TWI449974B - Light guide plate and method for manufacturing the same - Google Patents

Light guide plate and method for manufacturing the same Download PDF

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TWI449974B
TWI449974B TW101123601A TW101123601A TWI449974B TW I449974 B TWI449974 B TW I449974B TW 101123601 A TW101123601 A TW 101123601A TW 101123601 A TW101123601 A TW 101123601A TW I449974 B TWI449974 B TW I449974B
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microstructures
guide plate
main
light guide
light
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TW101123601A
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Chinese (zh)
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TW201400889A (en
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Kun Chih Pan
Chin Yuan Hu
Chung Hsing Chang
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Briview Corp
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導光板及其製造方法 manufacturing the sameLight guide plate and method of manufacturing same Manufacturing the same

本發明係關於一種導光板及其製造方法。The present invention relates to a light guide plate and a method of manufacturing the same.

習用的背光模組中,可舉例以發光二極體作為點狀光源的側射入光式光源結構。如此的光源結構中,因複數個發光二極體係距離預定間隔排列設置,各發光二極體發出的光係於該當的發光二極體正前方形成光束,相形之下,相鄰的發光二極體之間的亮度較暗。如此的光進入導光板時,會於導光板的出光面造成亮暗帶的現象。In a conventional backlight module, a side-injection light source structure in which a light-emitting diode is used as a point light source can be exemplified. In such a light source structure, since a plurality of light-emitting diode systems are arranged at a predetermined interval, light emitted from each of the light-emitting diodes forms a light beam directly in front of the light-emitting diode, and adjacent light-emitting diodes The brightness between the bodies is dark. When such light enters the light guide plate, it will cause a bright and dark band on the light exit surface of the light guide plate.

對此,習用技術中,於導光板的入光側設置凹溝以使入光側形成稜鏡結構或透鏡結構等的主微結構,藉此,使光入射至導光板的發散角度增加,減緩上述亮暗帶的現象。然而,如此的結構僅能增加光入射至導光板的發散角度,並無法消除光的全反射現象。即光源所發出的光中,其一部分係因全反射現象而漏失而未入射至導光板。In this regard, in the conventional technique, a groove is formed on the light incident side of the light guide plate to form a main microstructure of the 稜鏡 structure or the lens structure on the light incident side, thereby increasing the divergence angle of light incident on the light guide plate and slowing down. The above phenomenon of bright and dark bands. However, such a structure can only increase the divergence angle of light incident on the light guide plate, and cannot eliminate the total reflection phenomenon of light. That is, a part of the light emitted from the light source is lost due to the total reflection phenomenon and is not incident on the light guide plate.

對此,本發明係提供一種導光板及其製造方法,藉由奈米級的次微結構,有效降低光的全反射現象,避免光入射至導光板時的漏失,並且,增大光入射至導光板的發散角度,減緩因光束集中於光源前端造成導光板的出光面出現亮暗帶的現象。In this regard, the present invention provides a light guide plate and a method of manufacturing the same, which can effectively reduce the total reflection of light by the nano-structure of the nanometer, avoid leakage when light is incident on the light guide plate, and increase the incidence of light to the guide. The divergence angle of the light plate slows down the phenomenon that bright and dark bands appear on the light-emitting surface of the light guide plate due to the concentration of the light beam on the front end of the light source.

為了達成上述目的,本發明係提供一種導光板,其包 含具有入光側的主體,設置於入光側的複數個主微結構,以及分布於該些主微結構表面的複數個次微結構。該些次微結構的最大尺寸小於100nm且大於0nm。In order to achieve the above object, the present invention provides a light guide plate, which is packaged The body includes a body having a light incident side, a plurality of main microstructures disposed on the light incident side, and a plurality of secondary microstructures distributed on the surface of the main microstructures. The minor dimensions of the secondary microstructures are less than 100 nm and greater than 0 nm.

上述導光板中,該些主微結構可為稜鏡結構。此時,稜鏡結構的尖端的角度以介於10度至50度之間為佳。In the above light guide plate, the main microstructures may be a 稜鏡 structure. At this time, the angle of the tip end of the 稜鏡 structure is preferably between 10 and 50 degrees.

上述導光板中,該些次微結構的最大尺寸以介於20nm至100nm之間為佳。而複數個次微結構的分布可呈矩陣分布或蜂巢狀分布。In the above light guide plate, the maximum size of the secondary microstructures is preferably between 20 nm and 100 nm. The distribution of the plurality of sub-structures may be distributed in a matrix or in a honeycomb shape.

另外,本發明係提供一種導光板的製造方法,其包含提供具有入光側的主體,形成具有第一表面以及與該第一表面相對之第二表面的微結構基材,以及將微結構基材以第二表面固定於入光側之步驟。微結構基材於第一表面形成包含複數個次微結構的複數個主微結構,該些次微結構最大尺寸小於100nm且大於0nm,分布於主微結構上。In addition, the present invention provides a method of manufacturing a light guide plate, comprising providing a body having a light incident side, forming a microstructure substrate having a first surface and a second surface opposite to the first surface, and a microstructure base The step of fixing the material to the light incident side with the second surface. The microstructured substrate forms a plurality of primary microstructures comprising a plurality of secondary microstructures on the first surface, the secondary microstructures having a maximum dimension of less than 100 nm and greater than 0 nm, distributed over the primary microstructure.

上述製造方法中,形成微結構基材的步驟係包含形成第一模具,以及形成第二模具的步驟。其中第一模具用以形成主微結構,第二模具形成於第一模具上,用以形成次微結構。此時,於形成第二模具之後,更化學拋光處理第二模具為佳。In the above manufacturing method, the step of forming the microstructured substrate includes the steps of forming the first mold and forming the second mold. The first mold is used to form a main microstructure, and the second mold is formed on the first mold to form a secondary microstructure. At this time, after the second mold is formed, it is preferable to chemically polish the second mold.

上述製造方法中,形成微結構基材的步驟可選自塗佈UV膠、射出、熱壓塑膠成形技術。另外,可形成連續延伸的微結構基材之後,再裁切微結構基材。In the above manufacturing method, the step of forming the microstructured substrate may be selected from the group consisting of applying UV glue, injection, and hot press plastic forming techniques. Alternatively, the microstructured substrate can be cut after the continuous extending microstructured substrate is formed.

圖1係本發明之導光板一實施型態的示意圖。如圖1所示,導光板10係包含具有入光側的主體100,設置於入光側的複數個主微結構210,以及分布於該些主微結構210表面的複數個次微結構220(參閱圖3、圖4)。BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing an embodiment of a light guide plate of the present invention. As shown in FIG. 1 , the light guide plate 10 includes a main body 100 having a light incident side, a plurality of main microstructures 210 disposed on the light incident side, and a plurality of sub-micro structures 220 distributed on the surfaces of the main microstructures 210 ( See Figure 3, Figure 4).

圖2係圖1之導光板的立體分解圖。如圖2所示,導光板10係包含主體100以及微結構基材200。主體100係具有接受光進入的入光側101。主體100係可藉由預定之製造法,利用預定的材料,依預定的長、寬、厚度規格製作。2 is an exploded perspective view of the light guide plate of FIG. 1. As shown in FIG. 2, the light guide plate 10 includes a main body 100 and a microstructure substrate 200. The main body 100 has a light incident side 101 that receives light. The main body 100 can be produced by a predetermined manufacturing method using a predetermined material according to a predetermined length, width, and thickness specification.

微結構基材200係對應於主體100的尺寸,利用預定的材料而製作,以與主體100入光側101的厚度、寬度略同為較佳,並具有第一表面201,以及與第一表面201相對之第二表面202。第一表面201係接受光源照射的一面,第二表面202係用以固定於入光側101。The microstructure substrate 200 is made of a predetermined material corresponding to the size of the body 100, preferably to be similar to the thickness and width of the light incident side 101 of the main body 100, and has a first surface 201 and a first surface. 201 is opposite the second surface 202. The first surface 201 is a side that receives the light source, and the second surface 202 is fixed to the light incident side 101.

微結構基材200係包含設置於第一表面201的複數個主微結構210。該些主微結構210之間形成V字形、U字形或圓弧形的凹溝,藉此,該些主微結構210成為各圖所示的稜鏡結構,或者其他各種型態的透鏡結構。此時,該些主微結構210的尖端203的角度以介於10度至50度之間為佳。The microstructured substrate 200 comprises a plurality of primary microstructures 210 disposed on the first surface 201. V-shaped, U-shaped or circular-arc shaped grooves are formed between the main microstructures 210, whereby the main microstructures 210 are formed as 稜鏡 structures or various other types of lens structures. At this time, the angle of the tips 203 of the main microstructures 210 is preferably between 10 and 50 degrees.

微結構基材200更包含複數個次微結構220,分布於該些主微結構210表面(參閱圖3、圖4)。該些次微結構220係利用與主微結構210相同的材料,於形成主微結構210的同時形成於主微結構210的表面。The microstructured substrate 200 further includes a plurality of sub-microstructures 220 distributed over the surface of the main microstructures 210 (see FIGS. 3 and 4). The secondary microstructures 220 are formed on the surface of the main microstructures 210 while forming the main microstructures 210 using the same material as the main microstructures 210.

圖3、圖4係圖1、圖2的虛線圈所標示位置中的次微結構的不同實施例的放大圖。圖3所示的複數個次微結構220係呈蜂巢狀分布而形成,圖4所示的複數個次微結構220係呈方眼矩陣狀分布而形成。各次微結構220可為奈米級的凸起或凹陷。圖3、圖4中係以圓形表示各次微結構220,但不限於此,只要各次微結構220之中最寬處的距離(以下簡稱為最大尺寸)P小於100nm且大於0nm,則不限制次微結構220的形狀,另外,各次微結構220的最大尺寸P以介於20nm至100nm之間為佳。3 and 4 are enlarged views of different embodiments of the sub-microstructures in the positions indicated by the dashed circles of Figs. The plurality of sub-structures 220 shown in FIG. 3 are formed in a honeycomb shape, and the plurality of sub-structures 220 shown in FIG. 4 are formed in a matrix-like matrix distribution. Each of the microstructures 220 can be a nano-scale bump or depression. 3 and 4, each of the microstructures 220 is represented by a circle, but is not limited thereto, as long as the widest distance (hereinafter referred to as the maximum size) P among the microstructures 220 is less than 100 nm and greater than 0 nm. The shape of the secondary microstructures 220 is not limited, and in addition, the maximum dimension P of each of the microstructures 220 is preferably between 20 nm and 100 nm.

如圖所示,該些次微結構220的分布可呈矩陣分布、蜂巢狀分布,但不限於此而亦可為其他型態的分布。不論分布型態為何,該些次微結構220以均勻分布於該些主微結構210較佳,以使光能均勻分布。As shown, the distribution of the secondary microstructures 220 may be in a matrix distribution or a honeycomb distribution, but is not limited thereto and may be other types of distribution. Regardless of the distribution pattern, the secondary microstructures 220 are preferably evenly distributed over the main microstructures 210 to evenly distribute light energy.

以下,說明本發明之導光板的製造方法。Hereinafter, a method of manufacturing the light guide plate of the present invention will be described.

製作本發明之導光板10時,首先,提供具有入光側101的主體100。如上所述,主體100可藉由預定之製造法,利用預定的材料,依預定的長、寬、厚度等規格製作。When the light guide plate 10 of the present invention is produced, first, the main body 100 having the light incident side 101 is provided. As described above, the main body 100 can be produced by a predetermined manufacturing method using a predetermined material in accordance with a predetermined length, width, thickness, and the like.

接著,形成微結構基材200。微結構基材200具有第一表面201,以及與第一表面201相對之第二表面202。於第一表面201形成複數個主微結構210。該些主微結構210可形成各種稜鏡結構,或者各種型態的透鏡結構。Next, a microstructured substrate 200 is formed. The microstructured substrate 200 has a first surface 201 and a second surface 202 opposite the first surface 201. A plurality of main microstructures 210 are formed on the first surface 201. The main microstructures 210 can form various 稜鏡 structures, or various types of lens structures.

於形成主微結構210的同時,亦於主微結構210的表面形成複數個次微結構220。該些次微結構220係最大尺寸P小於100nm且大於0nm,分布於該些主微結構210上。A plurality of sub-microstructures 220 are also formed on the surface of the main microstructure 210 while forming the main microstructure 210. The sub-structures 220 have a maximum dimension P of less than 100 nm and greater than 0 nm and are distributed over the main microstructures 210.

之後,將微結構基材200以第二表面202固定於導光板主體100的入光側101,完成本發明之導光板10。Thereafter, the microstructure substrate 200 is fixed to the light incident side 101 of the light guide plate main body 100 with the second surface 202, and the light guide plate 10 of the present invention is completed.

圖5係形成微結構基材的示意圖,詳細地,形成微結構基材200時更包含如圖5所示的各步驟。FIG. 5 is a schematic view showing the formation of a microstructured substrate. In detail, when the microstructured substrate 200 is formed, the steps shown in FIG. 5 are further included.

首先,於步驟S10中提供一基板700。基板700可為鋁材等的金屬基板。First, a substrate 700 is provided in step S10. The substrate 700 may be a metal substrate such as aluminum.

接著,於步驟S20中形成第一模具710。此第一模具710係用以形成該些主微結構210。此步驟S20中,可利用超精密加工法,製作形成主微結構210的各種稜鏡、透鏡結構的模具作為第一模具710。Next, a first mold 710 is formed in step S20. This first mold 710 is used to form the main microstructures 210. In this step S20, a mold of various 稜鏡 and lens structures forming the main microstructure 210 can be produced as the first mold 710 by the ultra-precision machining method.

步驟S30中,更於第一模具710上形成第二模具720。此第二模具720係用以形成該些次微結構220。此步驟S30中,可對於第一模具710進行陽極處理,生成奈米級的凸起或凹陷氧化膜(圖5中僅表示凹陷氧化膜)。該些凸起或凹陷氧化膜的最大尺寸係小於100nm且大於0nm,而以介於20nm至100nm之間為較佳。此時,可使該些凸起或凹陷氧化膜依矩陣分布、蜂巢狀分布或者其他型態的分布,均勻地分布排列。In step S30, a second mold 720 is formed on the first mold 710. This second mold 720 is used to form the secondary microstructures 220. In this step S30, the first mold 710 may be subjected to anodization to form a nano-sized bump or recessed oxide film (only the recessed oxide film is shown in FIG. 5). The maximum size of the raised or recessed oxide films is less than 100 nm and greater than 0 nm, and preferably between 20 nm and 100 nm. At this time, the convex or depressed oxide films may be uniformly distributed according to a matrix distribution, a honeycomb distribution, or other types of distribution.

步驟S40中,更對於第一模具710及第二模具720進行化學拋光處理721,使模具表面精緻。In step S40, the first mold 710 and the second mold 720 are further subjected to a chemical polishing treatment 721 to make the mold surface fine.

步驟S50中,藉由塗佈UV膠、射出、熱壓塑膠成形等的習用方法,於化學拋光面721上填入形成微結構基材200的材料。此時,藉由第一模具710形成主微結構210,亦藉由第一模具710上的第二模具720,於主微結構210 的表面,同時形成次微結構220。待微結構基材200硬化,與模具710、720分離之後,即形成微結構基材200。In step S50, a material for forming the microstructure substrate 200 is filled on the chemical polishing surface 721 by a conventional method of applying UV glue, injection, hot press molding, or the like. At this time, the main microstructure 210 is formed by the first mold 710, and also by the second mold 720 on the first mold 710, in the main microstructure 210. The surface forms a secondary microstructure 220 at the same time. After the microstructure substrate 200 is hardened and separated from the molds 710, 720, the microstructure substrate 200 is formed.

依上述各步驟形成微結構基材200時,可依據入光側101的厚度、寬度形成微結構基材200,但亦可如圖6所示,依上述各步驟形成片狀基材300之後,於步驟S60中,依據入光側101的規格等預定的厚度、寬度,裁切片狀基材300形成微結構基材200。When the microstructure substrate 200 is formed according to the above steps, the microstructure substrate 200 may be formed according to the thickness and width of the light incident side 101. However, as shown in FIG. 6, after the sheet substrate 300 is formed according to the above steps, In step S60, the microstructure substrate 200 is formed by cutting the slice-shaped base material 300 in accordance with a predetermined thickness and width of the specification of the light incident side 101.

將微結構基材200以第二表面202固定於入光側101時,可利用習用的方法,例如光學膠貼合,將微結構基材200固定於入光側101。When the microstructure substrate 200 is fixed to the light incident side 101 by the second surface 202, the microstructure substrate 200 can be fixed to the light incident side 101 by a conventional method such as optical adhesive bonding.

依據上述各步驟所製造之導光板10係分別製造主體100與微結構基材200之後再將二者固定,但亦可直接於主體的入光側101形成主微結構210與次微結構220。若為如此的製造方法,則可直接將主微結構210與次微結構220形成於主體100,省去主體100與微結構基材200的尺寸對應的設計與固定等的製程,可更縮短製程,並且消除主體100與微結構基材200的界面的光的漏失。The light guide plate 10 manufactured according to each of the above steps is formed by separately manufacturing the main body 100 and the microstructure substrate 200, but the main microstructure 210 and the sub-micro structure 220 may be formed directly on the light incident side 101 of the main body. In the case of such a manufacturing method, the main microstructure 210 and the sub-micro structure 220 can be directly formed on the main body 100, and the process of designing and fixing the main body 100 corresponding to the size of the microstructure substrate 200 can be omitted, and the process can be further shortened. And eliminating the loss of light at the interface of the body 100 and the microstructured substrate 200.

如上所述,依據本發明的導光板,即可藉由次微結構,有效降低光的全反射現象,避免光入射至導光板時的漏失,並且,增大光入射至導光板的發散角度,減緩因光束集中於光源前端造成導光板的出光面出現亮暗帶的現象。As described above, according to the light guide plate of the present invention, the total reflection of light can be effectively reduced by the secondary microstructure, the leakage of light when the light is incident on the light guide plate is avoided, and the divergence angle of the light incident on the light guide plate is increased, Slow down the phenomenon that the light beam is concentrated on the front end of the light source, causing bright and dark bands on the light-emitting surface of the light guide plate.

10‧‧‧導光板10‧‧‧Light guide plate

100‧‧‧主體100‧‧‧ Subject

101‧‧‧入光側101‧‧‧light side

200‧‧‧微結構基材200‧‧‧Microstructured substrate

300‧‧‧片狀基材300‧‧‧Sheet substrate

201‧‧‧第一表面201‧‧‧ first surface

202‧‧‧第二表面202‧‧‧ second surface

203‧‧‧尖端203‧‧‧ cutting-edge

210‧‧‧主微結構210‧‧‧Main microstructure

220‧‧‧次微結構220‧‧‧ microstructures

700‧‧‧基板700‧‧‧Substrate

710‧‧‧第一模具710‧‧‧First mould

720‧‧‧第二模具720‧‧‧second mold

721‧‧‧化學拋光處理721‧‧‧Chemical polishing

P‧‧‧最大尺寸P‧‧‧Maximum size

以下各圖中繪示的各元件的尺寸(長、寬、厚度等) 僅為示意表示,只要在下述申請專利範圍中所界定的數值範圍內,各元件的實際尺寸可對應需要,適當地決定。Dimensions (length, width, thickness, etc.) of each component shown in the following figures It is merely a schematic representation, and the actual size of each component can be appropriately determined as needed within the numerical range defined in the following claims.

圖1係本發明之導光板一實施型態的示意圖。BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing an embodiment of a light guide plate of the present invention.

圖2係圖1之導光板的立體分解圖。2 is an exploded perspective view of the light guide plate of FIG. 1.

圖3係次微結構的一例的放大圖。Fig. 3 is an enlarged view showing an example of a secondary microstructure.

圖4係次微結構的另一例的放大圖。Figure 4 is an enlarged view of another example of a secondary microstructure.

圖5係形成微結構基材的示意圖。Figure 5 is a schematic illustration of the formation of a microstructured substrate.

圖6係裁切微結構基材的示意圖。Figure 6 is a schematic illustration of a cut microstructure substrate.

200‧‧‧微結構基材200‧‧‧Microstructured substrate

220‧‧‧次微結構220‧‧‧ microstructures

P‧‧‧最大尺寸P‧‧‧Maximum size

Claims (10)

一種導光板,其包含:一主體,具有一入光側;複數個主微結構,設置於該入光側,其中該些主微結構包含尖端的角度介於10度至50度之間的稜鏡結構;以及複數個次微結構,分布於該些主微結構表面,該些次微結構的最大尺寸小於100nm且大於0nm。 A light guide plate comprising: a main body having a light incident side; a plurality of main microstructures disposed on the light incident side, wherein the main microstructures comprise edges having a tip angle of between 10 and 50 degrees a mirror structure; and a plurality of sub-microstructures distributed on the surface of the main microstructures, the sub-micro structures having a maximum dimension of less than 100 nm and greater than 0 nm. 如請求項1所述之導光板,其中該些次微結構的最大尺寸係介於20nm至100nm之間。 The light guide plate of claim 1, wherein the maximum size of the secondary microstructures is between 20 nm and 100 nm. 如請求項1所述之導光板,其中該些次微結構的分布係呈矩陣分布。 The light guide plate of claim 1, wherein the distribution of the secondary microstructures is distributed in a matrix. 如請求項1所述之導光板,其中該些次微結構的分布係呈蜂巢狀分布。 The light guide plate of claim 1, wherein the distribution of the secondary microstructures is a honeycomb distribution. 一種導光板的製造方法,其包含下述步驟:提供一主體,該主體具有一入光側;形成一微結構基材,該微結構基材具有一第一表面以及與該第一表面相對之一第二表面,於該第一表面形成包含複數個次微結構的複數個主微結構,該些主微結構包含尖端的角度介於10度至50度之間的稜鏡結構,該些次微結構最大尺寸小於100nm且大於0nm,分布於該些主微結構上;以及 將該微結構基材以該第二表面固定於該入光側。 A method of manufacturing a light guide plate, comprising the steps of: providing a main body having a light incident side; forming a microstructure substrate having a first surface and opposite to the first surface a second surface forming a plurality of main microstructures including a plurality of sub-structures on the first surface, the main microstructures comprising a crucible structure having a tip angle of between 10 and 50 degrees, and The microstructure has a maximum dimension of less than 100 nm and greater than 0 nm and is distributed over the main microstructures; The microstructured substrate is fixed to the light incident side by the second surface. 如請求項5所述之製造方法,其中形成該微結構基材的步驟係包含下述步驟:形成第一模具,用以形成該些主微結構;以及形成第二模具於該第一模具上,用以形成該些次微結構。 The manufacturing method of claim 5, wherein the step of forming the microstructure substrate comprises the steps of: forming a first mold to form the main microstructures; and forming a second mold on the first mold Used to form the secondary microstructures. 如請求項6所述之製造方法,其中於形成該第二模具之後,更化學拋光處理該第二模具。 The manufacturing method of claim 6, wherein the second mold is further chemically polished after the second mold is formed. 如請求項5所述之製造方法,其中更裁切該微結構基材。 The manufacturing method of claim 5, wherein the microstructure substrate is further cut. 如請求項5至8之任一項所述之製造方法,其中該些次微結構的最大尺寸係介於20nm至100nm之間。 The manufacturing method according to any one of claims 5 to 8, wherein the minor microstructures have a maximum size of between 20 nm and 100 nm. 如請求項5至8之任一項所述之製造方法,其中形成該微結構基材的步驟係選自塗佈UV膠、射出、熱壓塑膠成形技術。 The manufacturing method according to any one of claims 5 to 8, wherein the step of forming the microstructured substrate is selected from the group consisting of UV-coated, injection, and hot-press plastic forming techniques.
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TW200951560A (en) * 2008-06-06 2009-12-16 Univ Nat Taiwan Composite light guiding curved surface structure
EP2323181A2 (en) * 2009-11-12 2011-05-18 LG Innotek Co., Ltd. Light emitting device and light emitting device package

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TW200951560A (en) * 2008-06-06 2009-12-16 Univ Nat Taiwan Composite light guiding curved surface structure
EP2323181A2 (en) * 2009-11-12 2011-05-18 LG Innotek Co., Ltd. Light emitting device and light emitting device package

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