto. The conductive member 43 may also include a columnar hollow conductor and a hole-filling body filled in the hollow conductor. The material of the hole-filling body may be a colloid, an insulating material or a conductive material.

In the differential signal transmission circuit board 50 shown in FIG. 12, the conductive member 53 may also be a columnar hollow conductor. The shape of the conductive member 53 is not limited thereto. The conductive member 53 may also include a columnar hollow conductor and a hole-filling body filled in the hollow conductor. The material of the hole-filling body may be a colloid, an insulating material or a conductive material.

In the differential signal transmission circuit board 60 shown in FIG. 14, the conductive member 63 may also be a columnar hollow conductor. The shape of the conductive member 63 is not limited thereto. The conductive member 63 may also include a columnar hollow conductor and a hole-filling body filled in the hollow conductor. The material of the hole-filling body may be a colloid, an insulating material or a conductive material.

In summary, the differential signal transmission circuit board of one embodiment of the present invention can appropriately adjust the design value of the equivalent characteristic impedance of the conductive element by providing a structural arrangement in which the insulating element is adjacent to or in contact with the conductive element. So that the equivalent characteristic impedance of the conductive element can be matched to a specific value. Therefore, the reflection phenomenon of the differential signal transmitted to the conductive element can be reduced, and the differential signal transmission distortion and attenuation problem can be alleviated, so that it can be applied to the transmission of the high-speed or high-frequency differential signal.

Although the present invention has been disclosed above in the foregoing embodiments, it is not intended to limit the invention. It is within the scope of the invention to be modified and modified without departing from the spirit and scope of the invention. Please refer to the attached patent application for the scope of protection defined by the present invention.

10, 20, 20a, 30, 40, 50, 60, 70, 80‧‧‧Differential signal transmission board

11, 21, 71‧‧‧ substrates

11a, 21a‧‧‧ first surface

11b, 21b‧‧‧ second surface

121, 221, 721‧‧‧ first conductive line

122‧‧‧Second conductive line

13, 23, 33, 43, 53, 63, 73, 83‧‧‧ conductive elements

14, 24, 24a, 34, 44, 64, 74‧‧‧ insulation components

151, 851‧‧‧ first conductive pad

152, 852‧‧‧second conductive pad

211‧‧‧ openings

240‧‧‧Volatile materials

261, 761‧‧‧ first conductive layer

262, 762‧‧‧ second conductive layer

541‧‧‧First insulation element

542‧‧‧Second insulation element

711‧‧‧ first layer

712‧‧‧Second layer

713‧‧‧ third layer

730‧‧‧ hollow conductor

731‧‧‧ hole filling body

77‧‧‧ Conductive circuit layer

D‧‧‧Distance

R1, R2, R3‧‧‧ areas

1 is a top plan view of a differential signal transmission circuit board in accordance with an embodiment of the present invention. 2 is a side cross-sectional view of the differential signal transmission circuit board of FIG. 1. 3 is a schematic diagram showing the equivalent characteristic impedance of the differential signal transmission circuit board of FIG. 1. 4 is a side cross-sectional view showing a semi-finished product of a differential signal transmission circuit board in accordance with another embodiment of the present invention. 5 is a side cross-sectional view of the differential signal transmission circuit board of FIG. 4. 6 is a side cross-sectional view of a differential signal transmission circuit board in accordance with another embodiment of the present invention. FIG. 7 is a top plan view of a differential signal transmission circuit board according to another embodiment of the present invention. 8 is a side cross-sectional view of the differential signal transmission circuit board of FIG. 7. 9 is a top plan view of a differential signal transmission circuit board in accordance with another embodiment of the present invention. 10 is a side cross-sectional view of the differential signal transmission circuit board of FIG. 9. 11 is a top plan view of a differential signal transmission circuit board in accordance with another embodiment of the present invention. 12 is a side cross-sectional view of the differential signal transmission circuit board of FIG. 11. FIG. 13 is a top plan view of a differential signal transmission circuit board according to another embodiment of the present invention. 14 is a side cross-sectional view of the differential signal transmission circuit board of FIG. 15 is a side cross-sectional view showing a differential signal transmission circuit board in accordance with another embodiment of the present invention. 16 is a side cross-sectional view showing a differential signal transmission circuit board in accordance with another embodiment of the present invention.

10‧‧‧Differential signal transmission board

11‧‧‧Substrate

121‧‧‧First conductive line

122‧‧‧Second conductive line

13‧‧‧Conducting components

14‧‧‧Insulation components

151‧‧‧First conductive pad

Claims (19)

A differential signal transmission circuit board includes: a substrate; at least two conductive elements disposed within the substrate; and at least one insulating member disposed within the substrate and adjacent to or in contact with the at least two conductive elements, The at least one insulating component does not surround the one of the at least two conductive components; wherein the material of the substrate has a first equivalent dielectric constant, and the material of the at least one insulating component has a second equivalent dielectric constant, The first equivalent dielectric coefficient is different from the second equivalent dielectric coefficient. The differential signal transmission circuit board of claim 1, wherein the at least two conductive elements are used to transmit a differential signal. The differential signal transmission circuit board of claim 1, wherein the substrate has a first surface and a second surface, and the at least two conductive elements extend from the first surface to the second surface. The differential signal transmission circuit board of claim 1, further comprising at least two conductive lines electrically connected to the at least two conductive elements. The differential signal transmission circuit board of claim 4, wherein the at least two conductive lines extend in a horizontal direction of the substrate, and the at least two conductive elements extend in a vertical direction of the substrate. The differential signal transmission circuit board of claim 1, wherein the number of the at least one insulating element is one, and the insulating element is located between the at least two conductive elements. The differential signal transmission circuit board of claim 1, wherein the number of the at least one insulating element is two, and the two insulating elements are located between the at least two conductive elements. The differential signal transmission circuit board of claim 1, wherein the number of the at least one insulating element is two, and the at least two conductive elements are located between the two insulating elements. The differential signal transmission circuit board of claim 1, wherein the at least one insulating component comprises two first insulating components and two second insulating components, the two first insulating components being located between the at least two conductive components, the at least Two conductive elements are located between the two second insulating elements. The differential signal transmission circuit board of claim 1, wherein the at least one insulating element is adjacent to the at least two conductive elements, and the distance between the outer surface of the at least one insulating element and the outer surface of each of the conductive elements is greater than zero And smaller than the outer diameter of each of the conductive elements. The differential signal transmission circuit board of claim 1, further comprising a first conductive layer disposed within the substrate, the at least two conductive elements and the first conductive layer being electrically insulated from each other via the substrate. The differential signal transmission circuit board of claim 11, further comprising a second conductive layer disposed within the substrate, the at least two conductive elements and the second conductive layer being electrically insulated from each other via the substrate. The differential signal transmission circuit board of claim 1, wherein the substrate has at least one opening, the at least one opening communicating from the surface of the substrate to the at least one insulating member. The differential signal transmission circuit board of claim 1, wherein the second equivalent dielectric constant is 1 to 50. The differential signal transmission circuit board of claim 1, wherein the substrate is a composite substrate. The differential signal transmission circuit board of claim 1, wherein each of the conductive elements is a hollow conductor. The differential signal transmission circuit board of claim 1, wherein each of the conductive elements comprises a hollow conductor and a hole-filling body, and the hole-filling body is filled in the hollow conductor, and the hole-filling body is made of colloid and insulation. Material or conductive material. The differential signal transmission circuit board of claim 1, wherein the two insulating elements are located inside the at least two conductive elements. The differential signal transmission circuit board of claim 1, wherein the two insulating elements are located on an outer side of the at least two conductive elements.