TWI604679B - An Electronic Device and a Power Method of a Housing of the Electronic Device - Google Patents

Description

Power supply method for electronic device and electronic device casing

The present invention relates to an apparatus and method, and more particularly to an electronic device and a method of supplying power to an electronic device housing.

In recent years, handheld electronic devices such as smart watches and smart phones have become more and more popular, and have become an indispensable mobile device for modern people. Generally, the outer casings of the electronic devices are provided with a pattern in which a plurality of light-emitting elements are arranged, and the patterns may represent brand logos or trademarks and the like. When the user operates the electronic device, the light-emitting elements can be controlled to emit light.

The conventional method of transmitting the power of the internal power supply unit of the electronic device to the light-emitting elements on the outer casing is to make holes, holes and wires of the outer casing to electrically connect the light-emitting elements with the internal power supply unit. However, such a manufacturing method not only easily damages the structure of the outer casing, but also facilitates the short circuit by the arrangement of the conductive lines.

Therefore, one of the objects of the present invention is to provide a kind of An electronic device that enables the external light-emitting element to electrically connect with the internal power supply unit by hole punching, opening, and pulling.

Thus, in some embodiments, the electronic device of the present invention comprises: a housing, an electronic component, and a power supply unit. The outer casing includes a substrate, two first electrodes, and two second electrodes. The substrate has an inner surface and an outer surface opposite to the inner surface. The two first electrodes are disposed on the inner surface of the substrate, and the two second electrodes are disposed on The outer surface of the substrate and the two first electrodes are respectively located at a specific corresponding position, so that the two second electrodes respectively form two equivalent capacitances with the two first electrodes. The electronic component is disposed on an outer surface of the substrate of the outer casing and electrically connected to the two second electrodes. The power supply unit is disposed in the housing and electrically connected to the two first electrodes, and is configured to provide power, and the power supply unit can transmit power to the electron through the electric field coupling between the two first electrodes and the two second electrodes. Component.

In some embodiments, each of the first electrodes and each of the second electrodes is a thin film structure and respectively coated on an inner surface and an outer surface of the substrate of the outer casing.

In some implementations, the electronic component is a light emitting component.

In some embodiments, at least one of an inner surface and an outer surface of the substrate of the outer casing is a curved surface.

In some embodiments, the inner surface and the outer surface of the substrate of the outer casing are curved surfaces, and the curvature of the inner surface of the substrate of the outer casing corresponds to the curvature of the outer surface.

In some embodiments, the electronic component is a micro LED, and the electronic device includes a plurality of the electronic components arranged in a specific pattern.

In some implementations, the particular pattern represents one of a name, a trademark, and a logo.

In some embodiments, the housing further includes a non-transparent conductive layer, a transparent conductive layer, and an insulating layer disposed on the outer surface of the substrate and electrically connected to one of the second electrodes, the insulation The layer is disposed on the one of the second electrodes, the transparent conductive layer is electrically connected to the other second electrode and separated from the one of the second electrodes by the insulating layer, the electronic component has a positive electrode at opposite ends And a negative electrode, the positive electrode and the negative electrode are electrically connected to the non-transparent conductive layer and the transparent conductive layer, respectively.

In some embodiments, the material of the non-transparent conductive layer is one of silver paste, electroplated copper, and copper plating. The transparent conductive layer is made of an indium tin oxide (ITO) conductive film and indium zinc oxide (IZO). One of the conductive films.

Another object of the present invention is to provide an outer casing that can improve the disadvantages of the prior art.

Therefore, in some embodiments, the housing of the present invention is suitable for electrically connecting a power supply unit for providing power and an electronic component, the housing comprising: a substrate, two first electrodes, and two second electrodes, the substrate Have an inner surface and an opposite An outer surface of the inner surface, the two first electrodes are disposed on an inner surface of the substrate, and the power supply unit is electrically connected to the two first electrodes, and the two second electrodes are disposed on an outer surface of the substrate and respectively The first electrode is located at a specific corresponding position, so that the two second electrodes respectively form two equivalent capacitances with the two first electrodes, and the electronic component is disposed on the outer surface of the substrate and electrically connected to the two second electrodes. The power supply unit can transmit power to the electronic component through an electric field coupling between the two first electrodes and the two second electrodes.

In some embodiments, each of the first electrodes and each of the second electrodes is a thin film structure and respectively coated on an inner surface and an outer surface of the substrate.

In some embodiments, at least one of the inner surface and the outer surface of the substrate is a curved surface.

In some embodiments, the inner and outer surfaces of the substrate of the outer casing are curved, and the curvature of the inner surface of the substrate corresponds to the curvature of the outer surface.

Still another object of the present invention is to provide a method of powering an electronic device housing that can improve the disadvantages of the prior art.

Therefore, in some embodiments, the power supply method of the electronic device casing of the present invention includes the steps of: providing an alternating current to the two first electrodes disposed on an inner surface of a substrate, such that the substrate is disposed opposite to the inner surface The two second electrodes of an outer surface form two equivalent capacitances with the two first electrodes, and the two second electrodes transmit power to an electronic component disposed on an outer surface of the substrate.

In some embodiments, the step of providing the alternating current is to output a high frequency alternating current having a frequency ranging from 20 kHz to 3 megahertz.

In some embodiments, the power supply method of the electronic device casing of the present invention comprises the steps of: providing a substrate having an inner surface and an outer surface opposite to the inner surface; and providing a pair on the inner surface of the substrate a first electrode; a pair of second electrodes are disposed on an outer surface of the substrate, and the pair of second electrodes are located at a specific corresponding position with the pair of first electrodes; an electronic component is disposed on an outer surface of the substrate, and The electronic component is electrically connected to the pair of second electrodes; and provides power to the pair of first electrodes and transmits the power to the electronic component through an electric field coupling between the pair of second electrodes and the pair of first electrodes.

In some embodiments, the electronic device of the present invention comprises: a substrate, a pair of first electrodes, a pair of second electrodes, an electronic component, and a power supply unit. The substrate has a first surface and a second surface opposite to the first surface, the pair of first electrodes are disposed on the first surface of the substrate, the pair of second electrodes are disposed on the second surface of the substrate, and the Positioning the second electrode at a specific position corresponding to the pair of first electrodes, the electronic component is disposed on the second surface of the substrate and electrically connected to the pair of second electrodes, and the power supply unit supplies power to the pair of first An electrode is coupled to the electronic component by coupling an electric field between the pair of second electrodes and the pair of first electrodes.

In some embodiments, the electronic device of the present invention comprises: a housing, and a plurality of electronic components. The outer casing has: a base having an outer surface and an inner surface a plate, a pair of electrodes disposed on an outer surface of the substrate, a non-transparent conductive layer disposed on an outer surface of the substrate and electrically connected to one of the electrodes, and an outer side of the non-transparent conductive layer and electrically connected thereto a transparent conductive layer of the other electrode; the electronic components respectively have two electrodes at opposite ends, and the two electrodes are electrically connected to the non-transparent conductive layer and the transparent conductive layer, respectively.

The present invention has at least the following effects: a power supply unit can transmit power to the electronic components through electric field coupling between the two first electrodes and the two second electrodes. Therefore, it is not necessary to punch, open or pull the substrate of the outer casing, that is, electric power can be transmitted from the two first electrodes to the two second electrodes in an electric field coupling manner, so as to achieve the purpose of not requiring wire connection. Furthermore, the method of electric field coupling by means of inductive coupling can achieve higher transmission efficiency and less heat energy generated in the process, which is more conducive to improving the efficiency of power transmission.

1‧‧‧Shell

11‧‧‧Substrate

111‧‧‧ inner surface

112‧‧‧ outer surface

12‧‧‧First electrode

13‧‧‧second electrode

14‧‧‧ Non-transparent conductive layer

15‧‧‧Transparent conductive layer

16‧‧‧Insulation

2‧‧‧Electronic components

21‧‧‧ positive electrode

22‧‧‧Negative electrode

3‧‧‧Power supply unit

Other features and effects of the present invention will be apparent from the embodiments of the present invention. FIG. 1 is a perspective view of an embodiment of an electronic device according to the present invention, illustrating that two first electrodes are disposed in a substrate. 2 is a perspective view of the embodiment, illustrating that the two second electrodes are disposed on the outer surface of the substrate; 3 is a cross-sectional view taken along line III-III of FIG. 2, illustrating that the two first electrodes are respectively located at a specific corresponding position with the two second electrodes, so that the two second electrodes are respectively associated with the two An electrode forms two equivalent capacitors; FIG. 4 is a circuit diagram of the embodiment; FIG. 5 is a cross-sectional view showing that the inner surface and the outer surface of the substrate of a casing are curved, and the two first electrodes are disposed in the substrate. a second electrode is disposed on the outer surface of the substrate; FIG. 6 is a cross-sectional view showing another embodiment of the electronic device of the present invention, illustrating that each electronic component is a micro-light emitting diode, and a positive electrode of the electronic component And a negative electrode electrically connected to a non-transparent conductive layer and a transparent conductive layer respectively on the substrate; and FIG. 7 is a plan view showing a specific pattern in which the plurality of electronic components are arranged on the substrate as an English letter "O".

Referring to FIG. 1 to FIG. 4, an embodiment of an electronic device of the present invention includes: a housing 1, a plurality of electronic components 2, and a power supply unit 3. In some embodiments, the electronic device can be a watch, a cell phone, an electronic door lock, or other electronic product.

As shown in FIG. 1 to FIG. 3, the outer casing 1 includes a substrate 11, two first electrodes 12, and two second electrodes 13. The substrate 11 can be, for example, a mobile phone casing, and can be made of PC (Polychloroprene), ABS (Acrylonitrile Butadiene Styrene), PA (Polyamide), LSR (Liquid Silicone Rubber), The insulating material of TPU (Thermoplastic polyurethane), PU (Polyurethane), TPE (Thermoplastic elastomers), TPR (Thermoplastic Rubber), epoxy resin, PET and ceramics, the substrate 11 has an inner surface 111 and an opposite inner surface 111 Outer surface 112. The two first electrodes 12 are spaced apart from each other and are respectively disposed on the inner surface 111 of the substrate 11 in a plating manner. In detail, each of the first electrodes 12 is a thin film structure and is coated on the inner surface 111 of the substrate 11. The two second electrodes 13 are spaced apart from each other and are respectively disposed on the outer surface 112 of the substrate 11 in a plating manner. Specifically, each of the second electrodes 13 is a thin film structure and is respectively coated on the outer surface 112 of the substrate 11 . The two second electrodes 13 are respectively located at a specific corresponding position with the two first electrodes 12, so that the two second electrodes 13 form two equivalent capacitances with the two first electrodes 12, respectively. The above-mentioned process of providing the first electrode 12 and the second electrode 13 on the inner surface 111 and the outer surface 112 in a plating manner is conventionally known. For example, reference may be made to the patent No. I475936 in the prior art, and other metal electrodes are formed on the insulating material substrate. The method can also be applied.

As shown in FIG. 2 and FIG. 3, each electronic component 2 is disposed on the outer surface 112 of the substrate 11 and electrically connected to the two second electrodes 13. In this embodiment, each electronic component 2 is a light emitting diode (LED).

Referring to FIG. 4, the power supply unit 3 is configured to provide power and is disposed in the outer casing 1 and electrically connected to the two first electrodes 12. The power supply unit 3 can transmit an electric field between the two first electrodes 12 and the two second electrodes 13. Coupling, power is delivered to the electronic components 2. Therefore, the substrate 11 does not need to be holed, opened or pulled, that is, the electric field can be coupled. The power is transmitted from the two first electrodes 12 to the two second electrodes 13 for the purpose of not requiring wire connection. Furthermore, the method of electric field coupling by means of inductive coupling can achieve higher transmission efficiency and less heat energy generated in the process, which is more conducive to improving the efficiency of power transmission. In the present embodiment, the power supply unit 3 is a high frequency conversion electronic device and an integrated circuit using a semiconductor such as gallium nitride (GaN), which is lighter in weight than a conventional power supply and has a larger volume than a conventional power supply. small.

In particular, referring to FIG. 5, in some embodiments, the inner surface 111 or the outer surface 112 of the substrate 11 of the outer casing 1 may also be a curved surface. As shown in FIG. 5, the inner surface 111 and the outer surface 112 of the substrate are both The curved surface, and the curvature of the inner surface 111 corresponds to the curvature of the outer surface 112. Thus, the first electrode 12 and each of the second electrodes 13 are respectively plated on the inner surface 111 and the outer surface 112 of the substrate 11, thereby forming Two equivalent capacitors.

Referring to FIG. 6, the outer casing 1 of another embodiment of the electronic device of the present invention further includes a non-transparent conductive layer 14, a transparent conductive layer 15, and an insulating layer 16. The non-transparent conductive layer 14 is disposed on the outer surface 112 of the substrate 11 and electrically connected to one of the second electrodes 13 by, for example, a conductive paste or a conductive sheet. In an embodiment, the material of the non-transparent conductive layer 14 may be silver paste. One of electroplated copper or copper plating. The transparent conductive layer 15 is in the form of a sheet and is electrically connected to one of the other second electrodes 13' at one end by a conductive paste or a conductive sheet or the like, and in the present embodiment, the other end of the transparent conductive layer 15 extends to the second electrode 13 On the outer side, therefore, the embodiment further provides the insulating layer 16 on the second electrode 13, Thereby, the transparent conductive layer 15 is separated from the second electrode 13, and the transparent conductive layer 15 is prevented from contacting the second electrode 13 to be short-circuited. The material of the transparent conductive layer 15 may be one of an indium tin oxide (ITO) conductive film and an indium zinc oxide (IZO) conductive film. The electronic device comprises a plurality of electronic components 2 arranged in a specific pattern, wherein the specific pattern represents one of a name, a trademark, and a logo. In this embodiment, each electronic component 2 is a micro LED, and has a positive electrode 21 and a negative electrode 22 at opposite ends, and each electronic component 2 is disposed on the non-transparent conductive layer 14 . Between the transparent conductive layer 15 and the positive electrode 21 and the negative electrode 22 of each electronic component 2 are electrically connected to the non-transparent conductive layer 14 and the transparent conductive layer 15, respectively. As shown in FIG. 7, in some embodiments, the electronic components 2 can be arranged on the substrate 11 in a specific pattern of an English letter "O" to display the logo or trademark when the electronic components 2 emit light.

The power supply method of the electronic device casing of the present invention will be described below.

Referring to FIG. 3 and FIG. 4, the power supply method includes the following steps: the power supply unit 3 supplies an alternating current to the two first electrodes 12 of the inner surface 111 of the substrate 11, wherein the supplied alternating current is a high frequency alternating current, and the high frequency The frequency range of the alternating current is between 20 kHz and 3 megahertz.

Next, the two second electrodes 13 of the outer surface 112 of the substrate 11 and the two first electrodes 12 of the inner surface 111 form two equivalent capacitances. Due to capacitance value ( ε : permittivity of the medium, A: electrode area, d: distance between the two electrodes), and the area and distance of each of the first electrode 12 and each of the second electrodes 13 are fixed, and thus the embodiment is constructed. The values of the two equivalent capacitors are fixed. Again, the impedance value of the capacitor (where f: the frequency of the input alternating current), it can be seen that when the first electrode 12 is to transmit a large current to the second electrode 13, the impedance value Z _{C of the} capacitor must be reduced, and at the capacitor C Under fixed conditions, only the frequency f of the input alternating current can be increased. Therefore, the alternating current provided by the present invention is a high-frequency alternating current, so that the current value of the transmission can be increased. The electronic components 2 are then transferred by the two second electrodes 13 to the outer surface 112 of the substrate 11, causing the particular pattern of the electronic components 2 to illuminate.

In summary, the electronic device of the present invention allows the power supply unit 3 to transmit power to the electronic components 2 through the electric field coupling between the two first electrodes 12 and the two second electrodes 13. Therefore, the substrate 11 is not required to be holed, opened or pulled, that is, electric power can be transmitted from the two first electrodes 12 to the two second electrodes 13 in an electric field coupling manner, so that the purpose of the wire connection is not required. Furthermore, the method of electric field coupling by means of inductive coupling not only achieves higher transmission efficiency, but also generates less heat energy in the process, which is more conducive to improving the efficiency of power transmission. The object of the invention can be achieved.

However, the above is only the embodiment of the present invention, and the scope of the invention is not limited thereto, and all the equivalent equivalent changes and modifications according to the scope of the patent application and the patent specification of the present invention are still The scope of the invention is covered.

1‧‧‧Shell

11‧‧‧Substrate

111‧‧‧ inner surface

112‧‧‧ outer surface

12‧‧‧First electrode

13‧‧‧second electrode

2‧‧‧Electronic components

Claims (18)

An electronic device comprising: a housing comprising a substrate, two first electrodes, and two second electrodes, the substrate having an inner surface and an outer surface opposite to the inner surface, the two first electrodes being disposed on the substrate The inner surface of the second electrode is disposed on the outer surface of the substrate and respectively located at a specific position corresponding to the two first electrodes, so that the two second electrodes respectively form two equivalent capacitances with the two first electrodes An electronic component disposed on an outer surface of the substrate of the outer casing and electrically connected to the two second electrodes; and a power supply unit electrically connected to the two first electrodes and configured to provide power, the power supply unit Power can be transmitted to the electronic component through electric field coupling between the two first electrodes and the two second electrodes. The electronic device of claim 1, wherein each of the first electrodes and each of the second electrodes is a thin film structure and respectively coated on an inner surface and an outer surface of the substrate of the outer casing. The electronic device of claim 1, wherein the electronic component is a light emitting component. The electronic device of claim 1, wherein at least one of an inner surface and an outer surface of the substrate of the outer casing is a curved surface. The electronic device of claim 4, wherein the inner surface and the outer surface of the substrate of the outer casing are curved surfaces, and the curvature of the inner surface of the substrate of the outer casing corresponds to the curvature of the outer surface. The electronic device of claim 3, wherein the electronic component is a micro-lighting device A micro-LED, and the electronic device includes a plurality of electronic components arranged in a specific pattern. The electronic device of claim 6, wherein the outer casing further comprises a non-transparent conductive layer and a transparent conductive layer, wherein the non-transparent conductive layer is disposed on an outer surface of the substrate and electrically connected to one of the second electrodes, the transparent conductive The layer is located on the outer side of the non-transparent conductive layer and is electrically connected to the other second electrode. The electronic component has two electrodes at opposite ends, and the two electrodes are electrically connected to the non-transparent conductive layer and the transparent conductive layer, respectively. The electronic device of claim 6, wherein the specific pattern represents one of a name, a trademark, and a logo. a housing suitable for electrically connecting a power supply unit for providing power and an electronic component, the housing comprising: a substrate, two first electrodes, and two second electrodes, the substrate having an inner surface and a opposite An outer surface of the inner surface, the two first electrodes are disposed on an inner surface of the substrate, and the power supply unit is electrically connected to the two first electrodes, and the two second electrodes are disposed on an outer surface of the substrate and respectively An electrode is located at a specific corresponding position, so that the two second electrodes respectively form two equivalent capacitances with the two first electrodes, and the electronic component is disposed on an outer surface of the substrate and electrically connected to the two second electrodes, The power supply unit can transmit power to the electronic component through an electric field coupling between the two first electrodes and the two second electrodes. The housing of claim 9, wherein each of the first electrode and each of the second electrodes is a thin film structure and is respectively coated on an inner surface and an outer surface of the substrate. The outer casing of claim 9, wherein the inner surface and the outer surface of the substrate At least one of them is a curved surface. The outer casing of claim 11, wherein the inner surface and the outer surface of the substrate of the outer casing are curved surfaces, and a curvature of an inner surface of the substrate corresponds to a curvature of the outer surface. The outer casing of claim 10, further comprising a non-transparent conductive layer and a transparent conductive layer disposed on the outer surface of the substrate and electrically connected to one of the second electrodes, the transparent conductive layer being located at the non-transparent conductive layer The outer side of the layer is electrically connected to the other second electrode, and the electronic component has two electrodes at opposite ends, and the two electrodes are electrically connected to the non-transparent conductive layer and the transparent conductive layer, respectively. A method for supplying power to an electronic device casing, comprising the steps of: providing an alternating current to two first electrodes disposed on an inner surface of a substrate, and causing two second electrodes disposed on an outer surface of the substrate opposite to the inner surface The two first electrodes form two equivalent capacitances, and the two second electrodes transmit power to an electronic component disposed on an outer surface of the substrate. The method of supplying power to an electronic device casing according to claim 14, wherein the step of providing the alternating current is outputting a high frequency alternating current having a frequency ranging from 20 kHz to 3 megahertz. A method for supplying power to an electronic device casing includes the steps of: providing a substrate having an inner surface and an outer surface opposite to the inner surface; and providing a pair of first electrodes on an inner surface of the substrate; The outer surface is provided with a pair of second electrodes, and the pair of second electrodes are located at a specific corresponding position with the pair of first electrodes; An electronic component is disposed on an outer surface of the substrate, and the electronic component is electrically connected to the pair of second electrodes; and power is supplied to the pair of first electrodes, and is transmitted between the pair of second electrodes and the pair of first electrodes An electric field is coupled to deliver the power to the electronic component. An electronic device comprising: a substrate having a first surface and a second surface opposite to the first surface; a pair of first electrodes disposed on the first surface of the substrate; and a pair of second electrodes disposed on the substrate a second surface of the substrate, and the pair of second electrodes and the pair of first electrodes are located at a specific corresponding position; an electronic component disposed on the second surface of the substrate and electrically connected to the pair of second electrodes; A power supply unit supplies power to the pair of first electrodes and transmits the power to the electronic component through an electric field coupling between the pair of second electrodes and the pair of first electrodes. An electronic device comprising: a housing having: a substrate having an outer surface and an inner surface; a pair of electrodes disposed on an outer surface of the substrate; and a non-transparent conductive layer disposed on the outer surface of the substrate and electrically Connecting to one of the electrodes; and a transparent conductive layer on the outer side of the non-transparent conductive layer and electrically connected to the other of the electrodes; and a plurality of electronic components having two electrodes at opposite ends, respectively The two electrodes are electrically connected to the non-transparent conductive layer and the transparent conductive layer, respectively.