TWI595615B - Touch panel - Google Patents

Description

Touch panel

The present invention relates to a transparent touch panel constructed using a patterned transparent conductive film.

In recent years, transparent touch panels have been used as input devices on displays of various electronic devices. Examples of the method of the touch panel include a resistive film type and a static capacitance type. In the resistive film type, the touch position is detected by the upper and lower electrode contacts. Further, in the static capacitance type, the touch position is detected by a change in the electrostatic capacitance of the surface when the fingertip or the like touches.

The capacitive touch panel is roughly classified into a surface capacitive type and a projected type. In the projection type, as the electrode for detecting the change in the electrostatic capacitance, a portion where the conductive film is formed (patterned) in the transparent conductive film and a portion having no conductive film by etching treatment or the like is used. At this time, the optical characteristics of the portion having the conductive film and the portion having no conductive film are different, and thus the pattern of the conductive layer becomes conspicuous and the visibility is deteriorated.

In order to make the pattern of the conductive film unobtrusive, a method has been proposed to make the pattern difficult to see by forming a dummy pattern patterned in such a manner as to be used with a conductive film for detecting a touch position of the conductive film. In part, the conductive film having a discontinuous small-area shape is left in isolation (see Patent Document 1).

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] International Publication No. 2011/033907

However, if a dummy pattern is used in the conductive film, a conductive film is left on almost the entire surface, and an increase in yellowing or an increase in haze due to the presence of the conductive film may become a problem. In other words, when the dummy pattern is formed in the non-conductive portion, the pattern of the conductive film layer of the electrode and the dummy pattern of the non-conductive layer portion are different from each other, and thus the pattern of the conductive layer becomes conspicuous and the visibility is deteriorated.

In order to solve the problems of the prior art as described above, the present invention provides a touch panel capable of suppressing the use of a virtual pattern to a minimum, thereby reducing yellowing or haze, and making it difficult to see a pattern, thereby improving visibility. Sex.

A first aspect of the present invention for solving the above problems is a touch panel comprising at least a first transparent substrate, and a first transparent conductive film patterned on one surface of the first transparent substrate; the first metal wiring And being connected to the first transparent conductive film; the second transparent substrate; the second transparent conductive film is patterned on one surface of the second transparent substrate; and the second metal wiring is connected to the second transparent conductive film; a transparent adhesive layer, the first transparent conductive film is a rectangular pattern having a substantially inner opening in a rectangular shape, and the second transparent conductive film is substantially placed inside the rectangular shape A rectangular pattern of slits, the pores of the first transparent conductive film being disposed at a position overlapping the second transparent conductive film.

According to still another aspect of the present invention, a touch panel includes at least: a transparent substrate; the first transparent conductive film is patterned on one surface of the transparent substrate; and the first metal wiring is connected to the first transparent conductive a second transparent conductive film is formed on the other side of the transparent substrate; the second metal wiring is connected to the second transparent conductive film, and the first transparent conductive film is a rectangle having a substantially inner opening in the rectangular shape The pattern, the second transparent conductive film is a rectangular pattern in which a slit is substantially placed inside the rectangle, and the hole of the first transparent conductive film is disposed at a position overlapping the second transparent conductive film.

Further, the hole of the first transparent conductive film is formed by disposing a dummy pattern in the slit formed in the first transparent conductive film, and the dummy pattern may not have the second transparent conductive film opposite to the facing in the plan view of the panel surface. The overlap.

Further, in the plan view of the touch panel area of the face pattern of the first transparent conductive film and the second transparent conductive film overlapping portion may be in the range where the average of ² or less than 0.0025mm ² 0.10mm.

Further, the width of the hole of the first transparent conductive film may be 0.020 mm or more and 0.15 mm or less wider than the width of the pattern of the second transparent conductive film stacked on the side along the width of the side of the second transparent conductive film.

Further, at least the narrowest portion width of the non-slit portion of the pattern of the second transparent conductive film may be in the range of 0.050 mm or more and 0.35 mm or less.

Further, at least the slit portion of the pattern of the second transparent conductive film The narrowest portion width may be the same as the width of the narrowest portion of the non-slit portion or wider than the width of the narrowest portion of the non-slit portion.

Further, the transparent conductive film may contain at least a nanowire.

Also, the nanowire can be covered by the resin layer.

Further, the shortest distance between the first transparent conductive film and the second transparent conductive film may be in the range of 20 μm or more and 150 μm or less.

Further, the thickness of the transparent substrate may be in the range of 20 μm or more and 150 μm or less.

Moreover, the haze ratio indicating the scattering of the transmitted light of the touch panel may be 1.5% or less.

In general, in order to avoid seeing the pattern of the transparent conductive film which has been patterned, the following method is employed: a portion other than the electrode portion of the transparent conductive film is covered with a dummy transparent conductive film so as not to be short-circuited with the electrode. . In the case where the electrodes of the upper and lower layers are overlapped in this state, substantially the two-layer transparent conductive film affects the yellowing or haze ratio. In the present invention, the electrode pattern of the transparent conductive film is formed into a rectangular shape in which the slit and the opening are formed, and the hole of one of the transparent conductive films is disposed at a position overlapping with the other transparent conductive film, thereby suppressing yellowing or The visibility of the pattern is effectively suppressed at the haze rate. In particular, it is very effective in the case where a nanowire such as a nano silver wire is used for a transparent conductive film.

As described above, according to the present invention, it is possible to provide a touch panel which minimizes the use of a virtual pattern, reduces yellowing or haze, and makes it difficult to see a pattern to improve visibility.

1‧‧‧Transparent substrate

2‧‧‧ resin layer

3‧‧‧hard film

4‧‧‧Optical adjustment layer

5‧‧‧Transparent conductive film

6‧‧‧Transparent adhesive layer

7‧‧‧protective glass

10, 20, 30‧‧‧ touch panel

40, 41, 80, 81‧‧‧ transparent conductive film pattern of touch panel

51, 91‧‧‧ first transparent conductive film

52‧‧‧Second transparent conductive film

511, 911‧‧‧ first transparent conductive film conductive part

512, 914‧‧‧ first transparent conductive film hole

912‧‧‧The first transparent conductive film slit

913‧‧‧The first transparent conductive film virtual department

521‧‧‧Second transparent conductive film conductive part

522‧‧‧Second transparent conductive film slit

60, 70‧‧‧ Transparent conductive film pattern of the touch panel of the comparative example

Fig. 1 is a cross-sectional view showing the configuration of a first touch panel according to an embodiment of the present invention.

Fig. 2 is a cross-sectional view showing the configuration of a second touch panel according to an embodiment of the present invention.

Fig. 3 is a cross-sectional view showing the configuration of a third touch panel according to an embodiment of the present invention.

Fig. 4 is a plan view showing the configuration of a transparent conductive film pattern according to the first embodiment of the present invention.

Fig. 5 is a plan view showing a repeating unit pattern constituting the transparent conductive film pattern of the first embodiment of the present invention.

Fig. 6 is a plan view showing the pattern of the first transparent conductive film of the first embodiment of the present invention.

Fig. 7 is a plan view showing a pattern of a second transparent conductive film according to an embodiment of the present invention.

Fig. 8 is a plan view showing the configuration of a transparent conductive film pattern according to a second embodiment of the present invention.

Fig. 9 is a plan view showing a repeating unit pattern constituting the transparent conductive film pattern of the second embodiment of the present invention.

Fig. 10 is a plan view showing the pattern of the first transparent conductive film of the second embodiment of the present invention.

Fig. 11 is a plan view showing the configuration of a transparent conductive film pattern of the first comparative example.

Fig. 12 is a plan view showing the configuration of the transparent conductive film pattern of the second comparative example.

[Formation of the Invention]

Hereinafter, embodiments for carrying out the invention will be described using the drawings. Further, the present invention is not limited to the embodiments described below, and may be changed based on the knowledge addition design of the same person, and the embodiment in which such a change is added is also included in the scope of the present invention.

1 to 3 are examples of the cross-sectional structure of the touch panel of the present invention.

The touch panel 10 shown in FIG. 1 has a configuration in which two substrates of the transparent conductive film 5 and the cured film 3 are sequentially provided on one surface of the transparent substrate 1 and are bonded to each other by a transparent adhesive layer 6. On the other side of the transparent substrate 1 and the cured film 3 side of the other substrate, the cover glass 7 is further adhered to the cured film 3 side of the one substrate through the transparent adhesive layer 6.

The touch panel 20 shown in FIG. 2 has a configuration in which the transparent conductive film 5 and the cured film 3 are sequentially provided on one surface and the other surface of the transparent substrate 1, and the protective glass 7 is further transparent. The adhesive layer 6 is bonded to one side of the cured film 3 side.

The touch panel 30 shown in FIG. 3 is configured such that the optical adjustment layer 4 and the transparent conductive film 5 are sequentially provided on one surface of the transparent substrate 1 and the other surface thereof, and the protective glass 7 is further transparent. The adhesive layer 6 is bonded to one side of the transparent conductive film 5, and the cured film 3 is provided on the other transparent conductive film 5.

As the transparent substrate 1 used in the present invention, in addition to glass, a plastic film composed of a resin can be used. As a plastic film, if The film forming process and the post-process are not particularly limited as long as they have sufficient strength and surface smoothness, and examples thereof include a polyethylene terephthalate film and a polybutylene terephthalate film. Polyethylene naphthalate film, polycarbonate film, polyether ruthenium film, polyfluorene film, polyarylate film, cyclic polyolefin film, polyimine film, and the like. The thickness thereof is preferably 10 μm or more and 20 μm or less, in particular, a thickness of 20 μm or more and 150 μm or less is used in consideration of the thickness reduction of the member and the flexibility of the laminate. Moreover, when the touch panel of the present invention is disposed in front of the display, the transparent substrate must have high transparency, and it is suitable to use a total light transmittance of 85% or more.

As the material contained in the transparent substrate 1, various known additives or stabilizers such as an antistatic agent, a plasticizer, a slip agent, an easy-adhesive agent and the like can be used. Corona treatment, low temperature plasma treatment, ion bombard treatment, pharmaceutical treatment, or the like may be applied as a pretreatment in order to improve the adhesion to each layer.

The resin layer 2 can also be formed on the transparent substrate 1 of the present invention. The resin layer 2 used in the present invention is provided in order to impart mechanical strength to the transparent conductive film 6. The resin to be used is not particularly limited, and is preferably a resin having transparency, moderate hardness, and mechanical strength. Specifically, it is preferably a photocurable resin such as a monomer or a crosslinkable oligomer having a trifunctional or higher acrylate which is three-dimensionally crosslinked as a main component. The resin layer 2 is disposed on the other surface of the transparent substrate 1 in the touch panel 10 of FIG. 1 , and is disposed on the transparent substrate in the touch panel 20 of FIG. 2 and the touch panel 30 of FIG. 3 , respectively. The face of one side of one and the other side of the face.

As the trifunctional or higher acrylate monomer, trihydroxyl is preferred Methylpropane triacrylate, isomeric cyanide EO modified triacrylate, neopentyl alcohol triacrylate, dipentaerythritol triacrylate, dipentaerythritol tetraacrylate, dipentaerythritol Pentaacrylate, dipentaerythritol hexaacrylate, ditrimethylolpropane tetraacrylate, neopentyltetraol tetraacrylate, polyester acrylate, and the like. Particularly preferred are isomeric cyanuric acid EO modified triacrylates and polyester acrylates. They may be used singly or in combination of two or more. Further, in addition to these trifunctional or higher acrylates, so-called acrylic resins such as epoxy acrylate, urethane acrylate, and polyol acrylate may be used in combination.

As the crosslinkable oligomer, polyester (meth) acrylate, polyether (meth) acrylate, polyurethane (meth) acrylate, epoxy (meth) acrylate is preferred. An acrylic oligomer such as an anthrone (meth) acrylate. Specifically, there are polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, bisphenol A epoxy acrylate, polyurethane diacrylate, cresol novolac type Epoxy (meth) acrylate and the like.

The resin layer 2 may be an additive containing other particles, a photopolymerization initiator, or the like.

The particles to be added include organic or inorganic particles, and when transparency is considered, organic particles are preferably used. Examples of the organic particles include an acrylic resin, a polystyrene resin, a polyester resin, a polyolefin resin, a polyamide resin, a polycarbonate resin, a polyurethane resin, an anthrone resin, and a fluororesin. The particles that make up.

The average particle diameter of the particles differs depending on the thickness of the resin layer 2, but from the viewpoint of appearance such as haze, the lower limit of use is 2 μm. More preferably, it is 5 μm or more, and the upper limit is 30 μm or less, and more preferably 15 μm or less. Moreover, for the same reason, the content of the particles is preferably 0.5% by weight or more and 5% by weight or less based on the resin.

In the case of adding a photopolymerization initiator, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzyl methyl group as a radical polymerization type photopolymerization initiator Benzoin (benzil methylketal) and other alkyl ethers; acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 1-hydroxycyclohexyl phenyl ketone and other acetophenone Class; hydrazines such as methyl hydrazine, 2-ethyl hydrazine, 2-pentyl hydrazine; (thioxanthone), 2,4-diethyloxysulfide 2,4-diisopropyloxysulfide Oxygen sulfur a diterpenoid such as acetophenone dimethyl dihydrazine or benzyl dimethyl dihydrazine; diphenyl ketones such as diphenyl ketone and 4,4-dimethylaminodiphenyl ketone; Compounds, etc. They can be used singly or in combination of two or more, and can also be a tertiary amine such as triethanolamine or methyldiethanolamine; 2-dimethylaminoethylbenzoic acid, 4-dimethylaminobenzoic acid B A light-starting adjuvant such as a benzoic acid derivative such as an ester is used in combination.

The amount of the photopolymerization initiator to be added is 0.1% by weight or more and 5% by weight or less, preferably 0.5% by weight or more and 3% by weight or less based on the resin of the main component. Below the lower limit, the hardening of the hard coat layer becomes insufficient. Moreover, when it exceeds the upper limit, the hard coat layer turns yellow and the weather resistance falls, which is not preferable. The light used to harden the photocurable resin is ultraviolet light, electron beam, or gamma line. In the case of an electron beam or a gamma line, it is not necessary to contain a photopolymerization initiator or a photoinitiator. . As these line sources, can be used High-pressure mercury lamps, xenon lamps, metal halide lamps or accelerating electronics.

Further, the thickness of the resin layer 2 is not particularly limited, but is preferably in the range of 0.5 μm or more and 15 μm or less. Further, it is more preferable that the refractive index is the same as or similar to that of the transparent substrate 1, and is preferably about 1.45 or more and 1.75 or less.

In the method of forming the resin layer 2, a resin of a main component or the like is dissolved in a solvent, and a die coater, a curtain flow coater, a roll coater, and a reverse roll coater are used. A coating method such as a coater, a gravure coater, a knife coater, a bar coater, a spin coater, or a micro-gravure coater is formed.

The solvent is not particularly limited as long as it is a resin that dissolves the above main component. Specific examples of the solvent include ethanol, isopropanol, isobutanol, benzene, toluene, xylene, acetone, methyl ethyl ketone, methyl isobutyl ketone, ethyl acetate, and acetic acid n- Butyl ester, isoamyl acetate, ethyl lactate, methyl cellosolve, ethyl celecoxib, butyl sirlo, methyl sarbuta acetate, propylene glycol monomethyl ether acetate Ester and the like. These solvents may be used alone or in combination of two or more.

The optical adjustment layer 4 has a function of adjusting the transmittance or hue of the transparent conductive film, and is used for improving the visibility. In the case where an inorganic compound is used as the optical adjustment layer 4, a material such as an oxide, a sulfide, a fluoride, or a nitride can be used. The film composed of the above inorganic compound differs in refractive index depending on the material thereof, and optical characteristics can be adjusted by forming a film having a different refractive index with a specific film thickness. In the case where an organic compound is used as the optical adjustment layer 4, it is to be folded according to the target The inorganic compound of the incident rate is added to the same crosslinkable resin as the resin layer 2, and is used in a specific film thickness. Further, the number of layers as the optical adjustment layer may be a plurality of layers depending on the target optical characteristics.

Examples of the material having a low refractive index include magnesium oxide (1.6), cerium oxide (1.5), magnesium fluoride (1.4), calcium fluoride (1.3 to 1.4), cerium fluoride (1.6), and aluminum fluoride. (1.3) and so on. Further, examples of the material having a high refractive index include titanium oxide (2.4), zirconium oxide (2.4), zinc sulfide (2.3), cerium oxide (2.1), zinc oxide (2.1), indium oxide (2.0), and oxidation.铌 (2.3), bismuth oxide (2.2), etc. Here, the numerical value in the above parentheses indicates the refractive index.

The transparent conductive film 5, as the inorganic compound, may be any of indium oxide, zinc oxide, and tin oxide, or an oxide of two or three kinds thereof, and further additives may be added according to the purpose. The use of various materials is not particularly limited. At present, the most reliable material with many achievements is indium tin oxide (ITO).

In the case where indium tin oxide (ITO) of the most common transparent conductive film is used as the transparent conductive film 5, the content ratio of tin oxide doped with indium oxide is selected in an arbitrary ratio depending on the specifications required for the device. For example, when the transparent substrate is a plastic film, the sputtering target material used for crystallizing the film for the purpose of improving the mechanical strength is preferably such that the content of tin oxide is less than 10% by weight, in order to make the film amorphous. It is made flexible, and it is preferable that the content ratio of tin oxide is 10 weight% or more. Further, in the case where the film requires low resistance, the content ratio of tin oxide is preferably in the range of 2% by weight to 20% by weight.

When the optical adjustment layer 4 and the transparent conductive film 5 are inorganic compounds, any method can be used as the manufacturing method. The film forming method is acceptable, and the dry method of forming the film is superior. This can be carried out by a physical vapor deposition method such as a vacuum deposition method or sputtering or a chemical vapor deposition method such as a CVD method. In particular, in order to form a film having a uniform film quality over a large area, a sputtering method in which the process is stable and the film is densified is preferable. Further, when the optical adjustment layer 4 is formed of an organic compound, a coating liquid, a solution, or the like, the same method as the method of forming the resin layer 2 can be used.

Further, the transparent conductive film 5 can be made of a material such as a nano metal particle, a nanowire, a carbon nanotube, a graphene or a conductive polymer, and can be dissolved or dispersed in an organic solvent or an alcohol. Water or the like is formed by coating and drying. Further, considering the sheet resistance or transparency of the transparent conductive film, it is more suitable to use a nano metal wire.

The nanowire is mixed with a resin or the like, and is mixed with water, an alcohol, an organic solvent, or the like to adjust the liquid, and after drying after coating, the nanowires are intertwined to form a mesh shape, thereby even A small amount of conductive material can still form a good electrical conduction path, which can further reduce the resistance value of the conductive layer. Further, in the case of forming such a mesh shape, since the opening of the gap portion of the mesh is large, even if the fibrous conductive material itself is not transparent, good transparency as a coating film can be achieved.

Specific examples of the metal of the nanowire include iron, cobalt, nickel, copper, zinc, ruthenium, rhodium, palladium, silver, cadmium, osmium, iridium, platinum, and gold, from the viewpoint of electrical conductivity. Preferably, it is gold, silver, copper, platinum or gold.

Formed on a transparent substrate by using a nanowire or the like As a method of the conductive film, a well-known coating method such as spray coating, bar coating, roll coating, die coating, inkjet coating, screen coating, or dip coating can be used.

When the film thickness of the transparent conductive layer is too small, sufficient conductivity as a conductor tends to be insufficient, and if it is too thick, the transparency tends to be impaired due to an increase in the haze value and a decrease in the total light transmittance. Usually, it is suitably adjusted between 10 nm or more and 10 μm or less. However, when the conductive material itself is opaque, such as a nanowire, it is easy to lose transparency due to an increase in film thickness, and most of the conductive thin film is formed. Floor. In this case, the conductive layer has a large number of openings. When the film thickness is measured by a contact film thickness meter, the film thickness is preferably from 10 nm to 500 nm, more preferably from 30 nm to 300 nm. 50 nm or more and 150 nm or less.

The cured film 3 can be provided to protect the transparent conductive film 5 or to provide mechanical strength to the transparent conductive film. The resin to be used is not particularly limited, and is preferably a resin having transparency and moderate hardness and mechanical strength. Specifically, a photocurable resin such as a monomer or a crosslinkable oligomer having a trifunctional or higher acrylate which is expected to be three-dimensionally crosslinked as a main component can be formed using the same material as the resin layer 2 . . The formation method can also be the same as the resin layer 2.

The optical adjustment layer 4 of the present invention or the transparent conductive film 5 may form an adhesion layer before forming them. Examples of the material used as the adhesion layer include metals such as ruthenium, nickel, chromium, tin, gold, silver, platinum, zinc, titanium, tungsten, zirconium, and palladium, or two or more of these. a compound composed of elements, or an oxide or fluoride of these elements , sulfides, nitrides, or mixtures of such oxides, fluorides, sulfides, nitrides, and the like. Among the above materials, the chemical composition of oxides, fluorides, sulfides, and nitrides may not conform to the stoichiometric composition if the adhesion can be improved. Further, a crosslinkable resin such as an acrylic resin similar to the resin layer 2 can also be used.

(First embodiment)

The transparent conductive film 5 of the first embodiment is a pattern as shown in Fig. 4 or Fig. 5. As shown in FIGS. 6 and 7, the pattern formed is a conductive pattern region (the first transparent conductive film 51 in FIG. 6 is composed of the conductive portion 511, and the second transparent conductive film 52 in FIG. 7 is formed. The conductive portion 521 and the non-conductive pattern region (the first transparent conductive film 51 in FIG. 6 is composed of the hole portion 512, and the second transparent conductive film 52 in FIG. 7 is formed by the slit portion). 522 constitutes). The conductive pattern region is in contact with a metal wiring (not shown) and is connected to a circuit capable of detecting a voltage change. When a human finger or the like approaches the conductive pattern region of the detecting electrode, the voltage of the circuit fluctuates due to the change in the overall electrostatic capacitance, and the contact position can be determined. The pattern of Fig. 6 and Fig. 7 is attached to the voltage change detecting circuit to obtain two-dimensional position information.

As a pattern forming method of the transparent conductive film 5, photolithography (photolithography) in which the transparent conductive film 5 is chemically dissolved by patterning by exposure or development is applied by coating or bonding a resist on the transparent conductive film 5. a method of forming a method of vaporizing a chemical reaction using a chemical reaction in a vacuum, and a method of sublimating a transparent conductive film by using a laser. The pattern forming method can be appropriately selected according to the shape and precision of the pattern, but considering the pattern precision and thinning, it is preferably constructed by photolithography. The method of formation.

The pattern formed by the transparent conductive film 5 of the present embodiment is two types of the first transparent conductive film 51 and the second transparent conductive film 52 as shown in FIGS. 4 to 7 . The first transparent conductive film 51 has a pattern. A rectangular pattern having substantially a hole inside the rectangle (the first transparent conductive film 51 composed of the conductive portion 511 and the hole portion 512 is shown in FIG. 6), and the second transparent conductive film 52 has substantially inside the rectangle A rectangular pattern in which the slit is placed (the second transparent conductive film 52 composed of the conductive portion 521 and the slit 522 is shown in FIG. 7), and they are disposed in the hole portion 512 of the first transparent conductive film 51 and the first portion. The positions where the conductive portions 521 of the two transparent conductive films 52 overlap are combined up and down to be used as a capacitance detecting sensor of the capacitive touch panel. The transparent conductive film 5 may be patterned on both surfaces of a single transparent substrate, or a transparent conductive film which has been separately patterned may be provided on an individual transparent substrate, and may be bonded to the transparent adhesive layer 6 to be placed upside down. Each of the electrodes formed of the transparent conductive film 5 is connected to a metal wiring (not shown), and is connected to an electrode formed of the first transparent conductive film 51 and an electrode composed of the second transparent conductive film 52. A circuit in which a capacitance changes between, and thus acts as a capacitive touch sensor. The touch sensor is finally bonded to the cover glass 7 through the transparent adhesive layer 6, so that the touch panel can be fabricated.

A pattern area of the overlapping portion of the pattern of the first transparent conductive film 51 and the second transparent conductive film 52 of, for example, can be set as the average or more places 0.0025mm ² to 0.10mm ² or less range. Further, for example, the hole 512 of the first transparent conductive film 51 defines the width along the side of the pattern traversing the second transparent conductive film 52 to be 0.020 mm wider than the width of the second transparent conductive film 52 overlying the side. Above 0.15mm. Further, for example, the narrowest portion width of the non-slit portion (conductive portion 521) of the pattern of the second transparent conductive film 52 can be set in a range of 0.050 mm or more and 0.35 mm or less. Further, for example, the narrowest portion width of the slit portion (slit 522) of the pattern of the second transparent conductive film 52 can be set to be the same as the narrowest portion width of the non-slit portion (the conductive portion 521) or the most non-slit portion. The width of the narrow portion is wide. The transparent conductive film may, for example, contain at least a nanowire, and the nanowire may be covered, for example, by the resin layer 2. The shortest distance between the first transparent conductive film 51 and the second transparent conductive film 52 can be set, for example, in the range of 20 μm or more and 150 μm or less.

According to the touch panel of each of the above configurations, the haze ratio indicating the scattering of the transmitted light of the touch panel can be set to 1.5% or less.

(Second embodiment)

The transparent conductive film 5 of the second embodiment is patterned as shown in plan view in Fig. 8 or Fig. 9. The transparent conductive film pattern 81 of Fig. 9 shows a person who extracts the repeated unit pattern constituting the transparent conductive film pattern 80 of Fig. 8. As the transparent conductive film 5 to which the pattern has been applied, the first transparent conductive film 91 and the second transparent conductive film 52 having a rectangular pattern in which a slit is substantially placed inside the rectangle are formed. As shown in FIGS. 10 and 7, the formed pattern is composed of a conductive pattern region (the first transparent conductive film 91 in FIG. 10 is composed of the conductive portion 911 and the dummy portion 913 of the dummy pattern, in the first The second transparent conductive film 52 in Fig. 7 is composed of the conductive portion 521 and the non-conductive pattern region (the slit portion 912 including the dummy portion 913 in the first transparent conductive film 91 in Fig. 10) The configuration is constituted by the slit portion 522 in the second transparent conductive film 52 of Fig. 7 . The conductive pattern region is connected to a metal wiring (not shown) Connected to a circuit that detects voltage changes. When a human finger or the like approaches the conductive pattern region of the detecting electrode, the voltage of the circuit fluctuates due to the change in the overall electrostatic capacitance, and the contact position can be determined. The two-dimensional position information is obtained by attaching the patterns of FIGS. 10 and 7 to the voltage change detecting circuit.

The pattern forming method of the transparent conductive film 5 is composed of photolithography which is formed by coating or bonding a resist on the transparent conductive film 5, forming a pattern by exposure and development, and chemically dissolving the transparent conductive film 5. A method of vaporizing a chemical reaction in a vacuum; a method of sublimating a transparent conductive film by using a laser. The pattern forming method can be appropriately selected in accordance with the shape, accuracy, and the like of the pattern. However, in consideration of pattern accuracy and thinning, a method using photolithography is preferred.

As shown in FIG. 10, the first transparent conductive film 91 is patterned into a dummy portion 913 in which a dummy pattern is formed inside the slit portion 912. Thereby, the hole 914 between the adjacent dummy portions 913 which are disposed inside the respective slit portions 912 of the first transparent conductive film 91 is formed. The first transparent conductive film 91 and the second transparent conductive film 52 are disposed at positions where the holes 914 overlap the conductive portion 521 of the second transparent conductive film 52, and are vertically combined. At this time, the first transparent conductive film dummy portion 913 does not have an overlapping portion with the opposing second transparent conductive film 52 in a plan view of the touch panel surface. The transparent conductive film 5 that has been patterned can be used as a capacitance detecting sensor of a capacitive touch panel. The transparent conductive film 5 may be disposed on both surfaces of a single transparent substrate, or the transparent conductive film 5 which has been separately patterned may be provided on an individual transparent substrate, and may be bonded to the transparent adhesive layer 6 to be placed upside down. Each of the electrodes formed by the transparent conductive film 5 is separately connected to the metal wiring (not The connection is connected to a circuit for detecting a change in capacitance between an electrode composed of the first transparent conductive film 91 and an electrode composed of the second transparent conductive film 52, thereby serving as a capacitive touch sensor. action. The touch sensor is finally bonded to the cover glass 7 through the transparent adhesive layer 6, so that the touch panel can be fabricated.

A pattern area of the overlapping portion of the pattern of the first transparent conductive film 91 and the second transparent conductive film 52 of, for example, can be laid in the range of ² to less than 0.0025mm ² 0.10mm average place. Further, for example, the hole 914 of the first transparent conductive film 91 defines the width along the side of the pattern traversing the second transparent conductive film 52 to be 0.020 mm wider than the width of the second transparent conductive film 52 overlying the side. Above 0.15mm. Further, for example, the narrowest portion width of each of the non-slit portions (the first transparent conductive film conductive portion 911 and the second transparent conductive film conductive portion 521) of the pattern of the first transparent conductive film 91 and the second transparent conductive film 52 can be It is set in the range of 0.050 mm or more and 0.35 mm or less. In addition, for example, the narrowest portion width of the slit portion (the first transparent conductive film slit portion 912 and the second transparent conductive film slit portion 522) of the pattern of the first transparent conductive film 91 and the pattern of the second transparent conductive film 52 can It is set to be the same as the width of the narrowest portion of each of the non-slit portions or wider than the width of the narrowest portion of the non-slit portion. The transparent conductive film may, for example, contain at least a nanowire, and the nanowire may be covered, for example, by the resin layer 2. The shortest distance between the first transparent conductive film 51 and the second transparent conductive film can be set, for example, in the range of 20 μm or more and 150 μm or less.

According to the touch panel of each of the above configurations, the haze ratio indicating the scattering of the transmitted light of the touch panel can be set to 1.5% or less.

[Examples]

Hereinafter, the present invention will be described in detail by way of specific examples, but these examples are intended to be illustrative, and the invention is not limited thereto.

<Example 1>

A touch panel 10 having the same layer configuration as that of Fig. 1 was produced. PET (50 μm) was used as the transparent substrate 1, and a UV-curable transparent acrylic resin was applied to the resin layer 2 as a single layer on a single surface, followed by drying and UV curing to form a thickness of 3 μm. The nano silver wire was applied to the surface of the transparent substrate 1 opposite to the resin layer 2 as a transparent conductive film 5 by a slot die coat so as to have a sheet resistance of 100 Ω/□, similarly to a thickness of 130 nm. A UV curable transparent acrylic resin is applied as the cured film 3.

By dividing the obtained substrate with the transparent conductive film into two halves, the photoresist is exposed and developed by photolithography, and then etching and peeling resist are performed to form one of the substrates as the fourth image. The pattern indicated by 51 is referred to as a first transparent conductive film, and the other square is a pattern indicated by 52 in FIG. 4 as a second transparent conductive film. The first transparent conductive film 51 has a plurality of holes 512 in the conductive portion 511, and the area of the hole portion is B × C, and B = 500 μm and C = 300 μm, and the hole portions 512 adjacent in one direction are spaced apart from each other. A = 280 μm configuration. The second transparent conductive film 52 has a plurality of slit portions 522 in the conductive portion 521, the width D of the conductive portion is set to 200 μm, and the width E of the slit portion is set to 500 μm. When photolithography is performed, the development of the photoresist is carried out with an aqueous solution of sodium carbonate, the nano silver wire is etched with a ferrous chloride solution, and the resist is peeled off with an aqueous sodium hydroxide solution. The first and second transparent conductive films are respectively connected to the silver wiring by the one transparent conductive film electrodes. The silver wiring is formed by printing silver paste by screen printing. The wiring width is 100 μm.

The base material with the first transparent conductive film 51 obtained above and the two base materials of the substrate on which the second transparent conductive film 52 has been patterned are bonded together using a transparent adhesive layer 6 having a thickness of 75 μm. The cover glass 10 having a thickness of 0.55 mm is attached to the surface to obtain the touch panel 10. The first transparent conductive film 51 and the second transparent conductive film 52 are arranged as shown in FIGS. 4 and 5 to dispose the conductive portion 521 of the second transparent conductive film 52 in a plurality of holes of the first transparent conductive film 51. The position on the 512 is precisely positioned to fit. In the operation of the touch panel 10, the silver wiring is connected to the drive LSI via the flexible printed circuit board to confirm the operation, and the contact of the finger and the position of the detected coordinate can be satisfactorily detected. The total light transmittance and the haze ratio measured by the cover glass 7 were 89.8% and 1.0%, respectively, and the shape of the pattern was not noticeable when viewed under a fluorescent lamp, and was hardly seen.

<Example 2>

A touch panel 20 having the same layer configuration as that of FIG. 2 is produced. PET (50 μm) was used as the transparent substrate 1, and a UV curable transparent acrylic resin to which 20 wt% of a UV absorber was added was applied to both sides as a resin layer 2 by microgravure, dried, and UV-cured to form a thickness of 5 μm. Further, the nano silver wire was applied as a transparent conductive film 5 by slit coating so as to have a sheet resistance of 100 Ω/□, and a UV curable transparent acrylic resin was applied as a cured film 3 in a thickness of 130 nm. .

The substrate having the double-sided transparent conductive film obtained was subjected to photolithography in the same manner as in Example 1 to expose and develop the photoresist, and then etching and peeling off the resist to form one surface. The pattern indicated by 51 in Fig. 4 serves as the first transparent conductive film, and the other surface shape The pattern indicated by 52 in Fig. 4 is referred to as a second transparent conductive film. The pattern shapes of the first transparent conductive film 51 and the second transparent conductive film 52 were created in the same manner as in the first embodiment. The first transparent conductive film 51 and the second transparent conductive film 52 are arranged in the plurality of holes of the first transparent conductive film 51 by the conductive portion 521 of the second transparent conductive film 52 as shown in FIGS. 4 and 5 . The form on the portion 512 is formed. Moreover, the silver wiring was also formed in the same manner as in the first embodiment.

On the second transparent conductive film 52 side of the substrate obtained above, a cover glass 20 having a thickness of 0.55 mm was bonded to the transparent adhesive layer 6 having a thickness of 75 μm to obtain a touch panel 20. In the operation of the touch panel 20, the silver wiring is connected to the drive LSI via the flexible printed circuit board, and the operation is confirmed, whereby the contact of the finger and the position of the detected coordinate can be satisfactorily detected. The total light transmittance and the haze ratio measured by the cover glass 7 were 91.0% and 0.9%, respectively, and the pattern shape was not noticeable when viewed under a fluorescent lamp, and was hardly seen.

<Example 3>

A touch panel 30 having the same layer configuration as that of Fig. 3 was produced. PET (50 μm) was used as the transparent substrate 1, and a UV curable transparent acrylic resin to which 20 wt% of a UV absorber was added was applied to both sides as a resin layer 2 by microgravure, dried, and UV-cured to form a thickness of 5 μm. Further, a UV curable acrylic resin to which zirconium oxide particles were added having a thickness of 90 nm was formed as an optical adjustment layer 4 on both sides. At this time, the refractive index of the optical adjustment layer 4 was 1.70. The obtained substrate was further subjected to DC magnetron sputtering to form ITO (tin content: 5 wt%) having a thickness of 22 nm on both sides as a transparent conductive film 5, and annealed at 150 ° C for 60 minutes to obtain a single sheet. The sheet resistance of the surface is 150Ω/□.

The substrate having the double-sided transparent conductive film obtained was subjected to photolithography in the same manner as in Example 1 to expose and develop the photoresist, and then etching and peeling off the resist to form one surface. The pattern indicated by 51 in Fig. 4 is referred to as a first transparent conductive film, and the other surface is formed as a pattern indicated by 52 in Fig. 4 as a second transparent conductive film. The pattern shapes of the first transparent conductive film 51 and the second transparent conductive film 52 were created in the same manner as in the first embodiment. The first transparent conductive film 51 and the second transparent conductive film 52 are arranged in the plurality of holes of the first transparent conductive film 51 by the conductive portion 521 of the second transparent conductive film 52 as shown in FIGS. 4 and 5 . The form on the portion 512 is formed. Moreover, the silver wiring was also formed in the same manner as in the first embodiment. Further, a transparent resin was applied as a cured film 3 by screen printing on the side of the first transparent conductive film 51 of the obtained substrate, and then UV-cured to form a thickness of 10 μm.

On the second transparent conductive film 52 side of the substrate obtained above, a cover glass 30 having a thickness of 0.55 mm was bonded to the transparent adhesive layer 6 having a thickness of 75 μm to obtain a touch panel 30. In the operation of the touch panel 30, the silver wiring is connected to the drive LSI via the flexible printed circuit board to confirm the operation, and the contact of the finger and the position of the detected coordinate can be satisfactorily detected. The total light transmittance and the haze ratio measured by the cover glass 7 were 90.5% and 0.7%, respectively, and the shape of the pattern was not noticeable when viewed under a fluorescent lamp, and was hardly seen.

<Example 4>

A touch panel 10 having the same layer configuration as that of Fig. 1 was produced. PET (50 μm) was used as a transparent substrate, and a UV curable transparent acrylic resin was applied to a single surface as a resin layer 2 by microgravure, followed by drying and UV hardening. The thickness was formed to a thickness of 3 μm. The nano silver wire was applied to the surface of the substrate opposite to the resin layer 2 as a transparent conductive film 5 by slit coating so as to have a sheet resistance of 100 Ω/□, and UV curable transparent acrylic was applied in the same manner at a thickness of 130 nm. The resin serves as the cured film 3.

By dividing the obtained base material with a transparent conductive film into two halves, the photoresist is exposed and developed by photolithography, and then etching and peeling resist are performed to form one of the substrates as the eighth figure. The pattern indicated by 91 is referred to as a first transparent conductive film, and the other square is a pattern indicated by 52 in FIG. 8 as a second transparent conductive film. The first transparent conductive film 91 has a plurality of slit portions 912 in the conductive portion 911, and has a dummy portion 913 inside the slit, and the dummy portion 913 does not have the second transparent conductive film 52 in a plan view of the panel surface. The virtual pattern of the overlapping portion of the way. The width A of the conductive portion of the first transparent conductive film 91 is set to 200 μm, and the width B of the slit portion 912 is set to 300 μm. The second transparent conductive film 52 has a plurality of slit portions 522 in the conductive portion 521, the width D of the conductive portion is set to 200 μm, and the width E of the slit portion is set to 500 μm. When photolithography is performed, the development of the photoresist is carried out with an aqueous solution of sodium carbonate, the nano silver wire is etched with a ferrous chloride solution, and the resist is peeled off with an aqueous sodium hydroxide solution.

The ones of the first and second transparent conductive films 91, 52, which have been isolated, are respectively connected to the silver wiring. The silver wiring is formed by printing silver paste by screen printing. The wiring width is 100 μm.

The two base materials with the first and second transparent conductive films 91 and 52 obtained above were bonded to each other using a transparent adhesive layer 6 having a thickness of 75 μm, and the protective glass 7 having a thickness of 0.55 mm was bonded to the outermost surface in the same manner. Touch panel. The first and second transparent conductive films 91 and 52 are as shown in FIGS. 8 and 9 , and the dummy portion 913 of the slit portion 912 of the first transparent conductive film 91 and the conductive portion 521 of the second transparent conductive film 52 are not The overlapping position is precisely matched to the positional accuracy. At this time, the area of the overlapping portion of the pattern of the first transparent conductive film 91 and the second transparent conductive film 52 is 0.04 mm ^{2 on} average per place. In the operation of the touch panel, the silver wiring is connected to the drive LSI via the flexible printed circuit board, and the operation is confirmed, so that the contact of the finger and the position of the detected coordinate can be satisfactorily detected.

The total light transmittance and the haze ratio measured by the cover glass 7 were 89.9% and 1.0%, respectively, and the pattern shape was not noticeable when viewed under a fluorescent lamp, and was hardly seen.

<Example 5>

A touch panel 20 having the same layer configuration as that of FIG. 2 is produced. PET (50 μm) was used as a transparent substrate, and a UV curable transparent acrylic resin to which 20 wt% of a UV absorber was added was applied to both sides as a resin layer 2 by microgravure, dried, and UV-cured to form a thickness of 5 μm. Further, the nano silver wire was applied as a transparent conductive film 5 by slit coating so as to have a sheet resistance of 100 Ω/□, and a UV curable transparent acrylic resin was applied as a cured film 3 in a thickness of 130 nm. .

The base material with the double-sided transparent conductive film obtained was subjected to photolithography in the same manner as in Example 4, and after exposure and development of the photoresist, etching and peeling of the resist were performed to form one surface. The pattern indicated by 91 in Fig. 8 is referred to as a first transparent conductive film, and the other surface is formed as a pattern indicated by 52 in Fig. 8 as a second transparent conductive film. The pattern shapes of the first transparent conductive film 91 and the second transparent conductive film 52 were created in the same manner as in the fourth embodiment. The first and second transparent conductive films 91 and 52 are as shown in Figs. 8 and 9 and have a dummy portion 913 and a second portion of the slit portion 912 of the first transparent conductive film 91 in a plan view of the panel surface. The conductive portion 521 of the transparent conductive film 52 is bonded to each other without having an overlapping portion. At this time, the overlapping portion area of the pattern of the first transparent conductive film 91 and the second transparent conductive film 51 is 0.04 mm ^{2 on} average per place. Further, the silver wiring was also formed in the same manner as in the fourth embodiment.

On the second transparent conductive film 52 side of the substrate obtained above, a cover glass having a thickness of 0.55 mm was bonded to the transparent adhesive layer 6 having a thickness of 75 μm to obtain a touch panel. In the operation of the touch panel, the silver wiring is connected to the drive LSI via the flexible printed circuit board, and the operation is confirmed, so that the contact of the finger and the position of the detected coordinate can be satisfactorily detected.

The total light transmittance and the haze ratio measured by the cover glass 7 were 91.1% and 0.9%, respectively, and the shape of the pattern was not noticeable when viewed under a fluorescent lamp, and was hardly seen.

<Example 6>

A touch panel 30 having the same layer configuration as that of Fig. 3 was produced. PET (50 μm) was used as a transparent substrate, and a UV curable transparent acrylic resin to which 20 wt% of a UV absorber was added was applied to both sides as a resin layer 2 by microgravure, dried, and UV-cured to form a thickness of 5 μm. Further, a UV curable acrylic resin to which zirconium oxide particles were added having a thickness of 90 nm was formed as an optical adjustment layer 4 on both sides. At this time, the refractive index of the optical adjustment layer 4 was 1.70. The obtained substrate was further subjected to DC magnetron sputtering to form ITO (tin content: 5 wt%) having a thickness of 22 nm on both sides as a transparent conductive film 5, and annealed at 150 ° C for 60 minutes. A one-sided sheet resistance of 150 Ω/□ was obtained.

The base material with the double-sided transparent conductive film obtained was subjected to photolithography in the same manner as in Example 4, and after exposure and development of the photoresist, etching and peeling of the resist were performed to form one surface. The pattern indicated by 91 in Fig. 8 is referred to as a first transparent conductive film, and the other surface is formed as a pattern indicated by 52 in Fig. 8 as a second transparent conductive film. The pattern shapes of the first transparent conductive film 91 and the second transparent conductive film 52 were created in the same manner as in the fourth embodiment. The first and second transparent conductive films 91 and 52 are as shown in Figs. 8 and 9 and have a dummy portion 813 and a second portion of the slit portion 812 of the first transparent conductive film 91 in plan view of the panel surface. The conductive portion 521 of the transparent conductive film 52 is bonded to each other without having an overlapping portion. At this time, the overlapping portion area of the pattern of the first transparent conductive film 91 and the second transparent conductive film 52 is 0.04 mm ^{2 on} average per place. Further, the silver wiring was also formed in the same manner as in the fourth embodiment. Further, a transparent resin was applied as a cured film 3 by screen printing on the side of the first transparent conductive film 91 of the obtained substrate, and then UV-cured to form a thickness of 10 μm.

On the second transparent conductive film 52 side of the substrate obtained above, a cover glass having a thickness of 0.55 mm was bonded to the transparent adhesive layer 6 having a thickness of 75 μm to obtain a touch panel. In the operation of the touch panel, the silver wiring is connected to the drive LSI via the flexible printed circuit board, and the operation is confirmed, so that the contact of the finger and the position of the detected coordinate can be satisfactorily detected.

The total light transmittance and the haze ratio measured by the cover glass 7 were 90.5% and 0.7%, respectively, and the shape of the pattern was not noticeable when viewed under a fluorescent lamp, and was hardly seen.

<Comparative Example 1>

A touch panel 10 having the same layer configuration as that of Fig. 1 was produced. PET (50 μm) was used as a transparent substrate, and a UV curable transparent acrylic resin was applied to the resin layer 2 as a single layer on a single surface, followed by drying and UV curing to form a thickness of 3 μm. The nano silver wire was applied to the surface of the substrate opposite to the resin layer 2 as a transparent conductive film 5 by slit coating so as to have a sheet resistance of 100 Ω/□, and UV curable transparent acrylic was applied in the same manner at a thickness of 130 nm. The resin serves as the cured film 3.

By dividing the obtained substrate with the transparent conductive film into two halves, the photoresist is exposed and developed by photolithography, and then the etching and peeling resist are performed, as shown in the plan view of FIG. Similarly to the film pattern 60, one of the squares is formed as a first transparent conductive film, and the other square is a pattern of 62 as a second transparent conductive film. When photolithography is performed, the development of the photoresist is carried out with an aqueous solution of sodium carbonate, the nano silver wire is etched with a ferrous chloride solution, and the resist is peeled off with an aqueous sodium hydroxide solution.

The ones of the first and second transparent conductive films 61, 62, which have been isolated, are respectively connected to the silver wiring. The silver wiring is formed by printing silver paste by screen printing. The wiring width is 100 μm.

The two base materials with the first and second transparent conductive films 61 and 62 obtained above were bonded to each other using a transparent adhesive layer 6 having a thickness of 75 μm, and the cover glass 7 having a thickness of 0.55 mm was bonded to the outermost surface in the same manner. Touch panel. The first and second transparent conductive films 61 and 62 are bonded to each other such that the long sides of the transparent conductive film pattern intersect each other by 90° as shown in Fig. 11 . The operation of the touch panel connects the silver wiring through the flexible printed substrate The drive LSI is checked for operation, so that the contact of the finger and the position of the detected coordinate can be well detected.

The total light transmittance and the haze ratio measured by the cover glass 7 were 89.5% and 1.0%, respectively. The pattern of the second transparent conductive film 52 is clearly observed under the fluorescent lamp, and becomes a touch panel having poor appearance quality.

<Comparative Example 2>

The touch panel having the structure shown in Fig. 1 was produced in the same manner as in Comparative Example 1, except that the pattern of the second transparent conductive film 62 of Comparative Example 1 was the transparent conductive film pattern 72 shown in plan view in Fig. 12 . The small square between the electrodes of the second transparent conductive film 72 is a dummy pattern that has been electrically insulated.

After the operation of the touch panel is confirmed, the contact of the finger and the position of the coordinate are well detected, and the pattern of the transparent conductive film observed under the fluorescent lamp is not conspicuous, and the total light transmittance and the haze ratio are 88.7%. 1.9%, which is a touch panel with poor transparency in terms of appearance quality.

[Industrial availability]

The touch panel of the present invention can be used, in particular, as a capacitive touch panel, and can be utilized as a user interface disposed in front of a smart phone, a tablet computer, a notebook PC, or the like.

Claims (11)

A touch panel includes at least: a first transparent substrate; a first transparent conductive film patterned on one side of the first transparent substrate; a first metal wiring connected to the first transparent conductive film; and a second transparent a second transparent conductive film patterned on one surface of the second transparent substrate; a second metal wiring connected to the second transparent conductive film; and a transparent adhesive layer, wherein the first transparent conductive film is substantially a rectangular pattern having a hole inside the rectangle, wherein the second transparent conductive film has a rectangular pattern in which a slit is substantially placed inside the rectangle, and the hole of the first transparent conductive film is disposed in the second transparent a position at which the conductive film overlaps, wherein the hole of the first transparent conductive film is formed by a dummy pattern formed on a slit formed in the first transparent conductive film, and the dummy pattern does not have a plan view of the touch panel surface An overlapping portion with the opposite second transparent conductive film. A touch panel comprising at least: a transparent substrate; a first transparent conductive film patterned on one side of the transparent substrate; a first metal wiring connected to the first transparent conductive film; and a second transparent conductive film Patterning is formed on the other surface of the transparent substrate; the second metal wiring is connected to the second transparent conductive film, and the first transparent conductive film is a rectangular pattern having substantially a hole inside the rectangular shape, and the second transparent conductive layer The membrane system has been placed substantially inside the rectangle a rectangular pattern of the slit, wherein a hole of the first transparent conductive film is disposed at a position overlapping the second transparent conductive film, and a hole of the first transparent conductive film is formed in a narrow portion of the first transparent conductive film The virtual pattern is formed by sewing, and the dummy pattern does not have an overlapping portion with the opposing second transparent conductive film in a plan view of the touch panel surface. The touch panel of claim 1 or 2, wherein an area of the overlapping portion of the pattern of the first transparent conductive film and the pattern of the second transparent conductive film is averaged in a plan view of the touch panel surface 0.0025mm ² or more places in the range of ² or less 0.10mm. The touch panel of claim 1 or 2, wherein the hole of the first transparent conductive film is wider than the side of the pattern of the second transparent conductive film, and the second transparent conductive layer is stacked on the side The width of the pattern of the film is 0.020 mm or more and 0.15 mm or less. The touch panel of claim 1 or 2, wherein at least the narrowest portion width of the non-slit portion of the pattern of the second transparent conductive film is in a range of 0.050 mm or more and 0.35 mm or less. The touch panel of claim 1 or 2, wherein at least the narrowest portion width of the slit portion of the pattern of the second transparent conductive film is the same as or smaller than the width of the narrowest portion of the non-slit portion The width of the narrow portion is wide. The touch panel of claim 1 or 2, wherein the transparent conductive film comprises at least a nanowire. The touch panel of claim 7, wherein the aforementioned nano metal wire is a tree Cover the lipid layer. The touch panel of claim 1 or 2, wherein the shortest distance between the first transparent conductive film and the second transparent conductive film is in a range of 20 μm or more and 150 μm or less. The touch panel of claim 1 or 2, wherein the thickness of the transparent substrate is in a range of 20 μm or more and 150 μm or less. The touch panel of claim 1 or 2, wherein the haze ratio indicating the scattering of the transmitted light of the touch panel is 1.5% or less.