TWI596658B - Protecting apparatus and semiconductor processing equipment including the same - Google Patents

Protecting apparatus and semiconductor processing equipment including the same Download PDF

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Publication number
TWI596658B
TWI596658B TW105129885A TW105129885A TWI596658B TW I596658 B TWI596658 B TW I596658B TW 105129885 A TW105129885 A TW 105129885A TW 105129885 A TW105129885 A TW 105129885A TW I596658 B TWI596658 B TW I596658B
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Taiwan
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opening
window
light transmissive
masks
reaction chamber
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TW105129885A
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Chinese (zh)
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TW201810378A (en
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黃燦華
健寶 黃
伍苗展
李松霖
邱建欽
吳中遠
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漢民科技股份有限公司
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Description

防護裝置及半導體製程機台Guard and semiconductor process machine

本發明是有關一種防護裝置及半導體製程機台,特別是一種可防止監測視窗受汙染之防護裝置及半導體製程機台。The invention relates to a protective device and a semiconductor processing machine, in particular to a protective device and a semiconductor processing machine capable of preventing contamination of a monitoring window.

在半導體製程的薄膜生長過程中,精密的即時量測儀器(In-situ monitor)可透過一監測視窗以監測一工件(workpiece)加工時的溫度或反射率,以監控製程之發展。監測視窗也容易隨著機台生產時間而逐漸受到副產品(By-product)汙染而影響監測結果。因此,為了清除工件生長過程中所沾附在監測視窗上的副產品或異物,需要頻繁地保養機台,例如:先破壞反應腔室的真空態,對該監測視窗進行清潔保養後,再重新密閉反應腔室。然而,上述步驟需要重新拆卸及組裝監測視窗或相關光路元件來進行保養,並暫停生產而降低機台的生產使用率。In the semiconductor film growth process, a sophisticated In-situ monitor monitors the temperature or reflectivity of a workpiece through a monitoring window to monitor the development of the process. The monitoring window is also susceptible to contamination by by-products (By-product) as the machine's production time is affected. Therefore, in order to remove by-products or foreign matter adhering to the monitoring window during the growth of the workpiece, it is necessary to frequently maintain the machine, for example, first destroying the vacuum state of the reaction chamber, cleaning and maintaining the monitoring window, and then resealing. Reaction chamber. However, the above steps require re-disassembly and assembly of the monitoring window or associated optical path components for maintenance, and suspension of production to reduce the production utilization of the machine.

綜上所述,如何提供一種可防止監測視窗受汙染之半導體製程機台便是目前極需努力的目標。In summary, how to provide a semiconductor process machine that can prevent the monitoring window from being contaminated is the goal that is currently in great demand.

本發明提供一種防護裝置及半導體製程機台,其是利用一多片式的透光遮罩,設置於工件與監測視窗之間,使半導體製程中產生的副產品或異物直接沾附在透光遮罩上,而不沾附於監測視窗。當預定的生產次數達成後,即切換至下一片乾淨的透光遮罩即可。The invention provides a shielding device and a semiconductor processing machine, which are arranged between a workpiece and a monitoring window by using a multi-piece light-transmissive mask, so that by-products or foreign matter generated in the semiconductor process are directly adhered to the light-transmitting cover. Cover, not attached to the monitoring window. When the predetermined number of productions is reached, the next clear light transmissive mask can be switched.

本發明一實施例之防護裝置與一反應腔室相連接,且反應腔室具有一第一開口。防護裝置包含一殼體、多個透光遮罩以及一驅動機構。殼體具有一第二開口以及與第二開口相對設置之一視窗,其中殼體之第二開口與反應腔室之第一開口相連接。多個透光遮罩設置於第二開口與視窗之間。驅動機構與多個透光遮罩連接。驅動機構驅動多個透光遮罩移動以切換不同之透光遮罩至第二開口與視窗之間。The guard device of one embodiment of the present invention is coupled to a reaction chamber, and the reaction chamber has a first opening. The guard includes a housing, a plurality of light transmissive masks, and a drive mechanism. The housing has a second opening and a window opposite the second opening, wherein the second opening of the housing is coupled to the first opening of the reaction chamber. A plurality of light transmissive masks are disposed between the second opening and the window. The drive mechanism is coupled to the plurality of light transmissive masks. The driving mechanism drives the plurality of light transmissive masks to switch between the different light transmissive masks to the second opening and the window.

本發明另一實施例之半導體製程機台包含一反應腔室與一防護裝置。反應腔室具有一第一開口,用以進行一半導體製程。防護裝置包含一殼體、多個透光遮罩以及一驅動機構。殼體具有一第二開口以及與第二開口相對設置之一視窗,其中殼體之第二開口與反應腔室之第一開口相連接。多個透光遮罩設置於第二開口與視窗之間。驅動機構與多個透光遮罩連接。驅動機構驅動多個透光遮罩移動以切換不同之透光遮罩至第二開口與視窗之間。A semiconductor process machine according to another embodiment of the present invention includes a reaction chamber and a guard. The reaction chamber has a first opening for performing a semiconductor process. The guard includes a housing, a plurality of light transmissive masks, and a drive mechanism. The housing has a second opening and a window opposite the second opening, wherein the second opening of the housing is coupled to the first opening of the reaction chamber. A plurality of light transmissive masks are disposed between the second opening and the window. The drive mechanism is coupled to the plurality of light transmissive masks. The driving mechanism drives the plurality of light transmissive masks to switch between the different light transmissive masks to the second opening and the window.

以下藉由具體實施例配合所附的圖式詳加說明,當更容易瞭解本發明之目的、技術內容、特點及其所達成之功效。The purpose, technical contents, features, and effects achieved by the present invention will become more apparent from the detailed description of the appended claims.

以下將詳述本發明之各實施例,並配合圖式作為例示。除了這些詳細說明之外,本發明亦可廣泛地施行於其它的實施例中,任何所述實施例的輕易替代、修改、等效變化都包含在本發明之範圍內,並以申請專利範圍為準。在說明書的描述中,為了使讀者對本發明有較完整的瞭解,提供了許多特定細節;然而,本發明可能在省略部分或全部特定細節的前提下,仍可實施。此外,眾所周知的步驟或元件並未描述於細節中,以避免對本發明形成不必要之限制。圖式中相同或類似之元件將以相同或類似符號來表示。特別注意的是,圖式僅為示意之用,並非代表元件實際之尺寸或數量,有些細節可能未完全繪出,以求圖式之簡潔。The embodiments of the present invention will be described in detail below with reference to the drawings. In addition to the detailed description, the present invention may be widely practiced in other embodiments, and any alternatives, modifications, and equivalent variations of the described embodiments are included in the scope of the present invention. quasi. In the description of the specification, numerous specific details are set forth in the description of the invention. In addition, well-known steps or elements are not described in detail to avoid unnecessarily limiting the invention. The same or similar elements in the drawings will be denoted by the same or similar symbols. It is to be noted that the drawings are for illustrative purposes only and do not represent the actual dimensions or quantities of the components. Some of the details may not be fully drawn in order to facilitate the simplicity of the drawings.

請參照圖1,本發明之一實施例之半導體製程機台包含一反應腔室1與一防護裝置2。反應腔室1具有一第一開口10,用以進行一半導體製程。舉例而言,半導體製程可以包含物理氣相沉積(Physical Vapor Deposition,PVD)、化學氣相沉積(Chemical Vapor Deposition,CVD)及離子植入(Ion Implant)等,但不以此為限。Referring to FIG. 1, a semiconductor process machine according to an embodiment of the present invention includes a reaction chamber 1 and a guard 2. The reaction chamber 1 has a first opening 10 for performing a semiconductor process. For example, the semiconductor process may include, but is not limited to, physical vapor deposition (PVD), chemical vapor deposition (CVD), and ion implantation (Ion Implant).

接續上述說明,請繼續參照圖1,防護裝置2包含一殼體21、多個透光遮罩22以及一驅動機構。殼體21具有一第二開口20以及與第二開口20相對設置之一視窗24,其中殼體21之第二開口20與反應腔室1之第一開口10相連接。於一實施例中,殼體21與反應腔室1形成一密閉空間。Following the above description, with continued reference to FIG. 1, the guard 2 includes a housing 21, a plurality of light transmissive masks 22, and a drive mechanism. The housing 21 has a second opening 20 and a window 24 opposite to the second opening 20, wherein the second opening 20 of the housing 21 is connected to the first opening 10 of the reaction chamber 1. In one embodiment, the housing 21 forms a closed space with the reaction chamber 1.

可以理解的是,一監測裝置M可透過視窗24以監測反應腔室1內一工件加工時的溫度或鍍膜反射率等製程參數,以監控一半導體製程。於圖3所示之一實施例中,視窗24更包含一連接元件240用以連接監測裝置M並固定之。It can be understood that a monitoring device M can monitor the process parameters such as temperature or coating reflectance during processing of a workpiece in the reaction chamber 1 through the window 24 to monitor a semiconductor process. In one embodiment shown in FIG. 3, the window 24 further includes a connecting member 240 for connecting to the monitoring device M and being fixed.

請一併參照圖1及圖2,多個透光遮罩22設置於第二開口20與視窗24之間。驅動機構與多個透光遮罩22連接。驅動機構驅動多個透光遮罩22移動以切換不同之透光遮罩22至第二開口20與視窗24之間。較佳者,多個透光遮罩22靠近第二開口設置,亦即透光遮罩22是較靠近於反應腔室1及工件,以直接阻檔來自反應腔室的副產品或異物,使半導體製程中產生的副產品或異物直接沾附在透光遮罩22上,而不沾附於視窗24。當半導體製程機台預定的生產次數(run)達成後,防護裝置即切換至下一片乾淨的透光遮罩即可。藉由上述多個透光遮罩,生產線可無須頻繁地因監測視窗髒汙而暫停半導體製程機台作保養清潔,屆時僅需依照半導體製程機台的原定保養時程一併清潔多個透光遮罩即可。Referring to FIG. 1 and FIG. 2 together, a plurality of transparent masks 22 are disposed between the second opening 20 and the window 24 . The drive mechanism is coupled to the plurality of light transmissive masks 22. The driving mechanism drives the plurality of light transmissive masks 22 to move between the different light transmissive masks 22 to the second opening 20 and the window 24. Preferably, the plurality of light transmissive masks 22 are disposed adjacent to the second opening, that is, the light transmissive mask 22 is closer to the reaction chamber 1 and the workpiece to directly block by-products or foreign matter from the reaction chamber, so that the semiconductor By-products or foreign matter generated in the process are directly adhered to the light-transmitting mask 22 without being attached to the window 24. When the predetermined production run of the semiconductor processing machine is reached, the protective device is switched to the next clean transparent mask. With the above-mentioned plurality of light-transmitting masks, the production line can suspend the maintenance of the semiconductor processing machine without frequent frequent monitoring of the window, and then only need to clean a plurality of transparent maintenance according to the original maintenance schedule of the semiconductor processing machine. A light mask can be used.

,於一實施例中,請參照圖3,多個透光遮罩22是設置於一基座25。因此驅動機構可以驅動基座25旋轉,以切換不同之透光遮罩22至第二開口20與視窗24之間,但不以此為限。於另一實施例中,多個透光遮罩更可以整合為一體。舉例而言,如圖3所示之多個透光遮罩22可以是一體成型的透光板,因此結構設計更為簡單,具有通常知識者當可自行修飾變換,但不以此為限。In an embodiment, referring to FIG. 3 , the plurality of transparent masks 22 are disposed on a pedestal 25 . Therefore, the driving mechanism can drive the base 25 to rotate to switch between the different transparent masks 22 to the second opening 20 and the window 24, but not limited thereto. In another embodiment, the plurality of light transmissive masks can be integrated into one body. For example, the plurality of light-transmissive masks 22 as shown in FIG. 3 may be an integrally formed light-transmitting plate, so that the structural design is simpler, and the person skilled in the art can modify the change by itself, but not limited thereto.

為了增進防護裝置阻檔副產品或異物的功效,請參照圖3,於一實施例中,防護裝置2更包含一管體30,其兩端分別與反應腔室1之第一開口10以及殼體21之第二開口20相連接。較佳者,管體30之側壁包含一進氣接口32以及與進氣接口32相對設置之一出氣接口34,以供一清除(purge)氣流經由進氣接口32導入管體30,並經由出氣接口34排出。依據上述結構,清除氣流可將落入管體30之副產品或異物吹出,以減少副產品或異物落在透光遮罩上,以進一步延長透光遮罩之使用時間。於一實施例中,進氣接口32之內徑可以小於出氣接口34之內徑,以利副產品或異物經由出氣接口34排出。In order to improve the efficacy of the protective device by-product or foreign matter, please refer to FIG. 3. In an embodiment, the shielding device 2 further includes a tube 30, the two ends of which are respectively connected to the first opening 10 of the reaction chamber 1 and the housing. The second openings 20 of 21 are connected. Preferably, the side wall of the pipe body 30 includes an air inlet port 32 and an air outlet port 34 opposite to the air inlet port 32 for introducing a purge airflow into the pipe body 30 via the air inlet port 32, and through the air outlet. The interface 34 is discharged. According to the above structure, the purge airflow can blow out by-products or foreign matter falling into the pipe body 30 to reduce by-products or foreign matter falling on the light-transmitting mask to further extend the use time of the light-transmitting mask. In an embodiment, the inner diameter of the intake port 32 may be smaller than the inner diameter of the air outlet port 34 to facilitate the discharge of by-products or foreign objects through the air outlet interface 34.

為了維持防護裝置處於真空狀態並同時驅動多個透光遮罩,請參照圖3,於一實施例中,驅動機構23包含一旋轉饋通( rotary feedthrough )與一驅動馬達27連接。因此,驅動機構23可以驅動基座25旋轉,以切換不同之透光遮罩22至第二開口20與視窗24之間,同時又保持防護裝置2維持於真空狀態。In order to maintain the guard in a vacuum state and simultaneously drive a plurality of light transmissive masks, please refer to FIG. 3. In an embodiment, the drive mechanism 23 includes a rotary feedthrough connected to a drive motor 27. Therefore, the driving mechanism 23 can drive the base 25 to rotate to switch between the different light-transmitting masks 22 to the second opening 20 and the window 24 while maintaining the guard 2 in a vacuum state.

請參照圖4,於一實施例中,多個透光遮罩22設置於一帶狀體28。帶狀體28與一滾軸26相連接,且驅動機構23驅動滾軸26以切換不同之透光遮罩22至第二開口20與視窗24之間。需說明的是,多個透光遮罩可以分別設置於一帶狀體或一體成型而構成一帶狀體。舉例而言,多個透光遮罩可以分段設置於一履帶上,藉由滾軸轉動履帶以切換不同之透光遮罩;或,多個透光遮罩可以是一體成型的透光材質而構成一長條狀的捲帶,藉由滾軸轉動捲帶以切換乾淨的透光遮罩至第二開口20與視窗24之間。具有通常知識者當可自行修飾變換,但不以此為限。Referring to FIG. 4 , in an embodiment, a plurality of light transmissive masks 22 are disposed on a strip 28 . The strip 28 is coupled to a roller 26 and the drive mechanism 23 drives the roller 26 to switch between the different light transmissive masks 22 to the second opening 20 and the window 24. It should be noted that the plurality of light-transmitting masks may be respectively disposed on a strip or integrally formed to form a strip. For example, a plurality of light-transmissive masks may be segmented on a crawler belt, and the crawler belts are rotated by the rollers to switch different light-transmitting masks; or, the plurality of light-transmitting masks may be integrally formed transparent materials. To form a long strip, the web is rotated by a roller to switch the clean light transmissive mask between the second opening 20 and the window 24. Those who have the usual knowledge can modify the transformation by themselves, but not limited to this.

請一併參照圖1至圖4,本發明一實施例之半導體製程機台包含一反應腔室1以及一防護裝置2,其中防護裝置2與一反應腔室1相連接。可以理解的是,本發明之半導體製程機台更包含實現半導體製程所需的其它元件。舉例而言,加熱器以將工件加熱至所需之製程溫度;薄膜成長時需要反應氣體源;離子植入時需要離子源產生器等。上述實現半導體製程所需的元件為習知之技術,且非為本發明之主要技術特徵,因此加以省略。防護裝置2包含一殼體21、多個透光遮罩22以及一驅動機構23。關於防護裝置2之各元件的技術特徵、彼此間之連接關係以及與反應腔室1之連接關係,已如前述,此即不再贅述。Referring to FIG. 1 to FIG. 4 together, a semiconductor process machine according to an embodiment of the invention comprises a reaction chamber 1 and a protection device 2, wherein the protection device 2 is connected to a reaction chamber 1. It will be appreciated that the semiconductor process tool of the present invention further includes other components required to implement the semiconductor process. For example, the heater heats the workpiece to the desired process temperature; the reaction gas source is required for film growth; the ion source generator is required for ion implantation. The above-described components required for realizing the semiconductor process are conventional techniques and are not the main technical features of the present invention, and therefore will be omitted. The guard 2 includes a housing 21, a plurality of light transmissive masks 22, and a drive mechanism 23. The technical features of the respective components of the guard 2, the connection relationship with each other, and the connection relationship with the reaction chamber 1 have been described above, and thus will not be described again.

綜合上述,本發明之一種防護裝置,其是利用一多片式的透光遮罩,設置於工件與監測視窗之間,使半導體製程中產生的副產品或異物直接沾附在透光遮罩上,而不沾附於監測視窗。當預定的生產次數達成後,即切換至下一片乾淨的透光遮罩即可。In summary, the protective device of the present invention utilizes a multi-piece light-transmissive mask disposed between the workpiece and the monitoring window to directly adhere the by-product or foreign matter generated in the semiconductor process to the light-transmitting mask. Without sticking to the monitoring window. When the predetermined number of productions is reached, the next clear light transmissive mask can be switched.

以上所述之實施例僅是為說明本發明之技術思想及特點,其目的在使熟習此項技藝之人士能夠瞭解本發明之內容並據以實施,當不能以之限定本發明之專利範圍,即大凡依本發明所揭示之精神所作之均等變化或修飾,仍應涵蓋在本發明之專利範圍內。The embodiments described above are only intended to illustrate the technical idea and the features of the present invention, and the purpose of the present invention is to enable those skilled in the art to understand the contents of the present invention and to implement the present invention. That is, the equivalent variations or modifications made by the spirit of the present invention should still be included in the scope of the present invention.

1‧‧‧反應腔室
10‧‧‧第一開口
2‧‧‧防護裝置
20‧‧‧第二開口
21‧‧‧殼體
22‧‧‧多個透光遮罩
23‧‧‧驅動機構
24‧‧‧視窗
240‧‧‧連接元件
25‧‧‧基座
26‧‧‧滾軸
27‧‧‧驅動馬達
28‧‧‧帶狀體
30‧‧‧管體
32‧‧‧進氣接口
34‧‧‧出氣接口
M‧‧‧監測裝置
1‧‧‧reaction chamber
10‧‧‧ first opening
2‧‧‧Protection devices
20‧‧‧second opening
21‧‧‧ housing
22‧‧‧Multiple light-transmissive masks
23‧‧‧ drive mechanism
24‧‧‧Window
240‧‧‧Connecting components
25‧‧‧Base
26‧‧‧Rolling
27‧‧‧Drive motor
28‧‧‧Strip
30‧‧‧pipe body
32‧‧‧Intake interface
34‧‧‧Exhaust interface
M‧‧‧Monitor

圖1為一示意圖,顯示本發明一實施例之防護裝置及其半導體製程機台。 圖2為一示意圖,顯示本發明一實施例之多個透光遮罩之俯視圖。 圖3為一示意圖,顯示本發明另一實施例之防護裝置及其半導體製程機台。 圖4為一曲線圖,顯示本發明再一實施例之防護裝置及其半導體製程機台。1 is a schematic view showing a guard device and a semiconductor process machine thereof according to an embodiment of the present invention. 2 is a schematic view showing a plan view of a plurality of light transmissive masks in accordance with an embodiment of the present invention. 3 is a schematic view showing a guard device and a semiconductor process machine thereof according to another embodiment of the present invention. 4 is a graph showing a guard device and a semiconductor process machine thereof according to still another embodiment of the present invention.

1‧‧‧反應腔室 1‧‧‧reaction chamber

10‧‧‧第一開口 10‧‧‧ first opening

2‧‧‧防護裝置 2‧‧‧Protection devices

20‧‧‧第二開口 20‧‧‧second opening

21‧‧‧殼體 21‧‧‧ housing

22‧‧‧多個透光遮罩 22‧‧‧Multiple light-transmissive masks

24‧‧‧視窗 24‧‧‧Window

M‧‧‧監測裝置 M‧‧‧Monitor

Claims (22)

一種防護裝置,與一反應腔室相連接,且該反應腔室具有一第一開口,該防護裝置包含: 一殼體,具有一第二開口以及與該第二開口相對設置之一視窗,其中該殼體之該第二開口與該反應腔室之該第一開口相連接; 多個透光遮罩,設置於該第二開口與該視窗之間;以及 一驅動機構,與該多個透光遮罩連接,該驅動機構驅動該多個透光遮罩移動以切換不同之該透光遮罩至該第二開口與該視窗之間。A guard device is coupled to a reaction chamber, and the reaction chamber has a first opening, the guard device comprising: a housing having a second opening and a window opposite the second opening, wherein The second opening of the housing is connected to the first opening of the reaction chamber; a plurality of transparent masks are disposed between the second opening and the window; and a driving mechanism, and the plurality of transparent a light mask connection, the driving mechanism driving the plurality of light transmissive masks to switch between the different light transmissive masks to the second opening and the window. 如請求項1所述之防護裝置,更包含: 一管體,其兩端分別與該反應腔室之該第一開口以及該殼體之該第二開口相連接。The protection device of claim 1, further comprising: a tube body, the two ends of which are respectively connected to the first opening of the reaction chamber and the second opening of the housing. 如請求項2所述之防護裝置,其中該管體之側壁包含一進氣接口以及與該進氣接口相對設置之一出氣接口,以供一清除(Purge)氣流經由該進氣接口導入該管體,並經由該出氣接口排出。The protection device of claim 2, wherein the side wall of the tube body comprises an air inlet interface and an air outlet interface opposite to the air inlet interface, so that a Purge airflow is introduced into the tube through the air inlet interface. The body is discharged through the outlet interface. 如請求項3所述之防護裝置,其中該進氣接口之內徑小於該出氣接口之內徑。The guard device of claim 3, wherein an inner diameter of the air inlet interface is smaller than an inner diameter of the air outlet interface. 如請求項1所述之防護裝置,其中該多個透光遮罩靠近該第二開口設置。The protective device of claim 1, wherein the plurality of light transmissive masks are disposed adjacent to the second opening. 如請求項1所述之防護裝置,其中該多個透光遮罩整合為一體。The protective device of claim 1, wherein the plurality of light transmissive masks are integrated. 如請求項1所述之防護裝置,其中該視窗更包含一連接元件,用以連接一監測裝置。The protective device of claim 1, wherein the window further comprises a connecting component for connecting to a monitoring device. 如請求項1所述之防護裝置,其中該多個透光遮罩設置於一基座,且該驅動機構驅動該基座旋轉,以切換不同之該透光遮罩至該第二開口與該視窗之間。The protection device of claim 1, wherein the plurality of light transmissive masks are disposed on a base, and the driving mechanism drives the base to rotate to switch different light transmissive masks to the second opening Between windows. 如請求項8所述之防護裝置,其中該驅動機構包含一旋轉饋通( rotary feedthrough )。The guard of claim 8 wherein the drive mechanism includes a rotary feedthrough. 如請求項1所述之防護裝置,其中該多個透光遮罩設置於一帶狀體,該帶狀體與一滾軸相連接,且該驅動機構驅動該滾軸以切換不同之該透光遮罩至該第二開口與該視窗之間。The protection device of claim 1, wherein the plurality of light-transmitting masks are disposed on a strip body, the strip-shaped body is coupled to a roller, and the driving mechanism drives the roller to switch differently. A light mask is placed between the second opening and the window. 如請求項1所述之防護裝置,其中該殼體與該反應腔室形成一密閉空間。The protective device of claim 1, wherein the housing forms a closed space with the reaction chamber. 一種半導體製程機台,包含: 一反應腔室,具有一第一開口,用以進行一半導體製程;以及 一防護裝置,包含: 一殼體,具有一第二開口以及與該第二開口相對設置之一視窗,其中該殼體之該第二開口與該反應腔室之該第一開口相連接; 多個透光遮罩,設置於該第二開口與該視窗之間;以及 一驅動機構,設置於該殼體內,該驅動機構驅動該多個透光遮罩移動以切換不同之該透光遮罩至該第二開口與該視窗之間。A semiconductor processing machine comprising: a reaction chamber having a first opening for performing a semiconductor process; and a guard comprising: a housing having a second opening and disposed opposite the second opening a window, wherein the second opening of the housing is connected to the first opening of the reaction chamber; a plurality of light transmissive masks disposed between the second opening and the window; and a driving mechanism Provided in the housing, the driving mechanism drives the plurality of transparent masks to move between the different transparent masks to the second opening and the window. 如請求項12所述之半導體製程機台,更包含: 一管體,其兩端分別與該反應腔室之該第一開口以及該殼體之該第二開口相連接。The semiconductor processing machine of claim 12, further comprising: a tube body, the two ends of which are respectively connected to the first opening of the reaction chamber and the second opening of the housing. 如請求項13所述之半導體製程機台,其中該管體之側壁包含一進氣接口以及與該進氣接口相對設置之一出氣接口,以供一清除氣流經由該進氣接口導入該管體,並經由該出氣接口排出。The semiconductor processing machine of claim 13, wherein the sidewall of the tube body comprises an air inlet interface and an air outlet interface opposite to the air inlet interface, wherein a clear airflow is introduced into the tube body through the air inlet interface. And discharged through the outlet interface. 如請求項14所述之半導體製程機台,其中該進氣接口之內徑小於該出氣接口之內徑。The semiconductor processing machine of claim 14, wherein an inner diameter of the air inlet interface is smaller than an inner diameter of the air outlet interface. 如請求項12所述之半導體製程機台,其中該多個透光遮罩靠近該第二開口設置。The semiconductor processing machine of claim 12, wherein the plurality of light transmissive masks are disposed adjacent to the second opening. 如請求項12所述之半導體製程機台,其中該多個透光遮罩整合為一體。The semiconductor processing machine of claim 12, wherein the plurality of light transmissive masks are integrated. 如請求項12所述之半導體製程機台,其中該視窗更包含一連接元件,用以連接一監測裝置。The semiconductor processing machine of claim 12, wherein the window further comprises a connecting component for connecting to a monitoring device. 如請求項12所述之半導體製程機台,其中該多個透光遮罩設置於一基座,且該驅動機構驅動該基座旋轉,以切換不同之該透光遮罩至該第二開口與該視窗之間。The semiconductor processing machine of claim 12, wherein the plurality of light transmissive masks are disposed on a base, and the driving mechanism drives the base to rotate to switch different light transmissive masks to the second opening Between this window and the window. 如請求項19所述之半導體製程機台,其中該驅動機構包含一旋轉饋通。The semiconductor process machine of claim 19, wherein the drive mechanism comprises a rotary feedthrough. 如請求項12所述之半導體製程機台,其中該多個透光遮罩設置於一帶狀體,該帶狀體與一滾軸相連接,且該驅動機構驅動該滾軸以切換不同之該透光遮罩至該第二開口與該視窗之間。The semiconductor processing machine of claim 12, wherein the plurality of light transmissive masks are disposed on a strip body, the strip body is coupled to a roller, and the driving mechanism drives the roller to switch between different ones. The light transmissive mask is between the second opening and the window. 如請求項12所述之半導體製程機台,其中該殼體與該反應腔室形成一密閉空間。The semiconductor processing machine of claim 12, wherein the housing forms a closed space with the reaction chamber.
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003052468A1 (en) * 2001-12-19 2003-06-26 Nikon Corporation Film forming device, and production method for optical member
TWM336266U (en) * 2007-12-27 2008-07-11 Bay Zu Prec Co Ltd Mask device for use with a vacuum equipment window
US20140174351A1 (en) * 2012-12-21 2014-06-26 Tokyo Electron Limited Substrate position detecting apparatus, substrate processing apparatus using substrate position detecting apparatus, and deposition apparatus
TWM501438U (en) * 2015-01-28 2015-05-21 Gold Choice Electric Technology Co Ltd Frequency control mask mechanical structure for vacuum viewing window

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003052468A1 (en) * 2001-12-19 2003-06-26 Nikon Corporation Film forming device, and production method for optical member
TWM336266U (en) * 2007-12-27 2008-07-11 Bay Zu Prec Co Ltd Mask device for use with a vacuum equipment window
US20140174351A1 (en) * 2012-12-21 2014-06-26 Tokyo Electron Limited Substrate position detecting apparatus, substrate processing apparatus using substrate position detecting apparatus, and deposition apparatus
TWM501438U (en) * 2015-01-28 2015-05-21 Gold Choice Electric Technology Co Ltd Frequency control mask mechanical structure for vacuum viewing window

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