TWI595206B - Heat exchange device - Google Patents
Heat exchange device Download PDFInfo
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- TWI595206B TWI595206B TW104144494A TW104144494A TWI595206B TW I595206 B TWI595206 B TW I595206B TW 104144494 A TW104144494 A TW 104144494A TW 104144494 A TW104144494 A TW 104144494A TW I595206 B TWI595206 B TW I595206B
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Description
本發明係提供一種熱交換裝置，特別係指一種藉由流體進行熱交換之熱交換裝置。 The present invention provides a heat exchange device, and more particularly to a heat exchange device that performs heat exchange by a fluid.
高溫容易造成電子產品的損壞或失效，因此散熱為電子產品的重要需求之一。傳統氣體對流式散熱已無法將現今的電子產品有效散熱，在相同空間下液冷式散熱器的效能較高。 High temperature is easy to cause damage or failure of electronic products, so heat dissipation is one of the important requirements of electronic products. Conventional gas convection heat dissipation has been unable to effectively dissipate heat in today's electronic products, and liquid-cooled heat sinks have higher efficiency in the same space.
目前的液冷式散熱器多為平流式液冷散熱器，亦即流體的流入方向與散熱面的平面方向相同，此種流動方式造成流體的熱邊界層較厚，因此熱無法均勻地傳導，無法有效散熱。 The current liquid-cooled heat sinks are mostly flat-flow liquid-cooled heat sinks, that is, the inflow direction of the fluid is the same as the plane direction of the heat-dissipating surface. This flow mode causes the thermal boundary layer of the fluid to be thick, so the heat cannot be uniformly transmitted. Can not effectively dissipate heat
本發明係欲提供一種衝擊流搭配特殊之流道設計，具有較過去熱交換效率佳的熱交換裝置。 The present invention is intended to provide an impact flow with a special flow path design, and has a heat exchange device with better heat exchange efficiency than in the past.
為達到上述目的，本發明提供一種熱交換裝置，熱交換裝置包括一熱交換腔體、一第一流道及一第二流道，熱交換腔體包括一熱交換面及一導流面，熱交換面與導流面為相對面。第一流道包括一第一流體出入口，第一流體出入口係用以注入一流體，第一流道透過導流面連通於熱交換腔體。第二流道包括一第二流體出入口，第二流道透過導流面連通於熱交換腔體。其中第一流道導引流體衝擊於熱交換面。 In order to achieve the above object, the present invention provides a heat exchange device including a heat exchange cavity, a first flow channel and a second flow channel, the heat exchange cavity including a heat exchange surface and a flow guiding surface, heat The exchange surface is opposite to the flow guiding surface. The first flow path includes a first fluid inlet and outlet, and the first fluid inlet and outlet is for injecting a fluid, and the first flow channel communicates with the heat exchange cavity through the flow guiding surface. The second flow path includes a second fluid inlet and outlet, and the second flow path communicates with the heat exchange cavity through the flow guiding surface. The first channel guide fluid impinges on the heat exchange surface.
本發明還提供另一實施例，其中第二流道包括一初段第二流道及一後段第二流道，初段第二流道環繞第一流道設置，後段第二流道設置於初段第二流道的一側。 The present invention further provides another embodiment, wherein the second flow channel comprises an initial second flow channel and a rear second flow channel, the first flow channel is disposed around the first flow channel, and the second flow channel is disposed in the second segment. One side of the flow channel.
本發明還提供另一實施例，其中第一流體出入口與第二流體出入口為等截面積。 The present invention also provides another embodiment wherein the first fluid inlet and outlet and the second fluid inlet and outlet are of equal cross-sectional area.
本發明還提供另一實施例，其中該熱交換腔體呈圓盤形。 The invention also provides another embodiment wherein the heat exchange chamber is disc shaped.
本發明還提供另一實施例，其中該熱交換面呈平面。 The invention also provides another embodiment wherein the heat exchange surface is planar.
本發明還提供另一實施例，其中該熱交換面呈非平面。 The invention also provides another embodiment wherein the heat exchange surface is non-planar.
本發明還提供另一實施例，其中第一流道設置於熱交換腔體的中央。 The invention also provides another embodiment wherein the first flow passage is disposed in the center of the heat exchange chamber.
本發明還提供另一實施例，其中初段第二流道與第一流道於熱交換腔體的投影為同心圓。 The present invention also provides another embodiment in which the projection of the first stage second flow path and the first flow path in the heat exchange cavity is concentric.
本發明還提供另一實施例，其中流體於第一流道的流動方向大致平行於熱交換面的法線方向。 The invention also provides another embodiment wherein the flow direction of the fluid in the first flow passage is substantially parallel to the normal direction of the heat exchange surface.
本發明還提供另一實施例，其中定義熱交換腔體的圓盤直徑為直徑長度，第一流體出入口的入口半徑為半徑長度，第二流體出入口與熱交換腔體的距離為距離長度，距離長度為半徑長度的平方除以距離長度直徑長度。 The present invention further provides another embodiment, wherein the diameter of the disk defining the heat exchange cavity is a diameter length, the inlet radius of the first fluid inlet and outlet is a radius length, and the distance between the second fluid inlet and outlet and the heat exchange cavity is a distance length, a distance The length is the square of the radius length divided by the distance length diameter length.
藉由上述實施例，本發明熱交換裝置至少可達到以下優點：藉由單一入口及單一出口，其獨特流道設計具流場分流及匯流的特性。並藉由第一流道導引流體衝擊熱交換面，流體於熱交換面產生極薄邊界層，並且第二流道及第一流道熱交換腔體為接近流體流動方向的腔體，流體較不易產生渦流。 According to the above embodiment, the heat exchange device of the present invention can at least achieve the following advantages: the unique flow path design has the characteristics of flow field splitting and sinking by a single inlet and a single outlet. And the first flow channel guides the fluid to impinge on the heat exchange surface, the fluid generates a very thin boundary layer on the heat exchange surface, and the second flow channel and the first flow channel heat exchange cavity are cavities close to the fluid flow direction, and the fluid is relatively difficult Generate eddy currents.
1‧‧‧熱交換裝置 1‧‧‧Hot exchange unit
10‧‧‧第一流道 10‧‧‧First runner
11‧‧‧第一流體出入口 11‧‧‧First fluid inlet and outlet
20‧‧‧熱交換腔體 20‧‧‧Heat exchange chamber
21‧‧‧熱交換面 21‧‧‧ heat exchange surface
22‧‧‧導流面 22‧‧‧Conduit
23‧‧‧轉向流道 23‧‧‧Steering runner
30‧‧‧第二流道 30‧‧‧Second runner
31‧‧‧第二流體出入口 31‧‧‧Second fluid inlet and outlet
32‧‧‧初段第二流道 32‧‧‧second stage second runner
33‧‧‧後段第二流道 33‧‧‧Second runner
40‧‧‧流體 40‧‧‧ fluid
41‧‧‧分流處 41‧‧‧Diversion
42‧‧‧匯流處 42‧‧‧ Confluence
9‧‧‧導熱裝置 9‧‧‧heat conduction device
91‧‧‧非平面導熱面 91‧‧‧ Non-planar heat transfer surface
r‧‧‧半徑長度 R‧‧‧ radius length
D‧‧‧直徑長度 D‧‧‧diameter length
h‧‧‧距離長度 H‧‧‧distance length
R‧‧‧底部半徑 R‧‧‧ bottom radius
H‧‧‧流道高度 H‧‧‧flow path height
圖1係本發明熱交換裝置之立體示意圖。 BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a perspective view of a heat exchange device of the present invention.
圖2係本發明熱交換裝置用以散熱之流體流動示意圖。 2 is a schematic view showing the fluid flow of the heat exchange device of the present invention for dissipating heat.
圖3係本發明熱交換裝置之另一實施例之立體示意圖。 Figure 3 is a perspective view of another embodiment of the heat exchange device of the present invention.
圖4係本發明熱交換裝置之另一實施例之流體流動示意圖。 Figure 4 is a schematic illustration of fluid flow for another embodiment of the heat exchange device of the present invention.
圖5係本發明熱交換裝置之另一實施例之流體流動示意圖。 Figure 5 is a schematic illustration of fluid flow for another embodiment of the heat exchange device of the present invention.
圖6係本發明熱交換裝置之另一實施例之流道高度及半徑長度關係示意圖。 Figure 6 is a schematic view showing the relationship between the flow path height and the radius length of another embodiment of the heat exchange device of the present invention.
為能讓 貴審查委員能更瞭解本發明之技術內容，特舉較佳具體實施例說明如下。 In order to enable the reviewing committee to better understand the technical contents of the present invention, the preferred embodiments are described below.
如圖1所示，本發明提供一種熱交換裝置1，係用以幫助一導熱裝置9散熱(參圖2)或加熱(參圖5)，導熱裝置9可以為發熱之裝置，例如為高度熱密度集中產生的電子元件或為機械上高熱能產生的部位。 As shown in FIG. 1, the present invention provides a heat exchange device 1 for helping a heat transfer device 9 to dissipate heat (see FIG. 2) or heat (see FIG. 5). The heat transfer device 9 can be a heat generating device, such as a high heat. Electronic components produced by concentration of density or parts of mechanically high thermal energy.
熱交換裝置1包括一第一流道10、一熱交換腔體20及一第二流道30，熱交換腔體20分別連通第一流道10及第二流道30，流體40由第一流道10流入至熱交換腔體20，再由熱交換腔體20流至第二流道30。熱交換腔體20對應於導熱裝置9，以將導熱裝置9所產生的熱傳導至熱交換腔體20，再藉由流體40將熱帶走。流體40可以為氣體或液體，於本發明實施例中，流體40為水，但不以此為限。 The heat exchange device 1 includes a first flow channel 10, a heat exchange cavity 20, and a second flow channel 30. The heat exchange cavity 20 communicates with the first flow channel 10 and the second flow channel 30, respectively. It flows into the heat exchange chamber 20 and then flows from the heat exchange chamber 20 to the second flow path 30. The heat exchange chamber 20 corresponds to the heat conducting means 9 for conducting the heat generated by the heat conducting means 9 to the heat exchange chamber 20, and then moving the tropics by the fluid 40. The fluid 40 may be a gas or a liquid. In the embodiment of the present invention, the fluid 40 is water, but is not limited thereto.
如圖1及圖2所示，第一流道10包括一第一流體出入口11，流體40由第一流體出入口11持續地流入。熱交換腔體20呈圓盤形。熱交換腔體20具有一熱交換面21及一導流面22，熱交換面21與導流面22為彼此 的相對面，熱交換面21與導流面22之間的厚度固定，熱交換面21對應於導熱裝置9，熱交換面21呈平面，導流面22係第一流道10及第二流道30貫通的一面，即第一流道10及第二流道30係透過導流面22連通於熱交換腔體20。第二流道30包括一初段第二流道32及一後段第二流道33，後段第二流道33具有一第二流體出入口31。流體40由熱交換腔體20流至初段第二流道32再流至後段第二流道33，流體40再由第二流體出入口31流出。確切而言，流體40由第一流道10流入，當流體40流至熱交換腔體20並衝擊熱交換面21時，流體40於此處分流，即為流體40之一分流處41，流體40再流至初段第二流道32，藉由初段第二流道32之設置匯流，即流體40之一匯流處42，流體40再藉由後段第二流道33流出。藉此，流體40係大致垂直地衝擊熱交換面21，以帶走較多的熱，即為衝擊流。 As shown in FIGS. 1 and 2, the first flow path 10 includes a first fluid inlet and outlet 11, and the fluid 40 continuously flows in from the first fluid inlet and outlet port 11. The heat exchange chamber 20 has a disk shape. The heat exchange cavity 20 has a heat exchange surface 21 and a flow guiding surface 22, and the heat exchange surface 21 and the flow guiding surface 22 are each other On the opposite side, the thickness between the heat exchange surface 21 and the flow guiding surface 22 is fixed, the heat exchange surface 21 corresponds to the heat conducting device 9, the heat exchange surface 21 is flat, and the flow guiding surface 22 is the first flow path 10 and the second flow path. The through surface 30, that is, the first flow path 10 and the second flow path 30 communicate with the heat exchange cavity 20 through the flow guiding surface 22. The second flow passage 30 includes an initial second flow passage 32 and a rear second flow passage 33. The rear second flow passage 33 has a second fluid inlet and outlet 31. The fluid 40 flows from the heat exchange chamber 20 to the first stage second flow path 32 to the second stage downstream flow path 33, and the fluid 40 flows out again through the second fluid inlet and outlet port 31. Specifically, the fluid 40 flows in from the first flow passage 10, and when the fluid 40 flows to the heat exchange chamber 20 and impinges on the heat exchange surface 21, the fluid 40 is split there, that is, a split portion 41 of the fluid 40, the fluid 40 The flow also flows to the second flow passage 32 of the first stage, and the flow is formed by the first flow passage 32 of the first stage, that is, the confluence portion 42 of the fluid 40, and the fluid 40 flows out through the second flow passage 33 of the rear stage. Thereby, the fluid 40 impacts the heat exchange surface 21 substantially vertically to take away more heat, that is, an impinging stream.
第一流體出入口11及第二流體出入口31大致為等截面積，不以此為限。本發明所提供之熱交換裝置1應為單一入口及單一出口之液體熱交換器，流體40僅由單一之第一流體出入口11及單一第二流體出入口31進出，單進單出之出入口令熱交換裝置1之安裝較為簡便。 The first fluid inlet and outlet 11 and the second fluid inlet and outlet 31 are substantially equal in cross-sectional area, and are not limited thereto. The heat exchange device 1 provided by the present invention should be a single inlet and a single outlet liquid heat exchanger. The fluid 40 is only in and out of a single first fluid inlet and outlet 11 and a single second fluid inlet and outlet 31. The inlet and outlet of the single inlet and outlet are hot. The installation of the exchange device 1 is relatively simple.
第一流道10係設置於導流面22中心，初段第二流道32環繞部分第一流道10，即初段第二流道32與第一流道10於熱交換面21的投影為同心圓設置，後段第二流道33設置於初段第二流道32的一側，初段第二流道32將流體40匯流至一側，流體40接著流至後段第二流道33。 The first flow channel 10 is disposed at the center of the flow guiding surface 22, and the first flow channel 32 surrounds a portion of the first flow channel 10, that is, the projection of the first flow channel 32 and the first flow channel 10 on the heat exchange surface 21 is concentric. The rear second flow passage 33 is disposed on one side of the first stage second flow passage 32. The first stage second flow passage 32 merges the fluid 40 to one side, and the fluid 40 then flows to the rear second flow passage 33.
流體40於第一流道10的流動方向大致平行於熱交換面21的法線方向，因此第一流道10導引流體40衝擊於熱交換面21，以提供流體40極薄的熱邊界層，可提供較高的熱傳效率。流體40於第一流道10的方向亦可僅與熱交換面21夾一角度，流體40於第一流道10的方向不平行 於熱交換面21的平面方向，亦即流體40於第一流道10及第二流道30的流動方向與流體40於熱交換腔體20的流動方向不平行。 The flow direction of the fluid 40 in the first flow path 10 is substantially parallel to the normal direction of the heat exchange surface 21, so that the first flow path 10 directs the fluid 40 to impinge on the heat exchange surface 21 to provide a very thin thermal boundary layer of the fluid 40. Provides high heat transfer efficiency. The fluid 40 may also be only at an angle to the heat exchange surface 21 in the direction of the first flow path 10, and the fluid 40 is not parallel in the direction of the first flow path 10. The flow direction of the heat exchange surface 21, that is, the flow direction of the fluid 40 in the first flow path 10 and the second flow path 30, is not parallel to the flow direction of the fluid 40 in the heat exchange cavity 20.
如圖2所示，定義第一流道10的第一流體出入口11的半徑為半徑長度r，熱交換腔體20的圓盤直徑為直徑長度D，第二流體出入口31至熱交換腔體20的導流面22的距離為一距離長度h，上述半徑長度r、直徑長度D及距離長度h之間的關係為h=r2/D。此種流道的設計，可避免渦流產生，使得所有的泵功能使用在對抗流道壁的剪切力，亦可避免熱能積累於渦流中，進一步避免流體40的溫度持續升高。參圖1及圖3所示，熱交換裝置1係為一彈性材質製成，可藉由彈性材質之可調整性，調整第一流道10及第二流道30之間之夾角。需注意的是，距離長度h是指第一流道10及第二流道30並未受到外力影響而彎折時，未連接至外部管路的第二流體出入口31至熱交換腔體20的導流面22之間的距離；也就是說，在第二流體出入口31並未連接至外部管路，且第一流道10及第二流道30未受到外力影響而彎折時，半徑長度r、直徑長度D及距離長度h之間的關係為h=r2/D。 As shown in FIG. 2, the radius of the first fluid inlet and outlet 11 defining the first flow path 10 is the radius length r, the diameter of the disk of the heat exchange cavity 20 is the diameter length D, and the second fluid inlet and outlet 31 is to the heat exchange cavity 20. The distance of the flow guiding surface 22 is a distance length h, and the relationship between the radius length r, the diameter length D and the distance length h is h = r 2 /D. The design of such a flow passage can avoid eddy current generation, so that all the pump functions are used to resist the shearing force of the flow channel wall, and heat energy can be prevented from accumulating in the eddy current, further preventing the temperature of the fluid 40 from continuously rising. As shown in FIG. 1 and FIG. 3, the heat exchange device 1 is made of an elastic material, and the angle between the first flow path 10 and the second flow path 30 can be adjusted by the adjustability of the elastic material. It should be noted that the distance length h refers to the guide of the second fluid inlet and outlet 31 to the heat exchange cavity 20 that is not connected to the external pipeline when the first flow passage 10 and the second flow passage 30 are not bent by the external force. The distance between the flow faces 22; that is, when the second fluid inlet and outlet port 31 is not connected to the external pipe, and the first flow passage 10 and the second flow passage 30 are not bent by the external force, the radius length r, The relationship between the diameter length D and the distance length h is h = r 2 /D.
本發明還提供另一實施例，熱交換腔體20設有一轉向流道23，轉向流道23連通第一流道10及第二流道30，當流體40由第一流道10衝擊至熱交換面21後，流體40流至轉向流道23，轉向流道23再將流體40導引至第二流道30，轉向流道23的一側為熱交換面21，因此當流體40流過轉向流道23時，流體40可同時進行熱交換，並且轉向流道23將流體40導引至第二流道30。 The present invention further provides another embodiment in which the heat exchange chamber 20 is provided with a steering flow passage 23 that communicates with the first flow passage 10 and the second flow passage 30 when the fluid 40 is impacted by the first flow passage 10 to the heat exchange surface. After 21, the fluid 40 flows to the steering flow passage 23, which in turn directs the fluid 40 to the second flow passage 30, and one side of the steering flow passage 23 is the heat exchange surface 21, so that when the fluid 40 flows through the steering flow At time 23, fluid 40 can be simultaneously heat exchanged, and steering runner 23 directs fluid 40 to second flow passage 30.
定義轉向流道23的高度(熱交換面21至轉向流道23另一側)為流道高度H，定義熱交換腔體20的圓盤半徑為半徑長度R，參圖4所示。可透過實驗、熱交換裝置1之所需大小及所需熱交換效能，調整流道高度 H及半徑長度R之間的關係式。參圖6所示，其表示調整流道H及半徑長度R之間的函數曲線，箭頭即表示流體40的流動方向。 The height of the steering flow path 23 (the other side of the heat exchange surface 21 to the steering flow path 23) is defined as the flow path height H, and the radius of the disk defining the heat exchange cavity 20 is the radius length R, as shown in FIG. Adjust the flow path height through experiments, the required size of the heat exchange unit 1 and the required heat exchange efficiency The relationship between H and the radius length R. Referring to Fig. 6, it shows a function curve between the adjustment flow path H and the radius length R, and the arrow indicates the flow direction of the fluid 40.
本發明還提供另一實施例，流道高度H與半徑長度R的關係式亦可由等截面之關係推導，定義第一流道10的半徑為r1，第二流道30的後段第二流道33的半徑為r2，藉由π r1 2=π r2 2=H×2π R，推導得到流道高度H與半徑長度R的第四關係式，為H=r1 2/2R或者H=r2 2/2R。製造者亦可加入設計參數，H=r1 2/2(R+J)或者為r2 2/2(R+K)，J為一第八設計參數，K為一第九設計參數。 The present invention further provides another embodiment. The relationship between the flow path height H and the radius length R can also be derived from the relationship of equal sections, defining the radius of the first flow path 10 as r 1 and the second flow path of the second flow path 30 . The radius of 33 is r 2 , and the fourth relation of the channel height H and the radius length R is derived by π r 1 2 = π r 2 2 = H × 2π R, which is H = r 1 2 /2R or H. =r 2 2 /2R. The manufacturer may also add design parameters, H = r 1 2 /2 (R + J) or r 2 2 /2 (R + K), J is an eighth design parameter, and K is a ninth design parameter.
本發明還提供另一實施例，如圖5所示，導熱裝置9係為吸熱之裝置，以將熱自熱交換腔體20傳導至吸熱裝置9，並以加熱吸熱裝置9。本發明還提供另一實施例，參圖5所示，其中第二流體出入口31係供流體40注入，第一流體出入口11係供流體40流出，即流體40流動方向改變，由第一流體出入口31流向第二流體出入口11。 The present invention also provides another embodiment. As shown in FIG. 5, the heat conducting device 9 is a heat absorbing device for conducting the heat from the heat exchange chamber 20 to the heat absorbing device 9, and heating the heat absorbing device 9. The present invention also provides another embodiment, as shown in FIG. 5, wherein the second fluid inlet and outlet 31 is for injecting fluid 40, and the first fluid inlet and outlet 11 is for fluid 40 to flow out, that is, the flow direction of the fluid 40 is changed, by the first fluid inlet and outlet. 31 flows to the second fluid inlet and outlet 11.
本發明還提供另一實施例，參圖5所示，熱交換面21呈非平面，用以對應具有一非平面導熱面91之導熱裝置9以進行熱交換。 The present invention further provides another embodiment. As shown in FIG. 5, the heat exchange surface 21 is non-planar for corresponding to the heat conducting device 9 having a non-planar heat conducting surface 91 for heat exchange.
本發明還提供另一實施例，參圖5所示，熱交換面21與導流面22之間的厚度非固定，用以建立非均勻的熱傳效率，或用以呈平面的導流面對應非平面的熱交換面，或用以呈非平面的導流面對應平面的熱交換面。 The present invention further provides another embodiment. As shown in FIG. 5, the thickness between the heat exchange surface 21 and the flow guiding surface 22 is not fixed, for establishing non-uniform heat transfer efficiency, or for using a planar flow guiding surface. Corresponding to a non-planar heat exchange surface, or a heat exchange surface for a non-planar flow guiding surface corresponding to a plane.
由上述可得知，本發明所提供熱交換裝置，藉由第一流道導引流體衝擊熱交換面，流體於熱交換面產生極薄邊界層，並且熱交換腔體為接近流體流動方向的腔體，因此流體較不易產生渦流。 It can be seen from the above that the heat exchange device provided by the present invention guides the fluid against the heat exchange surface by the first flow channel, the fluid generates a very thin boundary layer on the heat exchange surface, and the heat exchange cavity is a cavity close to the fluid flow direction. Body, so fluid is less prone to eddy currents.
本實施方式僅例示本發明之較佳實施例，為避免贅述，並未詳加記載所有可能的變化組合。然而，本領域之通常知識者應可理解，上 述各模組或元件未必皆為必要。且為實施本發明，亦可能包含其他較細節之習知模組或元件。各模組或元件皆可能視需求加以省略或修改，且任兩模組間未必不存在其他模組或元件。 The present embodiments are merely illustrative of the preferred embodiments of the present invention, and are not described in detail. However, those of ordinary skill in the art should understand that It is not necessarily necessary to describe each module or component. In order to implement the invention, other well-known modules or elements of more detail may also be included. Each module or component may be omitted or modified as needed, and no other modules or components may exist between any two modules.
需注意的是，上述僅為實施例，而非限制於實施例。譬如此不脫離本發明基本架構者，皆應為本專利所主張之權利範圍，而應以專利申請範圍為準。 It should be noted that the above is only an embodiment, and is not limited to the embodiment. Therefore, those who do not depart from the basic structure of the present invention should be bound by the scope of the patent, and the scope of the patent application shall prevail.
1‧‧‧熱交換裝置 1‧‧‧Hot exchange unit
10‧‧‧第一流道 10‧‧‧First runner
11‧‧‧第一流體出入口 11‧‧‧First fluid inlet and outlet
20‧‧‧熱交換腔體 20‧‧‧Heat exchange chamber
21‧‧‧熱交換面 21‧‧‧ heat exchange surface
22‧‧‧導流面 22‧‧‧Conduit
30‧‧‧第二流道 30‧‧‧Second runner
31‧‧‧第二流體出入口 31‧‧‧Second fluid inlet and outlet
32‧‧‧初段第二流道 32‧‧‧second stage second runner
33‧‧‧後段第二流道 33‧‧‧Second runner
9‧‧‧導熱裝置 9‧‧‧heat conduction device
r‧‧‧半徑長度 R‧‧‧ radius length
D‧‧‧直徑長度 D‧‧‧diameter length
h‧‧‧距離長度 H‧‧‧distance length
Claims (9)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104144494A TWI595206B (en) | 2015-12-30 | 2015-12-30 | Heat exchange device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104144494A TWI595206B (en) | 2015-12-30 | 2015-12-30 | Heat exchange device |
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| Publication Number | Publication Date |
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| TW201723409A TW201723409A (en) | 2017-07-01 |
| TWI595206B true TWI595206B (en) | 2017-08-11 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6543246B2 (en) * | 2001-07-24 | 2003-04-08 | Kryotech, Inc. | Integrated circuit cooling apparatus |
| CN101668405A (en) * | 2008-09-05 | 2010-03-10 | 华信精密股份有限公司 | Water cooled head |
| CN202759729U (en) * | 2011-09-21 | 2013-02-27 | 保锐科技股份有限公司 | Improved liquid-cooled heat exchange module |
| TWM458779U (en) * | 2013-03-13 | 2013-08-01 | Cooler Master Co Ltd | Water-cooling type heat dissipating device |
| CN104470190A (en) * | 2014-11-06 | 2015-03-25 | 东莞中子科学中心 | Cooling device of particle production target |
-
2015
- 2015-12-30 TW TW104144494A patent/TWI595206B/en active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6543246B2 (en) * | 2001-07-24 | 2003-04-08 | Kryotech, Inc. | Integrated circuit cooling apparatus |
| CN101668405A (en) * | 2008-09-05 | 2010-03-10 | 华信精密股份有限公司 | Water cooled head |
| CN202759729U (en) * | 2011-09-21 | 2013-02-27 | 保锐科技股份有限公司 | Improved liquid-cooled heat exchange module |
| TWM458779U (en) * | 2013-03-13 | 2013-08-01 | Cooler Master Co Ltd | Water-cooling type heat dissipating device |
| CN104470190A (en) * | 2014-11-06 | 2015-03-25 | 东莞中子科学中心 | Cooling device of particle production target |
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| TW201723409A (en) | 2017-07-01 |
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