TWI587546B - Illumination structure having multilayer lens and manufacturing method thereof - Google Patents

Description

Light-emitting structure with multilayer lens and manufacturing method thereof

The invention relates to a light-emitting structure with a multilayer lens and a manufacturing method thereof, in particular to a light-emitting structure for efficiently distributing and designing a light angle by using a multilayer lens and a manufacturing method thereof.

In the semiconductor light emitting device, for example, a light emitting diode (LED) or an organic light emitting diode (OLED), the optical lens can be reconfigured, thereby utilizing the secondary optical principle of the optical lens. Adjust the direction of the light path of the emitted light.

Taking the light-emitting diode as an example, the light-emitting diode wafer generally has an exit angle of only about 120 degrees, and the illumination range thereof is considerably limited, and since the light emitted from the light-emitting diode wafer is mainly concentrated on the optical axis thereof ( That is, the center of the light-emitting diode), so that the brightness of the light at the center and the periphery is not uniform, and the optical lens on the light-emitting diode wafer can improve the light-emitting angle of the light-emitting diode light source and the emitted light thereof. Uniformity and can be designed for light shapes.

However, most of the current LED photonics are mounted on the mechanism. In the body, the optical lens package is bonded to the mechanism carrier and mounted on the LED chip to complete the package of the LED chip; or in the packaged LED structure Various optical lenses are respectively disposed on the light-emitting path to change the light-emitting angle and the light-shaped shape of the light-emitting diode light-emitting structure.

However, the light-emitting structure manufactured in the conventional manner uses a plurality of independent and separate optical lenses, which makes it difficult to reduce the volume of the light-emitting structure, and does not conform to the trend of use of the existing miniaturized light-emitting structure. In addition, since a medium having a different refractive index is passed through the light path of the light emitted from the LED chip, a large amount of light loss is caused, which also does not meet the actual use requirements. In this regard, how to further reduce the volume of the light-emitting structure and reduce the light loss is a subject that the practitioners in the field are eager to improve.

The invention relates to a light-emitting structure with a multilayer lens and a manufacturing method thereof. By directly stacking a multilayer lens on a light-emitting element, light loss caused by the emitted light of the light-emitting element passing through the air and then passing through the lens can be avoided and utilized. The structure of the sub-lens in each layer of lens is designed and assigned to the light-emitting angle of the light-emitting structure to meet various application requirements.

The present invention provides a light emitting structure having a multilayer lens comprising: a light emitting element; a first lens structure directly overlying the surface of the light emitting element, and the first lens structure having a plurality of first sub-lenses arranged in an array And a second lens structure directly formed on the first lens structure, the second lens structure having a plurality of second sub-lenses arranged in an array, and each of the second sub-lenses and the corresponding first sub-lens has The same optical axis.

The invention further provides a method for fabricating a light-emitting structure having a multilayer lens, comprising the steps of: providing a light-emitting element having at least one positioning point defined thereon; forming a first lens structure on the surface of the light-emitting element, the positioning point being As a reference point, a first lens structure is formed on the light emitting element by a dicing method, a nanoimprint method, a mold forming method or a 3D printing method, and the first lens structure has a plurality of first sub-lenses arranged in an array; Forming a second lens structure on the surface of the first lens structure, using the positioning point as a reference point, forming a second lens structure on the surface of the first lens structure by a cutting method, a nanoimprint method, a mold forming method or a 3D printing method The second lens structure has a plurality of second sub-lenses arranged in an array, and each of the second sub-lenses has the same optical axis as the corresponding first sub-lens.

The present invention further provides a light emitting structure having a multilayer lens, comprising: a light emitting element having a central axis; a first lens structure directly covering the surface of the light emitting element, and the first lens structure having at least one a first sub-lens, a structure of the first sub-lens is symmetrically distributed along a central axis; and a second lens structure directly formed on the first lens structure, the second lens structure having at least two second sub-lenses, The structures of the second sub-lenses are symmetrically distributed along the central axis, and the lens curvature radius of each of the second sub-lenses is smaller than the lens curvature radius of the first sub-lens.

The present invention further provides a light emitting structure having a multilayer lens, comprising: a light emitting element having a central axis; a first lens structure directly covering the surface of the light emitting element, and the first lens structure having at least two a first sub-lens, the structures of the first sub-lenses are symmetrically distributed along a central axis; and a second lens structure directly formed on the first lens structure, the second lens structure having at least one second sub-lens, The second sub-lens is constructed with a central axis The distribution is called, and the lens radius of curvature of the second sub-lens is greater than the radius of curvature of the lens of each of the first sub-lenses.

By the implementation of the present invention, at least the following advancements can be achieved: 1. The light-emitting angle of the light-emitting structure can be designed to achieve a specific light-emitting shape to meet various use requirements; and second, the light loss can be reduced to improve the light-emitting brightness. And uniformity.

In order to make those skilled in the art understand the technical content of the present invention and implement it, and according to the disclosure, the patent scope and the drawings, the related objects and advantages of the present invention can be easily understood by those skilled in the art. The detailed features and advantages of the present invention will be described in detail in the embodiments.

100‧‧‧Lighting structure

20‧‧‧Lighting elements

21‧‧‧Light transmissive substrate

211‧‧‧Basic sub-lens

22‧‧‧Temporary substrate

22a‧‧‧heating substrate

23‧‧‧Light Emitting Diode Grains

24‧‧‧Central axis

25‧‧‧Location points

40‧‧‧First lens structure

41‧‧‧First sub-lens

60‧‧‧second lens structure

61‧‧‧Second sub-lens

80‧‧‧ third lens structure

81‧‧‧ third sub-lens

L‧‧‧ optical axis

90‧‧‧ Laser device

91‧‧‧Female template

92‧‧‧3D printing machine

1 is a schematic view showing a semiconductor wafer as a light-emitting element according to an embodiment of the present invention; FIG. 2A is a schematic perspective view showing a light-emitting structure having a multilayer lens according to an embodiment of the present invention; and FIG. 2B is a cross-sectional view taken along line AA of FIG. 2A. 3 is a schematic perspective view of another embodiment of the present invention having a multilayer lens light-emitting structure; FIG. 3B is a cross-sectional view taken along line BB of FIG. 3A; FIG. 4 is an embodiment of the present invention; A schematic diagram of using a temporary substrate or a heat dissipation substrate to carry a plurality of light emitting diode crystal grains as a light emitting element; FIG. 5A is a multilayer lens lens with a temporary substrate removed according to an embodiment of the present invention; 3B is a cross-sectional view taken along line CC of FIG. 5A; FIG. 5C is a cross-sectional view showing a multi-layer lens light-emitting structure according to an embodiment of the present invention; FIG. 6 is an embodiment of the present invention A further schematic cross-sectional view of a multi-layer lens light-emitting structure; FIG. 7A is a schematic view of a light-emitting element having only a first lens structure according to an embodiment of the present invention; and FIG. 7B is a cross-sectional view taken along line DD of FIG. 7A; Figure 7C is a schematic view of the light-emitting element of Figure 7A plus a second lens structure; Figure 7D is a cross-sectional view taken along line EE of Figure 7C; and Figure 7E is a light-emitting element of Figure 7D. A first embodiment of the third lens structure is added; FIG. 7F is a second embodiment of the illuminating element plus the third lens structure in FIG. 7D; and FIG. 7G is a illuminating element in the 7D A third embodiment of the third lens structure is added; FIG. 8A is a schematic view of another light-emitting element having only the first lens structure according to the embodiment of the present invention; and FIG. 8B is a cross-sectional view taken along line FF of FIG. 8A. Figure 8C is the light-emitting component of Figure 8A plus 2D is a schematic cross-sectional view taken along line G-G of FIG. 8C; FIG. 8E is a first embodiment of a light-emitting element plus a third lens structure in FIG. 8D; FIG. 8F is a second embodiment of the light-emitting element plus the third lens structure in FIG. 8D; FIG. 9 is a cross-sectional view showing another light-emitting structure having a multilayer lens according to an embodiment of the present invention; FIG. FIG. 11 is a cross-sectional view showing another embodiment of a light-emitting structure having a multilayer lens according to an embodiment of the present invention; FIG. 11 is a cross-sectional view showing another embodiment of a light-emitting structure having a multilayer lens according to an embodiment of the present invention; FIG. 13 is a cross-sectional view showing a method for fabricating a light-emitting structure having a multilayer lens according to an embodiment of the present invention; and FIG. 14 is a view showing a plurality of anchor points according to an embodiment of the present invention; FIG. 15 is a schematic view showing a lens structure using a laser cutting method according to an embodiment of the present invention; FIGS. 16A and 16B are diagrams showing a lens structure using a nanoimprint method according to an embodiment of the present invention; FIG. 17 is a schematic view showing a lens structure produced by using a 3D printing method according to an embodiment of the present invention.

As shown in FIG. 1 to FIG. 2B, the embodiment is a light-emitting structure 100 having a multilayer lens, comprising: a light-emitting element 20; a first lens structure 40; And a second lens structure 60.

As shown in FIG. 1, the light-emitting element 20 can be a semiconductor wafer, such as a light-emitting diode wafer, an organic light-emitting diode wafer, or a laser wafer. In the following figures, for convenience of explanation, only a part of the semiconductor wafer may be drawn, and those skilled in the art should understand and apply the technical contents of the following embodiments or embodiments to the semiconductor before uncutting. On the entire surface of the wafer.

As shown in FIGS. 2A and 2B, the first lens structure 40 directly covers the surface of the light-emitting element 20, and the emitted light of the light-emitting element 20 can be directly incident into the first lens structure 40 to reduce light loss, wherein the first lens The structure 40 has a plurality of first sub-lenses 41 arranged in an array, and the first sub-lenses 41 are adjacent to each other. Each of the first sub-lens 41 has the same structural size, and its lens diameter may be 200 micrometers or less, and the lens thickness may be 200 micrometers or less. The shape of the first sub-lens 41 may be a concave lens structure, a convex lens structure or a three-dimensional geometric structure to match the different use requirements.

The second lens structure 60 is directly covered and stacked on the first lens structure 40. The second lens structure 60 also has a plurality of second sub-lenses 61 arranged in an array, and each of the second sub-lenses 61 is vertically stacked on a first sub-lens 41 such that each second sub-lens 61 corresponds to The first sub-lens 41 has the same optical axis L. The second sub-lenses 61 are adjacent to each other, and each of the second sub-lenses 61 has the same structural size, and the lens diameter may be 200 micrometers or less, and the lens thickness may be 200 micrometers or less. The shape of the second sub-lens 61 may be a concave lens structure, a convex lens structure or a three-dimensional geometric structure. After the shape of the first sub-lens 41 is matched with each other, the emitted light of the light-emitting element 20 may be focused or emitted when leaving the light-emitting element 20 . Diverging, and then designing and distributing the exit angle of the light-emitting structure 100 according to the principle of optical design Degree to achieve a specific illuminating light shape. Further, the second sub-lens 61 may have the same or different lens curvature radius as the first sub-lens 41.

As shown in FIGS. 3A and 3B, in another embodiment, the light emitting element 20 may further include a third lens structure 80 that directly covers the second lens structure 60. The third lens structure 80 also has a plurality of third sub-lenses 81 arranged in an array, and each of the third sub-lenses 81 has the same optical axis L as the corresponding second sub-lens 61 and the first sub-lens 41. The third sub-lenses 81 are adjacent to each other, and each of the third sub-lens 81 has the same structural size, and the lens diameter may be 200 micrometers or less, and the lens thickness may be 200 micrometers or less. The shape of the third sub-lens 81 may also be a concave lens structure, a convex lens structure or a solid geometry. In yet another embodiment, it is of course also possible to continue to stack the multilayer lens structures on the third lens structure 80 to achieve the desired optical design. In addition, each of the third sub-lenses 81 may have the same or different lens curvature radius as the first sub-lens 41 and the second sub-lens 61.

The aforementioned three-dimensional geometric structure may be a triangular pyramid structure, and an optical effect similar to a grating can be achieved by arranging a plurality of triangular pyramid structures on a semiconductor wafer.

The materials of the first lens structure 40, the second lens structure 60 and the third lens structure 80 may be selected from a heat curing optical colloid, a photocurable optical colloid or an optical glass adhesive, and the first lens structure 40 may be used in conjunction with the disposed position. The second lens structure 60 may be made of a material having a refractive index between the air and the light-emitting element 20, and the second lens structure 60 may be made of a material having a refractive index between the air and the first lens structure 40. A material between the air and the second lens structure 60. That is, a material that gradually decreases the refractive indices of the first, second, and third lens structures 40, 60, 80 can be used to break the total reflection between the interfaces and thereby improve the light-emitting structure 100. The amount of light emitted.

However, if the adjacent lens structures 40, 60, 80 are made of colloids of different materials, the bonding strength between the lens structures 40, 60, 80 may be insufficient, so that the first lens structure 40 of the dissimilar material may be used. An adhesive is applied between the second lens structure 60 and the third lens structure 80 on the adjacent surface to increase the bonding strength.

As shown in FIG. 4, in addition to the semiconductor wafer, the light-emitting element 20 may optionally include a structure including a temporary substrate 22 and a plurality of light-emitting diode crystal grains 23 disposed on the temporary substrate 22, wherein the light-emitting elements 20 are used. The light emitting diode crystal grains 23 are separated from each other and arranged in an array at intervals. The temporary substrate 22 may also be replaced with a heat dissipation substrate 22a, such as a ceramic substrate, a printed circuit board, or a metal printed circuit board (MCPCB).

Referring to FIG. 5A and FIG. 5B simultaneously, the temporary substrate 22 is used to carry the LED die 23 only during the process, after the setting of the first, second and third lens structures 40, 60, 80 is completed. It can be removed, and finally cut along the periphery of the LED die 23 (as indicated by the arrow in FIG. 5B), or the temporary substrate 22 can be removed after cutting, so that the final A multilayer lens structure is formed on each of the light-emitting diode dies 23 in the finished product, and a plurality of vertically corresponding sub-lenses 41, 61 of each of the lens structures 40, 60 have the same optical axis L.

As shown in FIG. 5C, when the light-emitting diode 22 is carried by the heat-dissipating substrate 22a, the light-emitting diode dies 23 can be first screened and then arranged on the heat-dissipating substrate 22a, so that The illuminating intensity is set at different positions on the heat dissipation substrate 22a, whereby the illuminating light shape of the entire light emitting structure 100 can be designed in accordance with the needs of the optical design.

As shown in FIG. 6, since the light emitting element 20 is a semiconductor light emitting junction In the semiconductor light-emitting structure, a light-transmitting substrate 21 is often provided, and the light-transmitting substrate 21 has good light transmittance, such as a sapphire substrate. In this regard, a plurality of basic sub-lenses 211 arranged in an array may be formed on the outer surface of the transparent substrate 21 by a dicing method on the surface of the transparent substrate 21, wherein the shape of the basic sub-lens 211 may be a concave lens structure or a convex lens. The structure or the three-dimensional geometry, and the lens diameter thereof may be 200 micrometers or less, and the lens thickness thereof may be 200 micrometers or less. The foregoing cutting method may be, for example, a laser cutting method, a yellow etching exposure method, or any conventionally known method of cutting or removing a portion of the light-transmitting substrate 21.

The light-transmitting substrate 21 having a plurality of basic sub-lenses 211 is located at the top end of the light-emitting element 20, and the first, second, and third lens structures 40, 60, 80 are sequentially covered on the surface of the light-transmitting substrate 21, so that Each of the basic sub-lenses 211 has the same optical axis L as the corresponding first sub-lens 41 and second sub-lens 61, or further has the same optical axis L as the corresponding third sub-lens 81. In order to increase the bonding strength between the basic sub-lens 211 and the first lens structure 40, the adjacent surface between the basic sub-lens 211 and the first lens structure 40 may also be coated with an adhesive.

In addition to the fact that each of the vertically corresponding sub-lenses has the same optical axis L, the sub-lenses of the respective layers may be designed in a form that does not correspond to each other. As shown in FIGS. 7A and 7B, the light-emitting element 20 has a central axis 24, and the first sub-lens 41 of the first lens structure 40 is symmetrically distributed on the surface of the light-emitting element 20 with the central axis 24; As shown in FIGS. 7C and 7D, the second lens structure 60 covers the first lens structure 40 and is symmetrically distributed with the central axis 24 of the light-emitting element 20. The first lens structure 40 may include at least one first sub-lens 41, and the second lens structure 60 may include at least two second sub-lenses 61 (for example, four second sub-lenses 61), and the second sub- The lens has a radius of curvature smaller than that of the first sub-lens 41 The diameter of each of the second sub-lenses 61 may be smaller than the cross-sectional area of each of the first sub-lenses 41.

Referring to FIGS. 7E to 7G again, the light emitting structure 20 may further cover the second lens structure 60 with a third lens structure 80, the third lens structure 80 having at least a third sub-lens 81, and a third The structure of the sub-lens 80 is also symmetrically distributed along the central axis, and the lens curvature radius of the third sub-lens 81 is larger than the lens curvature radius of the second sub-lens 61, and the cross-sectional area of the third sub-lens 81 may be larger than the second sub-lens 61. The cross-sectional area of the third sub-lens 81 is smaller than the lens curvature radius of the second sub-lens 61, and the cross-sectional area of the third sub-lens 81 may be smaller than the second The cross-sectional area of the sub-lens 61 (as shown in FIG. 7E); or the lens curvature radius of the third sub-lens 81 is equal to the lens curvature radius of the second sub-lens 61, and the cross-sectional area of the third sub-lens 81 may also be It is equal to the sectional area of the second sub-lens 61 (as shown in Fig. 7G).

As shown in FIGS. 8A and 8B, at least two first sub-lenses 41 (for example, four second sub-lenses 41) may be included in the first lens structure 40, and as shown in FIGS. 8C and 8D, The second lens structure 60 may include at least one second sub-lens 61, and the lens radius of curvature of the second sub-lens 61 is larger than the lens curvature radius of the first sub-lens 41, and the cross-sectional area of the second sub-lens 61 may be greater than The cross-sectional area of the first sub-lens 41.

Referring to FIGS. 8E-8F, the light emitting structure 20 may further cover the second lens structure 60 with a third lens structure 80, the third lens structure 80 having at least a third sub-lens 81, and a third The structure of the sub-lens 80 is also symmetrically distributed along the central axis, and the lens curvature radius of the third sub-lens 81 may be smaller than the lens curvature radius of the second sub-lens 61, and the sectional area of the third sub-lens 81 It may be smaller than the sectional area of the second sub-lens 61 (as shown in FIG. 8E), or the lens curvature radius of the third sub-lens 81 is equal to the lens curvature radius of the second sub-lens 61, and the third sub-lens 81 is broken. The surface area may be equal to the cross-sectional area of the second sub-lens 61 (as shown in FIG. 8F ), or the lens curvature radius of the third sub-lens 81 may be greater than the lens curvature radius of the second sub-lens 61 (not shown) ).

The foregoing drawings are merely illustrative of various embodiments, and are not intended to limit the scope of the present invention. The user may select different number of lens structures 40, 60, 80 and each lens structure according to their needs. The size and shape of the neutron lenses 41, 61, 81, and the light-emitting element 20 may be the light-emitting element 20 in the form of a semiconductor wafer as shown in FIG. 1, or may include the temporary substrate 22 as shown in FIG. Or the heat-dissipating substrate 22a and the light-emitting elements 20 of the light-emitting diode dies 23 arranged thereon, but in order to facilitate understanding of various forms of the sub-lenses 41, 61, only the light-emitting elements 20 represent the above various states in the drawings. kind. In addition, in the case where the sub-layer lenses do not correspond to each other, the lens diameter and thickness of each sub-lens will be more than 200 micrometers, especially when only one sub-lens is included in the lens structure, that is, the lens diameter of each sub-lens. Or the size of the thickness will be adjusted according to the needs.

For example, as shown in FIG. 9, a semiconductor wafer can be used as the light-emitting element 20, and the shapes of the first lens structure 40 and the second lens structure 60 are designed to be concave lenses; as shown in FIG. 10, it can be used. The temporary substrate 22 or the heat dissipation substrate 22a carries a plurality of light emitting diode crystal grains 23 as the light emitting elements 20, and the shape of the first lens structure 40 is designed as a convex lens, the shape of the second lens structure 60 is a concave lens, and the third lens structure 80 is 80. The shape is a three-dimensional geometry (such as a triangular pyramid structure).

Or as shown in FIG. 11, wherein the first lens structure 40 has a plurality of first sub-lenses 41 in the shape of a convex lens, and the central axis of the light-emitting element 20 The second lens structure 60 has only one second sub-lens 61 in the shape of a convex lens, and is also symmetrically distributed according to the central axis. In addition, the lens surface radius of the second sub-lens 61 may be larger than that of the first sub-lens 41. The radius of the curved surface, and the sectional area of the second sub-lens 61 may be larger than the sectional area of the first sub-lens 41; the third lens structure 80 has a plurality of third sub-lenses 81 in the shape of a convex lens and is symmetrically distributed along the central axis. Moreover, the lens surface radius of the third sub-lens 81 may be smaller than the lens surface radius of the second sub-lens 61, and the third sub-lens 81 may also have a smaller cross-sectional area than the second sub-lens 61.

More preferably, as shown in FIG. 12, wherein the first lens structure 40 has a plurality of first sub-lenses 41 in the shape of a convex lens, and is symmetrically distributed according to a central axis of the light-emitting element 20; the second lens structure 60 has a plurality of concave lenses. The second sub-lens 61 of the shape is also symmetrically distributed according to the central axis, and the radius of the lens surface of the second sub-lens 61 may be larger than the radius of the lens surface of the first sub-lens 41, and the cross-sectional area of the second sub-lens 61 is further The third lens structure 80 may have only a third sub-lens 81 that is symmetrically distributed along the central axis and has a convex lens shape, and the lens radius of the third sub-lens 81 may be The lens surface radius of the second sub-lens 61 is larger than the cross-sectional area of the second sub-lens 61.

Although not shown, a light-emitting element 20 having a light-transmitting substrate 21 as shown in FIG. 6 may be selected such that the light-transmitting substrate 21 is located at the top end of the light-emitting element 20 and is formed on the surface of the light-transmitting substrate 21. At least one basic sub-lens 211 of the array, the first lens structure covers the surface of the light-transmitting substrate, and the basic sub-lens 211 is symmetrically distributed on the central axis, and the lens surface radius of the basic sub-lens 211 may be larger or smaller than the first The radius of the lens surface of a sub-lens may be equal to the transparency of the first sub-lens Mirror surface radius.

With the implementation of the above embodiments, the light exit angle of the light emitting structure 100 can be designed and distributed. For example, the light-emitting angle of the light-emitting structure 100 can be concentrated on the central axis 24 of the light-emitting element 20 to improve the light directivity of the light-emitting structure 100, and can be applied to a long-distance projection lighting fixture or the like, or a light angle can be designed. In order to make the light-emitting shape of the light-emitting structure 100 appear a left-right asymmetric shape, and then conform to a special light-shaped angle. Alternatively, the optical design and the shape of each layer of the lens structure can be selected, so that the light intensity of the light-emitting structure 100 is better and uniform, so that the use of various uniform light components can be omitted, and the manufacturing cost can be reduced.

Since the light-emitting structure 100 described in the above embodiments needs to be precisely aligned with each other using the lens structures of the respective layers, as shown in FIG. 13, a light-emitting structure manufacturing method S100 having a multilayer lens is provided, which includes the following steps: a light-emitting element (step S10); forming a first lens structure (step S20); forming a second lens structure (step S30); and forming a third lens structure (step S40).

Providing a light-emitting element (step S10): as shown in FIG. 14, the light-emitting element 20 may be provided on the temporary substrate 22 or the heat-dissipating substrate 22a, and a plurality of light-emitting diode crystal grains 23 arranged in an array may be disposed. It is a semiconductor wafer (as shown in Figure 1).

In order to provide a high-accuracy alignment result, at least one or more positioning points 25 may be defined on the light-emitting element 20, and may be in the form of a positioning hole, and then matched with the positioning pin to fix the light-emitting element 20 by means of mechanism fixing. Positioning; or optical positioning point 25 can be used and optical camera-assisted correction can be used to perform accurate alignment procedures using optical positioning, or on a light-emitting component After at least one or more positioning holes, the light source with the corresponding number and the appropriate beam diameter is used as the reference point of the light source, and when the light emitting element is moved, the beam diameter of each light source completely penetrates the positioning hole. After that, you can accurately match. The techniques applied to position the illuminating element 20 have been commonly used in various illuminating element 20 detection or packaging techniques, and will not be exemplified herein. Those skilled in the art should be able to understand how to apply known positioning techniques to the present implementation. In the example.

Since the number of the positioning points 25 can be set to two or more, it is possible to utilize the arrangement of the plurality of positioning points 25 to ensure that the light-emitting elements do not have angular deflection.

Next, please refer to the drawings attached to the foregoing structural embodiment.

Forming a first lens structure (step S20): forming a first light-emitting element 20 on the surface of the light-emitting element 20 by using a dicing method, a nano-imprint method, a mold-forming method, or a 3D printing method with the positioning point 25 as a reference point The lens structure 40 has a first lens structure 40 having a plurality of first sub-lenses 41 arranged in an array.

Forming a second lens structure (step S30): after step S20, using the same positioning point 25 as a reference point, using a cutting method, a nanoimprint method, a mold forming method or a 3D printing method on the first lens structure A second lens structure 60 is formed on the surface of the 40, the second lens structure 60 has a plurality of second sub-lenses 61 arranged in an array, and each of the second sub-lenses 61 has the same optical axis L as the corresponding first sub-lens 41. .

Forming a third lens structure (step S40): after step S30, the same positioning point 25 can be used as a reference point, and the second lens is cut, nanoimprinted, molded, or 3D printed. A third lens structure 80 is formed on the surface of the structure 60. The third lens structure 80 has a plurality of third sub-lenses 81 arranged in an array, and each of the third sub-lenses 81 and the corresponding second sub-lens 61 and the first sub-lens 41 has phase The same optical axis L.

In addition, as shown in FIG. 6, when the light-emitting element 20 has the light-transmitting substrate 21, the manufacturing method of the light-emitting structure 100 may further include a pre-cutting step before the step 20, and the positioning point 25 is also used as the reference point of the alignment. First, the light-transmitting substrate 21 is cut by a cutting method, and the surface of the light-transmitting substrate 21 is formed into a plurality of basic sub-lenses 211 arranged in an array. Since the light-transmitting substrate 21 is located at the top end of the light-emitting element 20, the first lens structure 40 covers the surface of the light-transmitting substrate 21, and the first and second lens structures 40, 60 are also used to perform the same positioning point 25. Therefore, the basic sub-lens 211 and the corresponding first sub-lens 41 and second sub-lens 61 have the same optical axis L. The cutting method may be, for example, a laser cutting method, a yellow etching exposure method, or any conventionally known method of cutting or removing a portion of the light-transmitting substrate 21.

As shown in FIG. 15, the laser cutting method described above may be provided with a heat curing optical colloid, a photocurable optical colloid or an optical glass paste on the surface of the light emitting element 20, and then solidified and then accurately cut out by the laser device 90. The shape of the first sub-lens 41 is required. Or a heat curing optical colloid, a photocurable optical colloid or an optical glass adhesive is first disposed on the first lens structure 40 or the second lens structure 60 to cure the second lens structure 60 or the third lens structure 80. After the preliminary shape, the shape of the desired second sub-lens 61 or third sub-lens 81 is cut by laser cutting.

Since the slit of the laser cutting is narrow and the precision is high, it is possible to form a sub-lens having a lens diameter of 200 μm or less and a lens thickness of 200 μm or less, and the use of the positioning point 25 can make the vertical direction correspond to each other. The sub-lenses do have the same optical axis L.

In addition, as shown in FIGS. 16A and 16B, it is also possible to use the nanoimprint method to form the master template 91 first, and then apply the first or second to be coated. The material of the third lens structure 40, 60, 80 is on the lower element, and the master template 91 is embossed in the material, and then the material is solidified and then demolded. Further, the mold forming method can be used to inject the material of the first, second or third lens structures 40, 60, 80 into the cavity formed between the mold and the component after the mold is formed, and then demold the mold after the material is solidified. Nanoimprinting and die-casting methods are often used in the fabrication of lens array structures, and therefore will not be described here. Further, as shown in Fig. 17, the first, second or third lens structures 40, 60, 80 may be directly formed on the light-emitting element 20 by the 3D printing machine 92 using the 3D printing method.

The various methods for forming the lens structure described above need to be aligned using the same positioning point 25 to ensure that the vertically corresponding sub-lenses of each layer have the same overlapping optical axis L. Even if the sub-lenses of the respective layers do not have a vertical correspondence, the manufacturing method can also use the positioning points as a reference base point for alignment when manufacturing the lens structures of the respective layers.

In the above embodiments, the multilayer wafer structure can be directly applied to the surface of the semiconductor wafer before cutting, and each layer of the lens structure has a plurality of juxtaposed sub-lenses, and the lens of each sub-lens is straight through. It has been micron or nanometer size, very fine; and the sub-lenses in each layer of lens structure are vertically corresponding and have the same optical axis, which can effectively control and distribute the light-emitting angle of the light-emitting structure.

The embodiments are described to illustrate the features of the present invention, and the purpose of the present invention is to enable those skilled in the art to understand the present invention and to implement the present invention without limiting the scope of the present invention. Equivalent modifications or modifications made by the spirit of the disclosure should still be included in the scope of the claims described below.

100‧‧‧Light-emitting structure with multilayer lens

20‧‧‧Lighting elements

40‧‧‧First lens structure

41‧‧‧First sub-lens

60‧‧‧second lens structure

61‧‧‧Second sub-lens

L‧‧‧ optical axis

Claims (19)

A light-emitting structure having a multilayer lens, comprising: a light-emitting element; a first lens structure directly covering the surface of the light-emitting element, and the first lens structure having a plurality of first sub-lenses arranged in an array; And a second lens structure directly formed on the first lens structure, the second lens structure having a plurality of second sub-lenses arranged in an array, and each of the second sub-lenses corresponding to the first The sub-lenses have the same optical axis. The illuminating structure of claim 1, wherein the illuminating element is a semiconductor wafer. The illuminating structure of claim 1, wherein the illuminating element comprises a temporary substrate and a plurality of illuminating diode dies, and the illuminating diode dies are disposed on the temporary substrate and arranged in an array. The illuminating structure of claim 1, wherein the illuminating element comprises a heat dissipating substrate and a plurality of illuminating diode dies, and the illuminating diode dies are disposed on the heat dissipating substrate and arranged in an array. The light-emitting structure of claim 1, wherein the light-emitting element has a light-transmitting substrate, and the light-transmitting substrate is located at a top end of the light-emitting element, and a plurality of arrays are arranged on the surface of the light-transmitting substrate. The basic sub-lens, wherein the first lens structure is directly formed on the surface of the transparent substrate, and the basic sub-lens has the same optical axis as the corresponding first sub-lens and the second sub-lens. The light-emitting structure of claim 5, wherein the light-transmitting substrate is a sapphire substrate. A light-emitting structure according to any one of claims 1 to 5, wherein Further comprising a third lens structure formed directly on the second lens structure, the third lens structure having a plurality of third sub-lenses arranged in an array, and each of the third sub-lenses and the corresponding The two sub-lenses and the first sub-lens have the same optical axis. The illuminating structure of claim 7, wherein each of the basic sub-lenses, each of the first sub-lenses, each of the second sub-lenses and each of the third sub-lenses are respectively a concave lens structure and a convex lens structure. Or solid geometry. The light-emitting structure of claim 8, wherein the basic sub-lens is fabricated by a cutting method, and the first lens structure, the second lens structure and the third lens structure are cut, nano Made by imprinting, die-casting or 3D printing. The light-emitting structure of claim 9, wherein the first lens structure, the second lens structure and the third lens structure are made of a heat-curable optical colloid, a photocurable optical colloid or an optical glass paste. The illuminating structure of claim 10, wherein each of the adjacent surfaces of the base sub-lens, the first lens structure, the second lens structure and the third lens structure is coated with an adhesive. A method for fabricating a light emitting structure having a multilayer lens, comprising the steps of: providing a light emitting element having at least one positioning point defined thereon; forming a first lens structure on the surface of the light emitting element, the positioning point being used as the positioning point a first lens structure formed on the light-emitting element by a dicing method, a nano-imprint method, a mold-forming method or a 3D printing method, and the first lens structure has a plurality of first sub-lenses arranged in an array And forming a second lens structure on the surface of the first lens structure to be positioned a point as a reference point, the second lens structure is formed on the surface of the first lens structure by a dicing method, a nanoimprint method, a mold forming method or a 3D printing method, the second lens structure having a plurality of arrays arranged in an array a second sub-lens, and each of the second sub-lenses has the same optical axis as the corresponding first sub-lens. The method for fabricating a light-emitting structure according to claim 12, further comprising forming a third lens structure on the surface of the second lens structure, wherein the positioning point is used as a reference point, and the cutting method and the nanoprinting are performed. Forming, forming, or 3D printing the third lens structure on the surface of the second lens structure, the third lens structure having a plurality of third sub-lenses arranged in an array, and each of the third sub-lenses The second sub-lens and the corresponding first sub-lens have the same optical axis. The method of fabricating a light-emitting structure according to claim 12, wherein the light-emitting element has a light-transmitting substrate at a top end of the light-emitting element, wherein the light-emitting structure manufacturing method further comprises a pre-cutting step And using the locating point as a reference point and cutting the transparent substrate by using a dicing method, the surface of the transparent substrate is formed into a plurality of basic sub-lenses arranged in an array, wherein the first lens structure is covered by the transparent The surface of the light substrate, and the basic sub-lens has the same optical axis as the corresponding first sub-lens and the second sub-lens. A light emitting structure having a multilayer lens, comprising: a light emitting element having a central axis; a first lens structure directly covering the surface of the light emitting element, and the first lens structure having at least one a sub-lens, the structure of the first sub-lens is symmetrically distributed by the central axis; and a second lens structure directly formed on the first lens structure, The second lens structure has at least two second sub-lenses, and the structures of the second sub-lenses are symmetrically distributed on the central axis, and the lens curvature radius of each of the second sub-lenses is smaller than the lens curvature radius of the first sub-lens . A light emitting structure having a multilayer lens, comprising: a light emitting element having a central axis; a first lens structure directly covering the surface of the light emitting element, and the first lens structure having at least two a sub-lens, the structures of the first sub-lenses are symmetrically distributed on the central axis; and a second lens structure directly formed on the first lens structure, the second lens structure having at least a second sub-structure The lens, the structure of the second sub-lens is symmetrically distributed on the central axis, and the lens radius of curvature of the second sub-lens is greater than the lens curvature radius of each of the first sub-lenses. The illuminating structure of claim 15 or 16, further comprising a third lens structure directly covering the second lens structure, the third lens structure having at least one third sub-lens And the structure of the third sub-lens is symmetrically distributed on the central axis, and the lens radius of curvature of the third sub-lens is greater than, less than or equal to the lens curvature radius of the second sub-lens. The light-emitting structure of claim 15 or claim 16, wherein the light-emitting element has a light-transmitting substrate, the light-transmitting substrate is located at a top end of the light-emitting element, and an array is formed on the surface of the light-transmitting substrate. Aligning at least one basic sub-lens, wherein the first lens structure is directly formed on the surface of the light-transmitting substrate, and the basic sub-lens is symmetrically distributed on the central axis, and the lens radius of curvature of the basic sub-lens is greater than Less than or equal to the lens curvature radius of the first sub-lens. The illuminating structure of claim 17, wherein the illuminating element has a light-transmitting substrate, the light-transmitting substrate is located at a top end of the light-emitting element, and at least one basic sub-lens arranged in an array is formed on the surface of the light-transmitting substrate, wherein the first lens structure is directly covered and formed on the transparent substrate The surface of the light substrate, and the basic sub-lens is symmetrically distributed with the central axis, and the lens has a radius of curvature greater than, less than or equal to a lens radius of curvature of the first sub-lens.