TWI596443B - Light-emitting device used in peripheral exposure apparatus - Google Patents

Description

Light irradiation device for peripheral exposure device

The present invention relates to a light irradiation device for a peripheral exposure apparatus, which performs light irradiation on a periphery of a substrate edge portion of a substrate on which a semiconductor substrate, a glass substrate for a liquid crystal display device, a glass substrate for a photomask, or the like is coated with a photoresist, and The excess resist at the edge portion is removed and exposure is performed.

Conventionally, in the manufacturing process of a semiconductor such as an IC (Integrated Circuit) or an LSI (Large Scale Integrated circuit), a photoresist is applied onto the surface of the semiconductor wafer, and the resist layer is exposed and developed through a mask to form a semiconductor layer. Circuit graphics.

As a method of applying a resist on the surface of a semiconductor wafer, a spin coating method is generally employed. That is, the wafer is placed on a rotating table, and a resist is dropped and rotated around the center of the surface of the wafer, and the entire surface of the wafer is coated with a resist by centrifugal force.

According to this spin coating method, although not only a resist is applied in the circuit pattern forming region at the central portion of the wafer but also at the edge portion of the wafer where the circuit pattern is not formed, in many cases, the wafer transport device is used to transport the wafer. Hold the crystal At the edge portion of the wafer, if the resist remains in the edge portion of the wafer, a part of the resist peels off and falls off during wafer conveyance. Further, when the resist at the edge portion of the wafer is detached and the detached resist adheres to the circuit pattern forming region of the wafer, the desired circuit pattern cannot be formed, and the yield is also lowered. Therefore, in general, exposure of a resist is performed using a peripheral exposure apparatus that irradiates light to the periphery including the edge portion of the wafer, and excess resist applied to the edge portion of the wafer is removed. Such a light irradiation device for a peripheral exposure device is described, for example, in Patent Document 1.

The light irradiation device for a peripheral exposure device (edge exposure device) described in Patent Document 1 includes a light source unit having a lamp inside, and a first light guide that guides light emitted from the light source unit; An optical element (quartz rod) that mixes light emitted by the first light guide; a second light guide that guides light emitted by the light mixing optical element; and an illumination head that projects light of the second light guide onto the edge portion of the substrate, and The light irradiated by the lamp is concentrated to a predetermined area of the edge portion of the substrate.

After exposure by the peripheral exposure device, the excess resist on the edge portion of the wafer is removed by etching or the like, but if the excess resist is not completely removed, when a small amount remains on the wafer (that is, when a so-called gray region is generated), This may cause the resist to fall off in the post process. Therefore, preferably, the cross-sectional shape of the resist end after removing the excess resist (that is, the cross-sectional shape of the resist end remaining in the circuit pattern forming region) is the circuit pattern forming region and the wafer edge There is a sharp rise (ie, less gradual) shape between the parts.

The appearance of the gray area appearing above is caused by the projection from the peripheral exposure device The intensity distribution of light incident on the edge portion of the substrate. That is, the light irradiation intensity distribution projected from the peripheral exposure device to the edge portion of the substrate may be insufficiently exposed between the circuit pattern forming region and the wafer edge portion if the light pattern is gently changed between the circuit pattern forming region and the wafer edge portion. In the region, the cross-sectional shape of the resist end remaining in the circuit pattern forming region also becomes a gentle shape (that is, a gray region appears), and therefore, the light irradiation intensity distribution projected from the peripheral exposure device to the edge portion is preferably A sharply rising (i.e., less gradual) shape is formed between the circuit pattern forming region and the wafer edge portion. Therefore, in the peripheral exposure apparatus described in Patent Document 1, a rectangular slit is formed in the irradiation head, and the light mixed by the optical mixing optical element is projected through the slit onto the substrate.

Patent Document 1: License No. 3947365.

According to the light irradiation device for a peripheral exposure device described in Patent Document 1, the light projected on the substrate passes through the slit and becomes only a rectangular light beam that restricts the diffusion angle to some extent (that is, substantially parallel). The light beam), therefore, a relatively sharp rise (i.e., less gradual) of the intensity distribution between the circuit pattern forming region and the wafer edge portion, and to some extent, suppresses the generation of the gray region.

Recently, however, circuits formed on a wafer have become more and more integrated, and circuit patterns have become more and more miniaturized. Therefore, there is a need for a light irradiation device for a peripheral exposure device between a circuit pattern and a wafer edge portion. It is possible to project light of an irradiation intensity distribution which is sharply increased (i.e., more uneven) than ever.

In order to make the light irradiation intensity distribution projected on the substrate sharply rise between the circuit pattern forming region and the edge portion of the wafer, the projection on the substrate can be improved. The intensity of the light on the light itself, but if the increased intensity of the illumination exceeds the required level, unexpected stray light is generated due to reflection of the optical member or the resist surface, etc., if the stray light is irradiated to the formation region of the circuit pattern There is a so-called pattern damage, so that the circuit pattern of the desired resolution cannot be obtained.

The present invention has been made in view of the above circumstances and, in view of the above object, a light irradiation device for a peripheral exposure device which can effectively suppress the occurrence of pattern damage while also irradiating a formation region of a circuit pattern and an edge of a wafer. Light with a sharply rising intensity distribution between the parts.

In order to achieve the above object, a light irradiation device for a peripheral exposure apparatus according to the present invention is a light source including a light source that emits light and that illuminates the periphery of an edge portion of an object to be irradiated and exposes the edge portion. The light irradiation device of the peripheral exposure device is characterized in that the light source forms a predetermined light intensity distribution, and the light intensity around the edge portion of the object to be irradiated becomes lower from the inner side to the outer side as the object to be irradiated.

According to this configuration, the light having a sharply rising (i.e., not gradual) illumination intensity distribution is irradiated toward the periphery of the edge portion of the object to be irradiated, and therefore, the resist of the circuit pattern forming region can be accurately retained while being accurately removed. The resist at the edge of the object to be irradiated. Further, since the light intensity around the edge portion of the object to be irradiated is configured to be lower from the inside to the outside as the object to be irradiated, it is possible to suppress unexpected stray light caused by reflection of the optical member or the resist surface. When generated, the occurrence of so-called pattern damage can be suppressed.

Further, the light source may be configured to include a discharge lamp that emits light, And a light guide composed of a plurality of optical fiber lines that guide light of the discharge lamp. The light guide has a light incident surface, and the plurality of optical fiber lines are gathered into a circular shape and incident on the light from the discharge lamp; and the light exit surface is formed by folding the plurality of optical fiber lines into a rectangular shape and emitting the light incident from the discharge lamp. The light exit surface is composed of a first region in which a part of the plurality of optical fiber lines located at the center portion is disposed on the light incident surface, and a second region in which a part of the plurality of optical fiber lines located in the peripheral portion is disposed on the light incident surface. Around the edge portion of the object to be irradiated, the light emitted from the first region is closer to the inner side of the object to be irradiated than the light emitted from the second region. Further, in this case, a plurality of optical fiber lines may be randomly arranged.

Further, the substrate may be provided with a substrate disposed in parallel with the object to be irradiated, and a plurality of light-emitting elements two-dimensionally disposed on the substrate to form a rectangular light exit surface, and the light source is parallel on both sides opposite to the light exit surface. In the direction, a specified light intensity distribution is formed. Further, in this case, a lens may be provided, in which the light sources are disposed in the optical paths of the plurality of light-emitting elements, and the light emitted from the respective light-emitting elements is shaped or formed by substantially parallel light. Further, in this case, the light exit surface may be configured by a first region that emits light of a first intensity and a second region that emits light of a second intensity lower than the first intensity, in the object to be irradiated Around the edge portion, the light emitted from the first region is closer to the inner side of the object to be irradiated than the light emitted from the second region.

Further, it is preferable that the light emitted from the first region is irradiated onto the object to be irradiated.

Further, it is preferable that at least a part of the light emitted from the second region is irradiated to the outside of the object to be irradiated.

In addition, the size of the first area and the second area may be substantially equal.

Further, preferably, a light mixer may be further provided which mixes the light emitted from the light exit surface and emits the light, and has a substantially rectangular cross section. Further, in this case, the optical hybrid may be configured as a glass rod that mixes the light emitted from the first region and the light emitted from the second region. Further, the optical hybrid may have a structure in which a first glass rod that mixes light emitted from the first region and a second glass rod that mixes light emitted from the second region.

Further, preferably, the light contains a wavelength of light that acts at least on the resist layer coated on the object to be irradiated.

As described above, according to the present invention, it is possible to realize a light for a peripheral exposure device which can suppress generation of pattern damage and can illuminate light having a sharply rising irradiation intensity distribution between a circuit pattern forming region and a wafer edge portion. Irradiation device.

In order to better understand the above and other aspects of the present invention, the preferred embodiments are described below, and in conjunction with the drawings, the detailed description is as follows:

1, 2, 3, 4‧‧‧ peripheral exposure devices

10‧‧‧Rotating mechanism

10a‧‧‧XY workbench

12‧‧‧Rotating motor

14‧‧‧Motor shaft

16‧‧‧Rotary chuck

20‧‧‧Slit translucent cover

100, 200, 300, 400‧‧‧ light irradiation devices

110‧‧‧Light source unit

112‧‧‧Discharge lamp

114‧‧‧Oval mirror

116‧‧‧Shell

116a‧‧‧ front panel

118‧‧‧Fixed parts

120, 220‧‧‧ light guide

120a, 220a‧‧‧ incident end face

120b, 220b‧‧‧ exit end face

121, 221‧‧‧ fiber optic cable

122‧‧‧First connector

124‧‧‧Second connector

130, 230‧‧‧ illuminated head

131, 231‧‧‧ first glass rod

132, 232‧‧‧second glass rod

133, 134‧ ‧ lens

135‧‧‧Mirror

331‧‧‧ glass rod

401‧‧‧ circuit board

402‧‧‧LED

403‧‧‧first lens

404‧‧‧second lens

405‧‧‧ third lens

410‧‧‧Light guide

C‧‧‧ Center

CA‧‧‧Circuit pattern forming area

L‧‧‧Light

PA‧‧‧ illumination graphics

PA1‧‧‧ first illumination graphic

PA2‧‧‧second illumination pattern

W‧‧‧Substrate

(a) and (b) of FIG. 1 are views showing a schematic configuration of a peripheral exposure apparatus on which a light irradiation device according to a first embodiment of the present invention is mounted.

2(a) and 2(b) are explanatory views of the structure of a light guide provided in the light irradiation device according to the first embodiment of the present invention.

FIG. 3 is a view showing the light irradiation device according to the first embodiment of the present invention; Schematic diagram of the illumination intensity distribution of the light incident on the incident end face of the light guide.

FIG. 4 is a view of the first glass rod and the second glass rod provided in the light irradiation device according to the first embodiment of the present invention as seen from the emission end surface side of the light guide.

FIG. 5 is a view showing an illumination pattern of light projected from the light irradiation device according to the first embodiment of the present invention to the periphery of the edge portion of the substrate.

FIG. 6 is a schematic diagram showing an irradiation intensity distribution of an irradiation pattern projected from the light irradiation device according to the first embodiment of the present invention around the edge portion of the substrate.

(a) and (b) of FIG. 7 are schematic configuration diagrams showing a peripheral exposure apparatus in which the light irradiation device according to the second embodiment of the present invention is mounted.

8(a) and 8(b) are views for explaining a light guide structure provided in the light irradiation device according to the second embodiment of the present invention.

FIG. 9 is a view of the first glass rod and the second glass rod provided in the light irradiation device according to the second embodiment of the present invention as seen from the emission end surface side of the light guide.

FIG. 10 is a view for explaining an irradiation pattern of light projected to the periphery of the edge portion of the substrate from the light irradiation device according to the second embodiment of the present invention.

FIG. 11 is a view showing a schematic configuration of a peripheral exposure apparatus in which the light irradiation device according to the third embodiment of the present invention is mounted.

FIG. 12 is a view for explaining an irradiation pattern of light projected to the periphery of the edge portion of the substrate from the light irradiation device according to the third embodiment of the present invention.

FIG. 13 is a schematic configuration diagram showing a peripheral exposure apparatus on which the light irradiation device according to the fourth embodiment of the present invention is mounted.

14(a) and 14(b) are diagrams for explaining illumination according to a fourth embodiment of the present invention. A diagram of the internal structure of the device.

Hereinafter, embodiments of the present invention will be further described in detail with reference to the accompanying drawings. In addition, the same or corresponding parts in the drawings are denoted by the same reference numerals, and the description thereof will not be repeated.

(First embodiment)

1(a) and 1(b) are diagrams showing a schematic configuration of a main part of a peripheral exposure apparatus 1 in which a light irradiation device 100 according to a first embodiment of the present invention is mounted, and Fig. 1(a) is a view A plan view of the peripheral exposure device 1 and FIG. 1(b) are side views of the peripheral exposure device 1. The peripheral exposure apparatus 1 of the present embodiment is a device that rotates the disk-shaped substrate W and irradiates the periphery of the edge portion of the substrate W with light to remove the excess resist at the edge portion. The rotating mechanism 10 in which the substrate W rotates and the light irradiation device 100 that performs light irradiation. In FIGS. 1(a) and 1(b), for convenience of explanation, the two axes orthogonal to the surface of the substrate W (that is, the horizontal plane) and orthogonal to each other are shown in the XYZ orthogonal coordinate system as the X-axis. The Y-axis and the axis orthogonal to the X-axis and the Y-axis are represented as the Z-axis, and the XYZ orthogonal coordinate system will be appropriately described below.

The rotating mechanism 10 has a rotary electric machine 12, a motor shaft 14, and a rotary chuck 16. The rotary chuck 16 is a disk-shaped member that is coupled to the rotary electric machine 12 via the motor shaft 14 and rotates in accordance with the rotation of the motor shaft 14. The center C of the substrate W is disposed on the rotary shaft AX of the rotary electric machine 12 from the rear surface. Vacuum adsorption substrate W Fixed in a roughly normal position. Therefore, the rotational motion of the rotary electric machine 12 is transmitted to the rotary collet 16 through the motor shaft 14, and the substrate W fixed to the rotary collet 16 is rotated in the XY plane.

The light irradiation device 100 is a device that irradiates light around the edge portion of the substrate W, and includes a light source unit 110, a light guide 120, and an irradiation head 130.

The light source unit 110 includes a discharge lamp 112, an elliptical mirror 114 that reflects the light L emitted from the discharge lamp 112, and a casing 116 that houses the discharge lamp 112 and the elliptical mirror 114. Further, on the front panel 116a of the casing 116, a fixing member 118 that is connected to the first connector 122 (described later) of the light guide 120 and supports and fixes the base end side (the incident end surface 120a side) of the light guide 120 is attached.

The discharge lamp 112 is a so-called UV lamp having a discharge medium composed of mercury or a rare gas and having an emission spectrum in an ultraviolet wavelength region, and the arc bright spot of the discharge lamp 112 substantially coincides with the first focus position of the elliptical mirror 114. Mode configuration.

The elliptical mirror 114 is a bowl-shaped mirror that reflects the light L emitted from the discharge lamp 112 toward the light guide 120. In the present embodiment, the light L reflected by the elliptical mirror 114 is on the incident end surface 120a of the light guide 120. It consists of a roughly circular concentrating method.

The light guide 120 is a light guiding member that guides the light L emitted from the discharge lamp 112 in the X-axis direction, and is composed of n (for example, 500) optical fiber lines 121. The outer peripheral surface of the light guide 120 (that is, the n optical fiber lines 121) is covered by a tube (not shown), and is attached to the outer peripheral surface of the light guide 120 at the proximal end side (the side of the incident end surface 120a). The first connector 122 of the fixture 118 is attached. Further, a second connector 124 to which the irradiation head 130 can be attached is attached to the outer peripheral surface of the front end portion side (the side of the emission end surface 120b) of the light guide 120. As shown in FIGS. 1(a) and 1(b), when the first connector 122 is coupled to the fixture 118, the incident end surface 120a of the light guide 120 is housed in the housing 116 and disposed at the second focus of the elliptical mirror 114. The light L reflected by the elliptical mirror 114 is incident into the light guide 120 (i.e., n optical fiber lines 121).

2(a) and 2(b) are diagrams for explaining the structure of the optical fiber line 121 in the light guide 120 of the present embodiment, and Fig. 2(a) is a view when the incident end surface 120a is viewed from the discharge lamp 112 side, and Fig. 2(b) It is a figure which looked at the exit end surface 120b from the irradiation head 130 side.

As shown in FIG. 2(a), in the incident end surface 120a of the light guide 120 of the present embodiment, the n optical fiber lines 121 are gathered into a substantially circular shape, and approximately n/2 strips (that is, approximately 250 or so) of the optical fiber lines 121 are disposed. In the center portion A1 (for example, from the center of the incident end surface 120a to a portion having a radius of 3 mm), approximately n/2 strips (i.e., approximately 250 strips) of the optical fiber line 121 are disposed in the peripheral portion A2 (gray in Fig. 2(a) The part shown).

Further, as shown in FIG. 2(b), in the emission end surface 120b of the light guide 120 of the present embodiment, the n optical fiber lines 121 are gathered in a substantially rectangular shape, and are arranged in the incident end surface 120a at substantially n/2 of the central portion A1 (ie, The optical fiber lines 121 of approximately 250 or so are arranged in a random combination in the first region B1 of the rectangle, and are arranged in the incident end surface 120a at substantially n/2 of the peripheral portion A2 (that is, approximately 250 or so). The optical fiber lines 121 are arranged in a random combination in the rectangular second region B2 (the portion shown by the gray in Fig. 2(b)).

As shown above, in the light guide 120 of the present embodiment, at the incident end The surface 120a is disposed in substantially n/2 strips (i.e., about 250 or so) of the optical fiber line 121 of the center portion A1, and substantially n/2 strips (i.e., about 250) disposed on the incident end surface 120a in the peripheral portion A2. The optical fiber lines 121 are disposed in different regions (i.e., the first region B1 and the second region B2) on the emission end faces 120b.

3 is a schematic view showing an irradiation intensity distribution of light L incident on the incident end surface 120a of the light guide 120, the horizontal axis represents a distance (mm) of 0 mm from the center of the incident end surface 120a, and the vertical axis represents a maximum intensity of 1.0. Relative strength. As shown in FIG. 3, the light L incident on the incident end surface 120a of the light guide 120 has a mountain-shaped irradiation intensity distribution having the highest peak at the center of the incident end surface 120a, so that it is disposed at the center portion A1 of the incident end surface 120a (from the incident end surface). The optical fiber 121 of the portion having a distance of 3 mm or less from the center of 120a is incident on the light L having a relative intensity of 0.5 or more, and is disposed on the peripheral portion A2 of the incident end surface 120a (the distance from the center of the incident end surface 120a is 3 mm). The optical fiber 121 of the other portion is incident on the light L having a relative intensity of 0.5 or less. Therefore, the light L having different irradiation intensities is emitted from the first region B1 and the second region B2 of the emission end surface 120b of the light guide 120.

The irradiation head 130 is connected to the second connector 124 of the light guide 120, and houses the front end side (the side of the emission end surface 120b) of the light guide 120, and guides the light L emitted from the emission end surface 120b to the periphery of the edge portion of the substrate W. Components (Fig. 1 (a) and 1 (b)). As shown in FIGS. 1(a) and 1(b), the irradiation head 130 includes a first glass rod 131 that guides light L emitted from the first region B1 of the emission end surface 120b, and a first glass rod 131 that faces the emission end surface 120b. The second glass rod 132 that guides the light L emitted from the two regions B2; the light L emitted from the first glass rod 131 and the second glass rod 132 is projected The lenses 133 and 134 to the periphery of the edge portion of the substrate W, and the mirror 135 which is disposed between the lens 133 and the lens 134 and bends the optical path of the light L emitted from the lens 133 by 90 degrees. Further, the irradiation head 130 of the present embodiment is fixed above the substrate W by a cantilever (not shown). Further, in the present embodiment, a slit transmissive cover 20 forming a rectangular slit (not shown) is provided between the irradiation head 130 and the substrate W, and the light L emitted from the irradiation head 130 is transmitted through the slit. A rectangular slit (not shown) in the cover removes stray light, and the designated rectangular illumination pattern PA is projected to the periphery of the edge portion of the substrate W (Fig. 4).

FIG. 4 is a view of the first glass rod 131 and the second glass rod 132 of the present embodiment as seen from the emission end surface 120b side of the light guide 120. As shown in FIG. 1(b) and FIG. 4, the first glass rod 131 is a square cylindrical glass rod having a cross section having substantially the same shape as the first area B1 of the exit end surface 120b, and the light emitted from the first area B1. L is mixed while guiding light in the X-axis direction, and is emitted toward the lens 133. Further, the second glass rod 132 is a square cylindrical glass rod having a cross section having substantially the same shape as the second area B2 of the exit end surface 120b, and the light L emitted from the second area B2 is mixed while being guided along the X-axis direction. Light is emitted to the lens 133.

As shown in FIG. 1(b), the light L transmitted through the lens 133 is reflected by the mirror 135 to the Z-axis direction (i.e., downward in FIG. 1(b)), through the lens 134, and the slit transmissive cover 20 A rectangular slit (not shown) is projected to the periphery of the edge portion of the substrate W. The lenses 133 and 134 of the present embodiment are lenses constituting a so-called projection optical system, and the light beams of the light L emitted from the first glass rod 131 and the second glass rod 132 are enlarged (or reduced) at a predetermined magnification, and are projected onto the edge portion of the substrate W. Surroundings. And, in Figure 1(b), The lenses 133 and 134 of the present embodiment are each illustrated by a lenticular lens. However, the present invention is not limited to this configuration, and may be composed of a lens group in which a lenticular lens, a plano-convex lens, a meniscus lens, or the like is combined.

Further, as described above, in the present embodiment, the slit transmissive cover 20 is provided between the irradiation head 130 and the substrate W in order to remove stray light or the like. However, if unnecessary light such as stray light does not cause a problem, Without the slit transmissive cover 20, the light L (i.e., a rectangular beam) transmitted through the lens 134 is directly projected onto the substrate W.

FIG. 5 is a view for explaining an irradiation pattern PA of light L projected from the light irradiation device 100 of the present embodiment to the periphery of the edge portion of the substrate W. As described above, in the present embodiment, the light L emitted from the exit end surface 120b of the light guide 120 passes through the first glass rod 131 and the second glass rod 132, and is enlarged (or reduced) at a predetermined magnification, and passes through the slit transmissive cover. A rectangular slit (not shown) of 20 is projected to the periphery of the edge portion of the substrate W. Therefore, as shown in FIG. 5, a rectangular irradiation pattern PA having substantially the same size as a slit (not shown) of the slit translucent cover 20 is projected to The periphery of the edge portion of the substrate W. Also, as described above, the illumination pattern PA is formed by combining the light L passing through the first glass rod 131 and the light L passing through the second glass rod 132, but the light L traveling through the lens 133 in the X-axis direction, The mirror 135 is bent downward (i.e., in the Z-axis direction), and therefore, the light L passing through the first glass rod 131 (i.e., the light L emitted from the first region B1 of the exit end surface 120b) is formed. The second illumination pattern PA2 formed by the illumination pattern PA1 is closer to the inner side of the substrate W than the second illumination pattern PA2 formed by the light L passing through the second glass rod 132 (i.e., the light L emitted from the second region B2 of the exit end surface 120b). . Further, as shown in FIG. 5, in the present embodiment, in order to make the first illumination pattern PA1 and the second illumination The boundary line of the pattern PA2 substantially coincides with the tangent of the substrate W. The first illumination pattern PA1 is located between the circuit pattern formation area CA of the substrate W and the edge portion of the substrate W, and the illumination head 130 is positioned above the substrate W and fixed.

6 is a schematic view showing an irradiation intensity distribution in the X-axis direction of the illumination pattern PA projected around the edge portion of the substrate W, and the horizontal axis represents the boundary line between the first illumination pattern PA1 and the second illumination pattern PA2 (ie, the substrate). The position of the tangent line of W is 0 mm in the X-axis direction (mm), and the vertical axis represents the relative intensity when the maximum intensity is 1.0. As described above, in the present embodiment, the optical fiber line 121 disposed on the central portion A1 of the incident end surface 120a of the light guide 120 receives the light L having a relative intensity of 0.5 or more, and is disposed on the optical fiber line 121 on the peripheral portion A2. Since the light L having a relative intensity of 0.5 or less is incident, the irradiation intensity of the light L emitted from the first region B1 of the emission end surface 120b of the light guide 120 is higher than the irradiation intensity of the light L emitted from the second region B2. Therefore, as shown in FIG. 6, the irradiation intensity of the first illumination pattern PA1 formed by the light L emitted from the first region B1 (that is, the irradiation intensity in the range of 0 mm to 2 mm in FIG. 6) is larger than that of the second region B2. The irradiation intensity of the second irradiation pattern PA2 formed by the emitted light L (that is, the irradiation intensity in the range of -2 mm to -0.2 mm in Fig. 6) is high, at the end of the circuit pattern forming region CA corresponding to the substrate W. The position of the portion (Fig. 5) (i.e., the position at a distance of 2 mm in Fig. 6) becomes a sharply rising irradiation intensity distribution.

Further, as described above, since the optical fibers 121 disposed in the first region B1 and the second region B2 are randomly arranged in combination, the irradiation intensity of the light L emitted from the first region B1 and the second region B2 is averaged. Therefore, by the first The irradiation intensity of the first illumination pattern PA1 formed by the light L emitted from the area B1 is substantially uniform in the X-axis direction and the Y-axis direction, and similarly, the second illumination pattern PA2 formed by the light L emitted from the second area B2 The irradiation intensity is substantially uniform in the X-axis direction and the Y-axis direction.

Further, in the present embodiment, the irradiation intensity of the second irradiation pattern PA2 is approximately 0.3 times the irradiation intensity with respect to the first irradiation pattern PA1, but is set to be the lowest in order to remove excess resist around the edge portion of the substrate W. Required intensity of illumination.

As described above, in the light irradiation device 100 of the present embodiment, the optical fiber line 121 disposed at the center portion A1 of the incident end surface 120a of the light guide 120 and the optical fiber line 121 disposed at the peripheral portion A2 at the incident end surface 120a are formed at the exit end face. Each of 120b is disposed in a different region (i.e., the first region B1 and the second region B2), whereby the irradiation intensity inside the substrate W is high, and the end portion of the circuit pattern forming region CA of the substrate W rises sharply ( That is, the irradiation pattern PA of the irradiation intensity distribution is projected to the periphery of the edge portion of the substrate W. Therefore, the resist of the circuit pattern forming region CA can be accurately retained, and the resist at the edge portion of the substrate W can be accurately removed.

Further, the irradiation intensity of the second irradiation pattern PA2 located outside the substrate W is set to the minimum required irradiation intensity (ie, suppressed) of removing the excess resist around the edge portion of the substrate W, and therefore, the optical Unexpected generation of stray light caused by reflection of components or resist surfaces, etc., suppresses the occurrence of so-called pattern damage.

The above description has been made in connection with the present embodiment, but the present invention is not limited to the above configuration, and various modifications can be made within the scope of the technical idea of the present invention.

For example, although the peripheral exposure apparatus 1 of the present embodiment has been described as an apparatus that irradiates light to the periphery of the edge portion of the disk-shaped substrate W, the substrate W may have a shape having an oriented flat portion, or may be used for A rectangular substrate such as a liquid crystal. Further, when the substrate W is rectangular, an XY table that moves the substrate in the XY plane is used instead of the rotation mechanism 10 that rotates the substrate W, and the light L emitted from the irradiation head 130 is relatively moved along the edge portion of the substrate W. Just move the XY table.

Further, in the light guide 120 of the present embodiment, the optical fiber line 121 of the substantially n/2 (i.e., about 250) optical fibers 121 disposed on the incident end surface 120a of the light guide 120 is disposed on the output end surface 120b. In a region B1, the optical fiber line 121 of the incident end surface 120a disposed at substantially n/2 (i.e., about 250) of the peripheral portion A2 is distributed on the second region B2 of the exit end surface 120b, but is not limited to the distribution, as long as The irradiation intensity on the inner side of the substrate W is maximized, and the irradiation pattern PA in which the irradiation intensity distribution is sharply increased (that is, not slick) is formed in the circuit pattern formation region CA of the substrate W.

(Second embodiment)

(a) and (b) of FIG. 7 are views showing a schematic configuration of a main part of the peripheral exposure device 2 in which the light irradiation device 200 according to the second embodiment of the present invention is mounted, and FIG. 7(a) is a view. The plan view of the peripheral exposure device 2, Figure 7 (b) is the peripheral exposure Side view of the optical device 2. As shown in FIGS. 7(a) and 7(b), in the peripheral exposure device 2 of the present embodiment, the irradiation head 230 and the rotation mechanism 10 are arranged in the Y-axis direction, and the light L emitted from the irradiation head 230 is projected onto the Y of the substrate W. This is different from the peripheral exposure device of the first embodiment in the periphery of the edge portion in the axial direction. Further, the configuration of the light guide 220 and the illumination head 230 differs from the light guide 120 and the illumination head 130 of the first embodiment in accordance with the difference in the projection position of the light L emitted from the irradiation head 230. Hereinafter, differences from the first embodiment will be described in detail.

8(a) and 8(b) are views for explaining the configuration of the optical fiber 221 of the light guide 220 of the present embodiment. Fig. 8(a) is a view when the incident end surface 220a is viewed from the discharge lamp 112 side, and Fig. 8(b) is a view when the emission end surface 220b is viewed from the irradiation head 230 side. In addition, FIG. 9 is a view of the first glass rod 231 and the second glass rod 232 of the irradiation head 230 of the present embodiment as seen from the emission end surface 220b side of the light guide 220.

As shown in FIG. 8(a), in the light guide 220 of the present embodiment, as in the light guide 120 of the second embodiment, the n optical fiber lines 221 are gathered in a substantially circular shape on the incident end surface 220a, and are substantially n/2 (ie, The optical fiber line 221 of about 250 pieces is disposed at the center portion A1 (for example, from the center of the incident end surface 220a to a portion having a radius of 3 mm), and approximately n/2 strips (i.e., about 250 pieces) of the optical fiber line 221 are disposed at the peripheral portion. A2 (the part shown in gray in Figure 8(a)).

However, as shown in FIG. 8(b), in the emission end surface 220b of the light guide 220 of the present embodiment, substantially n/2 strips (i.e., about 250 strips) of the optical fiber lines 221 disposed on the incident end surface 220a in the central portion A1 are random. The first region B1 and the incident end surface 220a arranged in the array are substantially n/2 (ie, 250) disposed in the peripheral portion A2. The second region B2 (the portion shown by the gray in FIG. 8(b)) in which the optical fiber lines 221 of the left and right are randomly arranged are arranged side by side in the left-right direction (that is, the Y-axis direction), which is the same as the light guide 120 of the first embodiment. different.

Further, as shown in FIGS. 7( a ) and 9 , the first glass rod 231 and the second glass rod 232 of the present embodiment are arranged side by side in the left-right direction in accordance with the arrangement of the first region B1 and the second region B2 ( That is, the Y-axis direction).

FIG. 10 is a view for explaining an irradiation pattern PA of light L projected from the light irradiation device 200 of the present embodiment to the periphery of the edge portion of the substrate W. As described above, in the present embodiment, the first region B1 and the second region B2 of the exit end face 220b of the light guide 220 are arranged in the Y-axis direction, and the first glass rod 231 and the second glass rod 232 are also arranged in the Y-axis direction. Therefore, as shown in FIG. 10, the first illumination pattern PA1 formed by the light L passing through the first glass rod 231 (i.e., the light L emitted from the first region B1 of the exit end surface 220b) and the passage through the second glass The second illumination pattern PA2 formed by the light L of the rod 232 (that is, the light L emitted from the second region B2 of the emission end surface 220b) is also arranged in the Y-axis direction. Further, as in the first embodiment, the first illumination pattern PA1 is closer to the inner side of the substrate W than the second illumination pattern PA2, and the boundary between the first illumination pattern PA1 and the second illumination pattern PA2 substantially coincides with the tangent of the substrate W, An illumination pattern PA1 is located between the circuit pattern forming region CA of the substrate W and the edge portion of the substrate W.

Therefore, according to the configuration of the present embodiment, the irradiation intensity inside the substrate W is high, and the irradiation pattern PA of the sharply rising (that is, not gradual) irradiation intensity distribution of the end portion of the circuit pattern forming region CA of the substrate W can be projected. To the substrate W The periphery of the edge. For this reason, the resist of the circuit pattern forming region CA can be accurately retained while the resist of the edge portion of the substrate W can be accurately removed.

(Third embodiment)

FIG. 11 is a plan view showing a schematic configuration of a main part of the peripheral exposure device 3 in which the light irradiation device 300 according to the third embodiment of the present invention is mounted. In the light irradiation device 300 of the present embodiment, the irradiation head 330 has one glass rod 331, and the light L emitted from the first region B1 and the second region B2 of the emission end surface 220b of the light guide 220 is guided by the glass rod 331. This is different from the light irradiation device 200 of the second embodiment.

FIG. 12 is a schematic diagram showing an irradiation intensity distribution in the Y-axis direction of the irradiation pattern PA (FIG. 10) projected from the light irradiation device 300 of the present embodiment to the periphery of the edge portion of the substrate W, and the horizontal axis represents the first irradiation pattern PA1. The position of the boundary line of the second irradiation pattern PA2 (that is, the tangent to the substrate W) is the distance (mm) in the Y-axis direction when Omm is 0 mm, and the vertical axis indicates the relative intensity when the maximum intensity is 1.0. As described above, in the present embodiment, the light L emitted from the first region B1 and the second region B2 of the emission end surface 220b of the light guide 220 is guided by one glass rod 331, and the light L emitted from the first region B1 and The light L emitted from the second region B2 is mixed inside the glass rod 331, but as shown in Fig. 12, the irradiation pattern PA projected by the structure of the present embodiment has the highest irradiation intensity on the inside of the substrate W, which is equivalent to The end position of the circuit pattern forming region CA of the substrate W (that is, the position at a distance of 2 mm in FIG. 12) is a sharply rising (that is, not gradual) irradiation intensity distribution. Thereby, as in the first and second embodiments, the circuit pattern forming region can be accurately retained The resist of CA can also accurately remove the resist at the edge portion of the substrate W.

(Fourth embodiment)

FIG. 13 is a side view showing a schematic configuration of a main part of a peripheral exposure apparatus in which the light irradiation device 400 according to the fourth embodiment of the present invention is mounted. The peripheral exposure device 4 of the present embodiment performs light irradiation on the periphery of the edge portion of the rectangular substrate W and removes excess resist in order to remove the edge portion (for example, a frame-shaped region from the end portion of the substrate W to a width of 70 mm). The exposure apparatus is different from the peripheral exposure apparatuses 1, 2, and 3 of the first to third embodiments in that the XY table 10a is used instead of the rotation mechanism 10. Further, the light irradiation device 400 of the present embodiment includes a plurality of LEDs (Light Emitting Diodes) 402 as light sources, and the irradiation pattern PA is formed by the light emitted from the LEDs 402, and is projected onto the periphery of the edge portion of the substrate W. The light irradiation devices 100, 200, and 300 of the first to third embodiments are different.

The XY table 10a is a mechanism for fixing the substrate W such that the opposite sides of the substrate W face the X-axis direction and the Y-axis direction, and move the substrate W in the XY plane. The XY table 10a of the present embodiment moves the substrate W in the XY plane so that the light L emitted from the light irradiation device 400 relatively moves along the edge portion of the substrate W.

FIGS. 14(a) and 14(b) are diagrams for explaining an internal configuration of the light irradiation device 400 of the present embodiment, and FIG. 14(a) is a view when the light irradiation device 400 is viewed from the Y-axis direction, and FIG. 14(b) This is a view when the light irradiation device 400 is viewed from the Z-axis direction (that is, when viewed from the lower side of FIG. 14(a)).

As shown in FIGS. 14(a) and 14(b), the light irradiation device 400 includes a rectangular circuit board 401 which is parallel to the X-axis direction and the Y-axis direction, 25 LEDs 402, and is disposed on the optical axis of each LED 402. a first lens 403, a second lens 404, a third lens 405; and a light guide 410.

The LED 402 is disposed on the circuit board 401 in a two-dimensional square lattice of five (X-axis directions) × five (Y-axis directions), and is electrically connected to the circuit board 401. The circuit board 401 is connected to an LED drive circuit (not shown), and a drive current from the LED drive circuit is supplied to each of the LEDs 402 through the circuit board 401. When a driving current is supplied to each of the LEDs 402, the LED 402 emits ultraviolet light (for example, a wavelength of 365 nm) that drives a corresponding amount of current.

The first lens 403, the second lens 404, and the third lens 405 are fixed to a frame (not shown) and disposed on the optical axis of each of the LEDs 402. The first lens 403 is a plano-convex lens formed by injection molding of a resin and having a flat LED 402 side, and has a function of reducing the diffusion angle of the ultraviolet light incident on the LED 402. The second lens 404 and the third lens 405 are lenticular lenses formed by injection molding of a resin and having a convex surface on both the incident surface and the exit surface, and the ultraviolet light incident on the first lens 403 is shaped or formed into substantially parallel light. Therefore, substantially parallel ultraviolet light having a specified beam diameter is emitted from each of the third lenses 405.

The light guide mirror 410 is a member in which a reflecting surface is formed inside and has a rectangular hollow cross section, and is provided so as to surround the 25 LEDs 404 when viewed in the Z-axis direction. Therefore, the ultraviolet light that has passed through each of the third lenses 405 is emitted through the light guide 410 and passes through a slit (not shown) of the slit transparent cover 20 to illuminate the image. The shape PA is projected to the periphery of the edge portion of the substrate W (Fig. 13).

Further, the irradiation pattern PA projected by the configuration of the present embodiment is such that the irradiation intensity inside the substrate W is the highest, and the position at the end of the circuit pattern forming region CA corresponding to the substrate W is sharply increased (that is, The irradiation intensity distribution is configured such that the amount of light emitted from the LEDs 402 disposed inside the substrate W is the highest. However, in the present embodiment, the LEDs 402 are opposed to the substrate W as the substrate W moves. Since the positional relationship is different, the drive current supplied to each of the LEDs 402 is changed in accordance with the moving direction of the substrate W and the irradiation position. Specifically, when the periphery of one side of the negative side of the X-axis direction of the substrate W is exposed, the drive current flows so that the amount of light emitted from the LED 402 on the positive side in the X-axis direction increases, and the substrate W is made. When one side of the positive side of the X-axis direction is exposed, the drive current flows so that the amount of light emitted from the LED 402 on the negative side in the X-axis direction increases, and the side of the negative side of the Y-axis direction of the substrate W is exposed. In the case of the LED 402 located on the positive side in the Y-axis direction, the drive current flows so that the amount of emitted light increases, and when the substrate W is exposed to the side on the positive side in the Y-axis direction, the Y-axis is placed. In the LED 402 on the negative side, the drive current flows so that the amount of emitted light becomes higher. As described above, according to the configuration of the present embodiment, as in the first to third embodiments, the resist of the circuit pattern forming CA can be accurately retained, and the resist of the edge portion of the substrate W can be accurately removed.

In addition, the embodiments disclosed herein are exemplified in various aspects, but it should be understood that the invention is not limited to the embodiments described. The scope of the present invention is not limited to the above description, and it is intended to include the application and the application according to the scope of the patent application. The intent of equal scope and all modifications included in its scope.

In conclusion, the present invention has been disclosed in the above preferred embodiments, and is not intended to limit the present invention. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

1‧‧‧ peripheral exposure device

100‧‧‧Lighting device

110‧‧‧Light source unit

112‧‧‧Discharge lamp

114‧‧‧Oval mirror

116‧‧‧Shell

116a‧‧‧ front panel

118‧‧‧Fixed parts

120‧‧‧Light Guide

120a‧‧‧incident end face

120b‧‧‧ exit end face

122‧‧‧First connector

124‧‧‧Second connector

130‧‧‧Emission head

132‧‧‧Second glass rod

133, 134‧ ‧ lens

135‧‧‧Mirror

C‧‧‧ Center

L‧‧‧Light

W‧‧‧Substrate

Claims (20)

A light irradiation device for a peripheral exposure device, comprising: a light source that emits light, and a light irradiation device for a peripheral exposure device that illuminates the periphery of an edge portion of the object to be irradiated and exposes the edge portion, The light irradiation device includes: the light source includes a discharge lamp that emits the light, and a light guide that is formed of a plurality of optical fiber lines that guide light of the discharge lamp; the light guide has a light incident surface and a light exit surface The plurality of optical fiber lines on the light incident surface are gathered into a circular shape, and light from the discharge lamp is incident on the light incident surface, and the plurality of optical fiber lines on the light exit surface are gathered into a rectangular shape. And emitting light emitted from the discharge lamp; the light exit surface is composed of a first region and a second region, and the first region is disposed with the majority of the plurality of the central portion on the light incident surface a portion of the optical fiber line, wherein the second region is disposed with a portion of the plurality of optical fiber lines located at a peripheral portion on the light incident surface; and the first region is emitted around the edge portion of the object to be irradiated Light The light emitted from the second region is closer to the inner side of the object to be irradiated, so that the light source forms a specified light intensity distribution, and the light intensity around the edge portion of the object to be irradiated becomes lower from the inner side to the outer side as the object to be irradiated . A light irradiation device for a peripheral exposure device according to claim 1, wherein the plurality of optical fiber wires are arranged in a random arrangement. A light illuminating device for a peripheral exposure device according to claim 1 or 2, wherein the light emitted from the first region illuminates the object to be irradiated. The light-irradiating device for a peripheral exposure device according to claim 1 or 2, wherein at least a portion of the light emitted from the second region illuminates an outer side of the object to be irradiated. The light-irradiating device for a peripheral exposure device according to claim 3, wherein at least a portion of the light emitted from the second region illuminates an outer side of the object to be irradiated. The light-irradiating device for a peripheral exposure device according to claim 1 or 2, wherein the first region and the second region are equal in size. A light irradiation device for a peripheral exposure device according to claim 3, wherein the first region and the second region are equal in size. A light irradiation device for a peripheral exposure device according to claim 4, wherein the first region and the second region are equal in size. A light irradiation device for a peripheral exposure device according to claim 5, wherein the first region and the second region are equal in size. The light irradiation device for a peripheral exposure device according to claim 1 or 2, wherein the light irradiation device for the peripheral exposure device is further provided with a light mixer, the light mixer mixing the light The light emitted from the exit surface is emitted and has a rectangular cross section. The light irradiation device for a peripheral exposure device according to claim 3, wherein the light irradiation device for the peripheral exposure device is further provided with a light mixer, the light mixer mixing the light exit surface The emitted light is emitted and has a rectangular cross section. The light irradiation device for a peripheral exposure device according to the fourth aspect of the invention, wherein the light irradiation device for the peripheral exposure device is further provided with a light mixer, the light mixer mixing the light exit surface The emitted light is emitted and has a rectangular cross section. A light irradiation device for a peripheral exposure device according to claim 5, wherein the light irradiation device for the peripheral exposure device is further provided with a light mixer, the light mixer mixing the light exit surface The emitted light is emitted and horizontally The section is rectangular. The light irradiation device for a peripheral exposure device according to claim 6, wherein the light irradiation device for the peripheral exposure device is further provided with a light mixer, the light mixer mixing the light exit surface The emitted light is emitted and has a rectangular cross section. The light irradiation device for a peripheral exposure device according to claim 7, wherein the light irradiation device for the peripheral exposure device is further provided with a light mixer, the light mixer mixing the light exit surface The emitted light is emitted and has a rectangular cross section. The light irradiation device for a peripheral exposure device according to claim 8, wherein the light irradiation device for the peripheral exposure device is further provided with a light mixer, the light mixer mixing the light exit surface The emitted light is emitted and has a rectangular cross section. The light irradiation device for a peripheral exposure device according to claim 9, wherein the light irradiation device for the peripheral exposure device is further provided with a light mixer that mixes the light exit surface The emitted light is emitted and has a rectangular cross section. The light irradiation device for a peripheral exposure device according to claim 10, wherein the light mixer mixes light emitted from the first region and light emitted from the second region Used glass rods. The light irradiation device for a peripheral exposure device according to claim 10, wherein: the optical mixer has a first glass rod for mixing light emitted from the first region, and mixing the first A second glass rod for the light emitted by the two regions. A light-irradiating device for a peripheral exposure device according to claim 1 or 2, wherein the light contains at least a wavelength of light acting on a resist layer coated on the object to be irradiated.