TWI601273B - A sensing wafer, a method of manufacturing the same, and an electronic device in which the sensing wafer is disposed - Google Patents

Description

Sensing wafer, manufacturing method thereof and electronic device configuring the same

The invention relates to a device for detecting information and converting into an electrical signal, a manufacturing method thereof, and a device using the device, in particular, a sensing chip for detecting biometric information of a human body, a manufacturing method thereof, and a method for manufacturing the same Electronic device.

A sensing chip for detecting biometric information of a human body, such as a fingerprint sensing chip, is usually a cubic structure, and the sensing chip is usually placed under a cover plate provided by an electronic device as a button, for example, the electronic device Often referred to as mobile phone personal mobile communication terminals, handheld tablets. The cover is typically a primary screen key, commonly referred to as the Home button, disposed on the electronic device described above. A cover plate is attached to the upper side of the sensing wafer. The electronic device is usually also provided with a main control unit and a Flexible Printed Circuit (FPC) that can be bent and used. The sensing chip enables the main screen key to realize both the function of the button and the function of sensing the biometric information of the human body. However, in the prior art sensing wafer, it is generally required to open a window for exposing the metal electrical contact contacts in the sensing wafer, and the electrical connection between the metal electrical contact and the FPC is made by the connecting wire passing through the window, because the connection is made. The wire passes over the sensing wafer, and the cover plate is attached to the sensing wafer, so that the cover plate and the sensing wafer cannot be closely adhered to each other, which affects the mounting effect, and also affects the information collecting capability of the sensing wafer.

The technical problem to be solved by the present invention is to avoid a deficiencies of the prior art and to provide a sensing wafer capable of being in close contact with a sensing wafer and a manufacturing method thereof, and an electronic device configuring the sensing wafer.

The technical problem of the present invention can be achieved by adopting the following technical solutions: designing and manufacturing a sensing chip for detecting human biometric information, including a substrate, a spacer layer encapsulated on the substrate, and being packaged on top of the spacer layer a wiring layer, and a rewiring layer covering and covering at least the top of the wiring layer; the spacer layer is further provided with N groups of contacts that are neither covered by the wiring layer nor covered by the rewiring layer, and N is not less than 1. Natural number; each set of contact groups each includes at least one contact. At least one sensing sensing device is packaged within the rewiring layer. The wiring layer is encapsulated with at least one connection pad, and at least one connecting member extending through the wiring layer in a longitudinal direction. The top and bottom of the connecting member are electrically connected to a sensing sensing device and a connecting pad respectively. The sensing layer is packaged with a sensing signal processing circuit; the connection pads in the wiring layer and the contacts of each group of contacts are electrically connected to the sensing signal processing circuit.

In order to prevent each group of contact groups from being covered by the wiring layer, the cross-sectional area of the wiring layer is smaller than the cross-sectional area of the spacer layer, so that the N-group of contact groups is disposed in a region where the top surface of the spacer layer is not covered by the wiring layer. Further, the wiring layer is disposed in a central portion of the top surface of the spacer layer; the center point of the top surface of the spacer layer is a symmetric point, and two sets of contact points that are point-symmetric with each other are disposed at the top of the spacer layer without being covered by the wiring layer.

In order to prevent each group of contact groups from being covered by the rewiring layer, the rewiring layer covers the entire wiring layer and the spacer layer, and N recesses penetrating the top and bottom of the rewiring layer are disposed on the side façade of the rewiring layer. And the positions of the respective grooves are respectively set corresponding to the positions of the groups of the contact groups, so that the groups of the contact groups on the top surface of the spacer layer are not covered by the rewiring layer.

Specifically, the sensing and sensing devices are arranged in an array structure in rows and columns in the rewiring layer, and the connection pads are arranged in an array structure corresponding to the sensing devices in the wiring layer.

The wiring layer is disposed in a central portion of the top surface of the spacer layer; the center point of the top surface of the spacer layer is a symmetric point, and two sets of contact points that are point-symmetric with each other are disposed at the top of the spacer layer without being covered by the wiring layer.

Specifically, the sensing device detects the human body by using the connecting member and the connecting pad. The biometric information is input to the sensing signal processing circuit for signal processing, and the sensing information formed by the signal processing is output from the sensing chip by using the contacts of each group of the contact groups.

More specifically, the volume of the sensing sensing device is greater than the volume of the connection pads.

The sensing chip may be a fingerprint sensing chip for sensing human fingerprint feature information, and the sensing sensing device may be a fingerprint sensing device, and the sensing signal processing circuit may be a fingerprint sensing signal processing circuit. In addition, the sensing chip may further be a pulse sensing chip for sensing pulse characteristic information of the human body, and the sensing sensing device may be a pulse sensing device, and the sensing signal processing circuit may be a pulse sensing signal processing circuit. .

The solution to the above technical problem can also be achieved by adopting the following technical solutions: designing and manufacturing an electronic device, including a cover plate, a flexible printed circuit board, and a main control unit. The electronic device further includes a sensing wafer disposed under the cover for detecting biometric information of the human body. The sensing wafer includes a substrate, a spacer layer encapsulated on the substrate, a wiring layer encapsulated on a top surface of the spacer layer, and a rewiring layer encapsulating and covering at least a top of the wiring layer; N sets of contact groups covered by the wiring layer and not covered by the rewiring layer, N is a natural number not less than 1; each set of contact groups each includes at least one contact. At least one sensing sensing device is packaged within the rewiring layer. The wiring layer is encapsulated with at least one connection pad and a connector extending longitudinally through the wiring layer, and the top and bottom of the connector are electrically connected to a sensing sensing device and a connection pad, respectively. The sensing layer is packaged with a sensing signal processing circuit, and the connection pads in the wiring layer and the contacts of each group of contacts are electrically connected to the sensing signal processing circuit. The contacts of the N sets of contact groups are electrically connected to the main control unit through a flexible printed circuit board.

In order to make each group of contact groups not covered by the wiring layer, the cross-sectional area of the wiring layer is smaller than the cross-sectional area of the spacer layer, so that the N groups of contact groups are disposed on the top surface of the spacer layer without being covered by the wiring layer. within the area. Further, the wiring layer is disposed in a central portion of the top surface of the spacer layer; the center point of the top surface of the spacer layer is a symmetric point, and two sets of contact points that are point-symmetric with each other are disposed at the top of the spacer layer without being covered by the wiring layer.

In order to prevent each group of contact groups from being covered by the rewiring layer, the rewiring layer covers the entire wiring layer and the spacer layer, and N recesses penetrating the top and bottom of the rewiring layer are disposed on the side façade of the rewiring layer. And the positions of the respective grooves are respectively set corresponding to the positions of the groups of the contact groups, so that the groups of the contact groups on the top surface of the spacer layer are not covered by the rewiring layer.

Specifically, the sensing and sensing devices are arranged in an array structure in rows and columns in the rewiring layer, and the connection pads are arranged in an array structure corresponding to the sensing devices in the wiring layer.

The wiring layer is disposed in a central portion of the top surface of the spacer layer. The center point of the top surface of the spacer layer is symmetric, and two sets of contact points which are point-symmetric with each other are disposed at the top of the spacer layer without being covered by the wiring layer.

Specifically, the sensing device transmits the detected human biometric information to the sensing signal processing circuit for signal processing by using the connecting member and the connecting pad, and the sensing information formed by the signal processing utilizes each set of contacts. The contacts of the group are output from the sensing chip, and the main control unit receives the sensing information outputted from the sensing chip through the flexible printed circuit board.

More specifically, the volume of the sensing sensing device is greater than the volume of the connection pads.

The sensing chip may be a fingerprint sensing chip for sensing human fingerprint feature information, and the sensing sensing device may be a fingerprint sensing device, and the sensing signal processing circuit may be a fingerprint sensing signal processing circuit. In addition, the sensing chip may also be a pulse sensing chip for sensing the pulse characteristic information of the human body, so that the sensing sensing device may be a pulse sensing device, and the sensing signal processing circuit may be pulse sensing signal processing. Circuit.

The present invention solves the above technical problem and can be realized by adopting the following technical solutions: a sensing wafer manufacturing method is proposed, including the following steps: A. providing a substrate; B. processing a spacer layer enclosing the sensing signal processing circuit and the connecting line on the substrate; C. providing at least one connecting pad on the top of the spacer layer, so that each connecting pad is electrically connected by a connecting line Connecting the sensing signal processing circuit; encapsulating all the connection pads with an insulating material to form a wiring layer, and making the connection pads not covered by the insulating material, thereby forming a through hole surrounded by the insulating material on the top of each connection pad; filling the conductive material Each of the through holes is formed to form a connecting member; N sets of contact groups are disposed on the top surface of the spacer layer without being covered by the wiring layer, and N is a natural number not less than 1, and each of the contact groups includes at least one contact, so that Each contact is electrically connected to the sensing signal processing circuit in the spacer layer by using a connecting line; the top of each group of contact groups is covered by a photoresist; D. at least one sensing sensing device is disposed on the top of the wiring layer to make each sensing sensing The device is electrically connected to each of the connecting members; the sensing sensing device is encapsulated with an insulating material, the insulating material covering at least the wiring layer, but not covering the photoresist, thereby forming a rewiring layer; E. removing the photoresist, thereby Each group of contact groups is neither covered by the wiring layer nor covered by the rewiring layer.

Specifically, the substrate described in step A is a germanium substrate.

In order to make each group of contact groups not covered by the wiring layer, in step B, the wiring layer is disposed in a central portion of the top surface of the spacer layer, and the cross-sectional area of the wiring layer is smaller than the cross-sectional area of the spacer layer. Further, the center point of the top surface of the spacer layer is symmetric, and two sets of contact points that are point-symmetric with each other are disposed at the top of the spacer layer without being covered by the wiring layer.

In order to make each group of contacts not covered by the rewiring layer, in step D, the rewiring layer covers the wiring layer, and all the areas of the spacer layer that are not covered by the wiring layer and the photoresist; In E, after removing the photoresist, N grooves extending through the top and bottom of the rewiring layer are formed on the side façade of the rewiring layer, so that each group of contacts is neither covered by the wiring layer nor Rewiring layer coverage.

Specifically, in step C, the connection pads are arranged in an array structure in rows and columns in the wiring layer. Then, in step D, the sensing sensing devices are arranged in an array structure in rows and columns in the rewiring layer.

In step E, each photoresist is removed by etching using a dry etching technique or a wet etching technique, and each group of contacts is exposed.

Compared with the prior art, the technical effects of the "sensing wafer and its manufacturing method, and the electronic device configuring the sensing wafer" of the present invention are as follows: The connection between the flexible printed circuit FPC and the external sensing circuit is electrically connected by using the contact point, so as to avoid connecting the connecting wire over the sensing wafer as in the prior art, and ensuring a close fit between the cover and the sensing wafer, so as to sense the information of the wafer. The acquisition capability is guaranteed, and the detection effect of the sensing chip on the biometric information of the human body is optimized.

1‧‧‧Sensor wafer

2‧‧‧Electronic devices

11‧‧‧Substrate

12‧‧‧ spacer

13‧‧‧ wiring layer

14‧‧‧Rewiring layer

15‧‧‧Contacts

16‧‧‧Insulating substances

21‧‧‧ Cover

22‧‧‧FPC

23‧‧‧Master unit

24‧‧‧ display screen

121‧‧‧Sensing processing circuit

122‧‧‧Connecting line

131‧‧‧Connecting mat

132‧‧‧Connecting parts

141‧‧‧Sensing sensing device

142‧‧‧ Groove

51~55‧‧‧Steps

FIG. 1 is a schematic top plan view of a sensing wafer of a preferred embodiment of the sensing wafer and its manufacturing method and the electronic device configuring the sensing wafer.

Fig. 2 is a schematic cross-sectional view taken along line J-J of Fig. 1.

FIG. 3 is a schematic view of the axonometric projection of the preferred embodiment.

[Fig. 4] is a schematic view showing the installation of the device when the sensing wafer is mounted in the electronic device in the preferred embodiment.

FIG. 5 is a schematic plan view of the electronic device of the preferred embodiment.

Fig. 6 is a schematic flow chart showing the process of manufacturing a sensing wafer of the present invention.

The following further details are described in conjunction with the preferred embodiments shown in the drawings.

The present invention proposes a sensing wafer 1 for detecting biometric information of a human body and an electronic device 2 on which the sensing wafer 1 is mounted.

As shown in FIGS. 4 and 5, in addition to the sensing wafer 1, the electronic device 2 includes a cover 21, a Flexible Printed Circuit (FPC) 22, and a main control unit 23. In practical applications, the electronic device 2 may be a personal mobile communication terminal commonly referred to as a "mobile phone", or may be a palmtop tablet, or even any electronic device configured with a button. In the preferred embodiment of the present invention, as shown in FIG. 5, a personal mobile communication terminal is taken as an example of the electronic device 2. The electronic device 2 further includes a display screen 24 for displaying a picture. In other embodiments, the electronic device 2 may further include a touch screen for performing a touch operation. The touch screen can be an external touch screen and attached to the display screen 24, and the touch screen can also be part of the display screen 24. For example, the touch screen is on the screen. The touch sensing unit (on cell) or the touch screen is an in-cell touch sensing unit (in cell).

The cover plate 21 not only realizes the button function of the pressing function to realize the setting function, but also realizes the function of sensing the wafer 1 to acquire the biometric information of the human body to provide the information collecting window. That is, the cover 21 can perform a key function when the cover 21 is pressed. In addition, when the sensing chip 1 performs the function of sensing the biometric information of the human body, the measured portion of the human body passes through the contact cover 21, so that the sensing chip 1 detects the biometric information of the human body through the cover 21, for example, the sensing chip. 1 is used to detect the fingerprint information of the human body. When the finger touches the cover 21, the sensing chip 1 detects the fingerprint feature information of the finger, and realizes the function set by the electronic device 2 through the detected fingerprint feature information. For example, using fingerprint information to achieve body Authentication function. In the preferred embodiment of the present invention, as shown in FIG. 5, the cover plate 21 is disposed on the frame around the display screen 24, and functions as both the main screen Home button and the sensing window 1 output window.

In the preferred embodiment of the present invention, as shown in FIG. 1 to FIG. 4, the sensing wafer 1 is generally in the shape of a cube. The sensing wafer 1 is fabricated into any columnar structure as described hereinafter, for example, The sensing wafer is formed into a cylindrical shape, an elliptical column shape, a prism shape, or the like.

As shown in FIGS. 2 to 4, the sensing wafer 1 includes a substrate 11, a spacer layer 12 packaged on the substrate 11, a wiring layer 13 encapsulated on the top of the spacer layer 12, and a package and covering at least the top of the wiring layer 13. Rewiring layer 14. Further, N sets of contact groups which are neither covered by the wiring layer 13 nor covered by the rewiring layer 14 are provided on the spacer layer 12, and N is a natural number of not less than 1. In the preferred embodiment of the present invention, two sets of contact groups are set, that is, N=2. Obviously, the technical effects of the present invention can be achieved by setting more than one contact group of any number as needed. As shown in FIG. 1 , the two contact groups each include ten contacts 15 , then the contact group can be set with at least one contact 15 according to actual needs, and the number of contacts 15 disposed in each group of contact groups does not have to be exactly the same. That is, the number of contacts 15 and the manner in which the contacts 15 are divided into groups do not affect the technical effect of the present invention.

The rewiring layer 14 is encapsulated with at least one sensing sensing device 141. In the preferred embodiment of the present invention, as shown in FIG. 1, since the sensing sensing device 141 is packaged and cannot be directly visible, it is shown by a broken line. profile. Of course, the re-wiring layer 14 is encapsulated with a transparent material and the sensing device 141 is visible. In addition, the sensing sensing device 141 is made of a transparent light transmissive material, that is, the rewiring layer 14 is encapsulated with a transparent material, and the sensing device 141 is still invisible. Therefore, the present invention does not limit the shape and material of the sensing device 141, and the sensing device 141 is a direct device for collecting biometric information of the human body. In the preferred embodiment of the present invention, as shown in FIGS. 1 and 3, thirty-five sensing sensing devices 141 are packaged in the rewiring layer 14, and the sensing sensing devices 141 are arranged in an array of five rows and seven columns. structure.

The wiring layer 13 is provided with at least one connection pad 131 and at least one connecting member 132 extending through the wiring layer 13 in the longitudinal direction. In the preferred embodiment of the present invention, as shown in FIG. 2, the connection pads 131 are provided in a one-to-one correspondence with the sensing sensing device 141, and a connection pad 131 is disposed under the sensing sensing device 141. Therefore, in the preferred embodiment of the present invention, thirty-five connection pads 131 are packaged in the wiring layer 13, and the connection pads 131 are also arranged in an array structure in five rows and seven columns. The connecting member 132 is disposed on the upper and lower corresponding sensing sensing devices 141 and the connecting pads 131. The sensing device 141 and a connecting pad 131 are electrically connected to the top and bottom of the connecting member 132, respectively.

In the preferred embodiment of the present invention, as shown in FIGS. 2 to 3, the wiring layer 13 and the rewiring layer 14 are all encapsulated with an insulating material 16.

The sensing layer processing circuit 121 is encapsulated in the spacer layer 12 . In the preferred embodiment of the present invention, as shown in FIG. 2 and FIG. 4, the sensing processing circuit 121 is only schematically illustrated by a block, and the specific circuit is selected according to a specific application environment and function, and details are not described herein again. Each of the connection pads 131 in the wiring layer 13 and the contacts 15 of each group of contact groups are electrically connected to the sensing signal processing circuit 121. In the preferred embodiment of the present invention, as shown in FIG. 2 and FIG. 4, the spacer layer 12 is further provided with a connection line 122, and the connection pads 131 in the wiring layer 13 and the connection groups of the groups are connected by the connection line 122. Point 15 is electrically coupled to sense signal processing circuit 121.

In a preferred embodiment of the present invention, as shown in FIGS. 2 and 4, the volume of the sensing device 141 is greater than the volume of the connection pad 131.

Using the connecting member 132 and the connecting pad 131, the sensing device 141 inputs the detected human biometric information to the sensing signal processing circuit 121 for signal processing, and the sensing information formed by the signal processing utilizes each set of contacts. The contacts 15 of the group are output from the sensing wafer 1.

In the electronic device 2, the contacts 15 of the N sets of contact groups are electrically connected to the main control unit 23 by the FPC 22. The FPC 22 functions to establish an electrical connection between the sensing wafer 1 and the main control unit 23, Thereby, the output information of the sensing wafer 1 is collectively transmitted to the main control unit 23. Since the node 15 of each contact group is disposed on the spacer layer 12, the spacer layer is covered with the wiring layer 13 and the rewiring layer 14, the cap plate 21 is over the rewiring layer 14, and the contacts 15 of the contact group are neither Covered by the wiring layer 13 and not covered by the rewiring layer 14, the above structure forms a void space between the contact 15 and the cover 21, and the FPC 22 electrically connects the contacts 15 in the void space, thereby preventing the FPC 22 from being pinched. Between the cover plate 21 and the sensing wafer 1, the problem that the prior art FPC 22 affects the adhesion of the cover plate 21 to the sensing wafer 1 is overcome. The invention can achieve a seamless fit between the cover plate 21 and the sensing wafer 1, in particular between the cover plate 21 and the rewiring layer 14 of the sensing wafer 1, thereby optimizing the sensing of the biometric information of the wafer 1 to the human body. Detect the effect. The main control unit 23 is configured to transmit and receive data and control commands, and perform data processing. The main control unit 23 may be a circuit composed of discrete components, and may be an integrated circuit chip, which may be a data processor or a main processing unit. Auxiliary processor for the device.

There are various specific ways in which the N-group of contact groups which are neither covered by the wiring layer 13 nor covered by the re-wiring layer 14 are provided on the spacer layer 12. For example, as described above, the spacer layer 12 is formed in a columnar shape, N sets of contact groups are disposed on the cylindrical surface of the spacer layer 12, or both the wiring layer 13 and the rewiring layer 14 are made to have a cross-sectional area smaller than the spacer layer. The cross-sectional area is such that an area not covered by the wiring layer 13 and the rewiring layer 14 is formed at the top of the spacer layer 12, and the N group of contact groups are disposed in the area.

In the preferred embodiment of the present invention, as shown in FIG. 1 to FIG. 4, N sets of contact groups which are neither covered by the wiring layer 13 nor covered by the rewiring layer 14 are disposed on the spacer layer 12 by providing the recesses 142. Thus, a gap 142 is used to create a void space between the cover 21 and the spacer layer 12 of the sensing wafer 1 to electrically connect the contacts 15 to the FPC 22. Specifically, the rewiring layer 14 covers the entire wiring layer 13 and the spacer layer 12, and N recesses 142 penetrating the top and bottom of the rewiring layer 14 are disposed on the side façade of the rewiring layer 14, and the grooves are formed. The position of 142 is corresponding to the position of each group of contact groups. The group of contacts on the top surface of the spacer layer 12 is not covered by the rewiring layer 14. Since the contacts 15 of the contact groups are disposed on the spacer layer 12, the contacts 15 of the contact group are neither covered by the wiring layer 13 nor covered by the rewiring layer 14 by the recesses 142, and the recesses 142 become contacts. 15 and the gap space between the cover plate 21, the FPC 22 electrically connects the contacts 15 in the gap space, thereby preventing the FPC 22 from being sandwiched between the cover plate 21 and the sensing wafer 1, overcoming the prior art FPC 22 affecting the cover. The problem that the board 21 is in contact with the sensing wafer 1. The structure of the groove 142 can achieve a seamless fit between the cover plate 21 and the sensing wafer 1, in particular between the cover plate 21 and the rewiring layer 14 of the sensing wafer 1, thereby optimizing the sensing wafer 1 to human organisms. The detection effect of feature information.

The present invention provides a contact group composed of contacts 15 in a region of the spacer layer 12 which is not covered by the wiring layer 13 and the rewiring layer 14, and is sensed by the contacts 15 surrounding the wiring layer 13 and the rewiring layer 14. The wafer 1 is electrically connected to an external device to output data to an external device. The electrical connection of the FPC 22 as an external device to the sensing wafer 1 is established through the respective contacts 15. The gap space between the contact 15 and the FPC 22 is formed through the recess 142 to avoid the occurrence of the prior art from the upper lead of the sensing wafer 1, and to ensure a close fit between the cover 21 and the sensing wafer 1. At the same time, avoiding the leads above the sensing wafer 1 eliminates the influence on the sensing sensing device 141, so that the information collecting capability of the sensing wafer 1 is ensured.

In the preferred embodiment of the present invention, the human body biometric information refers to human fingerprint feature information, that is, the sensing wafer 1 is a fingerprint sensing chip for sensing human fingerprint feature information; thus the sensing sensing device 141 is a fingerprint sense. The sensing device processing circuit 121 is a fingerprint sensing signal processing circuit. The implementation of the sensing sensing device 141 as a fingerprint sensing device is related to the sensing principle. According to a preferred embodiment of the present invention, the sensing sensing device 141 is based on an electrode plate of a capacitive sensing device and is permeable to the electrode plate. Measuring the difference in capacitance formed by the fingerprint embossed line, and then passing the signal of the sensing signal processing circuit 121 The processing electrical signal reflects the fingerprint characteristic information.

In addition, if the human biometric information is human body pulse characteristic information, the sensing chip 1 is a pulse sensing chip for sensing body pulse characteristic information; if the sensing sensing device 141 is a pulse sensing device, The sensing signal processing circuit 121 is a pulse sensing signal processing circuit.

The invention also proposes a manufacturing method for manufacturing the sensing wafer 1, as shown in FIG. 6, comprising the following steps: A. providing a substrate 11, that is, the flow 51 shown in FIG. 6; B. the flow 52 shown in FIG. The spacer layer 12 is encapsulated on the substrate 11. Specifically, a spacer layer 12 in which the sensing signal processing circuit 121 and the connecting line 122 are packaged is processed on the substrate 11; C. The flow 53 is shown in FIG. A connection pad 131 is disposed on the top of the layer 12, the package connection pad 131 forms a wiring layer 13, and a through hole (not shown) is formed above the connection pad 131, and a conductive material is filled in the through hole to form a connector 132; A region of the layer 12 that is not covered by the wiring layer 13 is provided with a cluster of contacts, and the cluster of contacts is covered with a photoresist.

Specifically, in the wiring layer forming process, at least one connection pad 131 is disposed on the top of the spacer layer 12, so that each connection pad 131 is electrically connected to the sensing signal processing circuit 121 by the connection line 122; and all the connection pads 131 are encapsulated by the insulating material 16. The wiring layer 13 is formed, and the connection pads 131 are not covered by the insulating material 16, so that through-holes surrounded by an insulating material are formed on the tops of the respective connection pads 131; conductive substances are filled into the respective through holes to form the connectors 132.

For the contact group forming procedure, N sets of contact groups are disposed on the top surface of the spacer layer 12 without the wiring layer covering area, N is a natural number not less than 1, and each set of contact groups each includes at least one contact 15 so that each The contact 15 is electrically connected to the sensing signal processing circuit 121 in the spacer layer 12 by using the connecting line 122; The photoresist cap covers the top of each group of contacts.

The above process does not limit the sequence of the program. The wiring layer 13 may be formed first, then the contact group may be set and the photoresist may be sealed. Alternatively, the contact group may be first formed to form the wiring layer 13 to finally cover the photoresist, and the contact group may be first set and The cap photoresist further forms the wiring layer 13. That is, all the programs in step C can be performed simultaneously, or in accordance with the set order, and the order of setting is not limited to form the wiring layer 13, the contact group is set, and the sealing photoresist is the final result of the step process; D. In the flow 54 shown in FIG. 6, the sensing sensing device 141 is disposed on the top of the wiring layer 13, and the rewiring layer 14 is formed by encapsulating the sensing sensing device 141 with an insulating material, so that the rewiring layer 14 covers at least the wiring layer 13 but Does not cover the photoresist.

Specifically, at least one sensing sensing device 141 is disposed on the top of the wiring layer 13 so that each sensing sensing device 141 is electrically connected to each of the connecting members 132. All of the sensing sensing devices 141 are encapsulated with an insulating material 16 that covers at least the wiring layer 13 but does not cover the photoresists, thereby forming the rewiring layer 14.

E. As shown in the flow 55 of FIG. 6, the photoresist is removed, and the contact groups are exposed to form a contact group which is neither covered by the wiring layer 13 nor covered by the rewiring layer 14.

In a preferred embodiment of the invention, the substrate 11 described in the step A is a germanium substrate. In the step C, as shown in the foregoing, the connection pads 131 are arranged in an array structure in rows and columns in the wiring layer 13, then in step D, the sensing sensing devices 141 are arranged in rows and columns in the rewiring layer 14. Array structure.

In the preferred embodiment of the present invention, the "N-group of contact groups are not covered by the wiring layer 13" is employed. As shown in FIGS. 1 to 4, the cross-sectional area of the wiring layer 13 is smaller than the cross-sectional area of the spacer layer 12. Thus, the N sets of contact groups are disposed in a region where the top surface of the spacer layer 12 is not covered by the wiring layer 13. Specifically, the wiring layer 13 is disposed at a central portion of the top surface of the spacer layer 12. The center point O of the top surface of the spacer layer 12 As the symmetry point, two sets of contact points which are point-symmetric with each other are disposed at the top of the spacer layer 12 without being covered by the wiring layer 13. The point symmetrical structural relationship is embodied in that for any of the contacts 15 of a group of contacts, there is a contact 15 in the other contact group that is symmetric with respect to its point. Based on this aspect, a preferred embodiment of the preferred embodiment of the present invention employs "covering the N sets of contact groups without being overlaid by the rewiring layer 14" in that the rewiring layer 14 covers the spacer layer in addition to the entire wiring layer 13. 12. More specifically, the rewiring layer 14 covers the top of the spacer layer 12, and N recesses 142 penetrating the top and bottom of the rewiring layer 14 are disposed on the side elevation of the rewiring layer 14, and each recess 142 The positions are respectively set corresponding to the positions of the respective sets of contact groups, so that the groups of contacts on the top surface of the spacer layer 12 are not covered by the rewiring layer 14. That is, by providing a groove 142 structure on the cylindrical surface of the rewiring layer 14, a window is provided for exposing each of the contact groups. In a preferred embodiment of the invention, "the N sets of contact groups are not covered by the rewiring layer 14", and further implementations can be applied to any implementation other than the one employed in the preferred embodiment of the invention. The group is not covered by the wiring layer 13".

In the preferred embodiment of the present invention, "the N-group of contact groups are not covered by the wiring layer 13", in the manufacturing method of the sensing wafer 1, the wiring layer 13 is disposed on the top of the spacer layer 12 in the step B. The central portion of the surface, and the cross-sectional area of the wiring layer 13 is smaller than the cross-sectional area of the spacer layer 12. In the preferred embodiment of the present invention, the process of forming the N sets of contact groups is specifically: taking the center point O of the top surface of the spacer layer 12 as a symmetrical point, and setting two sets of points symmetrically at the top of the spacer layer 12 without being covered by the wiring layer 13 Contact group. Then, the preferred embodiment of the present invention forms a "make N sets of contact groups not covered by the rewiring layer 14" based on the structural scheme of "make the N sets of contact groups not covered by the wiring layer 13", in sensing In the manufacturing method of the wafer 1, in the step D, the rewiring layer 14 covers the wiring layer 13, and all the regions of the spacer layer 12 which are not covered by the wiring layer 13 and the photoresist; then, in step E, after the photoresist is removed N grooves extending through the top and bottom of the rewiring layer 14 are formed on the side façade of the rewiring layer 14 142, so that each group of contact groups is neither covered by the wiring layer 13 nor covered by the rewiring layer 14. Similarly, the specific procedure of the preferred embodiment of the present invention for "covering the N sets of contact groups without being overlaid by the rewiring layer 14" may also be applied to the program process employed in accordance with the preferred embodiment of the present invention. Any implementation other than "implementing the N sets of contact groups are not covered by the routing layer 13".

In the step E, the program etching for removing the photoresist is specifically performed by etching or removing each photoresist by a dry etching technique or a wet etching process, and exposing each group of contact groups.

The above method utilizes a photoresist to construct a recess 142 capable of exposing the contacts 15 of the contact group to the outside of the sensing wafer 1. Through the structure of the recess 142, the contacts 15 of the contact group are neither covered by the wiring layer 13 nor The rewiring layer 14 is covered, and a void space is formed between the contact 15 and the cover 21, and the FPC 22 electrically connects the contacts 15 in the void space, thereby preventing the FPC 22 from being sandwiched between the cover 21 and the sensing wafer 1. In the meantime, the problem that the prior art FPC 22 affects the contact of the cover plate 21 with the sensing wafer 1 is overcome. The above method utilizes the structure of the recess 142 constructed by the photoresist to achieve a seamless fit between the cover plate 21 and the sensing wafer 1, in particular between the cover plate 21 and the rewiring layer 14 of the sensing wafer 1, and is optimized. The detection effect of the wafer 1 on the biometric information of the human body is sensed.

1‧‧‧Sensor wafer

11‧‧‧Substrate

12‧‧‧ spacer

13‧‧‧ wiring layer

14‧‧‧Rewiring layer

15‧‧‧Contacts

16‧‧‧Insulating substances

121‧‧‧Sensing processing circuit

122‧‧‧Connecting line

131‧‧‧Connecting mat

132‧‧‧Connecting parts

141‧‧‧Sensing sensing device

142‧‧‧ Groove

Claims (27)

A sensing wafer for detecting biometric information of a human body, comprising: a substrate; a spacer layer encapsulated on the substrate; a wiring layer encapsulated on a top of the spacer layer; and a package covering at least the top of the wiring layer a rewiring layer; the spacer layer is further provided with N groups of contacts that are neither covered by the wiring layer nor covered by the rewiring layer, and N is a natural number not less than 1; each group of contacts includes at least each a contact; the rewiring layer is encapsulated with at least one sensing sensing device; the wiring layer is encapsulated with at least one connection pad, and at least one connecting member extending longitudinally through the wiring layer, the top and bottom of the connecting member respectively Electrically connecting a sensing device and a connection pad; the spacing layer is packaged with a sensing signal processing circuit; the connection pads in the wiring layer and the contacts of each group of contacts are electrically connected to the sensing signal processing circuit . The sensing wafer of claim 1, wherein: the wiring layer has a cross-sectional area smaller than a cross-sectional area of the spacer layer, such that the N sets of contact groups are disposed in an area where the top surface of the spacer layer is not covered by the wiring layer . The sensing wafer of claim 1, wherein: the rewiring layer covers the entire wiring layer and the spacer layer, and N recesses penetrating the top and bottom of the rewiring layer are disposed on a side elevation of the rewiring layer And the positions of the respective grooves are respectively set corresponding to the positions of the groups of the contact groups, so that the groups of the contact groups on the top surface of the spacer layer are not covered by the rewiring layer. The sensing chip of claim 2, wherein: The rewiring layer covers the entire wiring layer and the spacer layer, and N recesses penetrating the top and bottom of the rewiring layer are disposed on the side façade of the rewiring layer, and the positions of the grooves are respectively associated with each group of contacts The position of the group is correspondingly set such that each group of contacts on the top surface of the spacer layer is not covered by the rewiring layer. The sensing chip of claim 1, wherein: the sensing sensing device is arranged in an array structure in rows and columns in the rewiring layer, and the connection pad also corresponds to the sensing device in the wiring layer. Arranged in an array structure by row and column. The sensing wafer of claim 2, wherein: the wiring layer is disposed at a central portion of a top surface of the spacer layer; the center point of the top surface of the spacer layer is a symmetrical point, and the top of the spacer layer is not covered by the wiring layer The two sets of contact groups that are point-symmetric with each other. The sensing chip of claim 1, wherein the sensing device transmits the detected human biometric information to the sensing signal processing circuit for signal processing, and the signal processing is performed by using the connecting member and the connecting pad. The post-formed sensing information is output from the sensing chip using the contacts of each set of contact groups. The sensing wafer of claim 1, wherein: the sensing sensing device has a volume greater than a volume of the connection pad. The sensing wafer of any one of claims 1 to 8, wherein: The sensing chip is a fingerprint sensing chip for sensing human fingerprint feature information, the sensing sensing device is a fingerprint sensing device, and the sensing signal processing circuit is a fingerprint sensing signal processing circuit. The sensing wafer of any one of claims 1 to 8, wherein: the sensing wafer is a pulse sensing chip for sensing body pulse characteristic information, the sensing sensing device is a pulse sensing device, The sensing signal processing circuit is a pulse sensing signal processing circuit. An electronic device includes a cover, a flexible printed circuit board, and a main control unit, wherein the electronic device further includes a sensing chip disposed under the cover for detecting biometric information of the human body; The test wafer includes a substrate; a spacer layer encapsulated on the substrate; a wiring layer encapsulated on a top surface of the spacer layer; and a rewiring layer encapsulating and covering at least a top portion of the wiring layer; and the spacer layer is further provided with the The wiring layer covers N sets of contact groups not covered by the rewiring layer, N is a natural number not less than 1; each set of contact groups each includes at least one contact; and the rewiring layer is encapsulated with at least one sensing a sensing device; the wiring layer is provided with at least one connecting pad, and a connecting member extending longitudinally through the wiring layer, the top and the bottom of the connecting member are electrically connected to a sensing sensing device and a connecting pad respectively; The sensing signal processing circuit is packaged, and the connection pads in the wiring layer and the contacts of each group of contacts are electrically connected to the sensing signal processing circuit; The contacts of the N sets of contact groups are electrically connected to the main control unit through a flexible printed circuit board. The electronic device of claim 11, wherein: the wiring layer has a cross-sectional area smaller than a cross-sectional area of the spacer layer, such that the N sets of contact groups are disposed on an area of the top surface of the spacer layer that is not covered by the wiring layer Inside. An electronic device according to claim 11, wherein: the rewiring layer covers the entire wiring layer and the spacer layer, and N recesses penetrating the top and bottom of the rewiring layer are disposed on a side façade of the rewiring layer, and The positions of the respective grooves are respectively set corresponding to the positions of the respective sets of contact groups, so that the groups of contact groups on the top surface of the spacer layer are not covered by the rewiring layer. The electronic device of claim 12, wherein: the rewiring layer covers the entire wiring layer and the spacer layer, and the side surfaces of the rewiring layer are provided with N grooves extending through the top and bottom of the rewiring layer, and The positions of the respective grooves are respectively set corresponding to the positions of the respective sets of contact groups, so that the groups of contact groups on the top surface of the spacer layer are not covered by the rewiring layer. The electronic device of claim 11, wherein: the sensing sensing device is arranged in an array structure in rows and columns in the rewiring layer, and the connection pad is also in the wiring layer corresponding to the sensing device. The columns are arranged in an array structure. The electronic device of claim 12, wherein: The wiring layer is disposed at a central portion of the top surface of the spacer layer; the center point of the top surface of the spacer layer is a symmetrical point, and two sets of contact points that are point-symmetric with each other are not disposed at the top of the spacer layer. The electronic device of claim 11, wherein: the sensing device transmits the detected biometric information to the sensing signal processing circuit for signal processing, and after signal processing, using the connecting member and the connecting pad. The formed sensing information is output from the sensing chip by using contacts of each group of contact groups, and the main control unit receives sensing information outputted from the sensing chip through a flexible printed circuit board. The electronic device of claim 11, wherein: the sensing sensing device has a volume greater than a volume of the connection pad. The electronic device of any one of claims 11 to 18, wherein: the sensing chip is a fingerprint sensing chip for sensing human fingerprint feature information, and the sensing sensing device is a fingerprint sensing device, The sensing signal processing circuit is a fingerprint sensing signal processing circuit. The electronic device of any one of claims 11 to 18, wherein: the sensing chip is a pulse sensing chip for sensing body pulse characteristic information, and the sensing sensing device is a pulse sensing device, The sensing signal processing circuit is a pulse sensing signal processing circuit. A method for manufacturing a sensing wafer, comprising the steps of: A. providing a substrate; B. processing a sensing signal processing circuit and connecting the substrate a spacer layer of the line; C. at least one connection pad is disposed on the top of the spacer layer, so that each connection pad is electrically connected to the sensing signal processing circuit by using the connection line; all the connection pads are encapsulated with an insulating material to form a wiring layer, and the connection is made The pad is not covered by the insulating material, so that a through hole surrounded by the insulating material is formed on the top of each connection pad; a conductive substance is filled into each through hole to form a connecting member; the top surface of the spacer layer is not covered by the wiring layer N sets a group of contacts, N is a natural number not less than 1, each group of contacts includes at least one contact, so that each contact is electrically connected to the sensing signal processing circuit in the spacer layer by using a connecting line; The photoresist cap covers the top of each group of contact groups; D. at least one sensing sensing device is disposed on the top of the wiring layer, so that each sensing sensing device is electrically connected to each connecting component; all sensing sensing devices are encapsulated with an insulating material The insulating material covers at least the wiring layer, but does not cover the photoresist, thereby forming a rewiring layer; E. removing the photoresist, so that each group of contacts is neither covered by the wiring layer nor re-repaired wiring Coverage. The method of manufacturing a sensing wafer according to claim 21, wherein the substrate described in step A is a germanium substrate. The method of manufacturing a sensing wafer according to claim 21, wherein in the step B, the wiring layer is disposed in a central portion of a top surface of the spacer layer, and a cross-sectional area of the wiring layer is smaller than a cross-sectional area of the spacer layer. A method of manufacturing a sensed wafer according to claim 23, wherein: The center point of the top surface of the spacer layer is a symmetrical point, and two sets of contact points that are point-symmetric with each other are disposed at the top of the spacer layer without being covered by the wiring layer. The method for manufacturing a sensing wafer according to claim 21, wherein in the step C, the connection pads are arranged in an array structure in rows and columns in the wiring layer, then in the step D, the sensing sensor device is in the rewiring layer. Arranged in an array structure by row and column. The method of manufacturing a sensing wafer according to claim 21, wherein in the step D, the rewiring layer covers the wiring layer, and all regions of the spacer layer that are not covered by the wiring layer and the photoresist; then in step E After removing the photoresist, N grooves extending through the top and bottom of the rewiring layer are formed on the side façade of the rewiring layer, so that each group of contacts is neither covered by the wiring layer nor The rewiring layer is covered. The sensing wafer manufacturing method according to claim 21 or 26, wherein in step E, each photoresist is removed by etching using a dry etching process or a wet etching process, and each group of contacts is exposed.