TWI587763B - The use of gravure printing method to form conductive totem - Google Patents

Description

Method for forming conductive totem by gravure printing

The present invention relates to a method of forming a conductive totem, and more particularly to a method of forming a conductive totem by gravure printing.

With the advancement of technology, technology products are moving toward a lighter, thinner and shorter direction. Therefore, integrated circuits are widely used in various electronic products. In the manufacturing process, extremely fine-sized circuits need to be fabricated on the substrate. When the pattern is used, it is mainly achieved by etching lithography.

For example, the method for preparing a circuit board having a patterned conductive layer is prepared by disposing a conductive layer on a substrate and then providing a photoresist layer on the conductive layer. Next, a photomask layer having a predetermined pattern is disposed on the photoresist layer, and a radiation light is applied to illuminate the photoresist layer through the photomask layer, and the photoresist layer is processed and used using a developer solution. An etchant etches the conductive layer, and finally, the photoresist layer is removed to obtain a conductive layer corresponding to the predetermined pattern.

However, in the manufacturing method, after the photoresist layer is formed, a device such as a yellow light developing device is required to perform the process, thereby increasing the complexity of the process and reducing the process speed. Therefore, how to reduce the complexity of the process to increase the process speed, And reducing the use of the machine to reduce costs is a big issue.

The main object of the present invention is to solve the problem that the prior art requires the use of equipment such as yellow light development for the process, and has the problems of high process cost and high complexity.

To achieve the above object, the present invention provides a method of forming a conductive totem by gravure printing, comprising the following steps:

S1: forming a conductive layer on a substrate;

S2: forming a shadow protection totem on the conductive layer by means of gravure printing;

S3: etching the conductive layer to form a conductive totem corresponding to the shielding protection totem.

In summary, the present invention has the following features:

1. The shadow protection totem is formed by using gravure printing, without the need of a process such as yellow light development, and the use of an expensive machine can be reduced to reduce the cost.

Second, the use of direct printing to form the shield protection totem, to avoid the use of photoresist still has to undergo exposure, development, etching photoresist and other procedures and then the conductive layer etching problem, reduce the complexity of the process and improve the processing speed.

The detailed description and technical content of the present invention will now be described as follows:

Please refer to FIG. 1 and FIG. 2A to FIG. 2F. The present invention is a method for forming a conductive totem by gravure printing, which comprises the following steps:

S1: As shown in FIG. 2A, a conductive layer 20 is formed on a substrate 10. In this embodiment, the conductive layer 20 is formed on the substrate 10 by sputtering, and the material of the substrate 10 is The conductive layer 20 may be made of a conductive material such as gold, silver or copper, or may be polyethylene terephthalate, polyethylene terephthalate, cellulose triacetate, polylactic acid or a combination thereof. It can be a non-metallic conductive material, and in the present embodiment, the thickness of the conductive layer 20 is less than 5 micrometers, the reasons are as follows. It should be particularly noted that in the present embodiment, a conductive line is produced as an example of the fabrication process.

S2: As shown in FIG. 2B and FIG. 2C, a shielding protection totem 30 is formed on the conductive layer 20 by gravure printing, and the material of the shielding protection totem 30 is a resin or anti-metal etching solution. The ink of the metal etching solution or the like, and due to the limitation of the gravure printing ability, if the transfer space of the gravure printing is too small, the contact area with the conductive layer 20 is likely to be too small, and the transfer is incomplete or the transfer fails. Therefore, the width of the shielding protection totem 30 can only reach about 7 micrometers at a minimum, and the plurality of linear bodies 31 are formed. In the embodiment, the widths of the linear bodies 31 are all less than 10 micrometers. The protection totem 30 can also be shaped differently according to the needs of the user, and is not limited thereto. And in this embodiment, the following steps are further included:

S2A: A masking protectant 42 is first filled into one of the grooves 41 in a transfer member 40.

S2B: contacting the transfer member 40 with the conductive layer 20, and transferring the shielding protection agent 42 in the recess 41 to the conductive layer 20 to form the shielding protection totem 30, thereby directly The totem required for the process is formed, and the amount of the shielding protectant 42 can be reduced, and the process such as yellow light development is not required to remove the excess shielding protection agent 42, which can reduce the complexity of the process and increase the process speed.

S2C: The shielding protection totem 30 is then cured by ultraviolet curing, infrared curing or heat curing. Of course, a material that gradually hardens when exposed to air may be used as the shielding protection agent 42 to form the shielding. Protect the totem 30.

S3: as shown in FIG. 2D to FIG. 2F, the conductive layer 20 is etched to form the conductive layer 20 to form a conductive totem 21 corresponding to the shielding protection totem 30, and finally the shielding protection totem 30 is removed. That is, the manufacturing steps of the present invention are completed, and the embodiment further includes the following steps:

S3A: as shown in FIG. 2D, the region of the conductive layer 20 that is not shielded by the shielding protection totem 30 is first anisotropically etched until the conductive layer 20 reveals the substrate 10 and is formed corresponding to the shielding. The conductive totem 21 that protects the pattern of the totem 30.

S3B: as shown in FIG. 2E, the conductive layer 20 is further etched, so that the etchant further etches the conductive tom 21 perpendicular to the side of the substrate 10, so that the width of the conductive tom 21 is smaller than the Masking protects the width of the totem 30 and further reduces the line width to meet the process requirements.

As described above, since the etching liquid is an anisotropic etching, in step S3A, lateral etching of the conductive layer 20 is performed while etching the conductive layer 20 downward, thereby defining the conductive layer 20 The thickness of the conductive totem 21 formed by the laterally etched conductive layer 20 may be about 7 micrometers. Alternatively, the thickness of the conductive totem 21 may be adjusted according to the aspect ratio of the conductive totem 21. The thickness of the conductive layer 20 is required to be smaller than the width of the conductive tom 21. Of course, vertical etching and lateral etching can also be performed sequentially by isotropic etching.

In summary, the present invention has the features:

1. By forming the shielding protection totem by means of gravure printing, the amount of the shielding protection agent can be reduced, the cost can be reduced, and the process such as yellow light development can be eliminated, and the complexity of the process can be reduced and the system can be improved. In terms of production speed, in addition, the yellow light developing machine and the like are expensive, and the present invention does not require the use of a yellow light developing machine, and can further reduce the process cost.

2. By continuously etching the conductive layer, the width of the conductive totem is smaller than the width of the shielding protection totem, and the line width is further reduced to make the line width extremely fine to meet the requirements of the process.

Therefore, the present invention is highly progressive and conforms to the requirements of the invention patent application, and the application is filed according to law, and the praying office grants the patent as soon as possible.

The present invention has been described in detail above, but the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the scope of the invention. That is, the equivalent changes and modifications made by the scope of the present application should remain within the scope of the patent of the present invention.

10: Substrate 20: Conductive layer 21: Conductive totem 30: Shadow protection totem 31: Linear body 40: Transfer member 41: Groove 42: Masking protectant S1~S3, S2A~S2C, S3A, S3B: Step

FIG. 1 is a schematic flow chart of a preferred embodiment of the present invention. 2A-2F are schematic diagrams showing the structure of a structure according to a preferred embodiment of the present invention.

S1~S3, S2A~S2C, S3A, S3B: Steps

Claims (9)

A method for forming a conductive totem by gravure printing comprises the following steps: S1: forming a conductive layer on a substrate; S2: forming a shadow protection totem on the conductive layer by gravure printing; S3A: the conductive The layer is not etched by the area covered by the shadow protection totem until the conductive layer exposes the substrate and forms the conductive totem corresponding to the pattern of the shadow protection totem; and S3B: continuing to etch the conductive layer, and Further, the conductive totem is etched perpendicular to the side of the substrate such that the width of the conductive totem is less than the width of the shielding protection totem. The method for forming a conductive totem by gravure printing according to the first aspect of the invention, wherein the material of the substrate is selected from the group consisting of polyethylene terephthalate and polyethylene terephthalate in step S1. a group consisting of ester, cellulose triacetate, polylactic acid, and combinations thereof, and the material of the conductive layer is a metal conductive material. The method for forming a conductive totem by gravure printing as described in claim 1, wherein in step S2, the shadow protection totem is composed of a plurality of linear bodies, each of which has a width of less than 10 micrometers. A method of forming a conductive totem by gravure printing as described in claim 1, wherein in step S1, the conductive layer has a thickness of less than 5 micrometers. A method of forming a conductive totem by gravure printing as described in claim 1, wherein in step S1, the conductive layer is formed on the substrate by sputtering. The method for forming a conductive totem by gravure printing according to the first aspect of the invention, wherein in the step S2, the material of the shielding protection totem is any one of a resin resistant to a metal etching solution and an ink resistant to a metal etching solution. The method for forming a conductive totem by gravure printing according to the first aspect of the invention, wherein in step S2, the method further comprises the following steps: S2A: filling a shielding protection agent into a groove of a transfer member; And S2B: transferring the shielding protection agent in the recess to the conductive layer to form the shielding protection totem. The method for forming a conductive totem by gravure printing according to claim 7 of the patent application, wherein after step S2B, there is a step S2C: curing the shadow protection totem. A method for forming a conductive totem by gravure printing as described in claim 8 wherein the method of curing the shadow protection totem is selected from the group consisting of ultraviolet light curing, infrared light curing, and heat curing.