TWI589825B - Bendable water-cooling device - Google Patents
Bendable water-cooling device Download PDFInfo
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- TWI589825B TWI589825B TW104116936A TW104116936A TWI589825B TW I589825 B TWI589825 B TW I589825B TW 104116936 A TW104116936 A TW 104116936A TW 104116936 A TW104116936 A TW 104116936A TW I589825 B TWI589825 B TW I589825B
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Description
本發明係有關於一種可彎折之水冷裝置,尤指一種具有彎折的功能且可依照電子裝置內現有的空間任意設置之可彎折或疊置之水冷裝置。 The invention relates to a water-cooling device which can be bent, in particular to a water-cooling device which has the function of bending and can be arbitrarily arranged according to the existing space in the electronic device.
在電子裝置運行中,CPU或其他處理器運作過程中產生的熱必須快速且有效的消散。而目前被廣泛應用CPU或其他處理器的冷卻手段以空氣冷卻裝置為主,主要以散器及風扇作為散熱的手段。另外一種係利用冷卻液來冷卻CPU或其他處理器,這樣的水冷技術例如美國公告專利號8245764(US 8245764)揭示一種發熱元件之冷卻系統,包括:一雙面基座,用來容置一泵浦使一冷卻液體循環,該泵浦包括一定子及一推動器,該推動器設在該基座底側,該定子設在該基座的頂側與該冷卻冷卻液體隔離;一儲液室,係供該冷卻液體通過其內,該儲液室包括:一泵浦腔室,包括該推動器並形成在該基座的下方,至少一推動器蓋體界定該泵浦腔室,且具有一或數個流道供該冷卻冷卻液體流通;一熱交換腔室,形成在該泵浦腔室的下方且垂直的與該泵浦腔室間隔,該泵浦腔室及該熱交換腔室係為分開的腔室並經該一或數個通道流動地的連接一起;一熱交換介面,該熱交換介面形成該熱交換腔室之一 側邊,且與一發熱元件接觸;及一散熱器,連接該儲液室以令該冷卻液體散熱。又如美國專利公開20050069432A1揭示一種具有泵浦的電子裝置,該電子裝置包括一儲液殼體具有一發熱元件、一散熱部用以對該發熱元件散熱,一泵浦單元具有一推動器及一吸熱部係熱連接該發熱元件,其中該泵浦單元藉由該推動器的轉動供應冷卻液體至該散熱部,且該冷卻液體在該吸熱部及該散熱部之間的一循環路徑循環,以透過該冷卻液體將該發熱元件產生的熱傳遞到散熱部。該泵浦單元的推動器的中央跟發熱元件的中央分離設置。由於習知的儲液殼體與泵浦單元零件很多,且零件都是直接組裝在單一雙而基座內部且還須隔出上下垂直的兩個腔室,此結構無法使所述儲液殼體與泵浦單元任意地設置於同一水平位置上,進而導致無法於電子裝置內現有的空間任意設置該冷卻系統。 In the operation of an electronic device, the heat generated during the operation of the CPU or other processor must be quickly and efficiently dissipated. At present, the cooling means widely used for CPU or other processors is mainly air-cooling devices, mainly using a bulk device and a fan as a means of heat dissipation. Another type of cooling system is used to cool a CPU or other processor. Such a water-cooling technique, such as U.S. Patent No. 8,245,764 (US Pat. No. 8,245,764), discloses a cooling system for a heating element, comprising: a double-sided base for accommodating a pump a pump for circulating a cooling liquid, the pump comprising a stator and a pusher, the pusher being disposed on a bottom side of the base, the stator being disposed on a top side of the base to be isolated from the cooling and cooling liquid; a liquid storage chamber Providing the cooling liquid therethrough, the liquid storage chamber comprising: a pumping chamber including the pusher and formed under the base, at least one pusher cover defining the pumping chamber, and having One or more flow passages for circulating the cooling and cooling liquid; a heat exchange chamber formed below the pump chamber and vertically spaced from the pump chamber, the pump chamber and the heat exchange chamber Separating chambers and flowing together through the one or more channels; a heat exchange interface forming one of the heat exchange chambers a side edge and in contact with a heating element; and a heat sink connected to the liquid storage chamber to dissipate the cooling liquid. In another example, the electronic device includes a pumping housing having a heating element, a heat dissipating portion for dissipating heat to the heating element, and a pumping unit having a pusher and a pumping unit. The heat absorbing portion is configured to thermally connect the heat generating component, wherein the pumping unit supplies cooling liquid to the heat radiating portion by the rotation of the pusher, and the cooling liquid circulates in a circulation path between the heat absorbing portion and the heat radiating portion to The heat generated by the heat generating element is transmitted to the heat radiating portion through the cooling liquid. The center of the pusher of the pump unit is disposed separately from the center of the heat generating component. Since the conventional liquid storage housing and the pump unit have many parts, and the parts are directly assembled in a single double and the inside of the base, and two chambers vertically separated from each other must be separated, the structure cannot make the liquid storage. The housing and the pump unit are arbitrarily disposed at the same horizontal position, thereby making it impossible to arbitrarily set the cooling system in the existing space in the electronic device.
是以,要如何解決上述習用之問題與缺失,即為本案之發明人與從事此行業之相關廠商所亟欲研究改善之方向所在者。 Therefore, how to solve the above problems and problems in the past, that is, the inventors of this case and the relevant manufacturers engaged in this industry are eager to study the direction of improvement.
爰此,為有效解決上述之問題,本發明之主要目的在於提供一種具有彎折功能之可彎折或疊設之水冷模組。 Accordingly, in order to effectively solve the above problems, the main object of the present invention is to provide a water-coolable module that can be bent or stacked with a bending function.
本發明之次要目的,在於提供一種可依照電子裝置內現有的空間任意設置之可彎折之水冷裝置。 A secondary object of the present invention is to provide a bendable water cooling device that can be arbitrarily arranged in accordance with an existing space in an electronic device.
為達上述目的,本發明係提供一種可彎折之水冷裝置,係包括一泵浦單元、一熱交換單元、一樞接單元及一管體,該泵浦單 元具有一泵殼體及一驅動器,該泵殼體具有一泵浦腔室及一第一入口及一第一出口,並該泵殼體於該第一出口之同一側形成有一第一樞接部,該第一入口及第一出口係連通該泵浦腔室,該驅動器設置在該泵浦腔室內且沈浸於一冷卻液體中,該熱交換單元具有一儲液殼體及一散熱件,該儲液殼體具有一熱交換腔室及一第二入口及一第二出口,並該儲液殼體於該第二入口之同一側形成有一第二樞接部,該第二入口及第二出口係連通該熱交換腔室,並該熱交換腔室係供該冷卻液體通過其內,該樞接單元具有一第一對接部及一第二對接部,該第一對接部對應與所述第一樞接部相樞接,該第二對接部對應與所述第二樞接部相樞接,所述泵浦單元及熱交換單元藉由該樞接單元從一水平位置彎折至一上下重疊位置,該管體係穿設該樞接單元,並該管體具有一第一出水孔及一第二出水孔,該第一出水孔對應與所述第一出口相連接,該第二出水孔對應與所述第二入口相連接。 In order to achieve the above object, the present invention provides a bendable water cooling device comprising a pump unit, a heat exchange unit, a pivoting unit and a pipe body, the pumping unit The pump housing has a pumping chamber and a first inlet and a first outlet, and the pump housing forms a first pivoting connection on the same side of the first outlet. The first inlet and the first outlet are connected to the pump chamber, and the driver is disposed in the pump chamber and immersed in a cooling liquid, the heat exchange unit has a liquid storage shell and a heat sink. The liquid storage housing has a heat exchange chamber, a second inlet and a second outlet, and the liquid storage housing has a second pivoting portion formed on the same side of the second inlet, the second inlet and the second inlet The two outlets are connected to the heat exchange chamber, and the heat exchange chamber is configured to pass the cooling liquid therein. The pivoting unit has a first butting portion and a second butting portion, and the first butting portion corresponds to The first pivoting portion is pivotally connected to the second pivoting portion, and the pumping unit and the heat exchange unit are bent from a horizontal position by the pivoting unit to An upper and lower overlapping position, the pipe system is disposed through the pivoting unit, and the pipe body has a first Water outlet hole and a second hole corresponding to the first nozzle holes connected to the first outlet, the second outlet hole corresponding to the second inlet is connected.
透過本發明此結構的設計,藉由前述之樞接單元的第一對接部及第二對接部分別與所述泵殼體之第一樞接部及所述儲液殼體之第二樞接部相樞接組合,而可令該泵浦單元及該熱交換單元從同一水平位置彎折至一上下重疊或疊置位置或其他具高低差位置令二者非在同一水平上;除此之外,若將本發明之該水冷裝置裝設於一電子裝置內,可依照該電子裝置內現有的空間任意地設置之效果。 With the design of the structure of the present invention, the first abutting portion and the second abutting portion of the pivoting unit are respectively pivotally connected to the first pivoting portion of the pump casing and the second storage portion of the liquid storage casing The pivoting combination of the parts can make the pumping unit and the heat exchange unit bend from the same horizontal position to an upper and lower overlapping or overlapping position or other high and low position so that the two are not at the same level; Further, if the water-cooling device of the present invention is installed in an electronic device, the effect can be arbitrarily set in accordance with the existing space in the electronic device.
1‧‧‧水冷裝置 1‧‧‧Water cooling unit
11‧‧‧泵浦單元 11‧‧‧ pump unit
111‧‧‧泵殼體 111‧‧‧ pump housing
1111‧‧‧泵浦腔室 1111‧‧‧ pumping chamber
1112‧‧‧第一入口 1112‧‧‧ first entrance
1113‧‧‧第一出口 1113‧‧‧ first exit
1114‧‧‧第一樞接部 1114‧‧‧First pivotal
112‧‧‧驅動器 112‧‧‧ drive
113‧‧‧第一頂板 113‧‧‧First top board
1131‧‧‧第一接合部 1131‧‧‧First joint
12‧‧‧熱交換單元 12‧‧‧Heat exchange unit
121‧‧‧熱交換面 121‧‧‧Heat exchange surface
122‧‧‧熱接觸面 122‧‧‧Hot contact surface
123‧‧‧儲液殼體 123‧‧‧Liquid housing
1231‧‧‧熱交換腔室 1231‧‧‧Heat exchange chamber
1232‧‧‧第二入口 1232‧‧‧second entrance
1233‧‧‧第二出口 1233‧‧‧second exit
1234‧‧‧第二樞接部 1234‧‧‧Second pivotal
124‧‧‧第二頂板 124‧‧‧ second top plate
1241‧‧‧第二接合部 1241‧‧‧Second joint
125‧‧‧散熱件 125‧‧‧Solder parts
1251‧‧‧散熱鰭片 1251‧‧‧heat fins
13‧‧‧樞接單元 13‧‧‧ pivot unit
131‧‧‧第一對接部 131‧‧‧First docking
132‧‧‧第二對接部 132‧‧‧Second docking department
133‧‧‧中空部 133‧‧‧ Hollow
14‧‧‧管體 14‧‧‧ body
141‧‧‧第一出水孔 141‧‧‧First water outlet
142‧‧‧第二出水孔 142‧‧‧Second outlet
2‧‧‧冷卻液體 2‧‧‧Cooling liquid
3‧‧‧連接件 3‧‧‧Connecting parts
第1A圖係為本發明可彎折之水冷裝置之第一實施例之立體分解圖;第1B圖係為本發明可彎折之水冷裝置之第一實施例之俯視剖面圖;第2圖係為本發明可彎折之水冷裝置之第一實施例之立體組合圖;第3圖係為本發明可彎折之水冷裝置之第一實施例之折疊態樣立體圖;第4圖係為本發明可彎折之水冷裝置之第一實施例之折疊態樣立體圖;第5圖係為本發明可彎折之水冷裝置之第二實施例之折疊態樣立體圖。 1A is a perspective exploded view of a first embodiment of a bendable water-cooling device of the present invention; FIG. 1B is a top cross-sectional view of a first embodiment of the bendable water-cooling device of the present invention; The present invention is a perspective view of a first embodiment of a bendable water-cooling device of the present invention; FIG. 3 is a perspective view of a first embodiment of a bendable water-cooling device of the present invention; A folded perspective view of a first embodiment of a bendable water cooling device; and a fifth perspective view of a folded embodiment of the second embodiment of the bendable water cooling device of the present invention.
本發明之上述目的及其結構與功能上的特性,將依據所附圖式之較佳實施例予以說明。 The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.
請參閱第1A、1B、2圖,係為本發明可彎折之水冷裝置之第一實施例之立體分解圖及立體組合圖,如圖所示,一種可彎折之水冷裝置,係包括一泵浦單元11、一熱交換單元12、一樞接單元13及一管體14,該泵浦單元11具有一泵殼體111及一驅動器112,該泵殼體111具有一泵浦腔室1111及一第一入口1112及一第一出口1113,並該泵殼體111於該第一出口1113之同一側形成有一第一樞接部1114,該第一入口1112及第一出口1113係連通該泵浦腔室1111,該驅動器112設置在該泵浦腔室1111內且沈浸於一冷 卻液體2中;所述熱交換單元12具有一儲液殼體123及一散熱件125,該儲液殼體123具有一熱交換腔室1231及一第二入口1232及一第二出口1233,並該儲液殼體123於該第二入口1232之同一側形成有一第二樞接部1234,所述第二入口1232及第二出口1233係連通該熱交換腔室1231,並該熱交換腔室1231係供該冷卻液體2通過其內,其中,該熱交換單元12具有一熱交換面121面對該熱交換腔室1231,以及一熱接觸面122相反該熱交換面121,該散熱件125具有複數散熱鰭片1251,該等散熱鰭片1251係呈間隔或交錯的排列設置於該熱交換而121上,並與所述熱交換腔室1231內的冷卻液體2接觸,該熱接觸面122係接觸一發熱源(如中央處理器或圖形處理器或其他電子元件,圖中未示);所述樞接單元13具有一第一對接部131及一第二對接部132,該第一對接部131對應與所述第一樞接部1114相樞接,該第二對接部132對應與所述第二樞接部1234相樞接,所述泵浦單元11及熱交換單元12藉由該樞接單元13從一水平位置彎折至一上下重疊位置或令二者具有一高低差位置,令泵浦單元11及熱交換單元12二者非在同一水平上,而該樞接單元13具有一中空部133;所述管體14係穿設該樞接單元13之中空部133,該管體14具有一第一出水孔141及一第二出水孔142,該第一出水孔141對應與所述第一出口1113相連接,該第二出水孔142對應與所述 第二入口1232相連接,令該泵殼體111內的冷卻液體2會由該第一出口1113流出經過該管體14後,再進入該儲液殼體123的第二入口1232流入該熱交換腔室1231內並流經該散熱件125,再藉由該第二出口1233流出,以達到散熱效果,當然冷卻液體2亦可反方向流動(即從熱交換腔室1231流經泵浦腔室1111再流出第一入口1112);續請一併參閱第3、4圖,係為本發明第一實施例之折疊態樣立體圖,於本實施例中,其中該泵殼體111更具有一第一頂板113,該第一頂板113上設有一第一接合部1131,該儲液殼體123更具有一第二頂板124,該第二頂板124上設有一第二接合部1241,而所述第一、二頂板113、124分別與所述泵殼體111及儲液殼體123結合的方式可以是嵌接、螺鎖、黏接、壓合或焊接等任一種方式。 1A, 1B, and 2 are a perspective exploded view and a perspective assembled view of a first embodiment of a bendable water-cooling device of the present invention. As shown, a bendable water-cooling device includes a The pump unit 11 , a heat exchange unit 12 , a pivot unit 13 and a tube 14 , the pump unit 11 has a pump housing 111 and a driver 112 , the pump housing 111 has a pump chamber 1111 And a first inlet 1112 and a first outlet 1113, and the pump housing 111 is formed with a first pivoting portion 1114 on the same side of the first outlet 1113. The first inlet 1112 and the first outlet 1113 are connected to the first inlet 1111. Pumping chamber 1111, the driver 112 is disposed in the pumping chamber 1111 and immersed in a cold In the liquid 2, the heat exchange unit 12 has a liquid storage housing 123 and a heat sink 125. The liquid storage housing 123 has a heat exchange chamber 1231, a second inlet 1232 and a second outlet 1233. A second pivoting portion 1234 is formed on the same side of the second inlet 1232, and the second inlet 1232 and the second outlet 1233 communicate with the heat exchange chamber 1231, and the heat exchange chamber The chamber 1231 is configured to pass the cooling liquid 2 therethrough, wherein the heat exchange unit 12 has a heat exchange surface 121 facing the heat exchange chamber 1231, and a heat contact surface 122 opposite the heat exchange surface 121, the heat sink The plurality of fins 1251 have a plurality of fins 1251 disposed on the heat exchange 121 in a spaced or staggered arrangement and in contact with the cooling liquid 2 in the heat exchange chamber 1231. The 122 series is in contact with a heat source (such as a central processing unit or a graphics processor or other electronic components, not shown); the pivoting unit 13 has a first docking portion 131 and a second docking portion 132, the first The docking portion 131 is pivotally connected to the first pivoting portion 1114, and the second docking portion The portion 132 is pivotally connected to the second pivoting portion 1234. The pumping unit 11 and the heat exchange unit 12 are bent from a horizontal position to an upper and lower overlapping position by the pivoting unit 13 or both have The height difference position is such that the pump unit 11 and the heat exchange unit 12 are not at the same level, and the pivot unit 13 has a hollow portion 133; the tube body 14 is hollowed through the pivot unit 13 The first water outlet 141 is connected to the first outlet 1113, and the second water outlet 142 corresponds to the first water outlet 141 and the second water outlet 142. The second inlet 1232 is connected such that the cooling liquid 2 in the pump casing 111 flows out of the pipe body 14 through the first outlet 1113, and then enters the second inlet 1232 of the liquid storage casing 123 to flow into the heat exchange. The chamber 1231 flows through the heat sink 125 and flows out through the second outlet 1233 to achieve a heat dissipation effect. Of course, the cooling liquid 2 can also flow in the opposite direction (ie, from the heat exchange chamber 1231 through the pump chamber). 1111 then flows out of the first inlet 1112); and continues to refer to Figures 3 and 4, which are perspective views of the folded aspect of the first embodiment of the present invention. In this embodiment, the pump housing 111 has a first a top plate 113, the first top plate 113 is provided with a first joint portion 1131, the liquid storage shell 123 further has a second top plate 124, and the second top plate 124 is provided with a second joint portion 1241. The manner in which the first and second top plates 113 and 124 are combined with the pump housing 111 and the liquid storage housing 123 may be any one of embedding, screwing, bonding, pressing or welding.
透過本發明此結構的設計,藉由前述之樞接單元13的第一對接部131所述泵殼體111之第一樞接部1114相互樞接組合,以及該第二對接部132與該第二樞接部1234相互樞接組合,可令該泵浦單元11及該熱交換單元12從一水平位置彎折至一上下重疊位置,使得該水冷裝置1具有彎折的功能,並搭配該第一頂板113上設有的第一接合部1131及該第二頂板124上設有的第二接合部1241相互對接,進以使所述泵殼體111及儲液殼體123維持一折疊狀態,並且,可令該水冷裝置1裝設於一電子裝置(圖中未示)內後,若該電子裝置於搖晃移動的狀態下時,該水冷裝置1的泵 浦單元11與熱交換單元12仍可牢固地維持一折疊狀態;除此之外,將所述水冷裝置1裝設在該電子裝置內,可達到依照該電子裝置內現有的空間大小進行配置的效果。 With the design of the structure of the present invention, the first pivoting portion 1114 of the pump housing 111 is pivotally combined with each other by the first abutting portion 131 of the pivoting unit 13 and the second docking portion 132 and the first The two pivoting portions 1234 are pivotally coupled to each other to bend the pumping unit 11 and the heat exchange unit 12 from a horizontal position to an upper and lower overlapping position, so that the water cooling device 1 has a bending function and is matched with the first The first joint portion 1131 provided on the top plate 113 and the second joint portion 1241 disposed on the second top plate 124 abut each other to maintain the pump casing 111 and the liquid storage casing 123 in a folded state. Moreover, after the water-cooling device 1 is installed in an electronic device (not shown), if the electronic device is shaken and moved, the pump of the water-cooling device 1 The pump unit 11 and the heat exchange unit 12 can still maintain a folded state firmly; in addition, the water-cooling device 1 is installed in the electronic device, and can be configured according to the existing space in the electronic device. effect.
請參閱第5圖並一併參閱第1A圖,係為本發明可彎折之水冷裝置之第二實施例之折疊態樣立體圖,所述之可彎折之水冷裝置結構部份元件及元件間之相對應之關係與前述之可彎折之水冷裝置相同,故在此不再贅述,惟本可彎折之水冷裝置與前述最主要之差異為,所述第一接合部1131與第二接合部1241係透過一連接件3將所述第一、二接合部1131、1421相互連接組合,並搭配所述樞接單元13的第一對接部131與所述第一樞接部1114相樞接,所述樞接單元13的第二對接部132對應與所述第二樞接部1234相樞接,可令該泵浦單元11及該熱交換單元12從一水平位置彎折至一上下重疊位置,且透過所述連接件3可使該泵浦單元11與熱交換單元12牢固地維持一折疊狀態;另外,將所述水冷裝置1裝設在該電子裝置內,可達到依照該電子裝置內現有的空間大小進行配置的效果。 Please refer to FIG. 5 and FIG. 1A together, which is a perspective view of a folded embodiment of a water-cooling device according to a second embodiment of the present invention, wherein the bendable water-cooling device is partially connected to components and components. The corresponding relationship is the same as the above-mentioned bendable water-cooling device, and therefore will not be described again here, but the difference between the bendable water-cooling device and the above-mentioned one is that the first joint portion 1131 and the second joint are The first and second joint portions 1131 and 1421 are connected to each other through a connecting member 3, and the first docking portion 131 of the pivoting unit 13 is pivotally connected to the first pivoting portion 1114. The second abutting portion 132 of the pivoting unit 13 is pivotally connected to the second pivoting portion 1234, so that the pumping unit 11 and the heat exchange unit 12 are bent from a horizontal position to an upper and lower overlap. Positioning, and the pump unit 11 and the heat exchange unit 12 can be firmly maintained in a folded state through the connecting member 3; further, the water cooling device 1 is installed in the electronic device, and the electronic device can be The effect of the existing space size configuration.
以上所述,本發明相較於習知具有下列優點: As described above, the present invention has the following advantages over the prior art:
1.水冷裝置具有可彎折變化的效果;2.於電子裝置內現有的空間可任意設置該水冷裝置。 1. The water-cooling device has the effect of being bendable; 2. The water-cooling device can be arbitrarily set in an existing space in the electronic device.
以上已將本發明做一詳細說明,惟以上所述者,僅為本發明之一較佳實施例而已,當不能限定本發明實施之範圍。即凡依本發明申請範圍所作之均等變化與修飾等,皆應仍屬本發明之專利涵蓋 範圍。 The present invention has been described in detail above, but the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the scope of the invention. That is, the equivalent changes and modifications made by the scope of the application of the present invention should still be covered by the patent of the present invention. range.
1‧‧‧水冷裝置 1‧‧‧Water cooling unit
11‧‧‧泵浦單元 11‧‧‧ pump unit
111‧‧‧泵殼體 111‧‧‧ pump housing
1111‧‧‧泵浦腔室 1111‧‧‧ pumping chamber
1112‧‧‧第一入口 1112‧‧‧ first entrance
1113‧‧‧第一出口 1113‧‧‧ first exit
1114‧‧‧第一樞接部 1114‧‧‧First pivotal
112‧‧‧驅動器 112‧‧‧ drive
113‧‧‧第一頂板 113‧‧‧First top board
1131‧‧‧第一接合部 1131‧‧‧First joint
12‧‧‧熱交換單元 12‧‧‧Heat exchange unit
121‧‧‧熱交換面 121‧‧‧Heat exchange surface
122‧‧‧熱接觸面 122‧‧‧Hot contact surface
123‧‧‧儲液殼體 123‧‧‧Liquid housing
1231‧‧‧熱交換腔室 1231‧‧‧Heat exchange chamber
1232‧‧‧第二入口 1232‧‧‧second entrance
1233‧‧‧第二出口 1233‧‧‧second exit
1234‧‧‧第二樞接部 1234‧‧‧Second pivotal
124‧‧‧第二頂板 124‧‧‧ second top plate
1241‧‧‧第二接合部 1241‧‧‧Second joint
125‧‧‧散熱件 125‧‧‧Solder parts
1251‧‧‧散熱鰭片 1251‧‧‧heat fins
13‧‧‧樞接單元 13‧‧‧ pivot unit
131‧‧‧第一對接部 131‧‧‧First docking
132‧‧‧第二對接部 132‧‧‧Second docking department
133‧‧‧中空部 133‧‧‧ Hollow
14‧‧‧管體 14‧‧‧ body
141‧‧‧第一出水孔 141‧‧‧First water outlet
142‧‧‧第二出水孔 142‧‧‧Second outlet
Claims (5)
Priority Applications (1)
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TW104116936A TWI589825B (en) | 2015-05-27 | 2015-05-27 | Bendable water-cooling device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW104116936A TWI589825B (en) | 2015-05-27 | 2015-05-27 | Bendable water-cooling device |
Publications (2)
Publication Number | Publication Date |
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TW201641908A TW201641908A (en) | 2016-12-01 |
TWI589825B true TWI589825B (en) | 2017-07-01 |
Family
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TW104116936A TWI589825B (en) | 2015-05-27 | 2015-05-27 | Bendable water-cooling device |
Country Status (1)
Country | Link |
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TW (1) | TWI589825B (en) |
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2015
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TW201641908A (en) | 2016-12-01 |
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