CN105487340B - light irradiation device for periphery exposure device - Google Patents
light irradiation device for periphery exposure device Download PDFInfo
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- CN105487340B CN105487340B CN201510621331.1A CN201510621331A CN105487340B CN 105487340 B CN105487340 B CN 105487340B CN 201510621331 A CN201510621331 A CN 201510621331A CN 105487340 B CN105487340 B CN 105487340B
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Abstract
The present invention provides a kind of light irradiation device for periphery exposure device, can effectively suppress the generation of pattern loss, while can also be to the light irradiation between circuit diagram forming region and Waffer edge portion, and it has the exposure intensity distribution steeply risen.The light irradiation device for periphery exposure device, possessing has the light source for projecting light, irradiates the light to the edge part periphery of thing to be illuminated and the edge is exposed；Wherein light source forms the light distribution specified, the light intensity on the edge part periphery of thing to be illuminated, with thing to be illuminated by Inside To Outside step-down.
Description
Technical field
The present invention relates to a kind of light irradiation device for periphery exposure device, to semiconductor substrate, liquid crystal display device
The substrate edges portion periphery that photoresist is scribbled with glass substrate, photomask with glass substrate etc. carries out light irradiation, in order to except
Remove the unnecessary resist of the edge part and be exposed.
Background technology
In the past, in IC (Integrated Circuit) and LSI (Large Scale Integrated circuit) etc.
In the manufacturing process of semiconductor, photoresist is coated on the surface of semiconductor wafer, is exposed by mask to the resist layer
Photodevelopment, so as to form circuitous pattern.
As the method for coating resist on a surface of a semiconductor wafer, spin-coating method is typically all used.Chip is placed
On a spinstand, make its rotation in the immediate vicinity resist that drips of the wafer surface, wafer surface is made by centrifugal action
It is overall all to coat resist.
Using this spin-coating method, although the circuitous pattern forming region in centre portion has coating resist in the wafer, in non-shape
Also there is coating into the Waffer edge portion of circuitous pattern, but many times, in order to transport chip, chip conveying device can grip
Waffer edge portion, if Waffer edge portion remains resist always, during chip conveying, it may appear that a part for resist
The phenomenon peel off, to come off.Also, if the resist in Waffer edge portion comes off, and the resist to come off is attached to crystalline substance
When in the circuitous pattern forming region of piece, then desired circuitous pattern can not be formed, has the problem of yield rate also reduces.Cause
This, generally, resist is carried out using to the periphery exposure device comprising its periphery irradiation light including Waffer edge portion
Exposure, remove coated in Waffer edge portion unnecessary resist.This light irradiation device for periphery exposure device, such as
It is on the books in patent document 1.
The light irradiation device for periphery exposure device (edge exposure device) described in patent document 1, possessing has：Light
Source unit, its inside have lamp；1st light guide, the light emitted by light source cell is carried out guide-lighting；Light mixed optical element (quartz
Rod), mix the light emitted by the 1st light guide；2nd light guide, the light emitted by light mixed optical element is carried out guide-lighting；Irradiation head,
By in the light projection of the 2nd light guide to substrate edges portion, and the light irradiated with lamp converges to the designated area in substrate edges portion
Mode and form.
After the periphery exposure device exposure, the unnecessary resist in Waffer edge portion is removed by etching etc., but such as
The unnecessary resist of fruit is not completely removed, in a small amount of residual on chip (when producing so-called gray area), it will as leading
The reason for process resist comes off after cause.It is therefore preferred that remove the shape of cross section of the resist end after unnecessary resist
(that is, the shape of cross section for remaining in the resist end of circuitous pattern forming region), it is circuitous pattern forming region and chip
In the shape for steeply rising (i.e., less gently) between edge part.
Irradiation of the appearance of upper described appearance gray area due to the light that substrate edges portion is projected from periphery exposure device
Intensity distribution.That is, from periphery, exposure device projects the photo-irradiation intensity distribution in substrate edges portion, if formed in circuitous pattern
When between region and Waffer edge portion gently changing, it will appear from exposing between circuitous pattern forming region and Waffer edge portion
Insufficient region, the shape of cross section for remaining in the resist end of circuitous pattern forming region are also changed into gentle shape (i.e.,
There is gray area), therefore, from periphery, exposure device projects the photo-irradiation intensity distribution of edge part, is preferably formed in circuitous pattern
(i.e., less gently) shape between region and Waffer edge portion to steeply rise.Thus, the periphery described in patent document 1 exposes
In electro-optical device, to form rectangular aperture in irradiation head, by the mixed light of light mixed optical element, projected through gap
Mode on substrate is formed.
【Prior art literature】
【Patent document】
【Patent document 1】Specially permit No. 3947365 specification
The content of the invention
Problems to be solved by the invention
According to the light irradiation device for periphery exposure device described in patent document 1, the light being incident upon on substrate, wear
After crossing gap, it can only turn into the rectangular light beam (that is, almost parallel light beam) for limiting angle of flare to a certain extent, therefore,
Turn into the exposure intensity point for relatively steeply rising (i.e., less gently) between circuitous pattern forming region and Waffer edge portion
Cloth, the generation of gray area has also been may refrain to a certain extent.
The technical problem to be solved in the present invention is due to that the circuit to be formed on chip is more and more integrated, circuitous pattern
Increasingly it is miniaturized, therefore, a kind of light irradiation device for periphery exposure device of demand, it is in circuitous pattern and Waffer edge
Between portion, the light for the exposure intensity distribution for more steeply rising (that is, more not gentle) than ever can be projected.
In order that the photo-irradiation intensity distribution being incident upon on substrate, between circuitous pattern forming region and Waffer edge portion
More steeply rise, the exposure intensity of the light being incident upon on substrate can be improved in itself, but the exposure intensity once improved surpasses
Cross and taken, unexpected veiling glare is produced due to reasons such as the reflections in optical component or face against corrosion, if the veiling glare
The forming region of circuitous pattern is irradiated to, then so-called pattern loss occurs, so as to which desired resolution ratio can not be obtained
Circuitous pattern.
The present invention is exactly in view of the foregoing, and while be based on this purpose, there is provided a kind of periphery exposure device that is used for
Light irradiation device, it can effectively suppress the generation of pattern loss, while can also be radiated at the forming region and crystalline substance of circuitous pattern
There is the light of the exposure intensity distribution steeply risen between the edge part of piece.
The means to solve the problem
In order to achieve the above object, the light irradiation device for periphery exposure device of the invention, it is that one kind possesses and penetrated
The light source of light extraction, and by the light irradiation is on the edge part periphery of thing to be illuminated and what the edge part was exposed be used for periphery
The light irradiation device of exposure device, light source form the light distribution specified, the light intensity on the edge part periphery of thing to be illuminated, with treating
Thing is irradiated by Inside To Outside step-down.
According to this structure, to the edge part periphery of thing to be illuminated, (i.e., the less gently) exposure intensity steeply risen is irradiated
The light of distribution, therefore, can accurate stick holding circuit figure forming region resist, while thing to be illuminated can also be removed exactly
The resist of edge part.In addition, the light intensity on the edge part periphery of thing to be illuminated, with thing to be illuminated by Inside To Outside step-down
Mode is formed, thus can be suppressed as the generation of the unexpected veiling glare caused by the reflection in optical component or face against corrosion etc.,
The generation of so-called pattern loss can be suppressed.
In addition, it may be configured as：Light source possesses the discharge lamp that has radiating light and guide-lighting more by being carried out to the light of discharge lamp
The light guide of root optical fiber cable composition.Light guide has light entrance face, is collapsed into circular by multifiber line and injects from discharge lamp
Light；And light-emitting face, multifiber line is collapsed into light that is rectangular and injecting discharge lamp and projected.Light-emitting face by：In light
The plane of incidence, which is configured with the 1st region of a part for the multifiber line positioned at central part and is configured with light entrance face, to be located at
2nd region of a part for the multifiber line of periphery is formed.On the edge part periphery of thing to be illuminated, what the 1st region was projected
Light, the light projected than the 2nd region is closer to the inner side of thing to be illuminated.In addition, in this case, may be configured as multifiber line with
Machine configures.
In addition, it may be configured as：Possessing has the substrate being be arranged in parallel with thing to be illuminated and two dimension setting on the substrate,
And multiple light-emitting components in rectangular light exit face are formed, light source is in shape on parallel direction on the both sides relative with light-emitting face
Into specified light distribution.In addition, in this case, can possess lens, its light source is individually configured in the light of multiple light-emitting components
Lu Zhong, the light projected from each light-emitting component turn into directional light and shaped.In addition, in this case, it may be configured as：Light-emitting face by
The 1st region for projecting the light of the 1st intensity and the 2nd region of the light for projecting 2nd intensity lower than the 1st intensity are formed, and are being treated
The edge part periphery of thing is irradiated, the light projected from the 1st region, the light projected than the 2nd region is closer to the inner side of thing to be illuminated.
Moreover it is preferred that the light projected with the 1st region, is irradiated on thing to be illuminated.
Moreover it is preferred that at least a portion of the light projected with the 2nd region, is irradiated to beyond the region of objective existence side to be illuminated.
In addition, may be configured as, the 1st region is equal in magnitude with the 2nd region.
Moreover it is preferred that can also possess has optical mixer, its light for projecting light-emitting face projects after mixing, and horizontal
Rectangular cross-section.In addition, in this case, may be configured as, light and the 2nd region that optical mixer projects for the 1st region of mixing
The glass bar of the light of injection.In addition, or optical mixer include the 1st glass bar of the light that the 1st region of mixing is projected and mixed
Close the structure of the 2nd glass bar of the light of the 2nd region injection.
Moreover it is preferred that light comprises at least the wavelength for acting on the light coated in the resist layer on thing to be illuminated.
Invention effect
As described above, according to the present invention, a kind of generation that can suppress pattern loss is realized, and circuit diagram can be radiated at
The periphery that is used for that there is the light of the exposure intensity steeply risen distribution to be irradiated between shape forming region and Waffer edge portion exposes
The light irradiation device of electro-optical device.
Brief description of the drawings
Fig. 1 is the periphery exposure device for showing the light irradiation device involved by the 1st embodiment for being equipped with the present invention
Schematic configuration figure.
Fig. 2 is the structure explanation figure of light guide provisioned in light irradiation device of the first embodiment of the invention.
Fig. 3 is the incidence for showing the light guide provisioned into the light irradiation device of the first embodiment of the present invention
The schematic diagram of the exposure intensity distribution for the light that end face is injected.
Fig. 4 is to be matched somebody with somebody from the exit end surface side of light guide in the light irradiation device of the first embodiment of the present invention
Figure when the 1st standby glass bar and 2 glass bar.
Fig. 5 is to show that the light irradiation device involved by the 1st embodiment from the present invention projects the edge part of substrate
The figure of the illumination pattern of the light on periphery.
Fig. 6 is to show that the light irradiation device involved by the 1st embodiment from the present invention is incident upon the edge part of substrate
The schematic diagram of the exposure intensity distribution of the illumination pattern on periphery.
Fig. 7 is the periphery exposure device for showing the light irradiation device involved by the 2nd embodiment for being equipped with the present invention
Summary construction diagram.
Fig. 8 is the figure for illustrating guide structure provisioned in the light irradiation device involved by the 2nd embodiment of the present invention.
Fig. 9 is to be matched somebody with somebody from the exit end surface side of light guide in the light irradiation device of the second embodiment of the present invention
Figure when the 1st standby glass bar and 2 glass bar.
Figure 10 is to illustrate that the light irradiation device involved by the 2nd embodiment from the present invention projects the edge part week of substrate
The figure of the illumination pattern of the light on side.
Figure 11 is the periphery exposure device for showing the light irradiation device involved by the 3rd embodiment for being equipped with the present invention
Schematic configuration figure.
Figure 12 illustrates that the light irradiation device involved by the 3rd embodiment from the present invention projects the edge part periphery of substrate
Light illumination pattern figure.
Figure 13 is the periphery exposure device for showing the light irradiation device involved by the 4th embodiment for being equipped with the present invention
Summary construction diagram.
Figure 14 is the figure for the internal structure for illustrating the light irradiation device involved by the 4th embodiment of the present invention.
In figure：
1st, 2,3,4 periphery exposure device
10 rotating mechanisms
10a XY worktables
12 electric rotating machines
14 motor shafts
16 rotary chucks
20 slit diffusers
100th, 200,300,400 light irradiation device
110 light source cells
112 discharge lamps
114 elliptical reflectors
116 housings
116a front panels
118 fixtures
120th, 220 light guide
120a, 220a incident end face
120b, 220b are emitted end face
121st, 221 optical fiber cable
122 the 1st connectors
124 the 2nd connectors
130th, 230 irradiation head
131st, 231 the 1st glass bar
132nd, 232 the 2nd glass bar
133rd, 134 lens
135 speculums
331 glass bars
401 circuit substrates
402 LED
403 the 1st lens
404 the 2nd lens
405 the 3rd lens
410 guide-lighting mirrors
W substrates
PA illumination patterns
The illumination patterns of PA1 the 1st
The illumination patterns of PA2 the 2nd
CA circuitous pattern forming regions
Embodiment
Below, embodiments of the present invention are described in further detail with reference to accompanying drawing.It is also, identical or corresponding in figure
Position identical sign flag, its explanation is not repeated.
1st embodiment:
Fig. 1 is all edge exposures dress for showing the light irradiation device 100 involved by the 1st embodiment for being equipped with the present invention
The figure of the schematic configuration of 1 main portions is put, Fig. 1 (a) is the plan of periphery exposure device 1, and Fig. 1 (b) is all edge exposure dresses
Put 1 side view.The periphery exposure device 1 of present embodiment is that one kind rotates discoidal substrate W, and to substrate W side
Edge periphery carries out light irradiation and the device being exposed to remove the unnecessary resist of edge part, and mainly possessing to have makes base
The rotating mechanism 10 of plate W rotations, the light irradiation device 100 for carrying out light irradiation.Also, in Fig. 1, for purposes of illustration only, with XYZ just
Hand over coordinate system to represent, 2 parallel and mutually orthogonal axles are as X-axis and Y-axis with substrate W surface (that is, horizontal plane), with X-axis and
The orthogonal axle of Y-axis represents as Z axis, below illustrates appropriate application XYZ orthogonal coordinate system.
Rotating mechanism 10 has electric rotating machine 12, motor shaft 14 and rotary chuck 16.Rotary chuck 16 is that one kind passes through
Motor shaft 14 is connected with electric rotating machine 12, the disc-shaped part rotated with the rotation of motor shaft 14, for ease of substrate W center
C is configured on the rotary shaft AX of electric rotating machine 12, is fixed from back side vacuum suction substrate W with approximate horizontal posture.Therefore, revolve
The spinning movement of rotating motor 12 is sent to rotary chuck 16 by motor shaft 14, and the substrate W being fixed on rotary chuck 16 exists
X/Y plane internal rotation.
Light irradiation device 100 is a kind of device that light irradiation is carried out on substrate W edge part periphery, and possessing has light source cell
110th, light guide 120, irradiation head 130.
Light source cell 110, possesses the elliptical reflector for the light L for thering is discharge lamp 112, reflection discharge lamp 112 to be radiated
114th, the housing 116 of discharge lamp 112 and elliptical reflector 114 is stored.In addition, on the front panel 116a of housing 116, installation
Have and be connected with the 1st connector 122 (aftermentioned) of light guide 120, support and fix base end part side (the incident end face 120a of light guide 120
Side) fixture 118.
Discharge lamp 112 is a kind of discharge medium enclosed and be made up of mercury or rare gas etc., is had in ultraviolet wavelengths
There is the so-called UV lamp of emission spectrum, with the 1st focal position of the electric arc bright spot of discharge lamp 112 and elliptical reflector 114 substantially
Consistent mode configures.
Elliptical reflector 114 is the bowl-type speculum that a kind of light L for radiating discharge lamp 112 reflects to light guide 120,
It is in circular on the incident end face 120a of light guide 120 with the light L reflected by elliptical reflector 114 in present embodiment
The mode of optically focused is formed.
Light guide 120 is that a kind of light L radiated along X-direction to discharge lamp 112 carries out guide-lighting light guide member, by n bars
(such as 500) optical fiber cable 121 is formed.The outer peripheral face of light guide 120 (that is, n bars optical fiber cable 121) is coated by pipe (not shown),
Outer peripheral face in the base end part side of light guide 120 (incident end face 120a sides), be provided with can connection fixture 118 the 1st connector
122.In addition, the outer peripheral face in the leading section side of light guide 120 (outgoing end face 120b sides), irradiation head 130 can be connected by being provided with
2nd connector 124.As shown in figure 1, when the 1st connector 122 is connected with fixture 118, the incident end face 120a of light guide 120 is received
It is contained in housing 116 and configures in the 2nd focus of elliptical reflector 114, the light L reflected by elliptical reflector 114 is injected
In light guide 120 (that is, n bars optical fiber cable 121).
Fig. 2 is the structure explanation figure of the optical fiber cable 121 in the light guide 120 of present embodiment, and Fig. 2 (a) is from discharge lamp 112
Figure during incident end face 120a is observed in side, and Fig. 2 (b) is figure when end face 120b is emitted from the side of irradiation head 130.
As shown in Fig. 2 (a), it is collapsed into greatly in incident end face 120a, the n bar optical fiber cable 121 of the light guide 120 of present embodiment
Cause circular, the optical fiber cables 121 of substantially n/2 bars (that is, general 250 or so) is configured in central part A1 (for example, from incident end face
120a center to radius 3mm part), the optical fiber cable 121 of substantially n/2 bars (that is, general 250 or so) is configured in periphery
A2 (part shown in grey in Fig. 2 (a)).
In addition, as shown in Fig. 2 (b), outgoing end face 120b, n the bar optical fiber cable 121 of the light guide 120 of present embodiment collapses
Into substantially rectangular, optical fiber of the configuration in central part A1 substantially n/2 bars (that is, general 250 or so) in incident end face 120a
Line 121 is configured in a manner of random combine in the 1st region B1 of rectangle, and configuration is periphery A2's in incident end face 120a
The optical fiber cable 121 of substantially n/2 bars (that is, general 250 articles or so) configures the 2nd region B2 in rectangle in a manner of random combine
In (part shown in grey in Fig. 2 (b)).
As it appears from the above, in the light guide 120 of present embodiment, the substantially n/ in central part A1 is configured in incident end face 120a
The optical fiber cable 121 of 2 (that is, general 250 or so) and incident end face 120a configuration periphery A2 substantially n/2 bars
The optical fiber cable 121 of (that is, general 250 or so), different regions (that is, the 1st region B1 is arranged respectively in outgoing end face 120b
And the 2nd region B2) in.
Fig. 3 is the schematic diagram for the exposure intensity distribution for showing the light L in the incident end face 120a for injecting light guide 120, horizontal
Axle represents the distance (mm) using incident end face 120a center as 0mm, and the longitudinal axis represents relatively strong when maximum intensity is 1.0
Degree.As shown in figure 3, the incident end face 120a of light guide 120 light L is injected, because the center with incident end face 120a is top
The distribution of mountain font exposure intensity, so to configuration incident end face 120a central part A1 (from incident end face 120a center
The distance of beginning be 3mm within part) optical fiber cable 121, inject relative intensity be more than 0.5 light L, to configuration in incidence
End face 120a periphery A2 (since the distance incident end face 120a center be 3mm beyond part) optical fiber cable 121,
Inject the light L that relative intensity is less than 0.5.Therefore, the 1st region B1 from the outgoing end face 120b of light guide 120 and the 2nd region
B2, each project the different light L of exposure intensity.
Irradiation head 130 is a kind of leading section (exit end for being connected with the 2nd connector 124 of light guide 120, storing light guide 120
Face 120b), by the light L leaded lights for being emitted end face 120b injections and it is projected to the component (Fig. 1) on substrate W edge part periphery.Such as Fig. 1
Shown, irradiation head 130 possesses and had：The 1st guide-lighting glass bar is carried out to being emitted the light L emitted by end face 120b the 1st region B1
131；The 2nd guide-lighting glass bar 132 is carried out to being emitted the light L emitted by end face 120b the 2nd region B2；By the 1st glass bar 131
And the 2nd light L emitted by glass bar 132 is projected to the lens 133,134 on substrate W edge part periphery；Configuration is in lens 133
Between lens 134, the speculum 135 of the 90 degree of bendings of light path for the light L that lens 133 are projected.Also, the photograph of present embodiment
First 130 are penetrated, substrate W top is fixed on by cantilever (not shown).In addition, in present embodiment, in irradiation head 130 and substrate
Between W, provided with the slit diffuser 20 for forming rectangular aperture (not shown), the light L that irradiation head 130 projects is passed through slit
Rectangular aperture (not shown) in diffuser, removes veiling glare therefrom, and the rectangular illumination figure PA specified is projected onto base
Plate W edge part periphery (Fig. 4).
Fig. 4 is the 1st glass bar 131 and the 2nd glass of the present embodiment from the outgoing end face 120b sides of light guide 120
Figure during rod 132.As shown in Fig. 1 (b) and Fig. 4, the 1st glass bar 131 is that its a kind of cross section has with being emitted end face 120b
The square column type glass bar of the 1st roughly the same shapes of region B1, along X-direction while the light L that the 1st region B1 is projected is mixed
Leaded light, projected to lens 133.In addition, the 2nd glass bar 132 be its a kind of cross section have be emitted end face 120b the 2nd region
The square column type glass bar of the roughly the same shapes of B2, it is guide-lighting along X-direction while the light L that the 2nd region B2 is projected is mixed, to
Lens 133 project.
As shown in Fig. 1 (b), through the light L of lens 133, Z-direction is reflexed to (that is, in Fig. 1 (b) by speculum 135
In downwards), through the rectangular slot (not shown) of lens 134, slit diffuser 20, be projected to substrate W edge part periphery.This
The lens 133,134 of embodiment are the lens for forming so-called projection optics system, the 1st glass bar 131 and the 2nd glass bar 132
The light L of injection light beam, which is pressed, specifies multiplying power to expand (or reducing), projects substrate W edge part periphery.Also, in Fig. 1 (b)
In, the lens 133,134 of present embodiment, each shown with biconvex lens, but the structure is not limited to, can also be by combining
The lens group of biconvex lens, planoconvex spotlight, concave-convex lens etc. is formed.
Also, as described above, in present embodiment, in order to remove veiling glare etc., set between irradiation head 130 and substrate W
There is slit diffuser 20, but if when more remaining lights such as veiling glare will not turn into problem, slit diffuser 20 can not also be used,
Directly it is incident upon on substrate W through the light L (that is, rectangular light beam) of lens 134.
Fig. 5 is the photograph for illustrating to be projected to the light L on substrate W edge part periphery from the light irradiation device 100 of present embodiment
Penetrate figure PA figure.As described above, in present embodiment, because the light L of the outgoing end face 120b injections from light guide 120 passes through the 1st
The glass bar 132 of glass bar 131 and the 2nd, expand (or reducing) by specified multiplying power, through the rectangular aperture of slit diffuser 20
(not shown) is projected to substrate W edge part periphery, so, as shown in figure 5, big with the gap (not shown) of slit diffuser 20
Small roughly the same rectangular illumination figure PA is projected to substrate W edge part periphery.Also, as described above, illumination pattern PA is
Formed with reference to the light L through the 1st glass bar 131 and through the light L of the 2nd glass bar 132, but pass through lens 133 along X-axis
The light L that direction is advanced, by (that is, the Z-direction) bending downwards of speculum 135, therefore, by the light L through the 1st glass bar 131
(that is, the light L projected from outgoing end face 120b the 1st region B1) the 1st illumination pattern PA1 for being formed, than by through the 2nd glass
The 2nd illumination pattern PA2 that the light L (that is, the light L projected from outgoing end face 120b the 2nd region B2) of rod 132 is formed, be more
Close to substrate W inner side.In addition, as shown in figure 5, in present embodiment, in order that the 1st illumination pattern PA1 and the 2nd illumination pattern
PA2 line of demarcation and substrate W tangent line are basically identical, and the 1st illumination pattern PA1 is located at substrate W circuitous pattern forming region CA
Between substrate W edge part, irradiation head 130 is positioned to substrate W top and fixation.
Fig. 6 is the exposure intensity distribution of the X-direction for the illumination pattern PA for showing the edge part periphery for being incident upon substrate W
Schematic diagram, transverse axis represent the 1st illumination pattern PA1 and the 2nd illumination pattern PA2 line of demarcation (that is, substrate W tangent line) position
For 0mm when X-direction distance (mm), the longitudinal axis represent maximum intensity be 1.0 when relative intensity.As described above, in this reality
Apply in mode, configure the optical fiber cable 121 on the incident end face 120a of light guide 120 central part A1, it is 0.5 to inject relative intensity
Light L above, the optical fiber cable 121 on periphery A2 is configured, the light L that relative intensity is less than 0.5 is injected, therefore, from light guide
The exposure intensity for the light L that 120 outgoing end face 120b the 1st region B1 is projected, than the light L projected from the 2nd region B2 irradiation
Intensity will height.Thus as shown in fig. 6, the 1st illumination pattern PA1 exposure intensity formed by the 1st region B1 light L projected
(that is, the exposure intensity in the range of the distance 0mm to 2mm of Fig. 6), the 2nd irradiation that the light L than being projected by the 2nd region B2 is formed
Figure PA2 exposure intensity (that is, the exposure intensity in the range of the distance -2mm of Fig. 6 to -0.2mm) is high, equivalent to substrate W
Circuitous pattern forming region CA end (Fig. 5) position (that is, Fig. 6 distance 2mm position), be changed into what is steeply risen
Exposure intensity is distributed.
In addition, as described above, because configuring the optical fiber cable 121 in the 1st region B1 and the 2nd region B2, respective random combine
Arrangement, so making the exposure intensity equalization from the light L of the 1st region B1 and the 2nd region B2 injections.Therefore, by the 1st region B1
The exposure intensity for the 1st illumination pattern PA1 that the light L of injection is formed is generally uniform in X-direction and Y direction, equally,
The 2nd illumination pattern PA2 exposure intensity formed by the 2nd region B2 light L projected is big in X-direction and Y direction
Cause uniform.
Also, it is relative 1st illumination pattern PA1 although the 2nd illumination pattern PA2 exposure intensity in present embodiment
About 0.3 times of exposure intensity, but in order to remove the unnecessary resist in substrate W edge part periphery, exposure intensity setting
For the exposure intensity of minimum requirements.
As described above, in the light irradiation device 100 of present embodiment, will exist in the incident end face 120a configurations of light guide 120
Central part A1 optical fiber cable 121 and incident end face 120a configuration periphery A2 optical fiber cable 121, outgoing end face
120b each divides in different region (that is, the 1st region B1 and the 2nd region B2) settings, and thus, the irradiation on the inside of substrate W is strong
Degree is high, and (i.e., less gently) exposure intensity steeply risen in substrate W circuitous pattern forming region CA ends is distributed
Illumination pattern PA is projected to substrate W edge part periphery.Therefore, can accurate stick holding circuit figure forming region CA it is against corrosion
Agent, while the resist of substrate W edge parts can also be removed exactly.
In addition, the exposure intensity of the 2nd illumination pattern PA2 on the outside of substrate W, is configured to remove substrate W sides
The exposure intensity (that is, be suppressed) of the minimum requirements of the unnecessary resist on edge periphery, therefore, it is suppressed that due to optical component or
The generation of unexpected veiling glare caused by the reflection in face against corrosion etc., also may refrain from the generation of so-called pattern loss.
Above is the explanation made with reference to present embodiment, but the present invention is not limited to above-mentioned composition, in the present invention
Technical thought range in can carry out various modifications.
For example, the periphery exposure device 1 of present embodiment, although being entered with a kind of edge part periphery to disc substrate W
The device of row light irradiation is illustrated, but substrate W can have the shape in directional plane portion or for liquid crystal
Deng rectangular substrate.And, it is assumed that when substrate W is rectangle, substituted using the XY worktable for making substrate be moved in X/Y plane
Make substrate W rotate rotating mechanism 10, for ease of irradiation head 130 project light L along substrate W edge part relative movement, only need
Move XY worktable.
In addition, in the light guide 120 of present embodiment, consist of：Configuration is at center on the incident end face 120a of light guide 120
The optical fiber cable 121 of portion A1 substantially n/2 bars (that is, 250 articles or so) is distributed on outgoing end face 120b the 1st region B1, incident
120a configurations in end face are distributed outgoing end face 120b's in the optical fiber cable 121 of periphery A2 substantially n/2 bars (that is, 250 or so)
On 2nd region B2, but the distribution is not limited to, as long as the exposure intensity on the inside of substrate W can be made to be changed into highest, substrate W's
Circuitous pattern forming region CA forms the illumination pattern PA of (i.e., less gently) exposure intensity distribution steeply risen.
(the 2nd embodiment)
Fig. 7 is all edge exposures dress for showing the light irradiation device 200 involved by the 2nd embodiment for being equipped with the present invention
The figure of the schematic configuration of 2 main portions is put, Fig. 7 (a) is the plan of periphery exposure device 2, and Fig. 7 (b) is all edge exposure dresses
Put 2 side view.As shown in fig. 7, the periphery exposure device 2 of present embodiment, irradiation head 230 and rotating mechanism 10 are along Y-axis
Direction arranges, and the light L projected from irradiation head 230 is projected to the edge part periphery of substrate W Y direction, and this point is implemented with the 1st
The periphery exposure device of mode is different.In addition, with irradiation head 230 project light L projected position difference, light guide 220 with
And the structure of irradiation head 230 is also different from the light guide 120 and irradiation head 130 of the 1st embodiment.Hereinafter, for implementing with the 1st
The difference of mode is described in detail.
Fig. 8 is the figure of the structure of optical fiber cable 221 for the light guide 220 for illustrating present embodiment.Fig. 8 (a) is from the side of discharge lamp 112
Figure during incident end face 220a is observed, Fig. 8 (b) is figure when end face 220b is emitted from the side of irradiation head 230.In addition, Fig. 9 is
The 1st glass bar 231 and the 2nd glass bar of the irradiation head 230 of present embodiment from the outgoing end face 220b sides of light guide 220
Figure when 232.
As shown in Fig. 8 (a), the light guide 220 of present embodiment, as the light guide 120 of the 1st embodiment, in incidence end
On the 220a of face, n bars optical fiber cable 221 collapses in a substantially circular, and the optical fiber cable 221 of substantially n/2 bars (that is, 250 or so) configures
Central part A1's (such as from incident end face 220a center to radius 3mm part), substantially n/2 bars (that is, 250 or so)
Optical fiber cable 221 is configured in periphery A2 (part shown in grey in Fig. 8 (a)).
However, as shown in Fig. 8 (b), in the outgoing end face 220b of the light guide 220 of present embodiment, on incident end face 220a
Configure central part A1 substantially n/2 bars (that is, 250 articles or so) the random alignment of optical fiber cable 221 configuration the 1st region B1, with
And configuration is matched somebody with somebody in the random alignment of optical fiber cable 221 of periphery A2 substantially n/2 bars (that is, 250 or so) on incident end face 220a
The 2nd region B2 (part shown in grey in Fig. 8 (b)) put, it is arranged side-by-side in left and right directions (that is, Y direction), this point and the
The light guide 120 of 1 embodiment is different.
In addition, as shown in Fig. 7 (a) and Fig. 9, the 1st glass bar 231 of present embodiment and the 2nd glass bar 232,
It is the configuration according to the 1st region B1 and the 2nd region B2, is arranged side-by-side in left and right directions (that is, Y direction).
Figure 10 is the photograph for illustrating to be projected to the light L on substrate W edge part periphery from the light irradiation device 200 of this form of implementation
Penetrate figure PA figure.As described above, in present embodiment, the outgoing end face 220b of light guide 220 the 1st region B1 and the 2nd area
Domain B2 is arranged in Y direction, and the 1st glass bar 231 and the 2nd glass bar 232 are also arranged in Y direction in addition, therefore such as Figure 10
Shown, being formed by the light L (that is, the light L projected from outgoing end face 220b the 1st region B1) through the 1st glass bar 231 the
1 illumination pattern PA1 and by through the 2nd glass bar 232 light L (that is, from outgoing end face 220b the 2nd region B2 project light
L the 2nd illumination pattern PA2) formed is also arranged in Y direction.In addition, as the 1st embodiment, the 1st illumination pattern PA1
Than the 2nd illumination pattern PA2 closer to substrate W inner side, the 1st illumination pattern PA1 and the 2nd illumination pattern PA2 line of demarcation and base
Plate W tangent line is substantially uniform, and the 1st illumination pattern PA1 is located at substrate W circuitous pattern forming region CA and substrate W edge part
Between.
Therefore, according to the structure of present embodiment, the exposure intensity on the inside of substrate W is high, and can be by substrate W circuit diagram
The illumination pattern PA of (i.e., the less gently) exposure intensity steeply risen distribution of shape forming region CA end is projected to substrate
W edge part periphery.Therefore, can stick holding circuit figure forming region CA exactly resist, while can also go exactly
Except the resist of substrate W edge parts.
(the 3rd embodiment)
Figure 11 shows all edge exposures dress of the light irradiation device 300 involved by the 3rd embodiment for being equipped with the present invention
Put the plan of the schematic configuration of 3 main portions.The light irradiation device 300 of present embodiment, its irradiation head 330 have 1
Glass bar 331, glass bar is passed through with the outgoing end face 220b of light guide 220 the 1st region B1 and the 2nd region B2 the light L projected
331 guide-lighting modes are formed, and this point is different from the light irradiation device 200 of the 2nd embodiment.
Figure 12 is the irradiation for showing the edge part periphery that substrate W is projected to from the light irradiation device 300 of present embodiment
The schematic diagram of the exposure intensity distribution of figure PA (Figure 10) Y direction, transverse axis represent that the irradiations of the 1st illumination pattern PA1 and the 2nd are schemed
The distance (mm) of Y direction when the position in shape PA2 line of demarcation (that is, substrate W tangent line) is Omm, the longitudinal axis represent maximum intensity
For 1.0 when relative intensity.As described above, in the present embodiment, because of the outgoing end face 220b of light guide 220 the 1st region B1
And the 2nd light L emitted by the B2 of region leaded light, the light L and the 2nd region B2 that the 1st region B1 is projected carried out by 1 glass bar 331
The light L of injection is mixed in the inside of glass bar 331, but as shown in figure 12, the photograph projected by the structure of present embodiment
Figure PA is penetrated, is highest in substrate W inner side exposure intensity, in the end of the circuitous pattern forming region CA equivalent to substrate W
Position (that is, Figure 12 distance 2mm position), for steeply rise (i.e., less gently) exposure intensity distribution.Thus, with
1st and the 2nd embodiment is identical, can stick holding circuit figure forming region CA exactly resist, can also be accurate
Ground removes the resist of substrate W edge parts.
(the 4th embodiment)
Figure 13 is all edge exposures for showing the light irradiation device 400 involved by the 4th embodiment for being equipped with the present invention
The side view of the schematic configuration of the main portions of device.The periphery exposure device 4 of present embodiment is a kind of to rectangular substrate W
Edge part periphery carries out light irradiation and in order to remove edge part (for example, from substrate W end to the blocked areas of 70mm width)
Unnecessary resist and the device being exposed, rotating mechanism 10, this point and the 1st to the 3rd are substituted using XY worktable 10a
The periphery exposure device 1,2,3 of embodiment is different.In addition, the light irradiation device 400 of present embodiment, possessing has multiple LED
(Light Emitting Diode) 402 is used as light source, forms illumination pattern PA by the light projected from LED402, and be projected to
Substrate W edge part periphery, this point are different from the light irradiation device 100,200,300 of the 1st to the 3rd embodiment.
XY worktable 10a is that one kind fixes substrate W, makes two relative opposite side of substrate W each towards X-direction and Y
Direction of principal axis, and the mechanism for making substrate W be moved in X/Y plane.The XY worktable 10a of present embodiment, make substrate W in X/Y plane
Interior movement, so as to light irradiation device 400 project light L along substrate W edge part relative movement.
Figure 14 is the figure of the internal structure for the light irradiation device 400 for illustrating present embodiment, and Figure 14 (a) is from Y direction
Figure during light irradiation device 400 is observed, (that is, from Figure 14's (a) when Figure 14 (b) is the light irradiation device 400 from Z-direction
Downside observe when) figure.
As shown in figure 14, light irradiation device 400 possesses and had：Parallel to the rectangular circuit substrate of X-direction and Y direction
401；25 LED402；Configure the 1st lens 403, the 2nd lens 404, the 3rd lens 405 on each LED402 optical axis；And
Guide-lighting mirror 410.
LED402 is configured in circuit substrate 401 with the two-dimentional tetragonal trellis of 5 (X-direction) × 5 (Y direction)
On, it is electrically connected with circuit substrate 401.Circuit substrate 401 is connected with LED drive circuit (not shown), from LED drive circuit
Drive current through circuit substrate 401, supply to each LED402.When driving current is supplied to each LED402, LED402 can be penetrated
Go out the ultraviolet light (for example, wavelength 365nm) of the corresponding light quantity of driving current.
1st lens 403, the 2nd lens 404 and the 3rd lens 405, it is fixed on mirror holder (not shown), and configures each
On LED402 optical axis.1st lens 403 be by silicones injection molding and formed and LED402 sides for plane plano-convex it is saturating
Mirror, there is the function of reducing the angle of flare that LED402 injects ultraviolet light.2nd lens 404 and the 3rd lens 405 are to pass through silicon
Resin injection molding and formed and the plane of incidence and exit facet are the biconvex lens on convex surface, and the 1st lens 403 are injected
Ultraviolet light is configured to almost parallel light.Therefore, projected from each 3rd lens 405 with the almost parallel purple for specifying beam diameter
Outer light.
Guide-lighting mirror 410 is a kind of internally formed with the part that reflecting surface and cross section are rectangular hollow, with from Z axis side
To during observation, surround 25 LED404 mode and set.Therefore, through the ultraviolet light of each 3rd lens 405, through leaded light
Mirror 410 and project, and through the gap (not shown) of slit diffuser 20, illumination pattern PA is projected to substrate W edge part
Periphery (Figure 13).
Although also, the illumination pattern PA projected according to the structure of present embodiment, also for making on the inside of substrate W
Exposure intensity is highest, be changed into steeply rising in the position of the circuitous pattern forming region CA ends equivalent to substrate W (i.e.,
It is less gentle) exposure intensity distribution, to configure the outgoing light quantity of LED402 on the inside of substrate W to be formed in a manner of highest,
But in present embodiment, with substrate W movement, each LED402 is different from substrate W relative position relation, therefore basis
Substrate W moving direction and irradiating position changing feed to each LED402 driving current.Specifically, substrate W X is made
When one side week edge exposure of direction of principal axis minus side, so that the emergent light quantitative change positioned at the LED402 of X-direction positive side is higher
Mode flows through driving current；When one side week edge exposure of substrate W X-direction positive side is made, so as to be born positioned at X-direction
The mode that the LED402 of side emergent light quantitative change is higher flows through driving current；On one side periphery for the Y direction minus side for making substrate W
When exposure, to make to flow through driving current in a manner of emergent light quantitative change is higher in the LED402 of Y direction positive side；
When making one side week edge exposure of substrate W Y direction positive side, so that with outgoing in the LED402 of Y direction minus side
The mode that light quantity becomes higher flows through driving current.As described above, according to the structure of present embodiment, with the 1st to the 3rd embodiment
It is identical, accurately it can form CA resist by stick holding circuit figure, while substrate W edge part resists can also be removed exactly.
In addition, embodiment of disclosure, is made that illustration, it should be appreciated that the present invention is not limited only in every respect
Described applies mode.The scope of the present invention is not limited to described above, and it is intended to include according to claims, with weighing
The impartial intention of sharp claim scope, and all deformations included in the range of it.
Claims (20)
1. a kind of light irradiation device for periphery exposure device, to possess the light source for projecting light, and to the edge of thing to be illuminated
The light is irradiated on portion periphery and the light irradiation device for periphery exposure device being exposed to the edge part, its feature exist
In,
The light source possesses and has the discharge lamp for radiating the light, and by carrying out guide-lighting most light to the light of the discharge lamp
The light guide that fine line is formed,
The light guide has light entrance face and a light-emitting face, and most optical fiber cable is collapsed into circle on the light entrance face
Shape, and the light from the discharge lamp injects the light entrance face, most optical fiber cable is collapsed on the light-emitting face
Rectangle, and the light injected from the discharge lamp is projected,
The light-emitting face is made up of the 1st region and the 2nd region, and the 1st region is configured with upper in the light entrance face
In a part for most optical fiber cable of central part, the 2nd region, which is configured with the light entrance face, is located at periphery
A part for most optical fiber cable in portion,
On the edge part periphery of the thing to be illuminated, light that the 1st region is projected than the light that the 2nd region is projected closer to
The inner side of the thing to be illuminated,
It is configured to the intensity of the light on the edge part periphery of the thing to be illuminated, is become with the thing to be illuminated by Inside To Outside
It is low.
2. the light irradiation device according to claim 1 for periphery exposure device, it is characterised in that
Most optical fiber cable random alignment configuration.
3. the light irradiation device according to claim 1 or 2 for periphery exposure device, it is characterised in that
The light that 1st region is projected, is radiated on the thing to be illuminated.
4. the light irradiation device according to claim 1 or 2 for periphery exposure device, it is characterised in that
At least a portion for the light that 2nd region is projected, irradiate the outside of the thing to be illuminated.
5. the light irradiation device according to claim 3 for periphery exposure device, it is characterised in that
At least a portion for the light that 2nd region is projected, irradiate the outside of the thing to be illuminated.
6. the light irradiation device according to claim 1 or 2 for periphery exposure device, it is characterised in that
1st region is equal in magnitude with the 2nd region.
7. the light irradiation device according to claim 3 for periphery exposure device, it is characterised in that
1st region is equal in magnitude with the 2nd region.
8. the light irradiation device according to claim 4 for periphery exposure device, it is characterised in that
1st region is equal in magnitude with the 2nd region.
9. the light irradiation device according to claim 5 for periphery exposure device, it is characterised in that
1st region is equal in magnitude with the 2nd region.
10. the light irradiation device according to claim 1 or 2 for periphery exposure device, it is characterised in that
The light irradiation device for periphery exposure device has been also equipped with optical mixer, and the optical mixer mixes the light and gone out
The light of face injection and injection are penetrated, and cross section is rectangle.
11. the light irradiation device according to claim 3 for periphery exposure device, it is characterised in that
The light irradiation device for periphery exposure device has been also equipped with optical mixer, and the optical mixer mixes the light and gone out
The light of face injection and injection are penetrated, and cross section is rectangle.
12. the light irradiation device according to claim 4 for periphery exposure device, it is characterised in that
The light irradiation device for periphery exposure device has been also equipped with optical mixer, and the optical mixer mixes the light and gone out
The light of face injection and injection are penetrated, and cross section is rectangle.
13. the light irradiation device according to claim 5 for periphery exposure device, it is characterised in that
The light irradiation device for periphery exposure device has been also equipped with optical mixer, and the optical mixer mixes the light and gone out
The light of face injection and injection are penetrated, and cross section is rectangle.
14. the light irradiation device according to claim 6 for periphery exposure device, it is characterised in that
The light irradiation device for periphery exposure device has been also equipped with optical mixer, and the optical mixer mixes the light and gone out
The light of face injection and injection are penetrated, and cross section is rectangle.
15. the light irradiation device according to claim 7 for periphery exposure device, it is characterised in that
The light irradiation device for periphery exposure device has been also equipped with optical mixer, and the optical mixer mixes the light and gone out
The light of face injection and injection are penetrated, and cross section is rectangle.
16. the light irradiation device according to claim 8 for periphery exposure device, it is characterised in that
The light irradiation device for periphery exposure device has been also equipped with optical mixer, and the optical mixer mixes the light and gone out
The light of face injection and injection are penetrated, and cross section is rectangle.
17. the light irradiation device for periphery exposure device according to claim 9, it is characterised in that
The light irradiation device for periphery exposure device has been also equipped with optical mixer, and the optical mixer mixes the light and gone out
The light of face injection and injection are penetrated, and cross section is rectangle.
18. the light irradiation device according to claim 10 for periphery exposure device, it is characterised in that
The optical mixer be by the light emitted by the 1st region and the light emitted by the 2nd region mix and glass
Glass rod.
19. the light irradiation device according to claim 10 for periphery exposure device, it is characterised in that
The optical mixer include mixing the light that the 1st region is projected and the 1st glass bar and mixing the 2nd area
Domain project light and the 2nd glass bar.
20. the light irradiation device according to claim 1 or 2 for periphery exposure device, it is characterised in that
The light, including at least the wavelength for the light for acting on the resist layer being coated on the thing to be illuminated.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014202704A JP6082721B2 (en) | 2014-10-01 | 2014-10-01 | Light irradiation device for peripheral exposure equipment |
| JP2014-202704 | 2014-10-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105487340A CN105487340A (en) | 2016-04-13 |
| CN105487340B true CN105487340B (en) | 2018-03-23 |
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ID=55674405
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510621331.1A Expired - Fee Related CN105487340B (en) | 2014-10-01 | 2015-09-25 | light irradiation device for periphery exposure device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6082721B2 (en) |
| KR (1) | KR101985848B1 (en) |
| CN (1) | CN105487340B (en) |
| TW (1) | TWI596443B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107748484A (en) * | 2017-11-22 | 2018-03-02 | 武汉新芯集成电路制造有限公司 | A kind of measuring method of minimum exposure energy |
| JP7007963B2 (en) * | 2018-03-16 | 2022-01-25 | Hoya株式会社 | Light irradiation device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05217885A (en) * | 1992-01-31 | 1993-08-27 | Canon Inc | Wafer edge exposure apparatus |
| CN1672242A (en) * | 2002-07-25 | 2005-09-21 | 浜松光子学株式会社 | Light conducting device |
| CN1991424A (en) * | 2005-12-28 | 2007-07-04 | 豪雅冠得股份有限公司 | Light guide and light irradiation device |
| JP2007194583A (en) * | 2005-12-21 | 2007-08-02 | Ａｒｋ Ｔｅｃｈ株式会社 | Light source device for peripheral exposure |
| WO2011125420A1 (en) * | 2010-03-31 | 2011-10-13 | 東レエンジニアリング株式会社 | Periphery exposure apparatus and periphery exposure method |
| CN103874962A (en) * | 2011-09-22 | 2014-06-18 | 日本电气工程株式会社 | Optical recording head and image formation device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2845629B2 (en) * | 1991-02-13 | 1999-01-13 | 東京エレクトロン株式会社 | Exposure method |
| JP3707060B2 (en) * | 1994-06-29 | 2005-10-19 | 株式会社ニコン | Illumination optics |
| JP3947365B2 (en) | 2001-04-17 | 2007-07-18 | 株式会社Ｓｏｋｕｄｏ | Edge exposure device |
-
2014
- 2014-10-01 JP JP2014202704A patent/JP6082721B2/en active Active
-
2015
- 2015-09-25 KR KR1020150136431A patent/KR101985848B1/en active IP Right Grant
- 2015-09-25 CN CN201510621331.1A patent/CN105487340B/en not_active Expired - Fee Related
- 2015-09-30 TW TW104132035A patent/TWI596443B/en not_active IP Right Cessation
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05217885A (en) * | 1992-01-31 | 1993-08-27 | Canon Inc | Wafer edge exposure apparatus |
| CN1672242A (en) * | 2002-07-25 | 2005-09-21 | 浜松光子学株式会社 | Light conducting device |
| JP2007194583A (en) * | 2005-12-21 | 2007-08-02 | Ａｒｋ Ｔｅｃｈ株式会社 | Light source device for peripheral exposure |
| CN1991424A (en) * | 2005-12-28 | 2007-07-04 | 豪雅冠得股份有限公司 | Light guide and light irradiation device |
| WO2011125420A1 (en) * | 2010-03-31 | 2011-10-13 | 東レエンジニアリング株式会社 | Periphery exposure apparatus and periphery exposure method |
| CN103874962A (en) * | 2011-09-22 | 2014-06-18 | 日本电气工程株式会社 | Optical recording head and image formation device |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101985848B1 (en) | 2019-09-03 |
| JP2016072543A (en) | 2016-05-09 |
| CN105487340A (en) | 2016-04-13 |
| TW201614387A (en) | 2016-04-16 |
| TWI596443B (en) | 2017-08-21 |
| JP6082721B2 (en) | 2017-02-15 |
| KR20160039545A (en) | 2016-04-11 |
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