TWI591120B - Wholly aromatic liquid crystalline polyester resin composition with excellent blister resistance - Google Patents

Wholly aromatic liquid crystalline polyester resin composition with excellent blister resistance Download PDF

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TWI591120B
TWI591120B TW101139656A TW101139656A TWI591120B TW I591120 B TWI591120 B TW I591120B TW 101139656 A TW101139656 A TW 101139656A TW 101139656 A TW101139656 A TW 101139656A TW I591120 B TWI591120 B TW I591120B
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liquid crystalline
crystalline polyester
polyester resin
aromatic liquid
wholly aromatic
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TW201317296A (en
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郭泰珍
金東植
高榮根
李美蘭
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深圳市沃特新材料股份有限公司
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    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K19/00Liquid crystal materials
    • C09K19/04Liquid crystal materials characterised by the chemical structure of the liquid crystal components, e.g. by a specific unit
    • C09K19/38Polymers
    • C09K19/3804Polymers with mesogenic groups in the main chain
    • C09K19/3809Polyesters; Polyester derivatives, e.g. polyamides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/01Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013Fillers, pigments or reinforcing additives

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Description

具優異氣泡抗性之全芳族液態結晶聚酯樹脂組合物 Fully aromatic liquid crystalline polyester resin composition with excellent bubble resistance

本發明主張韓國專利申請號第2011-0112179號,申請日為2011年10月31日之優先權,且該優先權案全文揭示內容以參考方式併入本文中。 The present invention claims the priority of the Korean Patent Application No. 2011-0112179, the entire disclosure of which is incorporated herein by reference.

本發明係關於一種具有增進氣泡抗性之全芳族液態結晶聚酯樹脂組合物;更具體而言,係關於一種全芳族液態結晶聚酯樹脂組合物,其氣泡抗性增加但無損於其耐熱性及機械特性。 The present invention relates to a wholly aromatic liquid crystalline polyester resin composition having improved bubble resistance; more particularly, to a wholly aromatic liquid crystalline polyester resin composition which has increased bubble resistance but does not impair its Heat resistance and mechanical properties.

全芳族液態結晶聚酯樹脂具有優異的導熱性及尺寸安定性,以及優異的熔融流動性,因此,已被廣泛地用於電子零件應用中精密射出的材料。 The all-aromatic liquid crystalline polyester resin has excellent thermal conductivity and dimensional stability, as well as excellent melt fluidity, and thus has been widely used as a material for precise injection in electronic component applications.

特別是,該全芳族液態結晶聚酯以多種填料加強後,具有高耐熱性及優異的尺寸穩定性、電絕緣性以及機械特性,因此,其已被作為連接器、記憶卡插座和其他需要高耐熱性之電子裝置之零件之材料,且越來越多地應用於其他聚合物材料之替代品。 In particular, the wholly aromatic liquid crystalline polyester is reinforced with various fillers, has high heat resistance and excellent dimensional stability, electrical insulation and mechanical properties, and thus has been used as a connector, a memory card socket and other needs. Materials for parts of high heat resistant electronic devices are increasingly being used as alternatives to other polymeric materials.

全芳族液態結晶聚酯樹脂是一種由縮聚合反應所得到的熱塑性聚合物,可由將聚酯樹脂與如玻璃纖維或滑石之無機填料混煉得到樹脂化合物,並擠出該所得之混合物。這樣的樹脂化合物可進一步加工,如透過射出加工而成為產品。 The wholly aromatic liquid crystalline polyester resin is a thermoplastic polymer obtained by a polycondensation reaction, and a resin compound can be obtained by kneading a polyester resin with an inorganic filler such as glass fiber or talc, and the resulting mixture is extruded. Such a resin compound can be further processed, for example, by injection processing to form a product.

由於電子零件趨於輕薄小型化,因此,對於具有增進的高耐熱性及氣泡抗性之全芳族聚酯樹脂化合物之需求與日俱增。 Since electronic parts tend to be thin and light, the demand for wholly aromatic polyester resin compounds having improved high heat resistance and bubble resistance is increasing.

此外,該樹脂化合物於電子器材中連接器或記憶卡插座之應用需要複雜的性能,因此,作為電子零件,全芳族液態結晶聚酯樹脂化合物需要 增進的耐熱性且能保持其他的特性。 In addition, the application of the resin compound to a connector or a memory card socket in an electronic device requires complicated performance, and therefore, as an electronic component, a wholly aromatic liquid crystalline polyester resin compound is required. Improved heat resistance and ability to maintain other properties.

然而,在這些全芳族液態結晶聚酯樹脂化合物中,樹脂化合物僅以玻璃纖維填充而製備者具有高耐熱性,但卻有氣泡問題,因為當進行接近熔點或高溫加工(如焊接)之熱處理時,樹脂化合物中的水或揮發性物質膨脹並從表面爆發,而該氣泡問題導致成形體的外觀不良或機械特性下降,因此,需避免應用於電子零件之材料。 However, among these wholly aromatic liquid crystalline polyester resin compounds, the resin compound is only filled with glass fiber and has high heat resistance, but has a bubble problem because heat treatment is performed near the melting point or high temperature processing (such as welding). At the time, water or a volatile substance in the resin compound swells and erupts from the surface, and the bubble problem causes a poor appearance of the molded body or a decrease in mechanical properties, and therefore, it is necessary to avoid the material applied to the electronic component.

因此,本發明係關於一種全芳族液態結晶聚酯樹脂組合物,其具有增進的氣泡抗性,而無損於耐熱性及機械特性,而可被用於連接器或記憶卡插座零件之材料。 Accordingly, the present invention is directed to a wholly aromatic liquid crystalline polyester resin composition which has improved bubble resistance without deteriorating heat resistance and mechanical properties, and can be used for materials of connectors or memory card socket parts.

本發明之一方面提供了一種具有增進的氣泡抗性之全芳族液態結晶聚酯樹脂組合物,其包含一具有熔點介於300至450℃間之全芳族液態結晶聚酯樹脂、一用以增強物理特性之填料及一無機填料粉末。 One aspect of the present invention provides a wholly aromatic liquid crystalline polyester resin composition having improved bubble resistance, comprising a wholly aromatic liquid crystalline polyester resin having a melting point of between 300 and 450 ° C, A filler for enhancing physical properties and an inorganic filler powder.

具體而言,該用以增強物理特性之填料可包含至少一種選自由玻璃纖維及碳纖維所組成之群組。 Specifically, the filler for enhancing physical properties may comprise at least one selected from the group consisting of glass fibers and carbon fibers.

而且,該無機填料粉末包含至少一種選自由碳酸鈣、石英、鱗石英、白矽石、斜矽石、重矽石、滑石、雲母及碳黑所組成之群組。 Moreover, the inorganic filler powder comprises at least one selected from the group consisting of calcium carbonate, quartz, tridymite, attapulgite, sillimanite, heavy vermiculite, talc, mica and carbon black.

該用以增強物理特性之填料相對於100重量份之全芳族液態結晶聚酯樹脂,包含有5至90重量份之含量。 The filler for enhancing physical properties contains the content of 5 to 90 parts by weight based on 100 parts by weight of the wholly aromatic liquid crystalline polyester resin.

該無機填料粉末相對於100重量份之全芳族液態結晶聚酯樹脂,包含有0.1至5重量份之含量。 The inorganic filler powder is contained in an amount of 0.1 to 5 parts by weight based on 100 parts by weight of the wholly aromatic liquid crystalline polyester resin.

在下文中將進一步描述根據本發明之全芳族液態結晶聚酯樹脂組合 物。 The wholly aromatic liquid crystalline polyester resin combination according to the present invention will be further described hereinafter. Things.

在本發明之一實施例中,該全芳族液態結晶聚酯樹脂組合物包含一具有熔點介於300至450℃間之全芳族液態結晶聚酯樹脂、一用以增強物理特性之填料及一無機填料粉末。 In one embodiment of the present invention, the wholly aromatic liquid crystalline polyester resin composition comprises a wholly aromatic liquid crystalline polyester resin having a melting point of between 300 and 450 ° C, a filler for enhancing physical properties, and An inorganic filler powder.

根據本實施例中,構成該全芳族液態結晶聚酯樹脂組合物之第一成分為全芳族液態結晶聚酯樹脂,較佳為選自那些具有熔點介於300至450℃間者,以達到高耐熱性及機械性質。 According to the present embodiment, the first component constituting the wholly aromatic liquid crystalline polyester resin composition is a wholly aromatic liquid crystalline polyester resin, preferably selected from those having a melting point of between 300 and 450 ° C. Achieve high heat resistance and mechanical properties.

由於其之高熔點,該全芳族液態結晶聚酯樹脂具有高耐熱性,這種全芳族液態結晶聚酯樹脂可由下方描述的兩個操作來製備: (a)透過將至少兩種單體縮聚合反應合成全芳族液態結晶聚酯之預聚物;且 (b)透過該預聚物之固態縮聚合,合成一全芳族液態結晶聚酯樹脂。 Due to its high melting point, the wholly aromatic liquid crystalline polyester resin has high heat resistance, and the wholly aromatic liquid crystalline polyester resin can be prepared by two operations as described below: (a) synthesizing a prepolymer of a wholly aromatic liquid crystalline polyester by polycondensation of at least two monomers; (b) synthesizing a wholly aromatic liquid crystalline polyester resin by solid state polycondensation of the prepolymer.

在操作(a)中所用之單體包含至少一化合物,其係選自由芳族二醇(aromatic diols)、芳族二胺(aromatic diamines)、芳族羥胺(aromatic hydroxylamines)及芳族二羧酸(aromatic dicarboxylic acid)所組成之群組;此外,該單體可進一步包含一芳族羥基羧酸(aromatic hydroxycarboxylic acid)及/或一芳族胺基羧酸(aromatic aminocarboxylic acid)。 The monomer used in the operation (a) comprises at least one compound selected from the group consisting of aromatic diols, aromatic diamines, aromatic hydroxylamines, and aromatic dicarboxylic acids. The group consisting of (aromatic dicarboxylic acid); in addition, the monomer may further comprise an aromatic hydroxycarboxylic acid and/or an aromatic aminocarboxylic acid.

溶液縮聚合方法或固態縮聚合方法(總體縮聚合,bulk condensation polymerization)可被使用於操作(a)之合成方法。此外,可使用具有增進反應性之單體,如醯化單體,其係透過以化學物質(像是醯化劑,如乙醯化劑)預處理,來加速操作(a)之縮合反應。 A solution condensation polymerization method or a bulk condensation polymerization method (bulk condensation polymerization) can be used in the synthesis method of the operation (a). Further, a monomer having enhanced reactivity such as a deuterated monomer which is pretreated by a chemical substance such as a deuterating agent such as an oxime agent to accelerate the condensation reaction of (a) can be used.

於固態聚縮合反應之操作(b)中,應提供適當的熱能。熱供給方法包含使用加熱板之方法、使用熱風之方法及使用高溫流體之方法;為了除去 固態聚縮合反應所產生的副產物,可進行惰性氣體清除或進行真空清除。 In operation (b) of the solid polycondensation reaction, appropriate thermal energy should be provided. The heat supply method includes a method of using a hot plate, a method of using hot air, and a method of using a high temperature fluid; By-products produced by solid-state polycondensation reactions can be purged with inert gas or vacuum purged.

該全芳族液態結晶聚酯樹脂可由上述建議的方式製備,但本發明並不限於該方法,且可選擇該等具有熔點介於300至450℃間者。 The wholly aromatic liquid crystalline polyester resin can be prepared in the manner suggested above, but the invention is not limited to this method, and those having a melting point between 300 and 450 ° C can be selected.

每個全芳族液態結晶聚酯樹脂可於其鏈狀結構中包含各種重複單元,例如下示之重複單元: Each of the wholly aromatic liquid crystalline polyester resins may contain various repeating units in its chain structure, such as the repeating unit shown below:

(1)衍生自芳族二醇之重複單元: (1) Repeating units derived from aromatic diols:

-O-Ar-O-; -O-Ar-O-;

(2)衍生自芳族二胺之重複單元: (2) Repeating units derived from aromatic diamines:

-HN-Ar-NH-; -HN-Ar-NH-;

(3)衍生自芳族羥胺之重複單元: (3) Repeating units derived from aromatic hydroxylamines:

-HN-Ar-O-; -HN-Ar-O-;

(4)衍生自芳族二羧酸之重複單元: (4) Repeating units derived from aromatic dicarboxylic acids:

-OC-Ar-CO-; -OC-Ar-CO-;

(5)衍生自芳族羥基羧酸之重複單元: (5) Repeating units derived from aromatic hydroxycarboxylic acids:

-O-Ar-CO-; -O-Ar-CO-;

(6)衍生自芳族胺基羧酸之重複單元 (6) a repeating unit derived from an aromatic aminocarboxylic acid

-HN-Ar-CO-。 -HN-Ar-CO-.

在這些重複單元中,Ar可為一芳香族化合物,其中伸苯基(phenylene)、伸二苯基(biphenylene)、萘(naphthalene)或兩個伸苯基與一碳或碳以外的元素連接,或為一芳香族化合物,其中伸苯基、伸二苯基、萘或兩個伸苯基與一碳或碳以外的元素連接,其中在芳香族化合物中之至少一個氫原子被另一元素取代。 In these repeating units, Ar may be an aromatic compound in which phenylene, biphenylene, naphthalene or two phenyl groups are bonded to an element other than carbon or carbon, or It is an aromatic compound in which a phenyl group, a diphenylene group, a naphthalene group or two phenylene groups are bonded to an element other than carbon or carbon, wherein at least one hydrogen atom in the aromatic compound is substituted by another element.

根據本實施例中之全芳族液態結晶聚酯樹脂組合物,包含一填料以賦予機械特性。用於增強物理特性的填料較佳包含至少一種選自由玻璃纖維及碳纖維所組成之群組,但本發明並不限於此等填料。 The wholly aromatic liquid crystalline polyester resin composition according to this embodiment contains a filler to impart mechanical properties. The filler for enhancing physical properties preferably comprises at least one selected from the group consisting of glass fibers and carbon fibers, but the invention is not limited to such fillers.

用於增強物理特性之填料之含量,相對於100重量份之全芳族液態結晶聚酯樹脂,包含有5至90重量份之含量。當填料之含量相對於100重量份之全芳族液態結晶聚酯樹脂,少於5重量份之含量時,該全芳族液態結晶聚酯樹脂組合物會有無法實現足夠的機械強度之困難;而當填料之含量相對於100重量份之全芳族液態結晶聚酯樹脂,高於90重量份之含量時,該全芳族液態結晶聚酯樹脂組合物之造模性會降低。 The content of the filler for enhancing physical properties is contained in an amount of 5 to 90 parts by weight based on 100 parts by weight of the wholly aromatic liquid crystalline polyester resin. When the content of the filler is less than 5 parts by weight based on 100 parts by weight of the total aromatic liquid crystalline polyester resin, the wholly aromatic liquid crystalline polyester resin composition may have difficulty in achieving sufficient mechanical strength; When the content of the filler is more than 90 parts by weight based on 100 parts by weight of the wholly aromatic liquid crystalline polyester resin, the moldability of the wholly aromatic liquid crystalline polyester resin composition is lowered.

同時,該樹脂化合物僅由全芳族液態結晶聚酯樹脂以及用於增強物理特性之填料所形成者,於高溫下會產生氣泡問題,因此,使用少量的無機填料粉末來防止此問題。 At the same time, the resin compound is formed only of a wholly aromatic liquid crystalline polyester resin and a filler for enhancing physical properties, which causes a bubble problem at a high temperature, and therefore, a small amount of inorganic filler powder is used to prevent this problem.

由於全芳族液態結晶聚酯樹脂具有至少300℃之高熔點,大多數的有機填料粉末會分解因而無法使用,因此,應採用熱穩定性的無機填料粉末。 Since the wholly aromatic liquid crystalline polyester resin has a high melting point of at least 300 ° C, most of the organic filler powder is decomposed and thus cannot be used, and therefore, a thermally stable inorganic filler powder should be used.

該無機填料粉末可為至少一種選自由碳酸鈣、石英、鱗石英、白矽石、斜矽石、重矽石、滑石、雲母及碳黑所組成之群組。 The inorganic filler powder may be at least one selected from the group consisting of calcium carbonate, quartz, tridymite, attapulgite, sillimanite, heavy vermiculite, talc, mica, and carbon black.

這些無機填料粉末可單獨使用或使用至少兩種之混合物。 These inorganic filler powders may be used singly or as a mixture of at least two.

該無機填料粉末之含量,相對於100重量份之全芳族液態結晶聚酯樹脂,較佳為0.1至5重量份。當該無機填料粉末之含量少於0.1重量份時,該全芳族液態結晶聚酯樹脂組合物無法達成增進氣泡抗性;反之,若該無機填料粉末之含量高於5重量份時,該全芳族液態結晶聚酯樹脂組合物之機械特性受到改變而不可採。 The content of the inorganic filler powder is preferably from 0.1 to 5 parts by weight based on 100 parts by weight of the wholly aromatic liquid crystalline polyester resin. When the content of the inorganic filler powder is less than 0.1 parts by weight, the wholly aromatic liquid crystalline polyester resin composition cannot achieve the improvement of bubble resistance; on the contrary, if the content of the inorganic filler powder is more than 5 parts by weight, the whole The mechanical properties of the aromatic liquid crystalline polyester resin composition are changed and are not available.

在這個意義上來說,該所包含用以增進氣泡抗性的無機填料較佳為粉末狀,因為粉末狀之無機顆粒可作為自由基的捕獲劑且有助於提高熱穩定性。 In this sense, the inorganic filler contained to enhance the resistance of the bubbles is preferably in the form of a powder because the powdery inorganic particles act as a trapping agent for the radicals and contribute to the improvement of thermal stability.

該包含於全芳族液態結晶聚酯樹脂化合物中之少量的無機填料粉末可增進氣泡抗性,而無損熱穩定性及機械特性,從而可適宜地鑄造電子裝置中,需要高耐熱性及受焊接之連接器或記憶卡插座之產品。 The small amount of the inorganic filler powder contained in the wholly aromatic liquid crystalline polyester resin compound can improve bubble resistance without impairing thermal stability and mechanical properties, so that it can be suitably cast into an electronic device, requiring high heat resistance and being welded. The product of the connector or memory card socket.

根據本發明之全芳族液態結晶聚酯樹脂組合物,其可透過將一具有熔點介於300至450℃間之全芳族液態結晶聚酯樹脂與一用以增強物理特性之填料及一無機填料粉末混合,並將所得之混合物熔融混煉(melt-kneading)而得到全芳族液態結晶聚酯樹脂化合物。 The wholly aromatic liquid crystalline polyester resin composition according to the present invention is permeable to a wholly aromatic liquid crystalline polyester resin having a melting point of between 300 and 450 ° C and a filler for enhancing physical properties and an inorganic The filler powder is mixed, and the resulting mixture is melt-kneading to obtain a wholly aromatic liquid crystalline polyester resin compound.

於熔融混煉,可使用一雙螺旋擠壓機、批次式混煉機(batch-type kneader)或混合輥(mixing roll),但本發明並不限於此。進一步而言,當使用雙螺旋擠壓機來執行熔融混煉時,該擠壓機之料桶(barrel)溫度可維持在300至450℃之間;在這個意義上來說,該擠壓機之料桶係指「缸筒(cylinder)」,其為擠出之原料(即樹脂組合物)被熔融、混煉及運送之部分。螺旋係安裝於料桶內部,因此,要擠出的原料依照螺旋的旋轉而向前運送,且同時,要擠出的原料因為料桶之壁的熱傳導而熔融。此外,在熔融混煉過程中,可使用潤滑劑來加速熔融混煉。 For melt-kneading, a twin-screw extruder, a batch-type kneader or a mixing roll may be used, but the present invention is not limited thereto. Further, when a twin-screw extruder is used to perform melt-kneading, the barrel temperature of the extruder can be maintained between 300 and 450 ° C; in this sense, the extruder The drum refers to a "cylinder" which is a portion in which the extruded raw material (i.e., the resin composition) is melted, kneaded, and conveyed. The spiral system is installed inside the drum, so that the raw material to be extruded is conveyed forward according to the rotation of the spiral, and at the same time, the raw material to be extruded is melted by the heat conduction of the wall of the drum. Further, a lubricant may be used to accelerate the melt-kneading during the melt-kneading process.

透過該具有高熔點之全芳族液態結晶聚酯樹脂與無機填料粉末混合且以上述方式熔融混煉該所得之混合物所得到之樹脂化合物,具有優異的氣泡抗性且無損其流動性、耐熱性及機械特性,因此適用於作為電子裝置之零件如連接器及記憶卡插座。 The resin compound obtained by mixing the wholly aromatic liquid crystalline polyester resin having a high melting point with an inorganic filler powder and melt-kneading the obtained mixture in the above manner has excellent bubble resistance and does not impair fluidity and heat resistance. And mechanical characteristics, therefore suitable for use as parts of electronic devices such as connectors and memory card sockets.

下文中,將進一步以詳細說明與實施例描述本發明。然而,應理解 這些實施例僅用於幫助可更加好理解本發明,而非用於限制本發明之範圍。 Hereinafter, the present invention will be further described in detail with reference to the embodiments. However, it should be understood The examples are only intended to aid in the understanding of the invention and are not intended to limit the scope of the invention.

<實施例> <Example> [製備例1] [Preparation Example 1]

製備全芳族液態結晶聚酯樹脂 Preparation of wholly aromatic liquid crystalline polyester resin

於容量為100公升的溫度可控制批次反應器中,加入24.4公斤之對-羥基苯甲酸(para-hydroxy benzoic acid)、10.8公斤之聯苯(biphenol)、7.3公斤之對苯二甲酸及2.4公斤之異苯二甲酸。將氮氣注入反應器中,使反應器內形成惰性氣氛,接著,將33公斤之乙酸酐加入反應器中。之後,於30分鐘內將反應器的溫度升高至150℃,在此溫度下,單體的醇基被乙醯化3小時。接著,在6小時內將反應器的溫度提高至330℃,同時,移除該乙醯化反應之乙酸產物,以獲得該全芳族液態結晶聚酯之預聚物,該預聚物係由該等單體通過縮聚合反應而得。此外,於預聚物的製備過程中,產生了額外的乙酸為副產物,在預聚物的製備過程中,該乙酸亦與乙醯化反應時所產生的乙酸一樣,持續地被移除。之後,從反應器中回收預聚物,並透過冷卻固化。 In a temperature-controlled batch reactor with a capacity of 100 liters, 24.4 kg of para-hydroxy benzoic acid, 10.8 kg of biphenol, 7.3 kg of terephthalic acid and 2.4 were added. Kilograms of isophthalic acid. Nitrogen gas was injected into the reactor to form an inert atmosphere in the reactor, followed by the addition of 33 kg of acetic anhydride to the reactor. Thereafter, the temperature of the reactor was raised to 150 ° C in 30 minutes, at which temperature the alcohol group of the monomer was acetated for 3 hours. Next, the temperature of the reactor is raised to 330 ° C in 6 hours, while the acetic acid product of the acetylation reaction is removed to obtain a prepolymer of the wholly aromatic liquid crystalline polyester, which is composed of These monomers are obtained by a condensation polymerization reaction. In addition, during the preparation of the prepolymer, additional acetic acid is produced as a by-product which is continuously removed during the preparation of the prepolymer as well as the acetic acid produced during the oximation reaction. Thereafter, the prepolymer was recovered from the reactor and solidified by cooling.

接著,將全芳族液態結晶聚酯之預聚物粉碎至平均顆粒大小為1 mm,將20 kg粉碎的全芳族液態結晶聚酯預聚物置於容量為100公升之旋窯反應器中,溫度升高至200℃,此為重量減少之起始溫度,於1小時內並持續給予速率為1 Nm3/小時之氮氣流,接著於10小時內再次將溫度升高至280℃,並維持3小時以製備全芳族液態結晶聚酯樹脂。隨後,將反應器冷卻至室溫1小時,從反應器中回收該全芳族液態結晶聚酯樹脂。 Next, the prepolymer of the wholly aromatic liquid crystalline polyester was pulverized to an average particle size of 1 mm, and 20 kg of the pulverized wholly aromatic liquid crystalline polyester prepolymer was placed in a rotary kiln reactor having a capacity of 100 liters. The temperature is raised to 200 ° C, which is the initial temperature of the weight reduction, and a nitrogen flow rate of 1 Nm 3 /hr is continuously administered within 1 hour, and then the temperature is raised again to 280 ° C in 10 hours, and maintained. Three hours to prepare a wholly aromatic liquid crystalline polyester resin. Subsequently, the reactor was cooled to room temperature for 1 hour, and the wholly aromatic liquid crystalline polyester resin was recovered from the reactor.

該樹脂使用示差掃描熱分析(differential scanning calorimeter)測得之熔 點為320℃。 The resin is melted using a differential scanning calorimeter The point is 320 °C.

[實施例1] [Example 1]

將製備例1所得之全芳族液態結晶聚酯樹脂、玻璃纖維(KCC,CS371)及碳黑(Evonik,HIBLACK 30L)以69.9:30:0.1之重量比混合,接著以雙螺旋擠壓機(L/D:40,直徑20mm)進行熔融混煉。於熔融混煉時,料桶溫度為350℃,此外,於熔融混煉時,於該雙螺旋擠壓機施以真空以移除副產物。此後,該熔融混煉後之產物以自動攪拌機(傑爾工業機械有限公司(Jeil Industrail Machinery Co.,Ltd.))混合10分鐘,並以熱氣乾燥機(Asung Plant)以130℃兩小時乾燥以獲得全芳族液態結晶聚酯樹脂化合物。 The wholly aromatic liquid crystalline polyester resin obtained in Preparation Example 1, glass fiber (KCC, CS371) and carbon black (Evonik, HIBLACK 30L) were mixed at a weight ratio of 69.9:30:0.1, followed by a twin screw extruder ( L/D: 40, diameter 20 mm) was melt-kneaded. At the time of melt-kneading, the drum temperature was 350 ° C. Further, at the time of melt-kneading, a vacuum was applied to the twin-screw extruder to remove by-products. Thereafter, the melt-kneaded product was mixed by an automatic mixer (Jeil Industrail Machinery Co., Ltd.) for 10 minutes, and dried by a hot air dryer (Asung Plant) at 130 ° C for two hours. A wholly aromatic liquid crystalline polyester resin compound is obtained.

[實施例2] [Embodiment 2]

該全芳族液態結晶聚酯樹脂化合物以相同於實施例1之方法製備,除了混合物以製備例1所得之全芳族液態結晶聚酯樹脂、玻璃纖維(KCC,CS371)及滑石(Dongyang Materials Industrial,ETA#400)以68.5:30:1.5之重量比替代之。 The wholly aromatic liquid crystalline polyester resin compound was prepared in the same manner as in Example 1, except that the mixture was obtained as the wholly aromatic liquid crystalline polyester resin obtained in Preparation Example 1, glass fiber (KCC, CS371) and talc (Dongyang Materials Industrial). , ETA #400) is replaced by a weight ratio of 68.5:30:1.5.

[實施例3] [Example 3]

該全芳族液態結晶聚酯樹脂化合物以相同於實施例1之方法製備,除了混合物以製備例1所得之全芳族液態結晶聚酯樹脂、玻璃纖維(KCC,CS371)及碳酸鈣(Dongyang Materials Industrial,V-JAD#300)以69:30:1之重量比替代之。 The wholly aromatic liquid crystalline polyester resin compound was prepared in the same manner as in Example 1, except that the mixture was obtained as the wholly aromatic liquid crystalline polyester resin obtained in Preparation Example 1, glass fiber (KCC, CS371), and calcium carbonate (Dongyang Materials). Industrial, V-JAD #300) is replaced by a weight ratio of 69:30:1.

[實施例4] [Example 4]

該全芳族液態結晶聚酯樹脂化合物以相同於實施例1之方法製備,除了混合物以製備例1所得之全芳族液態結晶聚酯樹脂、玻璃纖維(KCC,CS371)、滑石(Dongyang Materials Industrial,ETA#400)及碳黑(Evonik, HIBLACK 30L)以67:30:1.5:1.5之重量比替代之。 The wholly aromatic liquid crystalline polyester resin compound was prepared in the same manner as in Example 1, except that the mixture was obtained as the wholly aromatic liquid crystalline polyester resin obtained in Preparation Example 1, glass fiber (KCC, CS371), talc (Dongyang Materials Industrial). , ETA #400) and carbon black (Evonik, HIBLACK 30L) is replaced by a weight ratio of 67:30:1.5:1.5.

[實施例5] [Example 5]

該全芳族液態結晶聚酯樹脂化合物以相同於實施例1之方法製備,除了混合物以製備例1所得之全芳族液態結晶聚酯樹脂、玻璃纖維(KCC,CS371)及石英粉末(Dongyang Materials Industrial,QT#1250)以67:30:3之重量比替代之。 The wholly aromatic liquid crystalline polyester resin compound was prepared in the same manner as in Example 1, except that the mixture was obtained as the wholly aromatic liquid crystalline polyester resin obtained in Preparation Example 1, glass fiber (KCC, CS371), and quartz powder (Dongyang Materials). Industrial, QT #1250) is replaced by a weight ratio of 67:30:3.

[實施例6] [Embodiment 6]

該全芳族液態結晶聚酯樹脂化合物以相同於實施例1之方法製備,除了混合物以製備例1所得之全芳族液態結晶聚酯樹脂、玻璃纖維(KCC,CS371)及白矽石(HOBEN International Ltd.,C325)以67:30:3之重量比替代之。 The wholly aromatic liquid crystalline polyester resin compound was prepared in the same manner as in Example 1, except that the mixture was obtained as the wholly aromatic liquid crystalline polyester resin obtained in Preparation Example 1, glass fiber (KCC, CS371) and chalk (HOBEN). International Ltd., C325) is replaced by a weight ratio of 67:30:3.

[比較例1] [Comparative Example 1]

該全芳族液態結晶聚酯樹脂化合物以相同於實施例1之方法製備,除了混合物以製備例1所得之全芳族液態結晶聚酯樹脂及玻璃纖維(KCC,CS371)以70:30之重量比替代之。 The wholly aromatic liquid crystalline polyester resin compound was prepared in the same manner as in Example 1, except that the mixture was obtained by the total aromatic liquid crystalline polyester resin obtained in Preparation Example 1 and the glass fiber (KCC, CS371) at a weight of 70:30. More than alternative.

[比較例2] [Comparative Example 2]

該全芳族液態結晶聚酯樹脂化合物以相同於實施例1之方法製備,除了混合物以製備例1所得之全芳族液態結晶聚酯樹脂、玻璃纖維(KCC,CS371)、碳酸鈣(Dongyang Materials Industrial,V-JAD#300)及碳黑(Evonik,HIBLACK 30L)以65.5:30:3:1.5之重量比替代之。 The wholly aromatic liquid crystalline polyester resin compound was prepared in the same manner as in Example 1, except that the mixture was obtained as the wholly aromatic liquid crystalline polyester resin obtained in Preparation Example 1, glass fiber (KCC, CS371), and calcium carbonate (Dongyang Materials). Industrial, V-JAD #300) and carbon black (Evonik, HIBLACK 30L) were replaced by a weight ratio of 65.5:30:3:1.5.

[評估] [assessment]

由實施例1至6及比較例1及2所製備之全芳族液態結晶聚酯樹脂化合物之物理特性,以下列描述的方法測試之。 The physical properties of the wholly aromatic liquid crystalline polyester resin compound prepared in Examples 1 to 6 and Comparative Examples 1 and 2 were tested by the methods described below.

(1)量測熔融黏度 (1) Measuring the melt viscosity

每個化合物的黏度,於330℃及1/1000 s的條件下,以毛細管黏度計測定之,以比較熔融狀態下的流動性。 The viscosity of each compound was measured by a capillary viscometer at 330 ° C and 1/1000 s to compare the fluidity in the molten state.

(2)拉伸強度與拉伸伸長率的量測 (2) Measurement of tensile strength and tensile elongation

各全芳族液態結晶聚酯樹脂化合物之拉伸強度及拉伸伸長率係按照ASTM D638測定。 The tensile strength and tensile elongation of each wholly aromatic liquid crystalline polyester resin compound were measured in accordance with ASTM D638.

(3)彎曲強度及彎曲伸長率的量測 (3) Measurement of bending strength and bending elongation

各全芳族液態結晶聚酯樹脂化合物之彎曲強度及彎曲伸長率係按照ASTM D790測定。 The flexural strength and flexural elongation of each wholly aromatic liquid crystalline polyester resin compound were measured in accordance with ASTM D790.

(4)耐熱性(熱變形溫度)的量測 (4) Measurement of heat resistance (heat distortion temperature)

各全芳族液態結晶聚酯樹脂化合物之耐熱性係按照ASTM D648測定,所施加之壓力為18.5 kgf/cm2The heat resistance of each wholly aromatic liquid crystalline polyester resin compound was measured in accordance with ASTM D648, and the applied pressure was 18.5 kgf/cm 2 .

(5)氣泡抗性的量測 (5) Measurement of bubble resistance

各全芳族液態結晶聚酯之氣泡抗性係使用回流爐(三星,RF30102)於溫度間隔5℃及起始溫度250℃來測定氣泡發生之起始溫度。 The bubble resistance of each wholly aromatic liquid crystalline polyester was measured using a reflow oven (Samsung, RF30102) at a temperature interval of 5 ° C and an initial temperature of 250 ° C to determine the onset temperature of bubble generation.

參照表1,可以確認以下結論。 Referring to Table 1, the following conclusions can be confirmed.

首先,與無添加無機填料粉末之比較例1之全芳族液態結晶聚酯樹脂化合物相比,實施例1至6所製備的全芳族液態結晶聚酯樹脂化合物並沒有減損其物理特性,如拉伸強度、拉伸伸長率、彎曲強度、彎曲伸長率及耐熱性,且具有較高的氣泡抗性。 First, the wholly aromatic liquid crystalline polyester resin compound prepared in Examples 1 to 6 did not detract from its physical properties as compared with the wholly aromatic liquid crystalline polyester resin compound of Comparative Example 1 in which no inorganic filler powder was added, such as Tensile strength, tensile elongation, flexural strength, flexural elongation, and heat resistance, and high bubble resistance.

第二,比較實施例1至4,相對於100重量份之全芳族液態結晶聚酯樹脂添加增高至5重量份之無機填料粉末者,其氣泡抗性進一步增加且無損其物理特性。 Second, in Comparative Examples 1 to 4, the addition of the inorganic filler powder increased to 5 parts by weight with respect to 100 parts by weight of the wholly aromatic liquid crystalline polyester resin, the bubble resistance was further increased and the physical properties were not impaired.

第三,在比較例2的情況下,相對於100重量份之全芳族液態結晶聚酯樹脂,添加超過5重量份之無機填料粉末,在此處,可證實其物理特性 如拉伸強度、拉伸伸長率及彎曲強度減損。 Third, in the case of Comparative Example 2, more than 5 parts by weight of the inorganic filler powder is added with respect to 100 parts by weight of the wholly aromatic liquid crystalline polyester resin, where physical properties can be confirmed Such as tensile strength, tensile elongation and bending strength loss.

根據本發明之全芳族液態結晶聚酯樹脂組合物,透過添加少量的無機填料粉末至包含有增強物理特性之填料之具有高熔點之全芳族液態結晶聚酯樹脂,展現了優異的氣泡抗性且不減損其流動性、耐熱性及機械特性。因此,根據本發明之全芳族液態結晶聚酯樹脂組合物可作為電子裝置之零件如連接器及記憶卡插座。 The wholly aromatic liquid crystalline polyester resin composition according to the present invention exhibits excellent bubble resistance by adding a small amount of an inorganic filler powder to a wholly aromatic liquid crystalline polyester resin having a high melting point containing a filler having enhanced physical properties. It does not detract from its fluidity, heat resistance and mechanical properties. Therefore, the wholly aromatic liquid crystalline polyester resin composition according to the present invention can be used as a component of an electronic device such as a connector and a memory card socket.

雖然本文中揭示了實施例,但應理解其包含其他變化的可能性,這些變化並不視為背離本發明之實施例的精神及範圍,且對技藝人士而言,所有這些明顯的修飾仍視為下方申請專利範圍之範疇內。 Although the embodiments are disclosed herein, it is to be understood that the scope of the present invention is not to be construed as a For the scope of the patent application below.

Claims (3)

一種具有增進的氣泡抗性之全芳族液態結晶聚酯樹脂組合物,其包含:一具有熔點介於300至450℃間之全芳族液態結晶聚酯樹脂;一用以增強物理特性之填料,該用以增強物理特性之填料包含至少一種選自由玻璃纖維及碳纖維所組成之群組;及一無機填料粉末,其中該無機填料粉末相對於100重量份之全芳族液態結晶聚酯樹脂,包含有0.1至1重量份之含量。 A wholly aromatic liquid crystalline polyester resin composition having improved bubble resistance, comprising: a wholly aromatic liquid crystalline polyester resin having a melting point between 300 and 450 ° C; and a filler for enhancing physical properties The filler for enhancing physical properties comprises at least one selected from the group consisting of glass fibers and carbon fibers; and an inorganic filler powder, wherein the inorganic filler powder is relative to 100 parts by weight of the wholly aromatic liquid crystalline polyester resin, It is contained in an amount of 0.1 to 1 part by weight. 如請求項1之全芳族液態結晶聚酯樹脂組合物,其中該無機填料粉末包含至少一種選自由碳酸鈣、石英、鱗石英、白矽石、斜矽石、重矽石、滑石、雲母及碳黑所組成之群組。 The wholly aromatic liquid crystalline polyester resin composition of claim 1, wherein the inorganic filler powder comprises at least one selected from the group consisting of calcium carbonate, quartz, tridymite, chalk, chert, heavy ochre, talc, mica and A group of carbon blacks. 如請求項1之全芳族液態結晶聚酯樹脂組合物,其中該用以增強物理特性之填料相對於100重量份之全芳族液態結晶聚酯樹脂,包含有5至90重量份之含量。 The wholly aromatic liquid crystalline polyester resin composition of claim 1, wherein the filler for enhancing physical properties contains the content of 5 to 90 parts by weight based on 100 parts by weight of the wholly aromatic liquid crystalline polyester resin.
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KR101708927B1 (en) * 2009-10-09 2017-02-21 심천 워트 어드밴스드 머티리얼즈 주식회사 Wholly aromatic liquid crystalline polyester resin compound with enhanced thermal resistance and method for preparing the same
KR101783477B1 (en) * 2009-10-21 2017-09-29 심천 워트 어드밴스드 머티리얼즈 주식회사 Wholly aromatic liquid crystalline polyester resin compound, method of preparing the resin compound, parts for optical pick-up, and method of preparing the parts

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