TWI590497B - Light-emitting structure and the manufacture thereof - Google Patents

Description

Light-emitting structure and its preparation method

The invention relates to an electronic component, in particular to a structure of a light-emitting electronic component and a method of manufacturing the same.

With the rapid development of the electronics industry, electronic products tend to be light, thin and short in terms of type, and gradually become a high-performance, high-function, high-speed research and development direction in terms of functions. Among them, the Light Emitting Diode (LED) has the advantages of long life, small size, high shock resistance and low power consumption, so it is widely used in electronic products for illumination needs, and therefore, industrially. The use of various electronic products and home appliances is becoming more and more popular.

Generally, the LED chip is light-emitting on both sides. As shown in FIG. 1, the conventional LED element 1 is a substrate body 10 having a first side 10a and a second side 10b opposite to each other, and the first side 10a has a plurality of electrodes 100. The first side 10a and the second side 10b are light emitting sides.

However, in the conventional LED element 1, since the first side 10a and the second side 10b are light-emitting sides, heat dissipation is poor.

Moreover, although the flip-chip type LED chip has a single heat-dissipating type and has a better heat-dissipating effect, the flip-chip type LED chip is expensive.

Therefore, how to overcome various problems in the prior art has become the current The problem that I want to solve.

In view of the above-mentioned deficiencies of the prior art, the present invention provides a light-emitting structure, comprising: a substrate unit having opposite first and second sides, the first side and the second side being light-emitting sides, and the first The side has a plurality of electrodes; and a light reflecting layer is formed on the first side of the substrate unit, and the reflective layer exposes the electrodes.

The invention provides a method for fabricating a light emitting structure, comprising: providing a substrate unit having opposite first and second sides, wherein the first side and the second side are all light emitting sides, and the first side has a plurality of electrodes And forming a reflective layer on the first side of the substrate unit, and the reflective layer exposes the electrodes.

In the above-described light-emitting structure and method of manufacturing the same, the substrate unit is, for example, a general-type light-emitting diode.

In the foregoing light-emitting structure and the method of manufacturing the same, the light-reflecting layer is a white rubber layer.

In the foregoing light-emitting structure and method of manufacturing the same, the method further comprises forming a conductor layer on the light-reflecting layer and the electrode.

In the above light-emitting structure and method of manufacturing the same, the light-reflecting layer is formed on the side of the substrate unit.

As can be seen from the above, the light-emitting structure of the present invention and the manufacturing method thereof are formed on the first side of the substrate unit by the light-reflecting layer, so that the light-emitting structure emits light only from the second side, so the light-emitting structure of the present invention only needs to be used. A cheaper wafer without the need for expensive flip-chip wafers provides good heat dissipation.

1‧‧‧LED components

10,20‧‧‧Substrate body

10a, 20a‧‧‧ first side

10b, 20b‧‧‧ second side

100,200‧‧‧ electrodes

2,2’‧‧‧Lighting structure

20'‧‧‧Substrate unit

20c‧‧‧ side

21,21’‧‧‧reflective layer

210‧‧‧Opening

22‧‧‧Conductor layer

23‧‧‧ recess

S‧‧‧ cutting path

1 is a cross-sectional view of a conventional LED element; and FIGS. 2A to 2C are schematic cross-sectional views showing a method of fabricating the light-emitting structure of the present invention; wherein, FIGS. 2A' and 2C' are diagrams of FIGS. 2A and 2C In one embodiment, the 2A" diagram is a top view of the second embodiment in which the reflective layer is omitted.

The other embodiments of the present invention will be readily understood by those skilled in the art from this disclosure.

It is to be understood that the structure, the proportions, the size, and the like of the present invention are intended to be used in conjunction with the disclosure of the specification, and are not intended to limit the invention. The conditions are limited, so it is not technically meaningful. Any modification of the structure, change of the proportional relationship or adjustment of the size should remain in this book without affecting the effects and the objectives that can be achieved by the present invention. The technical content disclosed in the invention can be covered. In the meantime, the terms "upper", "first", "second" and "one" are used in the description, and are not intended to limit the scope of the invention. Changes or adjustments in the relative relationship are considered to be within the scope of the present invention.

2A to 2C are schematic cross-sectional views showing the manufacturing method of the light-emitting structure 2 of the present invention.

As shown in FIG. 2A, a substrate body 20 having a first side 20a and a second side 20b opposite thereto is provided, and the first side 20a has a plurality of electrodes 200. Next, a light reflecting layer 21 is formed on the first side of the substrate body 20 20a, and the reflective layer 21 exposes the electrodes 200.

In the embodiment, the substrate body 20 is an illuminant, such as a general light emitting diode (LED), which can be lighted by the first side 20a and the second side 20b.

Furthermore, the shape of the substrate body 20 is a wafer type, and as shown in Fig. 2A", the substrate body 20 includes a plurality of substrate units 20'.

The reflective layer 21 has a plurality of openings 210 for exposing the electrodes 200 to the openings 210, and the reflective layer 21 is a white layer to shield the first side 20a of the substrate body 20. The light that is emitted. In the present embodiment, the white glue having the opening 210 of the external exposed electrode 200 can be directly formed on the first side 20a of the substrate body 20 through, for example, screen printing, or in the substrate body 20 first. The first side 20a is covered with white glue, and an opening 210 is formed to expose the electrode 200.

In addition, as shown in FIG. 2A', before forming the light reflecting layer 21, a plurality of concave portions 23 may be formed on the first side 20a of the substrate body 20 (preferably, the concave portion 23 is connected to the second side 20b). ), the reflective layer 21 ′ is formed in the recesses 23 . Specifically, the recesses 23 may be formed along the edge of the substrate unit 20', and the recesses 23 may be, for example, a recess having a vertical side of the 2A' diagram or a recess having a sloped side.

As shown in FIG. 2B, following the process of FIG. 2A, a conductor layer 22 is formed on the light reflecting layer 21 and each of the openings 210, and the conductor layer 22 is electrically connected to the electrode 200. In this embodiment, the conductor layer 22 can be, for example, a patterned pattern of pillars or lines formed by plating a metal layer, chemically depositing a metal layer, or coating a conductive paste.

As shown in FIG. 2C, a singulation process is performed along the dicing path S as shown in FIG. 2B (ie, the edge of the substrate unit 20') to obtain a plurality of light-emitting structures 2, and the substrate unit 20' The one side 20a is blocked by the light reflecting layer 21, so that the light emitting structure 2 can be lighted only by the second side 20b.

In other embodiments, as shown in FIG. 2C', if the subsequent process is performed according to the process shown in FIG. 2A', and the cutting path S is along the path of the recesses 23, another light-emitting structure 2 will be fabricated. ', and the light reflecting layer 21' is formed on the first side 20a and the side surface 20c of the substrate unit 20'.

In addition, in other embodiments, the present invention can also directly perform the process of the reflective layer for a single substrate unit 20'.

The method of the present invention is formed on the first side 20a (and the side surface 20c) of the substrate unit 20' by the light reflecting layer 21, 21', so that the light emitting structure 2, 2' is only emitted by the second side 20b. Therefore, the light-emitting structure 2, 2' of the present invention only needs to use a general-purpose LED chip which is inexpensive, and can have a good heat-dissipating effect without using a expensive flip-chip LED chip.

The above embodiments are intended to illustrate the principles of the invention and its effects, and are not intended to limit the invention. Any of the above-described embodiments may be modified by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be as set forth in the appended claims.

2‧‧‧Lighting structure

20'‧‧‧Substrate unit

20a‧‧‧ first side

20b‧‧‧ second side

200‧‧‧electrode

21‧‧‧Reflective layer

22‧‧‧Conductor layer

Claims (10)

A light-emitting structure includes: a substrate unit having opposite first and second sides, the first side and the second side are all light-emitting sides, and the first side has a plurality of electrodes; and the reflective layer is formed On the first side of the substrate unit, the electrodes are exposed. The light-emitting structure of claim 1, wherein the substrate unit is a light-emitting diode. The light-emitting structure of claim 1, wherein the light-reflecting layer is a white rubber layer. The light-emitting structure of claim 1, wherein the light-reflecting layer is formed on a side of the substrate unit. The light-emitting structure of claim 1, further comprising a conductor layer formed on the light-reflecting layer and the electrode. A method of fabricating a light emitting structure, comprising: providing a substrate unit having opposite first and second sides, wherein the first side and the second side are all light emitting sides, and the first side has a plurality of electrodes; Forming a light reflecting layer on the first side of the substrate unit and exposing the electrodes. The method of fabricating a light-emitting structure according to claim 6, wherein the substrate unit is a light-emitting diode. The method for manufacturing a light-emitting structure according to claim 6 of the patent application, wherein The reflective layer is a white rubber layer. The method for fabricating a light-emitting structure according to claim 6, further comprising forming a conductor layer on the light-reflecting layer and the electrode. The method of fabricating the light-emitting structure of claim 6, wherein the light-reflecting layer is formed on a side of the substrate unit.