TWI597816B - Multilayer film structure - Google Patents

Description

Multilayer film structure

The present invention relates to a film structure, and more particularly to a multilayer film structure.

With the rapid development of science and technology, many technological products are being pushed out, and the advancement of technology, the current electronic devices generally tend to be light, thin and small structural directions, so that electronic devices carry more and more aspects, while functions and functions It is also becoming more and more diverse, and then step by step to improve the quality of life. In view of the above, among the electronic devices and devices, the structure that is the easiest and the first to be noticed should be based on display elements.

According to the above, in the current technology, the application market and demand for forward-looking technologies such as flexible display components are bound to increase. On the other hand, the development of display technology and industry today is based on the increasing popularity of smart phones and tablets. According to a survey conducted by domestic people, the penetration rate of smart phones has reached 65.4%, while the popularity of tablet computers is 29.2%. The popularity of the aforementioned products has led to the development of related application products, and manufacturers are not only facing competition for product prices. It is even more necessary to seek product differentiation from the functions and patterns of mobile devices in order to stand out in the market.

With regard to flexible display elements, the flexible elements of the current multilayer film structure are oriented toward a degree of flexibility and folding, making them useful for products such as electronic paper and wearable components. Application. However, for the application of the above products, the mechanical stress of the flexible component subjected to bending and torsion under various use situations may cause the horizontal stress and the vertical stress to be important in the flexible component. The failure or destruction of components occurs.

Please refer to the first A diagram and the first B diagram, which is the current structural design for the flexible component, mostly for the optimization of the mechanical stress and the design structure under the bending load, and the electronic component 101 is located at The flexible film 102 is on the neutral axis 103, thus ensuring that the aforementioned electronic component 101 does not cause failure due to the maximum horizontal stress. However, from a mechanical point of view, the foregoing design will cause the vertical stress acting on the electronic component 101 to become large, thereby causing the electronic component 101 to fail.

Accordingly, the present invention is directed to improvements in the disadvantages of the prior art and provides a multilayer film structure. When the horizontal stress and the vertical stress generated under mechanical load affect the multilayer film structure, the key components of the multilayer film structure can be released under the mechanical load of the flat or patterned multilayer film structure due to the structural concept designed. Horizontal stress and vertical stress, such as the position of the key components in the structure, can also meet the horizontal stress and vertical stress that are lower than the electronic components can withstand.

It is an object of the present invention to provide a multilayer film structure that is designed to be placed in a multilayer film by electronic components, thereby reducing the effects of horizontal stress and vertical stress on the electronic components under mechanical load.

The present invention provides a multilayer film structure comprising a film body and at least one electronic component. The film body comprises a plurality of film layers and at least one soft film layer, wherein the at least one soft film layer is disposed between the film layers, and at least three neutral axes are respectively located above the at least one soft film layer, internally and And the at least one electronic component is disposed above or below the neutral axis of the film body, wherein the Young's coefficient of the at least one flexible film is less than the Young's modulus of each of the film layers.

The present invention provides an embodiment in which the film layers are disposed above the at least one soft film layer, and the neutral axis above the at least one soft film layer is located at a horizontal center line of the film layers.

The present invention provides an embodiment in which the film layers are disposed under the at least one soft film layer, and the neutral axis under the at least one soft film layer is located at a horizontal center line of the film layers.

The present invention provides an embodiment in which the neutral axis is located at a horizontal centerline position of the at least one soft film layer.

The present invention provides an embodiment in which the at least one electronic component is separated from the neutral axis by a vertical distance.

The present invention provides an embodiment in which the external force is a non-maximal vertical stress and/or a non-maximal horizontal stress when the at least one electronic component is subjected to an external force.

The present invention provides an embodiment in which the at least one electronic component is a diode, a transistor, an integrated circuit, or a hybrid circuit.

The present invention provides an embodiment in which the at least one flexible film layer is a plurality of soft film layers, wherein the at least three neutral axes are a plurality of neutral axes, and the soft film layers are respectively disposed on the film layers. Between these, the neutral axes are respectively located between the soft film layers.

In order to provide a better understanding and understanding of the features and the efficacies of the present invention, the preferred embodiment and the detailed description are as follows:

Please refer to FIG. 2A and FIG. 2B, which are schematic diagrams showing the schematic and flexural state of the multilayer film structure of the present invention. As shown in the figure, the present embodiment is a multilayer film structure 1 which can be applied to a related structure of a display element, since the display element structure is currently developing in the direction of excellent flexibility and foldability. That is to say, in various use cases, the influence of vertical stress and horizontal stress on the mechanical load of key components must be carefully considered and analyzed. In the design of the previous multilayer film structure, only the horizontal stress slowing was emphasized, which did not consider the influence of the vertical stress under the mechanical load on the multilayer film structure 1. Therefore, the multilayer film structure 1 of the present embodiment comprehensively considers and judges the mechanical reliability of the component in actual use in structural design. For the key points of this technology, structural design criteria conforming to the above conditions are proposed, and the multilayer film structure 1 for flexibility and stretchability is applied.

This embodiment provides the multilayer film structure 1 comprising a film body 10 and at least one electronic component 20. The film body 10 includes a plurality of film layers 110 and at least one soft film layer 120. The at least one flexible film layer 120 is disposed between the film layers 10, and at least three neutral axes 21 (shown by broken lines in the drawing) are respectively located above, inside and below the at least one soft film layer 120. The at least one electronic component 20 is disposed above or below the neutral axis 21 (ie, in the vertical direction) of one of the film bodies. The Young's modulus of the at least one flexible film 120 is smaller than the Young's modulus of each of the film layers 10.

In this embodiment, the film body 10 includes the film layers 110, and the film layers 110 comprise a film layer structure of a plurality of materials, such as PSA, TFE-SiNx, Cathode, PDL-P003, PV-SiNx, Gi -SiNx, GB-SiNx/SiOx or HT-PI, etc. The at least one flexible film layer 120 is selected from the stacked structure layer of the film body 10, and the Young's modulus of the structural layer is the smallest, that is, the Young's coefficient of the at least one flexible film 120 is smaller than that of each of the film layers 10. Young's coefficient.

In addition, the film body 10 includes at least three neutral axes 21, wherein the film layers 110 are disposed above the at least one soft film layer 120, and the neutral axis 21 above the at least one soft film layer 120 is located. The horizontal midline position of the film layers 110. The plurality of thin film layers 110 are disposed under the at least one soft film layer 120, and the neutral axis 21 below the at least one soft film layer 120 is located at a horizontal center line position of the film layers 10. The neutral axis 21 is located at a horizontal centerline position of the at least one soft film layer 120.

As described above, the at least one electronic component 20 is disposed above or below the neutral axis 21 inside the at least one flexible film layer 120, that is, the at least one electronic component 20 and the interior of the at least one flexible film 120. The neutral axes 21 are separated by a vertical distance D.

In addition, in the embodiment, the multilayer film structure 1 can be various types of display devices, electronic devices or various types of parts. The at least one electronic component 20 can be a diode, a transistor, an integrated circuit or a hybrid circuit or the like, which can be applied to a variety of devices or components.

Please refer to the third figure, which is a schematic diagram of the mechanical load force of the multilayer film structure of the present invention. As shown in the figure, in the embodiment, the electronic component 20 is located above the neutral axis 21 of one of the film bodies 10, and the neutral axis 21 of the electronic component 20 and the at least one flexible film 120 The vertical distance D is from this distance. In the drawing, the first figure on the right side of the at least one flexible film 120 is expressed as a vertical stress of mechanical load force, and the figure is semicircular, which indicates that the vertical stress closer to the center position is the maximum, and the figure is shown. The central portion is shown as the neutral axis 21 position, so that the closer the vertical stress is to the stress at the neutral axis 21 of the flexible film 120, the greater the stress.

Furthermore, the second representation on the right side of the at least one flexible film 120 is expressed as a horizontal stress of mechanical load force, which presents an illustration of the right right right angle and the lower half right angle, which is closer to the central position. The horizontal stress approaches zero, and the central portion of the figure is shown as the neutral axis 21 position, so the greater the horizontal force is from the position of the neutral axis 21, the greater the force, in other words, from both sides of the neutral axis 21 The horizontal forces of the directions are opposite to each other, and their horizontal forces are gradually increasing in opposite directions.

After the above description, if the electronic component 20 is placed at the position of the neutral axis 21 of the at least one soft film layer 120, the vertical stress of the mechanical load force is maximum, and the horizontal stress of the mechanical load force is close to zero. . Moreover, if the electronic component 20 is placed away from the neutral axis 21 of the at least one soft film layer 120, the vertical stress of the mechanical load force becomes smaller and smaller, and the horizontal stress of the mechanical load force appears. The bigger the trend. According to the stacked structure of the film body 1, the flat mechanical or patterned design can be divided into the main mechanical load force form which may be caused by horizontal stress or/and vertical stress and the failure of the crack. Therefore, in the embodiment, the electronic component 20 is located above (or below) the neutral axis 21 inside the at least one flexible film layer 120, and is separated by the vertical distance D. Thus, the structural concept of the film body 10 proposed in this embodiment enables the electronic component 20 to be located in the film body 10, and the horizontal stress and the vertical stress which can simultaneously satisfy the mechanical load force are lower than that of the electronic component 20. To the extent that it can withstand, the electronic component 20 can be easily affected by the horizontal stress and the vertical stress of the mechanical load force, and can maintain normal operation.

This embodiment is directed to the improvement of the disadvantages of the prior art in that the electronic component is placed on the neutral axis of the flexible film such that the horizontal stress acting on the electronic component approaches zero. However, the prior art only adjusts and sets the influence of the horizontal stress of the mechanical load force, and does not have a relevant means for the vertical stress of the mechanical load force. Therefore, under the structure of the prior art, The vertical stress of the mechanical load bearing is approached to the maximum. Therefore, once subjected to the vertical stress of the mechanical load force, the operation of the electronic component is greatly affected. Therefore, the present invention provides a multilayer film structure 1 which is advantageous in that the multilayer film structure 1 comprises a film body 10 and the at least An electronic component 20. The film body 10 further includes a plurality of film layers 110 and at least one soft film layer 120. The at least one flexible film layer 120 is disposed between the film layers 110, and the at least three neutral axes 21 are respectively located above, inside and below the at least one soft film layer 120. The at least one electronic component 20 is disposed above or below the neutral axis 21 of the film body 10. Soing to adjust the horizontal stress and the vertical stress which may be applied to the at least one electronic component 20, and the horizontal stress and the vertical stress are all within the range that the at least one electronic component 20 can bear without being for the at least one electron. Element 20 causes a performance impact.

Furthermore, in the present invention, it is not limited to the application to the display element alone, and the structural design of the present invention can be utilized with respect to the similar structure of the multilayer film structure 1. In addition, the present invention does not limit the film layer 10 to have only the at least one soft film layer 120. When the at least one flexible film layer 120 is a plurality of soft film layers 120, the at least three neutral axes 21 are a plurality of neutral axes 21, that is, the number of the neutral axes 21 is more than three. The film body 10 will produce more neutral axes 21 due to the influence of the soft film layers 120. The plurality of flexible film layers 120 are respectively disposed between the plurality of thin film layers 110. The plurality of electronic components 20 are respectively located between the plurality of flexible film layers 120, and the at least one electronic component 20 can be a plurality of electronic components. The elements 20 are disposed between the neutral shafts 21, respectively.

In summary, the present invention provides a multilayer film structure comprising a film body and at least one electronic component. The film body comprises a plurality of film layers and at least one soft film layer, wherein the at least one soft film layer is disposed between the film layers, and at least three neutral axes are respectively located above, inside and below the at least one soft film layer And the at least one electronic component is disposed above or below one of the neutral axes of the film body (ie, in a vertical direction), wherein a Young's modulus of the at least one flexible film is less than a Young's modulus of the film layer . The invention can greatly reduce the maximum horizontal stress or/and the maximum vertical stress generated directly or indirectly for the at least one electronic component due to various use conditions, which may result in electrical and optical properties of the at least one electronic component. Reduce even damage and so on. This is to improve the mechanical reliability of the flat or patterned multilayer film element. It is quite helpful for the improvement of its process and structure, and can improve the service life of the multilayer film structure.

As can be seen from the above, the present invention has indeed achieved a breakthrough structure, and has improved invention content, and at the same time, can achieve industrial utilization and progress. When complying with the provisions of the Patent Law, the invention patent application is filed according to law. The Board of Review examiners granted legal patent rights and was praying.

1‧‧‧Multilayer film structure
10‧‧‧film body
110‧‧‧film layer
120‧‧‧Soft film layer
20‧‧‧Electronic components
21‧‧‧Neutral axis
D‧‧‧ vertical distance

Figure 1A is a schematic view of the prior art; Figure 1B is a schematic view of the flexural state of the prior art; Figure 2A is a schematic view of the multilayer film structure of the present invention; A schematic view of the flexural state of the multilayer film structure of the present invention; and a third view: it is a schematic view of the mechanical loading force of the multilayer film structure of the present invention.

1‧‧‧Multilayer film structure

10‧‧‧film body

110‧‧‧film layer

120‧‧‧Soft film layer

20‧‧‧Electronic components

21‧‧‧Neutral axis

D‧‧‧ vertical distance

Claims (7)

A multilayer film structure comprising: a film body comprising a plurality of film layers and at least one soft film layer, the at least one soft film layer being disposed between the film layers, and at least three neutral axes respectively located At least one of the flexible film layers above, inside and below; and at least one electronic component disposed above or below the neutral axis of the film body; wherein the at least one flexible film layer is a plurality of soft film layers The at least three neutral axes are a plurality of neutral axes, and the soft film layers are respectively disposed between the film layers, and the neutral axes are respectively located between the soft film layers. And the Young's modulus of the at least one flexible film is less than the Young's modulus of each of the film layers. The multilayer film structure of claim 1, wherein the film layers are disposed above the at least one soft film layer, and the neutral axis above the at least one soft film layer is located in the film layers Horizontal centerline position. The multilayer film structure of claim 1, wherein the film layers are disposed under the at least one soft film layer, and the neutral axis under the at least one soft film layer is located in the film layers The horizontal midline position. The multilayer film structure of claim 1, wherein the neutral axis is located at a horizontal midline position of the at least one soft film layer. The multilayer film structure of claim 1, wherein the at least one electronic component is at a vertical distance from the neutral axis. The multilayer film structure of claim 1, wherein the external force is a non-maximum vertical stress and/or a non-maximal horizontal stress when the at least one electronic component is subjected to an external force. The multilayer film structure of claim 1, wherein the at least one electronic component is a diode, a transistor, an integrated circuit or a hybrid circuit.