TWI590125B - Touch panels - Google Patents

Description

Touch panel

The present disclosure relates to a touch panel, and more particularly to a touch panel including a novel wire design.

Related products for touch panels have been widely used in daily work and life. Generally, the touch panel structure includes a sensing area formed on the surface of the substrate, which is used to sense a finger of a human body or a writing instrument similar to a pen. To achieve the touch effect.

A common projected capacitive touch panel is provided with a plurality of transparent electrodes (such as indium tin oxide (ITO) electrodes) insulated, intersecting or not intersecting each other on the surface of the substrate, and the transparent electrodes are connected to the controller by peripheral wires. . When an object approaches or touches the touch panel, a change in capacitance between the electrodes at the touch position is caused, and the capacitance change signals are transmitted to the controller by the peripheral wires to calculate the coordinates of the touch position.

As the screen of the touch panel product becomes larger and larger, it is necessary to control both the one-handed control and the better holding size. The touch panel manufacturers all try to reduce the size of the frame, and hope to achieve the maximum screen size and the best grip. size.

In the conventional capacitive touch panel, since the metal material has good electrical conductivity, a peripheral material such as a molybdenum-aluminum-molybdenum (Mo-Al-Mo) metal laminate is generally used to make a peripheral wire. Aluminum is a very conductive material The material has poor adhesion to the substrate and is highly oxidizable, and the molybdenum material for improving its adhesion to the substrate and protecting it from oxidation is inferior in electrical conductivity. Generally, in order to meet the surface resistance (resistivity/film thickness) of the peripheral wires of the touch panel (less than or equal to 0.3 ohms), the film thickness of the molybdenum-aluminum-molybdenum alloy is about 300 nm, and the two layers of molybdenum materials are each 50 nm. To improve the adhesion and anti-oxidation effect, the corresponding aluminum material needs 200nm to meet the surface resistance requirements of the metal laminate. Moreover, the molybdenum and aluminum materials have large differences, and the etching rate of the same etching liquid is different for different layers. When the etching process is performed, the etching liquid is etched from the surface layer to the bottom layer, which also causes the etching liquid to be easily oriented. The side of the etching layer is eroded, causing side etching. The larger the overall thickness, the more serious the side etching problem. In order to avoid the problem of incomplete etching or excessive etching on the side, the wire made of molybdenum-aluminum-molybdenum alloy must have a wide line width and line spacing (the line width after etching and the line spacing must be about 25 μm). The effect of thin lines, fine pitch and narrowing of the touch panel frame. It is worth noting that these problems exist not only in the above projected capacitive touch panel, but also in other common touch panel structures such as resistive, infrared, and surface acoustic wave. In addition, conventional high-thickness wires require a relatively large amount of target and the target is expensive.

According to an embodiment of the present disclosure, a touch panel includes: a substrate defining a touch area and a peripheral area, the peripheral area surrounding the touch area; and a plurality of peripheral wires disposed on the periphery of the substrate a region, wherein the peripheral wires comprise a metal layer and a first nickel-copper-titanium layer, the metal layer is disposed on the substrate, the first nickel-copper-titanium layer is disposed on a side of the metal layer away from the substrate; The sensing layer is disposed on the touch area of the substrate and electrically connected to the peripheral wires.

According to an embodiment of the present disclosure, a touch panel includes: a cover plate defining a touch area and a peripheral area, the peripheral area surrounding the touch area; and a plurality of peripheral wires disposed on the cover The peripheral region, wherein the peripheral wires comprise a first nickel-copper-titanium layer, a metal layer and a second nickel-copper-titanium layer, the first nickel-copper-titanium layer is disposed on the cover plate, and the metal layer is disposed on the The second nickel-copper-titanium layer is disposed on the metal layer; and a sensing layer is disposed on the touch area of the cover and electrically connected to the peripheral wires.

The above described objects, features and advantages of the present invention will become more apparent from the following description.

10, 100‧‧‧ touch panel

12‧‧‧Substrate

14, 140‧‧ ‧ touch area

16, 160‧‧‧ surrounding area

18, 18’, 180‧‧‧ peripheral conductors

20, 200‧‧‧ metal layer

22, 220‧‧‧ first nickel-copper-titanium layer

24, 240‧‧ ‧ sensing layer

26, 260‧‧‧ second nickel-copper-titanium layer

28, 280‧‧‧ first sensing electrode

30, 300‧‧‧second sensing electrode

32, 320‧‧‧ First direction of the first sensing electrode extension

34, 340‧‧‧ second direction of the second sensing electrode extension

36, 360‧‧‧ first conductive unit

38, 38', 38", 38''', 380, 380" ‧ ‧ bridge wires

40,400‧‧‧Insulation unit

42, 420‧‧‧ second metal layer

44, 440‧‧‧ third nickel-copper-titanium layer

46, 460‧‧‧ fourth nickel-copper-titanium layer

48, 480‧‧‧ third metal layer

50, 500‧‧‧ fifth nickel-copper-titanium layer

52, 520‧‧‧ sixth nickel-copper-titanium layer

120‧‧‧ cover

250‧‧‧Ink layer or colored photoresist layer

1 is a cross-sectional view of a touch panel according to an embodiment of the present disclosure; FIG. 2 is a cross-sectional view of a touch panel according to an embodiment of the present disclosure; and FIG. 3 is an implementation according to the present disclosure. For example, a top view of a structure of a sensing electrode; FIG. 4 is a cross-sectional view of a touch panel according to an embodiment of the present disclosure; and FIG. 5 is a cross section of a touch panel according to an embodiment of the present disclosure. FIG. 6 is a cross-sectional view of a touch panel according to an embodiment of the present disclosure; 7 is a cross-sectional view of a touch panel according to an embodiment of the present disclosure; FIG. 8 is a cross-sectional view of a touch panel according to an embodiment of the present disclosure; and FIG. 9 is an implementation according to the present disclosure. For example, a top view of a structure of a sensing electrode; FIG. 10 is a schematic cross-sectional view of a touch panel according to an embodiment of the present disclosure.

According to an embodiment of the present disclosure, a touch panel is described in FIG. 1 . FIG. 1 is a schematic cross-sectional view of the touch panel.

Referring to FIG. 1 , a touch panel 10 is provided. The touch panel 10 includes a substrate 12 defining a touch area 14 and a peripheral area 16 . The peripheral area 16 surrounds the touch area 14 . The plurality of peripheral wires 18 are disposed on the peripheral area 16 of the substrate 12 , wherein the peripheral wires 18 are disposed. A metal layer 20 and a first nickel-copper-titanium layer 22 are disposed. The metal layer 20 is disposed on the substrate 12. The first nickel-copper-titanium layer 22 is disposed on a side of the metal layer 20 away from the substrate 12, that is, the metal layer 20 is disposed. Between the substrate 12 and the first nickel-copper-titanium layer 22; and a sensing layer 24 disposed on the touch region 14 of the substrate 12 and electrically connected to the peripheral wires 18.

In some embodiments, the substrate 12 can include a glass substrate or a film substrate.

Nickel-copper-titanium (NCT) alloy with low impedance, high adhesion to substrates such as glass and film, and oxidation and corrosion resistance Characteristics such as eclipse. Compared with the molybdenum material, it has lower resistivity and stronger anti-oxidation and corrosion resistance, and can achieve the same anti-oxidation effect with a thinner thickness. In some embodiments, the first nickel-copper-titanium layer 22 has a thickness of 10 to 30 nm, preferably 15 to 25 nm, and more preferably 20 nm. The first nickel-copper-titanium layer 22 may comprise nickel-copper-titanium alloy in various proportions. In a preferred embodiment, the ratio of nickel-copper-titanium in nickel-copper-titanium (NCT) is 35-50 weight percent nickel, 4-10 weight. Percentage of copper, 44 to 55 weight percent titanium.

In some embodiments, the metal layer 20 may be copper, aluminum, gold or silver. The material cost, resistivity, adhesion, etching rate and the like are comprehensive. The material of the metal layer 20 is preferably copper, and the thickness thereof is 120-150 nm. The surface resistance of the peripheral wires 18 can be made to meet the requirements of the touch panel (less than or equal to 0.3 ohms).

In some embodiments, the difference from FIG. 1 is that a second nickel-copper-titanium layer 26 is further disposed between the metal layer 20 and the substrate 12 to form a peripheral lead 18', as shown in FIG. The second nickel-copper-titanium layer 26 is mainly used to enhance the adhesion between the metal layer 20 and the substrate 12, and the thickness thereof is between 10 and 30 nm, preferably between 15 and 25 nm, and more preferably 20 nm. Meter. The second nickel-copper-titanium layer 26 may comprise nickel-copper-titanium alloy in various proportions. In a preferred embodiment, the ratio of nickel-copper-titanium in nickel-copper-titanium (NCT) is 35% to 50% nickel, 4% to 10%. % copper, 44% to 55% titanium.

In some embodiments, the sensing layer 24 in FIGS. 1 and 2 can be formed by a sensing electrode extending in a single direction, for example, extending in the X direction or in the Y direction (not shown). In this embodiment, the sensing electrode may be made of a transparent conductive material, such as indium tin oxide (ITO), indium zinc oxide (IZO), cadmium tin oxide (cadmium tin oxide). CTO) or doped aluminum-doped zinc oxide (AZO), metal mesh (metal mesh) or nano silver wire (SNW).

In some embodiments, the sensing layer 24 can include a plurality of first sensing electrodes 28 and a plurality of second sensing electrodes 30. The first sensing electrodes 28 extend along a first direction 32, for example, extending in the X direction, and the second sensing electrodes 30 extends in a second direction 34, such as in the Y direction, and the first sensing electrode 28 intersects the second sensing electrode 30, as shown in FIG. FIG. 3 is a top view of the first sensing electrode 28 and the second sensing electrode 30 in a structural form.

In this embodiment, the first sensing electrode 28 includes a plurality of first conductive units 36 and a plurality of bridge wires 38, and the bridge wires 38 are connected to the first conductive unit 36. The first conductive unit 36 and the second sensing electrode 30 of the first sensing electrode 28 may be made of a transparent conductive material, such as indium tin oxide (ITO), indium zinc oxide (IZO), cadmium. Cadmium tin oxide (CTO) or aluminum-doped zinc oxide (AZO), metal mesh or nano silver wire (SNW).

In some embodiments, the first sensing electrode 28 and the second sensing electrode 30 further include a plurality of insulating units 40 to electrically insulate between the first sensing electrode 28 and the second sensing electrode 30. Refer to Figures 1 and 2. The insulating unit 40 may be composed of a transparent insulating material.

In some embodiments, the bridging conductors 38 are disposed on the insulating unit 40. The bridging conductor 38 includes a second metal layer 42 and a third nickel-copper-titanium layer 44. The second metal layer 42 is disposed on the insulating unit 40, and the third nickel-copper-titanium layer 44 is disposed on the second metal layer 42. 1, 2 shown. The second metal layer 42 can be copper, aluminum, gold or silver, preferably copper. The thickness of the third nickel-copper-titanium layer 44 is between 10 and 30 nm, preferably between 15 and 25 nm, more preferably 20 nm. The third nickel-copper-titanium layer 44 may comprise nickel-copper-titanium alloy in various ratios. In a preferred embodiment, nickel-copper-titanium (NCT) The ratio of medium nickel copper to titanium is 35% to 50% nickel, 4% to 10% copper, and 44% to 55% titanium.

In some embodiments, the difference between the second metal layer 42 and the insulating unit 40 is further provided with a fourth nickel-copper-titanium layer 46 to form a bridging conductor 38', as in the fourth embodiment. Figure 5 shows. The thickness of the fourth nickel-copper-titanium layer 46 is between 10 and 30 nm, preferably between 15 and 25 nm, more preferably 20 nm. The fourth nickel-copper-titanium layer 46 may comprise nickel-copper-titanium alloy in various proportions. In a preferred embodiment, the ratio of nickel-copper-titanium in nickel-copper-titanium (NCT) is 35% to 50% nickel, 4% to 10%. % copper, 44% to 55% titanium.

In some embodiments, the difference from FIG. 1 is that the bridging conductor 38" is disposed between the insulating unit 40 and the substrate 12, as shown in FIG. 6. In the figure, the bridging conductor 38" includes a third metal. The layer 48 and a fifth nickel-copper-titanium layer 50 are disposed on the substrate 12, and the fifth nickel-copper-titanium layer 50 is disposed on the third metal layer 48. The third metal layer 48 can be copper, aluminum, gold or silver, preferably copper. The fifth nickel-copper-titanium layer 50 has a thickness of 10 to 30 nm, preferably 15 to 25 nm, more preferably 20 nm. The fifth nickel-copper-titanium layer 50 may comprise nickel-copper-titanium alloy in various proportions. In a preferred embodiment, the ratio of nickel-copper-titanium in nickel-copper-titanium (NCT) is 35%~50% nickel, 4%~10. % copper, 44% to 55% titanium.

In some embodiments, the difference from FIG. 6 is that a third nickel-copper-titanium layer 52 is further disposed between the third metal layer 48 and the substrate 12 to form a bridge wire 38 ′′′, as shown in FIG. 7 . Show. The sixth nickel-copper-titanium layer 52 has a thickness of 10 to 30 nm, preferably 15 to 25 nm, more preferably 20 nm. The sixth nickel-copper-titanium layer 52 may comprise nickel-copper-titanium alloy in various proportions. In a preferred embodiment, the ratio of nickel-copper-titanium in nickel-copper-titanium (NCT) is 35%~50% nickel, 4%~10. % copper, 44% to 55% titanium.

Taking FIG. 1 as an example, the difference in etching speed between the first nickel-copper-titanium layer 22 and the metal layer 20 used in the peripheral wires 18 is small, and the overall thickness is thin, and the problems of incomplete etching and excessive side etching are greatly improved. The line width and line spacing of the peripheral wires 18 can be reduced to a smaller range. In some embodiments, the perimeter conductor 18 has a line width of between 5 and 20 microns, preferably 10 microns. The peripheral wire 18 has a line pitch of 5 to 20 microns, preferably 10 microns.

According to an embodiment of the present disclosure, a touch panel is described in FIG. FIG. 8 is a schematic cross-sectional view of the touch panel.

Referring to FIG. 8 , a touch panel 100 is provided. The touch panel 100 includes a cover 120 defining a touch area 140 and a peripheral area 160. The peripheral area 160 surrounds the touch area 140. The plurality of peripheral wires 180 are disposed in the peripheral area 160 of the cover 120. The wire 180 includes a first nickel-copper-titanium layer 220, a metal layer 200 and a second nickel-copper-titanium layer 260. The first nickel-copper-titanium layer 220 is disposed on the cap plate 120, and the metal layer 200 is disposed on the first nickel-copper-titanium layer. The layer 220 is away from the side of the cover plate 120, and the second nickel-copper-titanium layer 260 is disposed on a side of the metal layer 200 away from the first nickel-copper-titanium layer 220, that is, the metal layer 200 is sandwiched between the first nickel-copper-titanium layer 220 and A second nickel-copper-titanium layer 260; and a sensing layer 240 are disposed on the touch area 140 of the cover 120 and electrically connected to the peripheral wires 180.

In some embodiments, the metal layer 200 can be copper, aluminum, gold or silver, preferably copper.

In some embodiments, the first nickel copper titanium layer 220 and the second nickel copper titanium layer 260 have a thickness of 10 to 30 nm, preferably 15 to 25 nm, more preferably 20 nm. The first nickel copper titanium layer 220 and the second nickel copper titanium layer 260 may comprise various ratios Nickel-copper-titanium alloy, in a preferred embodiment, nickel-copper-titanium (NCT) nickel-copper-titanium ratio of 35% to 50% nickel, 4% to 10% copper, 44% to 55% titanium .

In some embodiments, an ink layer or a colored photoresist layer 250 is further disposed between the peripheral lead 180 and the cover 120 to block the peripheral lead 180.

In some embodiments, the sensing layer 240 in FIG. 8 may be formed of a sensing electrode extending in a single direction, for example, extending in the X direction or in the Y direction (not shown). In this embodiment, the sensing electrode may be made of a transparent conductive material, such as indium tin oxide (ITO), indium zinc oxide (IZO), cadmium tin oxide (cadmium tin oxide). CTO) or doped aluminum-doped zinc oxide (AZO), metal mesh (metal mesh) or nano silver wire (SNW).

In some embodiments, the sensing layer 240 can include a first sensing electrode 280 and a second sensing electrode 300. The first sensing electrode 280 extends along a first direction 320, for example, along the X direction, and the second sensing electrode 300 extends along the first The two directions 340 extend, for example, extending in the Y direction, and the first sensing electrode 280 intersects the second sensing electrode 300, as shown in FIG. FIG. 9 is a top view showing a structural aspect of the first sensing electrode 280 and the second sensing electrode 300.

In this embodiment, the first sensing electrode 280 includes a plurality of first conductive units 360 and a plurality of bridge wires 380, and the bridge wires 380 are connected to the first conductive unit 360. The first conductive unit 360 and the second sensing electrode 300 of the first sensing electrode 280 may be formed of a transparent conductive material, such as indium tin oxide (ITO), indium zinc oxide (IZO), cadmium. Cadmium tin oxide (CTO) or doped aluminum zinc oxide (aluminum-doped zinc oxide, AZO), metal mesh or nano silver wire (SNW).

In some embodiments, the first sensing electrode 280 and the second sensing electrode 300 further include a plurality of insulating units 400 to electrically insulate between the first sensing electrode 280 and the second sensing electrode 300. Refer to Figure 8. The insulating unit 400 may be composed of a transparent insulating material.

In some embodiments, the bridging conductors 380 are disposed on the insulating unit 400 as shown in FIG. In the figure, the bridge wire 380 includes a third nickel-copper-titanium layer 440, a second metal layer 420 and a fourth nickel-copper-titanium layer 460. The third nickel-copper-titanium layer 440 is disposed on the insulating unit 400, and the second metal layer 420 is disposed on a side of the third nickel-copper-titanium layer 440 away from the insulating unit 400, and the fourth nickel-copper-titanium layer 460 is disposed on a side of the second metal layer 420 away from the third nickel-copper-titanium layer 440, that is, the second metal layer 420. It is sandwiched between the third nickel-copper-titanium layer 440 and the fourth nickel-copper-titanium layer 460. The second metal layer 420 can be copper, aluminum, gold or silver, preferably copper. The third nickel-copper-titanium layer 440 and the fourth nickel-copper-titanium layer 460 have a thickness of 10 to 30 nm, preferably 15 to 25 nm, more preferably 20 nm. The third nickel-copper-titanium layer 440 and the fourth nickel-copper-titanium layer 460 may comprise nickel-copper-titanium alloys in various proportions. In a preferred embodiment, the ratio of nickel-copper-titanium in nickel-copper-titanium (NCT) is 35% to 50. % nickel, 4% to 10% copper, 44% to 55% titanium.

In some embodiments, the difference from FIG. 8 is that the bridging conductor 380" is disposed between the insulating unit 400 and the cover 120, as shown in FIG. 10. In the figure, the bridging conductor 380" includes a fifth A nickel-copper-titanium layer 500, a third metal layer 480 and a sixth nickel-copper-titanium layer 520, a fifth nickel-copper-titanium layer 500 is disposed on the cap plate 120, and a third metal layer 480 is disposed on the fifth nickel-copper-titanium layer 500. One away from the cover 120 The sixth nickel-copper-titanium layer 520 is disposed on a side of the third metal layer 480 away from the fifth nickel-copper-titanium layer 500, that is, the third metal layer 480 is sandwiched between the fifth nickel-copper-titanium layer 500 and the sixth nickel-copper layer. Between the titanium layers 520. The third metal layer 480 can be copper, aluminum, gold or silver, preferably copper. The fifth nickel copper titanium layer 500 and the sixth nickel copper titanium layer 520 have a thickness of 10 to 30 nm, preferably 15 to 25 nm, more preferably 20 nm. The fifth nickel-copper-titanium layer 500 and the sixth nickel-copper-titanium layer 520 may comprise nickel-copper-titanium alloys in various proportions. In a preferred embodiment, the ratio of nickel-copper-titanium in nickel-copper-titanium (NCT) is 35%~50. % nickel, 4% to 10% copper, 44% to 55% titanium.

Taking FIG. 8 as an example, in some embodiments, the peripheral conductor 180 has a line width of 5 to 20 micrometers, preferably 10 micrometers. The peripheral wire 180 has a line pitch of 5 to 20 microns, preferably 10 microns.

According to an embodiment of the present disclosure, a method of manufacturing a touch panel is described in FIG.

Here, only the fabrication of the peripheral conductor 18' and the bridge conductor 38' is focused on, and the remaining components may be fabricated in accordance with a general semiconductor process. For the fabrication of the peripheral lead 18', a second nickel-copper-titanium layer 26 is sputtered onto the substrate 12. Thereafter, a metal layer 20 is sputtered onto the second nickel-copper-titanium layer 26. Thereafter, a first nickel-copper-titanium layer 22 is sputtered onto the metal layer 20. Thereafter, the laminated structure is etched to form a peripheral lead 18'.

Similarly, for the fabrication of the bridging conductor 38', a fourth nickel-copper-titanium layer 46 is sputtered onto the insulating unit 40. Thereafter, a second metal layer 42 is sputtered onto the fourth nickel-copper-titanium layer 46. Thereafter, a third nickel-copper-titanium layer 44 is sputtered onto the second metal layer 42. Thereafter, the laminated structure is etched to form a bridging conductor 38'.

In some embodiments, the perimeter conductor 18' can be the same as the bridge conductor 38'. Made or made separately.

The present disclosure utilizes the advantages of low resistivity of nickel-copper-titanium layer and excellent oxidation resistance, high adhesion, and small difference in etching speed with gold, silver, copper, aluminum, and especially copper metal, in a two-layer stacked structure, nickel The copper-titanium layer/metal layer (especially the nickel-copper-titanium layer/copper metal layer) replaces the molybdenum/aluminum/molybdenum structure to make a peripheral wire or a bridge wire, which can reduce the thickness of the peripheral wire or the bridge wire, and improve the overall flatness of the touch panel. At the same time, the nickel-copper-titanium layer and the metal layer of the peripheral wire or the bridge wire reduce the etching rate difference of the same etching liquid, effectively solve the problem of incomplete etching or side etching in the etching process, and realize the technical result of fine line and fine pitch. .

The disclosure discloses a peripheral wire or a bridge wire by a three-layer stacked structure (for example, a nickel-copper-titanium layer/copper metal layer/nickel-copper-titanium layer), wherein the nickel-copper-titanium layer in contact with the substrate or the ink layer can effectively enhance the copper metal layer and the substrate. Or adhesion between ink layers.

The thin circuit design can be applied to a double glass single layer line touch panel (GG (SITO)), a double glass double layer line touch panel (GG (DITO)), a one-piece glass touch panel (one glass solution, OGS) and other related structures.

While the invention has been described above in terms of several preferred embodiments, it is not intended to limit the scope of the present invention, and any one of ordinary skill in the art can make any changes without departing from the spirit and scope of the invention. And the scope of the present invention is defined by the scope of the appended claims.

10‧‧‧Touch panel

12‧‧‧Substrate

14‧‧‧ touch area

16‧‧‧The surrounding area

18‧‧‧Boundary conductors

20‧‧‧metal layer

22‧‧‧First nickel-copper-titanium layer

24‧‧‧Sense layer

28‧‧‧First sensing electrode

30‧‧‧Second sensing electrode

36‧‧‧First Conductive Unit

38‧‧‧Bridge conductor

40‧‧‧Insulation unit

42‧‧‧Second metal layer

44‧‧‧The third nickel-copper-titanium layer

Claims (21)

A touch panel includes: a substrate defining a touch area and a peripheral area, the peripheral area surrounding the touch area; a plurality of peripheral wires disposed in the peripheral area of the substrate, wherein the peripheral wires include a a metal layer and a first nickel copper titanium layer disposed on the substrate, the first nickel copper titanium layer disposed on a side of the metal layer away from the substrate; and a sensing layer disposed on the substrate The touch area is electrically connected to the peripheral wires. The touch panel of claim 1, wherein the metal layer is made of copper, aluminum, gold or silver. The touch panel of claim 1, wherein the first nickel-copper-titanium layer contains 35 to 50% by weight of nickel, 4 to 10% by weight of copper, and 44 to 55% by weight of titanium. The touch panel of claim 1, wherein the first nickel-copper-titanium layer has a thickness of 10 to 30 nm. The touch panel of claim 1, wherein the first nickel-copper-titanium layer has a thickness of 15 to 25 nm. The touch panel of claim 1, further comprising a second nickel-copper-titanium layer disposed between the metal layer and the substrate. The touch panel of claim 6, wherein the second nickel-copper-titanium layer has a thickness of 10 to 30 nm. The touch panel of claim 7, wherein the second nickel The thickness of the copper-titanium layer is between 15 and 25 nm. The touch panel of claim 1, wherein the peripheral wires have a line width of 5 to 20 microns. The touch panel of claim 1, wherein the peripheral wires have a line pitch of 5 to 20 micrometers. The touch panel of claim 1, wherein the sensing layer comprises a plurality of first sensing electrodes and a plurality of second sensing electrodes, the first sensing electrodes extending along a first direction, the second sensing electrodes And extending in a second direction, the first sensing electrode and the second sensing electrode intersecting, further comprising a plurality of insulating units disposed between the first sensing electrode and the second sensing electrode, the first sensing electrode comprising a plurality of first conductive units and a plurality of bridge wires, the bridge wires connecting the first conductive units. The touch panel of claim 11, wherein the bridge wires are disposed on the insulation unit. The touch panel of claim 12, wherein the bridge wires comprise a second metal layer and a third nickel-copper-titanium layer, the second metal layer is disposed on the insulating unit, the third nickel A copper-titanium layer is disposed on the second metal layer. The touch panel of claim 13, wherein the second metal layer is copper, aluminum, gold or silver. The touch panel of claim 13, further comprising a fourth nickel-copper-titanium layer disposed between the second metal layer and the insulating unit. The touch panel of claim 15, wherein the third The thickness of the nickel-copper-titanium layer and the fourth nickel-copper-titanium layer is between 10 and 30 nm. The touch panel of claim 11, wherein the bridge wires are disposed between the insulating unit and the substrate. The touch panel of claim 17, wherein the bridge wires comprise a third metal layer and a fifth nickel-copper-titanium layer, the third metal layer is disposed on the substrate, the fifth nickel-copper A titanium layer is disposed on the third metal layer. The touch panel of claim 18, wherein the third metal layer is copper, aluminum, gold or silver. The touch panel of claim 18, further comprising a sixth nickel-copper-titanium layer disposed between the three metal layers and the substrate. The touch panel of claim 20, wherein the fifth nickel-copper-titanium layer and the sixth nickel-copper-titanium layer have a thickness of 10 to 30 nm.