TWI588850B - Oscillator circuit and operating method of oscillator circuit - Google Patents

Description

Oscillator circuit and oscillator circuit operation method

The present disclosure relates to a coupling structure for an inductive device.

In integrated circuits, a clock tree is typically used to distribute common clock signals to different components to synchronize their operation. The difference in the arrival time of the clock signal at the two or more clock elements of the integrated circuit can cause an operational error of the integrated circuit. In some applications, the clock tree for the common clock signal distribution includes structures such as H-tree screens or balanced buffer trees. In many instances, the mismatch in the arrival of the distributed clock signal is minimized at a current sufficient to drive the distribution of the common clock signal along the clock tree. As the frequency of the clock signal increases, the power consumption of the driving clock tree increases. Similarly, the clock buffer draws a large amount of current from the power supply at different stages of the clock tree, thus affecting the performance of nearby components by causing a voltage drop in the supply voltage. In some applications, the clock tree uses 20% to 40% of the total power consumption of the integrated circuit.

Some embodiments of the present disclosure provide a circuit including a coupling structure including two or more conductive loops; and a set of conductive paths electrically connected to the two or more conductive loops; and a first inductive device Magnetically coupled to the first conduction loop of the two or more conduction loops.

Some embodiments of the present disclosure provide a circuit including a first oscillator a oscillating device comprising: an inductive device; a second oscillator comprising an inductive device; and a coupling structure comprising a first conducting loop magnetically coupled to the inductive device of the first oscillator; a second conducting loop, magnetically An inductive device coupled to the second oscillator; and a set of conductive paths electrically coupled to the first conductive loop and the second conductive loop.

Some embodiments of the present disclosure provide a method including generating a induced current in a first conductive loop of a coupling structure in response to a first magnetic field generated by a first inductive device of a first oscillator; and transmitting the induced current via electricity And a pair of conductive paths connecting the first and second conductive loops to the second conductive loop of the coupling structure, and the second inductive device of the second oscillator is magnetically coupled to the second inductor The first inductive device of the first oscillator.

100A‧‧‧Oscillator

100B‧‧‧Oscillator

110A‧‧‧Inductive device

120A‧‧‧Capacitive device

130A‧‧‧Active feedback device

140A‧‧‧Switching device

152A‧‧‧Output node

154A‧‧‧Complementary Output Node

152B‧‧‧Complementary Output Node

132A, 134A‧‧‧N type transistor

162A, 162B‧‧‧ Ground Reference Node

164A, 164B‧‧‧ supply reference node

112A, 114A‧‧‧Inductors

122A, 122B‧‧‧ coarse adjustment capacitor

124A, 124B‧‧‧ trimmer capacitor

170A, 170B‧‧ Path

110B‧‧‧Inductive device

120B‧‧‧Capacitive device

130B‧‧‧Active feedback device

140B‧‧‧Switching device

152B‧‧‧Output node

154B‧‧‧Complementary output node

126A, 126B‧‧ ‧ busbar

200‧‧‧ capacitor array

202‧‧‧first node

204‧‧‧second node

212-1~212-K‧‧‧Optoelectronics

222-1~222-K, 224-1~224-K‧‧‧ capacitor

B[0], B[1], B[K-1]‧‧‧ control signals

250‧‧‧Transformers

252‧‧‧ first node

254‧‧‧second node

256‧‧‧Control node

262, 264‧‧‧Optoelectronics

128A, 128B‧‧ Path

300A~300F‧‧‧Oscillator

310A~310E‧‧‧Inductive device

380A~380G‧‧‧ mutual inductive coupling

400‧‧‧Master-slave fine-tuning unit

402‧‧‧Main Oscillator

404‧‧‧From Oscillator

412‧‧‧First Phase Comparator

414‧‧‧Second phase comparator

416‧‧‧Control unit

422‧‧‧First conduction path

424‧‧‧Second conduction path

432‧‧‧First frequency divider

434‧‧‧Second frequency divider

422‧‧‧First conduction path

424‧‧‧Second conduction path

442‧‧‧First phase error signal

444‧‧‧Second phase error signal

406‧‧‧Control unit

500‧‧‧pulse distribution network

510‧‧‧ pulse generator

520‧‧‧ drive

532, 534‧‧‧ oscillator

541‧‧‧First-order conduction path

543a, 543b‧‧‧ second-order conduction path

545a~545d‧‧‧ third-order conduction path

547a~547i‧‧‧ fourth-order conduction path

549a~549p‧‧‧ fifth-order conduction path

552, 554, 556, 558‧‧‧ drive

700‧‧‧Oscillator

702‧‧‧ Output node

710-1~710-P‧‧‧ reverser

720‧‧‧ reverser

800‧‧‧Oscillator

802, 804‧‧‧ output nodes

810-1~810-Q‧‧‧Differential Amplifier

900‧‧‧ Circuitry

910‧‧‧Coupling structure

922‧‧‧First Inductive Device

924‧‧‧second inductive device

912‧‧‧First conduction loop

914‧‧‧Second conduction loop

916‧‧‧Transmission path

922a, 924a‧‧‧ signal埠

922b, 924b‧‧‧ coil

922c, 924c‧‧‧ direction

912a, 914a‧‧‧ first end

912b, 914b‧‧‧ second end

916a‧‧‧First conduction path

916b‧‧‧second conduction path

910A, 910B, 910C‧‧‧ coupling structure

916Aa‧‧‧First conduction path

916Ab‧‧‧second conduction path

916B‧‧‧ Conduction path

916Ba‧‧‧First conduction path

916Bb‧‧‧second conduction path

916C‧‧‧ Conduction path

916Ca‧‧‧First conduction path

916Cb‧‧‧second conduction path

1210A‧‧‧Coupling structure

1212A‧‧‧First conduction loop

1214A‧‧‧Second conduction loop

1216A‧‧‧First set of conduction paths

1210B‧‧‧Coupling structure

1212B‧‧‧ third conduction loop

1214B‧‧‧fourth conduction loop

1216B‧‧‧Second set of conduction paths

1222, 1224, 1226‧‧‧Inductive devices

1210C‧‧‧Coupling structure

1226‧‧‧Inductive device

1210D‧‧‧ coupling structure

1210E‧‧‧Coupling structure

1216B’‧‧‧ Conduction path

1310A, 1310B‧‧‧ coupling structure

Inductive devices 1322, 1324, 1326, 1327‧‧

1312, 1314, 1316, 1317‧‧‧ conduction loop

1318‧‧‧ Conduction path

1410‧‧‧Coupling structure

1412, 1414‧‧‧ Conduction loop

1416‧‧‧ Conduction path

1512‧‧‧First shielding structure

1514‧‧‧Second shield structure

The description of the one or more embodiments is intended to be illustrative and not restrictive.

1 is a schematic diagram illustrating two oscillators in accordance with one or more embodiments.

2A is a schematic diagram of a capacitor array that can be used with one or both of the oscillators shown in FIG. 1 in accordance with one or more embodiments.

2B is a schematic illustration of a varactor that can be used with one or both of the oscillators shown in FIG. 1 in accordance with one or more embodiments.

3 is a schematic diagram illustrating six oscillators in accordance with one or more embodiments.

4 is a functional block diagram illustrating a set of master-slave fine-tuning units in accordance with one or more embodiments.

FIG. 5 illustrates an overview of a pulse distribution network in accordance with one or more embodiments.

6 is a diagram illustrating a method of synchronizing an oscillator in accordance with one or more embodiments. Flow chart.

FIG. 7 illustrates an overview of a ring oscillator in accordance with one or more embodiments.

FIG. 8 is a diagrammatic view of another ring oscillator in accordance with one or more embodiments.

9 is a top plan view of a coupling structure and corresponding inductive device in accordance with one or more embodiments.

10 is a diagram illustrating the relationship between coupling factors and frequency between two inductive devices with or without a coupled structure, in accordance with one or more embodiments.

11A-11C illustrate top views of a coupling structure and corresponding inductive device in accordance with one or more embodiments.

12A-12E illustrate top views of a coupling structure and corresponding inductive device in accordance with one or more embodiments.

13A-13B illustrate top views of a coupling structure and corresponding inductive device in accordance with one or more embodiments.

14 is a top plan view of a coupling structure and corresponding inductive device in accordance with one or more embodiments.

15 is a top plan view of a coupling structure having a shield structure and a corresponding inductive device, in accordance with one or more embodiments.

16 is a flow chart illustrating a method of a magnetically coupled inductive device in accordance with one or more embodiments.

It is to be understood that the following disclosure provides one or more different embodiments or examples for implementing different features of the disclosed. Specific examples of components and configurations are described below to simplify the disclosure. Of course, these examples are not intended to limit the disclosure. According to the implementation of industry standards, the various features in the drawings are not drawn to scale, but are for illustrative purposes only. use.

In some embodiments, instead of using a clock tree, two or more oscillators for generating an output oscillating signal having a predetermined frequency are used to distribute the clock signals to various clock elements in the integrated circuit. Furthermore, one or more synchronization mechanisms are implemented to minimize the frequency or phase difference between the oscillating signals generated by the two or more oscillators. In some embodiments, one or more synchronization mechanisms include magnetic coupling, master-slave trimming, and pulse injection.

1 is a schematic diagram illustrating two oscillators 100A and 100B in accordance with one or more embodiments. In some embodiments, oscillators 100A and 100B are used to generate an oscillating signal having a predetermined frequency. In some embodiments, the frequency of the oscillating signals from oscillators 100A and 100B is about the same, but not exactly equal to the predetermined frequency. Likewise, the phases of the oscillating signals from oscillators 100A and 100B are not fully synchronized. In some embodiments, synchronizing oscillators 100A and 100B refers to minimizing the frequency or phase difference between the oscillating signals from oscillators 100A and 100B. Although FIG. 1 illustrates only two oscillators 100A and 100B, the synchronization mechanism described herein can be used for two or more oscillators of similar architecture of the same integrated circuit.

The oscillator 100A includes an inductive device 110A, a capacitive device 120A, an active feedback device 130A, a switching device 140A, an output node 152A, and a complementary output node 154A. Inductor 110A, capacitive device 120A, active feedback device 130A, and switching device 140A are coupled between output node 152A and complementary output node 152B.

The active feedback device 130A includes two N-type transistors 132A and 134A. The source terminals of transistors 132A and 134A are coupled to ground reference node 162A. The drain terminal of transistor 132A is coupled to node 152A and the gate terminal of transistor 134A, and the gate terminal of transistor 134A is coupled to node 154A and the gate terminal of transistor 132A. Active feedback device 130A is for outputting a first output oscillating signal at node 152A and a first complementary output oscillating signal at node 154A. The first output oscillating signal and the first complementary output oscillating signal have a predetermined frequency, and the predetermined frequency is determined according to the electrical properties of the inductive device 110A and the electrical properties of the capacitive device 120A. In some embodiments, if the inductive device 110A has an inductance L _TOTAL and the capacitive device 120A has a capacitance C _TOTAL , the predetermined frequency F _OSC (Hz, Hz) can be determined according to the following equation:

In some applications, oscillators having an architecture similar to oscillator 100A are also known as LC tank oscillators. In some embodiments, transistors 132A and 134A are P-type transistors. In some embodiments, other types of active feedback devices may also be used as the active feedback device 130A.

The inductive device 110A includes an inductor 112A and an inductor 114A that are integrated to form a conductive coil. Inductor 112A is coupled between node 152A and supply reference node 164A, and inductor 114A is coupled between node 154A and supply reference node 164A.

The capacitor device 120A includes a coarse adjustment capacitor 122A and a trimming capacitor 124A. In some embodiments, the capacitance of the coarse tuning capacitor 122A is set based on a set of digital signals from the busbar 126A. In some embodiments, the coarse adjustment capacitor 122A is replaced by a set of hard-wired capacitors, so that the capacitance of the coarse adjustment capacitor 233A is fixed, and the bus bar 126A is omitted. In some embodiments, the capacitance of trimmer capacitor 124A is set based on the analog signal from path 128A. In some embodiments, the resonant frequency of oscillator 100A can be adjusted by controlling coarse capacitor 122A or trim capacitor 124A.

When the switching device 140A is turned on, the switching device 140A is configured to set the signals of the nodes 152A and 154A to a corresponding predetermined voltage level. For example, when switching device 140A is turned on, nodes 152A and 154A are electrically coupled together. In this case, the transistor 132A and 134A and inductors 112A and 114A are used as voltage dividers, and the voltage levels of the signals at nodes 152A and 154A can be determined based on the impedance of transistors 132A and 134A and inductors 112A and 114A. In some embodiments, when switching device 140A is turned on, the signals of nodes 152A and 154A are set to be intermediate between the voltage levels of supply reference node 164A and ground reference node 162A.

Switching device 140A is controlled by the signal on path 170A. In some embodiments, the control signal on path 170A is a pulse signal that forces nodes 152A to intersect the oscillating signal of 154A. Therefore, in the present application, the switching device 140A also refers to a reset device or a pulse injection device. In some embodiments, switching device 140A is a transistor. In some embodiments, switching device 140A is a P-type transistor, an N-type transistor, or a transmission gate. In some embodiments, switching device 140A is omitted.

The oscillator 100B includes an inductive device 110B, a capacitive device 120B, an active feedback device 130B, a switching device 140B, an output node 152B, and a complementary output node 154B. Oscillator 100B has substantially the same architecture as oscillator 100A. The components of the oscillator 100B are similar to those of the oscillator 100A and have similar component symbols, with the difference being that "A" is changed to "B". The features and functions of the oscillator 100B are substantially similar to the oscillator 100A described above, and thus the detailed description of the oscillator 100B will not be repeated.

In some embodiments, the oscillator 100A and the oscillator 100B are on the same substrate, on different substrates on the same package substrate, on different substrates of the stacked substrate, or on different substrates of the stacked die. In some embodiments, the power distribution network is implemented such that supply reference nodes 164A and 164B have substantially the same supply voltage level and that ground reference nodes 162A and 162B have substantially the same ground reference level. In some embodiments, the digital signals of busbars 126A and 126B have the same logic value.

In some embodiments, the signal distribution network provides signals on path 170A and path 170B based on a common signal. In some embodiments, path 170A and path The signal on 170B is a synchronized signal. In some embodiments, the signals on path 170A and path 170B are pulse signals. In some embodiments, the predetermined frequency of the output oscillating signals of oscillators 100A and 100B is an integer multiple of the signal frequency on path 170A and path 170B.

Furthermore, the inductive device 110A of the oscillator 100A is magnetically coupled to the inductive device 110B of the oscillator 100B (as indicated by the dashed arrow 180). The magnetic coupling between the inductive device 110A and the inductive device 110B refers to the magnetic flux generated by the operating inductive device 110A affecting the operation of the inductive device 110B, and vice versa. Similar to the configuration positions of the oscillators 100A and 100B, in some embodiments, the inductive device 110A and the inductive device 110B are on the same substrate, on different substrates on the same package substrate, on different substrates of the stacked substrate, or On different substrates of stacked crystal grains. Inductor 110A and inductive device 110B are used to attenuate the out-of-phase components of the oscillating signal at node 152A of oscillator 100A and node 152B of oscillator 100B and to strengthen node 152A and oscillate at oscillator 100A. The in-phase component of the oscillating signal of node 152B of device 100B. Thus, after the oscillator 100A and oscillator 100B are enabled, the output oscillating signals at nodes 152A and 152B eventually stabilize as in-phase oscillating signals. In other words, the inductive device 110A and the inductive device 110B are used to synchronize the oscillation signal generated by the oscillator 100A with the oscillator 100B.

In some embodiments, the distance between the inductive device 110A of the oscillator 100A and the inductive device 110B of the oscillator 100B is equal to or less than a predetermined distance, resulting in mutual-inductance sufficient to synchronize the oscillator for a predetermined period of time. 100A and oscillator 100B. In some embodiments, the predetermined distance is half the wavelength of the electromagnetic wave having a predetermined frequency of the oscillating signal. In some embodiments, the predetermined frequency range of the output oscillating signal is from 100 MHz to 20 GHz.

2A is a schematic diagram of a capacitor array 200 that can be used as a coarse adjustment capacitor 122A or a coarse adjustment capacitor 122B, in accordance with one or more embodiments. Capacitor array 200 includes a first node 202, a second node 204, K transistors 212-1 through 212-K, and 2K Capacitors 222-1 through 222-K and 224-1 through 224-K, where K is a positive integer. The first node 202 and the second node 204 can be used to connect to the corresponding node 152A or node 154A or to the corresponding node 152B or node 154B. Capacitors 222-1 through 222-K are coupled to first node 202, capacitors 224-1 through 224-K are coupled to second node 204, and transistors 212-1 through 212-K are coupled to corresponding pairs of capacitors. Between 222-1 and 222-K and 224-1 to 224-K. The transistors 212-1 to 212-K are used as switches and are controlled by control signals B[0], B[1] to B[K-1].

In some embodiments, the transistors 212-1 through 212-K are P-type transistors or N-type transistors. In some embodiments, transistors 212-1 through 212-K are replaced with transmission gates or other types of switches. In some embodiments, capacitors 222-1 through 222-K and 224-1 through 224-K are metal-oxide-metal capacitors or metal-insulator-metal capacitors.

In some embodiments, the total capacitance of each path including one of transistors 212-1 to 212-K, a corresponding capacitor of capacitors 222-1 to 222-K, and a corresponding capacitor of capacitors 224-1 to 224-K has the same Value. In these cases, the control signal B[0:K-1] is encoded as a unary coding format. In some embodiments, the total capacitance of each of the paths defined above corresponds to one of 2 ⁰ , 2 ¹ , . . . , 2 ^K-1 times the predetermined unit capacitance value. In these alternative cases, the control signal B[0:K-1] is encoded as a binary encoding format.

2B is a schematic illustration of a varactor 250 that can be used as the trimmer capacitor 124A or trimmer capacitor 124B of FIG. 1 in accordance with one or more embodiments. The varactor 250 includes a first node 252, a second node 254, a control node 256, and transistors 262 and 264. The first node 252 and the second node 254 can be used to couple the corresponding node 152A or node 154A, or to couple the corresponding node 152B or node 154B. The transistor 262 has a 汲 terminal coupled to the first node 252 along with the source terminal. The transistor 262 has a gate terminal coupled to the control node 256. The transistor 264 has a 汲 terminal coupled to the source node with a second node 254. Transistor 264 has a gate terminal coupled to control node 256. Control node 256 is operative to receive analog control signal _VCAP , such as a control signal on path 128A or 128B. The total capacitance between nodes 252 and 254 can be adjusted in response to the voltage level of control signal _VCAP . In some embodiments, transistors 262 and 264 are P-type transistors or N-type transistors.

In Fig. 1, only two oscillators 100A and 100B are described. However, in some embodiments, there are more than two oscillators for generating a clock in the integrated circuit. Similarly, the inductive device 110A or 110B of the oscillator 100A or 100B can magnetically couple more than two inductive devices of two or more oscillators.

For example, FIG. 3 illustrates an overview of six oscillators 300A-300F in accordance with one or more embodiments. The oscillators 300A to 300F have an architecture similar to the oscillator 100A described above. In addition to this, the oscillators 300A to 300F have corresponding inductive devices 310A to 310F. Other detailed descriptions of the oscillators 300A to 300F are omitted.

As shown in FIG. 3, the inductive devices 310A and 310B are magnetically coupled (shown by dashed arrow 380A); the inductive devices 310B and 310C are magnetically coupled (dashed arrow 380B); and the inductive devices 310D and 310E are magnetically coupled (dashed arrows) 380C); inductive devices 310E and 310F are electromagnetically coupled (shown by dashed arrow 380D); inductive devices 310A and 310D are magnetically coupled (shown by dashed arrow 380E); inductive devices 310B and 310E are magnetically coupled (dashed arrow) The inductive devices 310C and 310F are magnetically coupled (shown by dashed arrow 380G). In this embodiment, mutual inductive couplings 380A through 380G are used to cause oscillators 300A through 300F to generate an oscillating signal having approximately the same predetermined frequency and approximately the same phase.

In some embodiments, the inductive devices 310A-310F are formed on the same substrate, on different substrates on the same package substrate, on different substrates of the stacked substrate, or on different substrates of the stacked die. In some embodiments, the distance between the two inductive devices 310A-310F corresponds to one of the magnetic couplings 380A to 380G, which is one-half the wavelength of the electromagnetic wave having a predetermined frequency. In some embodiments, the predetermined frequency range of the output oscillating signal is from 100 MHz to 20 GHz.

4 illustrates a set of master-slave fine tuning units 400 in accordance with one or more embodiments. Functional block diagram. The set of master-slave trimming units 400 are coupled to the primary oscillator 402 and the slave oscillator 404, and may control the resonant frequency of the slave oscillator 404 based on comparing the output oscillator signals of the master oscillator 402 with the slave oscillator 404. In some embodiments, main oscillator 402 is equivalent to oscillator 100B of FIG. 1, slave oscillator 404 is equivalent to oscillator 100A, and by controlling trimmer capacitor 124A, the resonant frequency of slave oscillator 404 can be adjusted.

The set of master-slave fine-tuning units 400 includes a first phase comparator 412, a second phase comparator 414, a control unit 416, a first conduction path 422, a second conduction path 424, a first frequency divider 432, and a second frequency division. 434.

The first frequency divider 432 is adjacent to the primary oscillator 402 and is electrically coupled to the primary oscillator 402. The first frequency divider 432 is for receiving the output oscillating signal CLK_M from the main oscillator 402, and frequency-dividing the output oscillating signal CLK_M by a predetermined ratio N to generate the reference signal CLK_MR. In some embodiments, N is a positive integer. In some embodiments, N ranges from 4 to 16. The second frequency divider 434 is adjacent to and coupled to the slave oscillator 402. The second frequency divider 434 is for receiving the output oscillating signal CLK_S from the slave oscillator 404 and dividing the output oscillating signal CLK_S at a predetermined ratio N frequency.

In some embodiments, the first frequency divider 432 and the second frequency divider 434 are omitted, and the oscillating signals CLK_M and CLK_S are used as the reference signal CLK_MR and the reference signal CLK_SR.

The first phase comparator 412 is adjacent to the main oscillator 402. The second phase comparator 414 is adjacent to the slave oscillator 404. The first conductive path 422 and the second conductive path 424 are located between the main oscillator 402 and the slave oscillator 404. The first phase comparator 412 is configured to generate a first phase error signal based on the reference signal CLK_MR from the main oscillator 402 and the delayed version CLK_SR' from the oscillator 404 and the reference signal CLK_SR transmitted via the first conduction path 422. 442. The second phase comparator 422 is configured to be based on the reference signal CLK_SR from the slave oscillator 404 and from the main oscillator 402. The delayed version CLK_MR' of the reference signal CLK_MR transmitted by the second conduction path 424 generates a second phase error signal 444.

The control unit 416 is configured to generate the adjustment signal V _TUNE to the slave oscillator 404 according to the first phase error signal 442 and the second phase error signal 444. In some embodiments, the adjustment signal V _TUNE can be used as the analog control signal V _{CAP of} FIG. 2 or as an analog control signal for adjusting the trimmer capacitor 124A carried by the path 128A of FIG.

FIG. 5 illustrates an overview of a pulse distribution network 500 in accordance with one or more embodiments. In some embodiments, pulse distribution network 500 can be used to provide control signals to switch device 140A of oscillator 100A via path 170A, and to switch device 140B to provide control signals to oscillator 100B via path 170B.

Pulse distribution network 500 includes a pulse generator 510, a driver 520, and one or more conductive paths configured to have an H-tree architecture. Two or more oscillators 532 and 534 are coupled to both ends of the H-tree. In some embodiments, oscillator 532 is equivalent to oscillator 100A of FIG. 1, and oscillator 534 is directed to oscillator 100B.

The pulse generator 510 is used to generate a pulse signal, which can be used as a control signal for a switching device or a reset device of the corresponding oscillator. In some embodiments, the pulse signal has a pulse frequency and an integer multiple of a predetermined frequency train pulse frequency of the output oscillating signals of oscillators 532 and 534. In response to the pulse signal being set at a predetermined voltage level by the oscillator corresponding switching means, the pulse signal is transmitted to oscillators 532 and 534. Therefore, according to the pulse signal, the time points of the rising edge or the falling edge of the output oscillation signals of the oscillators 532 and 534 are synchronized.

H tree chart of the fifth-order 5 H described below, which comprises a ⁽²⁰⁾ conducting a first-order path 541, two ⁽²¹⁾ conducting path 543a and the second stage 543b is coupled to a corresponding end of the path 541, Four (2 ² ) third-order conduction paths 545a, 545b, 545c, and 545d are coupled to corresponding endpoints of path 543a or 543b, and eight (2 ³ ) fourth-order conduction paths 547a through 547i are coupled to paths 545a through 545d Corresponding endpoints, and sixteen (2 ⁴ ) fifth-order conduction paths 549a through 549p are coupled to corresponding endpoints of paths 547a through 547i. The fifth order conduction paths 549a through 549p have endpoints connected to corresponding switching devices of different oscillators. For example, one end of path 549a is coupled to oscillator 532, and one end of path 549b is coupled to oscillator 534. In some embodiments, each end of the fifth-order conductive paths 539a through 539p have the same routing distance. Thus, the conduction path from the driver 520 to the corresponding endpoint of the fifth-order conduction paths 549a through 549p is used to substantially add the same delay to the pulse signal during its transmission and distribution.

Driver 520 is operative to provide sufficient current drive capability to transmit pulse signals generated by pulse generator 510 to different end points of fifth order conduction paths 549a through 549p. In some embodiments, additional drivers 552, 554, 556, and 558 are tied at the ends of second order conduction paths 543a and 543b. In some embodiments, additional drivers 552, 554, 556, and 558 are omitted. In some embodiments, the additional drivers 552, 554, 556, and 558 are tied to corresponding endpoints of different orders of conduction paths in the H-tree.

Thus, the output oscillating signals of two or more oscillators (the two or more oscillators such as oscillators 100A and 100B of FIG. 1) are synchronized in at least three different ways as described above: magnetic coupling (as shown in Figures 1 and 3) Master-slave fine-tuning (as shown in Figure 4); and pulse injection (as shown in Figure 5). In some embodiments, two or more oscillators 100A and 100B are synchronized using a magnetic coupling and master-slave fine-tuning mechanism. In some embodiments, two or more oscillators 100A and 100B are synchronized using magnetic coupling and pulse injection. In some embodiments, two or more oscillators 100A and 100B are synchronized using magnetic coupling, master-slave trimming, and pulse injection mechanisms.

6 is a flow diagram illustrating a method of synchronizing an oscillator, such as oscillators 100A and 100B shown in FIG. 1, in accordance with one or more embodiments. It should be understood that other operations may be performed before, during, and/or after the method illustrated in FIG. 6, and that only some other processes may be briefly described herein.

In operation 610, the oscillator is operated to output an oscillating signal. For example, in some embodiments, oscillator 100A is operated to output a first oscillating signal at node 152A and to operate oscillator 100B to output a second oscillating signal at node 152B.

In operation 620, an inductive device of the magnetically coupled oscillator. For example, in some embodiments, the inductive device 110A of the magnetically coupled oscillator 100 and the inductive device 110B of the oscillator 100B reduce the frequency difference or phase difference between the oscillator oscillating signals of the oscillator 100A and the oscillator 100B.

In operation 630, a pulse injection procedure is performed on various oscillators. For example, in some embodiments, a pulse injection procedure is performed on oscillator 100A and oscillator 100B. In some embodiments, operation 630 includes generating a pulse signal (operation 632), transmitting the pulse signal to the switching device 140A of the oscillator 100A via the first conduction path, and transmitting the pulse signal to the oscillator 100B via the second conduction path. Switching device 140B. In some embodiments, the first conductive path and the second conductive path are used to substantially add the same delay to the pulse signal.

In some embodiments, operation 630 further includes responding to the pulse signal, setting a first oscillating signal of the oscillator 100A at a first predetermined voltage level by the switching device 140A (operation 634), and responding to the pulse signal by the switching device 140B sets the second oscillating signal of oscillator 100B at a first predetermined voltage level (operation 636).

The method proceeds to operation 640 where a master-slave fine-tuning procedure is performed on two or more oscillators. For example, in some embodiments, a master-slave fine-tuning procedure is performed on oscillator 100A and oscillator 100B. As shown in FIGS. 6 and 4, operation 640 includes generating a reference signal CLK_MR by dividing the oscillating signal from the oscillator 402 or 100B at a predetermined frequency (operation 642); and dividing the oscillator from the predetermined frequency. The 404 or 100A oscillating signal generates a reference signal CLK_SR (operation 643).

Moreover, in operation 645, a first phase error signal 442 is generated based on the reference signal CLK_MR and the delayed version CLK_SR' of the reference signal CLK_SR transmitted via the conduction path 422. In operation 646, a second phase error signal 444 is generated based on the reference signal CLK_SR and the delayed version CLK_MR' of the reference signal CLK_MR transmitted via the conduction path 424. In operation 648, an adjustment signal V _{TUNE is} generated based on the first phase error signal 442 and the second phase error signal 424.

As shown in FIG. 6 and FIG. 1, in operation 649, the frequency or phase of the oscillating signal generated by the oscillator 404 or 100A is adjusted based on the adjustment signal V _TUNE .

In some embodiments, when the oscillators 100A and 100B of FIG. 1 are synchronized, one of the operations 630 or 640 is omitted, or both are omitted.

Furthermore, the pulse distribution network 500 and pulse injection routine of FIG. 5 (operation 630) can be used with other types of oscillators, not limited to LC tank oscillators. In some embodiments, the pulse injection procedure or pulse injection mechanism described above can also be used with a particular type of oscillator, known as a ring oscillator.

For example, FIG. 7 illustrates an overview of ring oscillator 700 in accordance with one or more embodiments. Oscillator 700 has an output node 702 and P inverters 710-1 through 710-P, where P is an odd number. The inverters 710-1 to 710-P are connected in series. Furthermore, the output of the final stage inverter 710-P is coupled to the output node 702, and the input of the first stage inverter 710-1 is coupled to the output of the inverter 710-P. The inverters 710-1 to 710-P are used as active feedback devices and are used to generate an oscillating signal at the output node 702. Another inverter 720 has an input for receiving a pulse signal and an output coupled to the first node 702. The inverter 720 acts as a reset device for setting the output oscillating signal to a predetermined voltage level at node 704 in response to the pulse signal. In some embodiments, two or more ring oscillators (such as oscillators 532 and 534 of FIG. 5) similar to oscillator 700 are coupled to different end points of a pulse distribution network similar to pulse distribution network 500, It is used to synchronize the output oscillation signals of two or more ring oscillators.

FIG. 8 illustrates an overview of another ring oscillator 800 in accordance with one or more embodiments. Oscillator 800 has a pair of output nodes 802 and 804 and Q differential amplifiers (differential amplifier) 810-1 to 810-Q, where Q is an odd number. The amplifiers 810-1 to 810-Q are connected in series. The output of amplifier 810-Q of the final stage is coupled to output nodes 802 and 804, and the input of amplifier 810-1 of the first stage is coupled to the output of amplifier 810-Q. Amplifiers 810-1 through 810-Q act as active feedback devices and generate a pair of differential oscillating signals at output nodes 802 and 804. One of the amplifiers, such as amplifier 810-1, further includes a switching device or reset device for setting the output of amplifier 810-1 to a predetermined voltage level in response to the pulse signal. In some embodiments, any of the amplifiers 810-1 through 810-Q can be used for pulse signal injection. In some embodiments, to synchronize the output oscillating signals of two or more ring oscillators, two or more ring oscillators (such as oscillators 532 and 534 of FIG. 5) similar to oscillator 800 are connected to similar The different ends of the pulse distribution network of the pulse distribution network 500.

9 is a top plan view of circuitry 900 including portions of coupling structure 910 and corresponding first and second inductive devices 922 and 924, in accordance with one or more embodiments. In some embodiments, inductive devices 922 and 924 are equivalent to inductive devices 110A and 110B of FIG. 1 or inductive devices 310A through 310F of FIG. In some embodiments, the coupling structure 910 is used to make the magnetic coupling 180 of FIG. 1 easier or to make the magnetic couplings 308A through 380G of FIG. 3 easier.

The coupling structure 910 includes a first conductive loop 912, a second conductive loop 914, and a set of conductive paths 916 electrically connected to the first conductive loop 912 and the second conductive loop 914. The first conductive loop 912 and the second conductive loop 914 have the shape of an octagonal loop. In some embodiments, the first conductive loop 912 and the second conductive loop 914 have the shape of a polygonal loop or a circular loop. First conductive loop 912, second conductive loop 914, and a set of conductive paths 916 are formed in different interconnect layers of one or more wafers. The first conduction loop 912 surrounds the first inductive device 922 as viewed in a top view. The second inductive loop 914 surrounds the second inductive device 924 as viewed in a top view.

The first inductive device 922 has a coil corresponding to the inductive device 922 The signal 埠 922a of the mouth, the center of the coil 922b, and the 埠 direction 922c. The second inductive device 924 has a signal 埠 924a corresponding to the opening of the coil of the inductive device 924, a center of the coil 924b, and a meandering direction 924c. In Fig. 10, the 埠 directions 922c and 924c point in the same direction. In some embodiments, the turns directions 922c and 924c point in different directions.

The first conduction loop 912 includes a first end 912a and a second end 912b. The second conduction loop 914 includes a first end 914a and a second end 914b. The set of conductive paths 916 includes a first conductive path 916a and a second conductive path 916b. The first conductive path 916a is electrically connected to the first end 912a of the first conductive path 912 and the first end 914a of the second conductive path 914. The second conductive path 916b is electrically connected to the second end 912b of the first conductive loop 912 and the second end 914b of the second conductive loop 914. The length L is defined as the length of the space between the first conductive loop 912 and the second conductive loop 914. In some embodiments, the length L is equal to or greater than 100 microns.

In some embodiments, the first magnetic field generated in response to the first inductive device 922 generates an induced current in the first conduction loop 912. The induced current is transmitted to the second conductive loop 914 via the set of conductive paths 916 and a second magnetic field is generated within the second conductive loop 914. Accordingly, the mutual inductance between the first and second inductive devices 922 and 924 is less dominated by the field distribution of the first magnetic field and is governed by the second magnetic field regenerated by the induced current. Thus, the mutual inductance between the first and second inductive devices 922 and 924 is not governed by the distance between the inductive devices 922 and 924, such as when the length L is equal to or greater than 100 micrometers (μm).

10 is a diagram illustrating the relationship between the coupling factor K and the frequency Freq between two inductive devices, such as inductive devices 922 and 924, with or without a coupled structure, in accordance with one or more embodiments. Curve 1010 represents the coupling factor K between inductive devices 922 and 924 when the coupling structure 910 is uncoupled and the distance between the inductive devices 922 and 924 is set to 1000 microns. The curve 1020a represents the coupling factor K between the inductive devices 922 and 924 when the coupling structure 910 is provided and the length L is set to 500 μm; the curve 1020b represents the coupling factor K when the length L is 1000 μm; the curve 1020c represents the length L is a coupling factor K at 2000 microns; curve 1020d represents a coupling factor K at a length L of 3000 microns; and curve 1020e represents a coupling factor K at a length L of 5000 microns. Reference line 1030 represents a K value of 0.001 (10 ^-3 ).

The coupling factor K is defined as: The mutual inductance between the M-based inductive devices 922 and 924, the self-inductance of the L ₁ -based first inductive device 922, and the self-inductance of the L ₂ -based second inductive device 924. If the K value is greater than 0.001 (reference line 1030), the oscillators corresponding to inductive devices 922 and 924 have a meaningful magnetic coupling sufficient to maintain a stable phase difference between inductive devices 922 and 924.

As shown by curve 1010 of FIG. 10, at a distance of 1000 microns, the architecture of the uncoupled structure 910 no longer ensures sufficient magnetic coupling between the inductive devices 922 and 924. In contrast, curves 1020a-1020e illustrate that embodiments having a coupling structure 910 provide magnetic coupling between inductive devices 922 and 924 without being governed by the distance therebetween. As shown in FIG. 10, after 500 MHz, for the length L set to 500, 1000, 2000, 3000 or 5000 microns, the curves 1020a-1020e are all above the reference line 1030.

Figures 11A through 15 further illustrate some of the possible variations with the embodiment of Figure 9. In some embodiments, the variations illustrated in Figures 11A-15 can be combined with further variations that are consistent with the concepts illustrated in Figures 9 and 11A-15.

FIG. 11A illustrates a top view of coupling structure 910A and corresponding inductive devices 922 and 924 in accordance with one or more embodiments. The same or similar elements as those shown in FIG. 9 have the same component symbols, and a detailed description thereof will be omitted.

In contrast to coupling structure 910, coupling structure 910A includes a set of conductive paths 916A in place of the set of conductive paths 916. This set of conductive paths 916A includes a first conductive path 916Aa and a second conductive path 916Ab. First conductive path 916Aa and second conductive path The 916Ab is routed such that the first conductive path 916Aa is observed at the location 1110 to intersect the second conductive path 916Ab in a top view.

FIG. 11B illustrates a top view of coupling structure 910B and corresponding inductive devices 922 and 924 in accordance with one or more embodiments. The same or similar elements as those shown in FIG. 9 have the same component symbols, and a detailed description thereof will be omitted.

In contrast to coupling structure 910, coupling structure 910B includes a set of conductive paths 916B in place of the set of conductive paths 916. This set of conductive paths 916B includes a first conductive path 916Ba and a second conductive path 916Bb. The first conductive path 916Ba and the second conductive path 916Ba are routed such that the first conductive path 916Ba and the second conductive path 916Bb each have an angular angle at the position 1120 as viewed from a plan view.

FIG. 11C illustrates a top view of coupling structure 910C and corresponding inductive devices 922 and 924 in accordance with one or more embodiments. The same or similar elements as those shown in FIG. 9 have the same component symbols, and a detailed description thereof will be omitted.

In contrast to the coupling structure 910, the coupling structure 910C includes a set of conduction paths 916C in place of the set of conduction paths 916. The set of conductive paths 916C includes a first conductive path 916Ca and a second conductive path 916Cb. The first conductive path 916Ca and the second conductive path 916Cb are routed such that the first conductive path 916Ca and the second conductive path 916Cb each have an angular angle at the position 1130 as viewed from a top view. Likewise, the first conductive path 916Ca and the second conductive path 916Cb intersect at a position 1130 as viewed from a top view.

FIG. 12A illustrates a top view of coupling structure 1210A and corresponding inductive devices 1222 and 1224 in accordance with one or more embodiments. The coupling structure 1210A includes a first conductive loop 1212A, a second conductive loop 1214A, a first set of conductive paths 1216A, a third conductive loop 1212B, a fourth conductive loop 1214B, and electrical connection conduction electrically connected to the conductive loops 1212A and 1214A. A second set of conduction paths 1216B of loops 1212B and 1214B. The first inductive device 1222 is magnetically coupled to the first conduction loop 1212A. The second inductive device 1224 is magnetically coupled to the third conduction loop 1212B. Second conduction loop 1214A The fourth conductive loop 1214B is magnetically coupled. The second conduction loop 1214A surrounds the fourth conduction loop 1214B as viewed from a top view.

In some embodiments, a first induced current is generated at the first conduction loop 1212A in response to the first magnetic field generated by the first inductive device 1222. The first induced current is transmitted to the second conductive loop 1214A via the first set of conduction paths 1216A and a second magnetic field is generated within the second conductive loop 1214A. In response to the second magnetic field, a second induced current is generated at the fourth conduction loop 1214B. The second induced current is transmitted to the third conductive loop 1214B via the second set of conduction paths 1216B and a third magnetic field is generated within the third conductive loop 1214B. Accordingly, the second inductive device 1224 is magnetically coupled to the first inductive device 1222 via a third magnetic field regenerated by the second induced current in the third conductive loop 1214B.

FIG. 12B illustrates a top view of coupling structure 1210B and corresponding inductive devices 1222 and 1224 in accordance with one or more embodiments. The same or similar elements as those shown in FIG. 12A have the same component symbols, and detailed description thereof is omitted. Compared to the coupling structure 1210A, the second conduction loop 1214A overlaps the fourth conduction loop 1214B as viewed from a plan view. In other words, the second conductive loop 1214A and the fourth conductive loop 1214B have the same size and shape, but are formed on different interconnect layers.

12C illustrates a top view of coupling structure 1210C and corresponding inductive devices 1222, 1224, and 1226, in accordance with one or more embodiments. The same or similar elements as those shown in FIG. 12A have the same component symbols, and detailed description thereof is omitted. The second conductive loop 1214A and the fourth conductive loop 1214B are configured to magnetically couple with an additional inductive device 1226 as compared to the coupling structure 1210A. Similarly, the fourth conduction loop 1214B surrounds the second conduction loop 1214A as viewed from a top view.

12D illustrates a top view of coupling structure 1210D and corresponding inductive devices 1222, 1224, and 1226, in accordance with one or more embodiments. The same or similar elements as those shown in FIG. 12B have the same component symbols, and detailed description thereof is omitted. The second conductive loop 1214A and the fourth conductive loop 1214B are configured to magnetically couple with an additional inductive device 1226 as compared to the coupling structure 1210B.

12E illustrates a top view of coupling structure 1210E and corresponding inductive devices 1222, 1224, and 1226, in accordance with one or more embodiments. The same or similar elements as those shown in FIG. 12D have the same component symbols, and detailed description thereof is omitted. In contrast to the coupling structure 1210D, a second set of conductive paths 1216B' is replaced with a set of conductive paths 1216B', wherein one conductive path of the set of conductive paths 1216B' crosses another conductive path of the set of conductive paths 1216B' at location 1230 .

FIG. 13A illustrates a top view of coupling structure 1310A and corresponding inductive devices 1322, 1324, and 1326, in accordance with one or more embodiments. The coupling structure 1310A includes three conductive loops 1312, 1314, and 1316 that are electrically coupled together via a set of conductive paths 1318. Conductive loops 1312, 1314, and 1316 are each magnetically coupled to corresponding inductive devices 1322, 1324, and 1326.

FIG. 13B illustrates a top view of coupling structure 1310B and corresponding inductive devices 1322, 1324, 1326, and 1327, in accordance with one or more embodiments. The same or similar elements as those shown in FIG. 13A have the same component symbols, and detailed description thereof is omitted. The coupling structure 1310B includes four conductive loops 1312, 1314, 1316, and 1317 that are electrically coupled together via a set of conductive paths 1318. Conductive loops 1312, 1314, 1316, and 1317 are each magnetically coupled to corresponding inductive devices 1322, 1324, 1326, and 1327.

14 is a top plan view of coupling structure 1410 and corresponding inductive devices 922 and 924, in accordance with one or more embodiments. The same or similar elements as those shown in FIG. 9 have the same component symbols, and a detailed description thereof will be omitted. The coupling structure 1410 includes two conductive loops 1412 and 1414 that are electrically coupled together via a set of conductive paths 1416. Conductive loops 1412 and 1416 are each magnetically coupled to corresponding inductive devices 922 and 924. Furthermore, the inductive device 922 is surrounded by the conduction loop 1412 as viewed from a top view; and the inductive device 924 is surrounded by the conduction loop 1414 as viewed from a top view.

15 is a top plan view of a coupling structure 910 having shielding structures 1512 and 1514 and corresponding inductive devices 922 and 924, in accordance with one or more embodiments. The same or similar elements as those shown in FIG. 9 have the same component symbols, and a detailed description thereof will be omitted. In contrast to circuit 900 of FIG. 9, the circuit of FIG. 15 further includes a first shield structure 1512 and a second shield structure 1514. At least a portion of the set of conductive paths 916 is seen between the first shield structure 1512 and the second shield structure 1514 as viewed from a top view.

16 is a flow diagram of a method 1600 of a magnetically coupled inductive device in accordance with one or more embodiments. In some embodiments, method 1600 can be used in conjunction with the circuitry of FIG. 9 or FIG. In some embodiments, method 1600 can also be used in conjunction with the circuits of FIGS. 11A-11C, 12B-12E, or 13A-15. It will be appreciated that other operations may be performed before, during, and/or after the method 1600 shown in FIG. 16, and only some other procedures are briefly described herein.

The process begins at operation 1610 where an induced current is generated at the first conduction loop 912 or 1212A in response to a first magnetic field of the first oscillator generated by the first inductive device 922 or 1222.

The process proceeds to operation 1620 where the induced current is transmitted to the second conductive loop 914 or 1214A via a set of conductive paths 916 or 1216A electrically coupled to the first and second conductive loops.

The program proceeds to operation 1630 to generate a second magnetic field in response to the induced current through the second conduction loop 914 or 1214A.

For a coupling structure having the same or similar architecture as FIG. 12 or FIGS. 12B through E, the program proceeds to operation 1640 to generate another induced current in the third conduction loop 1214B in response to the second magnetic field.

The process proceeds to operation 1650, which is transmitted to the fourth conduction loop 1212B via another set of conduction paths 1216B that are electrically coupled to the third and fourth conduction loops.

Thus, the second inductive device 924 or 1224 of the second oscillator is magnetically coupled to the first inductive device 922 or 1222 of the first oscillator via the coupling structure 910 or 1210.

According to an embodiment, the circuit includes a coupling structure and a first inductive device. The coupling structure includes two or more conductive loops and a set of conductive paths electrically connected to the two or more conductive loops. The first inductive device is magnetically coupled to the first conduction loop of the two or more conduction loops.

In accordance with another embodiment, a circuit includes a first oscillator including an inductive device, a second oscillator including an inductive device, and a coupling structure. The coupling structure includes a first conductive loop magnetically coupled to the inductive device of the first oscillator, a second conductive loop magnetically coupled to the inductive device of the second oscillator, and an electrical connection between the first conductive loop and the second conductive loop A set of conduction paths.

In accordance with another embodiment, a method includes generating a induced current in a first conductive loop of a coupled structure in response to a first magnetic field generated by a first inductive device of the first oscillator. The induced current is transmitted to the second conductive loop of the coupling structure via a set of conduction paths of the coupling structure electrically coupled to the first and second conductive loops. A second inductive device of the second oscillator is magnetically coupled to the first inductive device of the first oscillator via the coupling structure.

The foregoing description summarizes the features of some embodiments, and those skilled in the art can understand the aspects of the disclosure. Those skilled in the art will appreciate that the present disclosure can be readily utilized as a basis for designing or modifying other processes and structures to achieve the same objectives and/or the same advantages as the present application. It should be understood by those skilled in the art that the present invention is not limited to the spirit and scope of the disclosure, and various changes, substitutions and changes can be made without departing from the spirit and scope of the disclosure.

900‧‧‧ Circuitry

910‧‧‧Coupling structure

922‧‧‧First Inductive Device

924‧‧‧second inductive device

912‧‧‧First conduction loop

914‧‧‧Second conduction loop

916‧‧‧Transmission path

922a, 924a‧‧‧ signal埠

922b, 924b‧‧‧ coil

922c, 924c‧‧‧ direction

912a, 914a‧‧‧ first end

912b, 914b‧‧‧ second end

916a‧‧‧First conduction path

916b‧‧‧second conduction path

Claims (9)

An oscillator circuit comprising: a coupling structure comprising a continuous conductive material, the continuous conductive material comprising: two or more conductive loops; and a set of conductive paths electrically connected to the two or more conductive loops; And a first inductive device of the first oscillator electrically separated from the coupling structure and magnetically coupled to a first conduction loop of the two or more conduction loops, wherein the first inductive device is viewed from a top view Surrounding the first conduction loop. The oscillator circuit of claim 1, wherein the first conductive loop of the two or more conductive loops comprises a first end and a second end; and a second conductive loop of the two or more conductive loops The system includes a first end and a second end; and the set of conductive paths includes: a first conductive path electrically connected to the first end of the first conductive loop and the first end of the second conductive loop And a second conductive path electrically connected to the second end of the first conductive loop and the second end of the second conductive loop. The oscillator circuit of claim 1 further comprising a second inductive device magnetically coupled to a second conductive loop of the two or more conductive loops. The oscillator circuit of claim 1, wherein the coupling structure further comprises: another two or more conductive loops; and another set of conductive paths electrically connected to the other two or more conductive loops; a first conductive loop of the plurality of conductive loops is magnetically coupled to a second An inductive device; and a second conductive loop of the two or more conductive loops are magnetically coupled to a second conductive loop of the other two or more conductive loops. The oscillator circuit of claim 4, further comprising a third inductive device magnetically coupled to the second conduction loop of the two or more conduction loops and the second conduction of the other two or more conduction loops Loop. An oscillator circuit comprising: a first oscillator comprising an inductive device; a second oscillator comprising an inductive device; and a coupling structure comprising: a first conduction loop magnetically coupled to the first oscillation The inductive device is electrically separated from the inductive device of the first oscillator, wherein a first point of an inner circumference of the first conductive loop is compared to the first point in a top-down viewing angle A second point of an outer perimeter of the inductive device of the oscillator is remote from a center of the first conductive loop, the first point and the second point being disposed along a line extending through the center of the first conductive loop a second conduction loop magnetically coupled to the inductive device of the second oscillator; and a set of conductive paths electrically coupled to the first conductive loop and the second conductive loop. The oscillator circuit of claim 6, wherein the first conductive loop includes a first end and a second end; the second conductive loop includes a first end and a second end; and the set of conductive paths The system includes: a first conductive path electrically connected to the first end of the first conductive loop and the first end of the second conductive loop; a second conductive path electrically connected to the second end of the first conductive loop and the second end of the second conductive loop. The oscillator circuit of claim 6, further comprising: a first shielding structure; and a second shielding structure, wherein at least a portion of the set of conductive paths are seen in the top view from the first shielding structure and the second Between the shielded structures. An operating method of an oscillator circuit, comprising: a first conducting loop in a coupling structure, generating a sensing current in response to a first magnetic field generated by a first inductive device of the first oscillator, the first inductive device The coupling structure is electrically separated; the induced current is transmitted to the second conduction loop of the coupling structure via a group conduction path electrically connected to the coupling structure of the first and a second conduction loop, and a second oscillation a second inductive device is magnetically coupled to the first inductive device of the first oscillator via the coupling structure; generating a second magnetic field in response to the induced current through the second conductive loop of the coupling structure; Responding to the second magnetic field, generating another induced current in a third conductive loop; and passing the another induced current to another set of conductive paths of the coupling structure electrically connected to the third and fourth conductive loops Transmitted to the fourth conduction loop of the coupling structure.