TWI586614B - The groove processing method of the substrate and the groove processing device - Google Patents

Description

Substrate groove processing method and groove processing device

The present invention relates to a trench processing method, and more particularly to a trench processing method for a substrate in which a trench is formed on a surface of a substrate along a predetermined line. Further, it relates to a groove processing apparatus for a substrate for realizing the method.

The thin film solar cell is manufactured, for example, by the steps as shown below. That is, first, a lower electrode film made of a Mo film is formed on a substrate such as glass, and then a groove is formed in the lower electrode film, thereby dividing into a short strip shape. Next, a compound semiconductor film containing a chalcopyrite structure compound semiconductor film such as a CIGS film is formed on the lower electrode film. Then, one of the semiconductor films is removed in a stripe shape by trench processing and divided into short strips to cover the surface to form an upper electrode film. Finally, one of the upper electrode films is peeled off in a stripe shape by groove processing and divided into short strips.

In the manufacture of the above thin film solar cell, a scribing apparatus as disclosed in Patent Document 1 is used. The device of Patent Document 1 includes a platform on which a substrate is placed, a support member disposed above the platform, and a film cutting mechanism. The membrane cutting mechanism has a pendulum swaying body that is freely movable and freely movable in the direction in which the groove is formed.

In the apparatus of Patent Document 1, a groove processing tool is attached to the front end of the pendulum swaying body. With such a configuration, a groove can be formed in the film every time it is moved back and forth.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2010-245255

In the apparatus of Patent Document 1, the swaying body provided with the tool is supported by the raking shaft and is tilted. Further, the raking shaft is supported by the frame body and the two members.

In the apparatus of Patent Document 1, in order to smoothly sway the swaying body, it is necessary to provide a small margin between the swaying body and the members supporting the two members in the axial direction of the swaying shaft ( gap).

Due to the gap, if the swaying body is moved in the direction of the groove formation during the processing of the groove, the swaying body and the groove processing tool mounted thereon are swayed in the axial direction of the swaying shaft, and the groove processing tool The position becomes unstable. Therefore, the groove cannot be formed with high precision.

An object of the present invention is to stabilize a groove processing tool and perform groove processing with high precision when a groove is formed on a substrate by using a head of a groove processing tool.

A groove processing method for a substrate according to a first aspect of the present invention is a method of extending in the Y direction by a processing apparatus including a stage, a head, and a moving mechanism having a mounting surface on which a substrate is placed. The predetermined line forms a groove on the surface of the substrate. The head has a swaying shaft that slidably supports the groove machining tool and extends in the X direction, and a restriction mechanism that restricts movement of the groove machining tool along the sway axis. The moving mechanism is a mechanism for moving the platform and the head relatively in the horizontal direction in the X direction and the Y direction orthogonal to the X direction. Moreover, the trench processing method includes the following steps.

Substrate mounting step: the planned line of the substrate is aligned with respect to the Y direction The substrate is placed on the platform in a manner that is tilted within a range of angles.

Processing position calculation step: calculating a machining start position and a machining end position of a planned line of the substrate.

Processing step: groove processing is performed along the planned line while the groove machining tool is relatively moved in the X direction and the Y direction with respect to the substrate in accordance with the calculated machining start position and the machining end position.

Here, by moving the platform relative to the head, a groove is formed in the substrate by a groove processing tool mounted on the head.

At the time of the groove processing, the substrate is placed on the stage such that the planned line is inclined with respect to the Y direction within a predetermined angle range. Therefore, the groove processing tool is tilted with respect to the Y direction. At this time, since the machining resistance acts on the groove machining tool, the component force that is pressed against the axial direction of the sway axis and the component force that pulsates around the sway axis are acted upon by the machining resistance. head. Thus, the head is pressed against one end side of the swaying shaft by the machining resistance, so that the gap between the head and the member for supporting it disappears during processing. Therefore, the position of the head at the time of groove processing is stabilized, so that the groove can be formed with high precision.

A trench processing method for a substrate according to a second aspect of the present invention is the trench processing method according to the first aspect, wherein the substrate mounting step includes the following steps.

Step 1: Place the substrate on the platform.

Step 2: Confirm the posture of the substrate placed on the platform.

The third step: determining whether the planned line in the substrate is within a range of a predetermined tilt angle with respect to the Y direction.

Step 4: When the planned line of the substrate is not within a predetermined range of the tilt angle, the posture of the substrate is controlled so as to be within a predetermined angle range.

Here, when the substrate is placed on the stage, when the substrate is tilted within a predetermined angle range, the subsequent steps are directly performed. Moreover, when the substrate is placed on the platform, the substrate is not The posture of the substrate is controlled in the case of tilting within a predetermined angle range. Therefore, during the processing of the groove, the gap between the head and the member for supporting it does disappear, and the position of the head is stable.

A groove processing method for a substrate according to a third aspect of the present invention is the groove processing method according to the second aspect, wherein in the second step, an alignment mark of the substrate placed on the stage is photographed to confirm the posture of the substrate.

A groove processing apparatus for a substrate according to a fourth aspect of the present invention is a device for forming a groove on a surface of a substrate along a planned line extending in the Y direction, and includes: a platform having a mounting surface on which the substrate is placed, and a head The moving mechanism, the substrate posture confirming device, the substrate posture control mechanism, and the control means. The head has a swaying shaft extending in the X direction orthogonal to the Y direction, and has a restricting mechanism that supports the groove machining tool by the swaying shaft and restricts movement of the groove machining tool along the swaying axis. The moving mechanism relatively moves the platform and the head in the horizontal direction in the X direction and the Y direction. The substrate posture confirming device confirms the posture of the substrate placed on the platform. The substrate attitude control mechanism controls the posture of the substrate on the platform relative to the head. The control means controls the moving mechanism and the substrate posture control means based on the confirmation result from the substrate posture confirming means.

Moreover, the control means has a machining position calculation function and a movement control function. The machining position calculation function calculates the machining start position and the machining end position of the machining planned line placed on the substrate of the platform such that the planned line of the substrate becomes within a predetermined angular range. The movement control function controls the moving mechanism based on the calculation result of the machining position calculation function to move the groove machining tool from the machining start position to the machining end position.

Here, by moving the platform relative to the head, a groove is formed in the substrate by a groove processing tool mounted on the head.

At this time, as in the first aspect, the head is pressed against one end of the swaying shaft by the machining resistance, and the gap between the head and the member for supporting it disappears during processing. Therefore, the position of the head at the time of groove processing is stabilized, so that the groove can be formed with high precision.

The groove processing device for the substrate of the fifth aspect of the present invention is as in the fourth aspect The trench processing apparatus further includes a substrate attitude control mechanism that controls a posture of the substrate on the platform of the head. Further, the control means further has a substrate posture determination function and a substrate posture control function. The substrate posture determination function determines whether or not the planned line is inclined within a predetermined angle range with respect to the Y direction based on the result of the confirmation by the substrate posture checking device. The substrate posture control function controls the substrate posture control mechanism to control the posture of the substrate such that the planned line of the substrate is within a predetermined angle range when the predetermined line of processing of the substrate is not within a predetermined tilt angle range. Further, the control means controls the substrate posture control means and the moving means based on the confirmation result from the substrate posture confirming means.

A groove processing apparatus for a substrate according to a sixth aspect of the invention is the device of the fourth or fifth aspect, wherein the head has a base, a holder, and a pressing member. The holder is movably supported in the up and down direction with respect to the susceptor, and holds the groove processing tool. The pressing member presses the groove processing tool held by the holder to the substrate with a predetermined pressing force.

In the device, the groove processing tool presses the substrate with a predetermined pressing force by the pressing member and moves back and forth. Moreover, grooves are formed on the substrate during both the moving direction and the moving direction.

A groove processing apparatus for a substrate according to a seventh aspect of the invention is the apparatus of the sixth aspect, wherein the holder has a holder body, a support member fixed to the holder body, and a raking member. The swaying member is slidably supported by the holder main body and the support member, and is movably supported along the axial direction of the swaying shaft, and is provided with a groove processing tool at the front end, and is obtained by pulsing around the swaying shaft. Go to the moving position and the moving direction.

A groove processing apparatus for a substrate according to an eighth aspect of the present invention is the device of the seventh aspect, wherein a space for accommodating the swaying member supported by the swaying shaft is formed between the holder main body and the support member, and the restriction is restricted. The mechanism is composed of a holder body and a support member.

According to the invention as described above, the head of the groove processing tool is supported by using the sway When the groove is formed in the substrate, the groove processing tool can be stabilized, and the groove can be formed with high precision.

1‧‧‧ platform

2‧‧‧ Tools

3‧‧‧ head

4‧‧‧ Camera (substrate posture confirmation device)

6a‧‧‧Y direction drive mechanism

6b‧‧‧θ drive mechanism (substrate posture control mechanism)

6c‧‧‧X direction drive mechanism

17‧‧‧Holding

18‧‧‧ 揺 moving components

19‧‧‧ cylinder

22‧‧‧Holding body (restricting mechanism)

23‧‧‧Support members (restriction mechanism)

36‧‧‧Tool body

38a, 38b‧‧‧ knife

40‧‧‧Control Department

Fig. 1 is a perspective view showing the appearance of a groove processing apparatus for a substrate according to an embodiment of the present invention.

Figure 2 is a front elevational view of the head of the groove processing apparatus.

Fig. 3 is a schematic view for explaining the operation of the groove processing.

Figure 4 is a control block diagram of the groove processing apparatus.

Figure 5 is a flow chart of the groove processing.

Fig. 6 is a view showing control of the posture of the substrate during the groove processing.

Fig. 7 is a schematic view showing the movement of the swaying member during the groove processing.

Fig. 8 is a schematic view showing the movement of the swaying member during the groove processing.

Fig. 1 is a perspective view showing the appearance of a groove processing apparatus according to an embodiment of the present invention.

[The overall composition of the groove processing device]

This apparatus includes a table 1 on which the substrate W is placed, a head 3 on which a groove processing tool (hereinafter simply referred to as a tool) 2 is attached, and two cameras 4 and two monitors 5 as posture correcting devices for the substrate. .

The platform 1 is movable in the Y direction in the horizontal plane by the Y-direction drive mechanism 6a (see FIG. 4), and is rotatable to an arbitrary angle in the horizontal plane by the θ drive mechanism 6b (see FIG. 4). The drive mechanisms 6a and 6b respectively include a motor or the like and are disposed on the platform. Below the 1st. By rotating the stage 1 in the horizontal plane by the θ drive mechanism 6b, the posture of the substrate W placed on the stage 1 can be controlled.

The head 3 is movable in the X direction above the stage 1 by the X-direction drive mechanism 6c. Furthermore, as shown in FIG. 1, the X direction is a direction orthogonal to the Y direction in the horizontal plane. The X-direction drive mechanism 6c has a pair of support columns 7a and 7b, a guide rod 8 provided between the pair of support columns 7a and 7b, and a motor 10 that drives the guide 9 formed on the guide rod 8. The head 3 can be moved along the guide 9 in the X direction as described above.

The two cameras 4 are fixed to the pedestal 12, respectively. Each of the pedestals 12 is movable along an introducer 14 that is disposed on the support table 13 and extends in the X direction. The two cameras 4 are movable up and down, and images captured by the cameras 4 are displayed on the corresponding monitor 5.

[head]

In Fig. 2, the head 3 is drawn out. The head 3 has a plate-shaped base 16, a holder 17, and a cylinder 19.

The holder 17 is slidably supported in the vertical direction with respect to the susceptor 16 via a rail (not shown). The holder 17 has a holder body 22, a support member 23 fixed to the surface of the holder body 22, and a swaying member 18.

The holder body 22 is formed in a plate shape and has an opening 22a at the upper portion. The support member 23 is a rectangular member that is long in the lateral direction, and has a through hole 23a through which the swaying member 18 is inserted.

The swaying member 18 is slidably supported by the holder body 22 and the support member 23. More specifically, a space in which the swaying member is housed is formed between the holder main body 22 and the support member 23. Further, the swaying member 18 restricts the movement of the yaw axis in the axial direction by the holder body 22 and the support member 23. That is, the retaining body 22 and the support member 23 constitute a restricting mechanism. The swaying member 18 has a lower tool mounting portion 24 and extends upward from the tool mounting portion 24 An extension 25 is formed.

A groove is formed in the tool mounting portion 24, and the tool 2 is inserted into the groove, and the tool 2 is fixed in the groove by the fixing plate 24a.

A through hole 25a penetrating in a direction orthogonal to the groove forming direction in the horizontal direction is formed in a lower portion of the extension portion 25. Further, the swaying member 18 is freely movable around the pin 26 penetrating the hole 25a. The pin 26 is supported by the holder body 22 and the support member 23. Further, between the swaying member 18 and the holder main body 22 and the support member 23, a predetermined gap is provided so that the swaying member 18 can be smoothly swayed. Moreover, the swaying member 18 is movable in the axial direction along the pin 26.

A pair of restriction members 27a and 27b are provided on the left and right sides of the upper end portion 25b of the extension portion 25. As shown in Fig. 3, each of the restricting members 27a and 27b has cylindrical members 28a and 28b fixed to the holder main body 22, and springs 29a and 29b inserted into the inside of the tubular members 28a and 28b. Further, by abutting the front ends of the respective springs 29a and 29b against the upper end portion 25b of the extension portion 25, the oscillating member 18 is maintained at the neutral position as shown in Figs. 2 and 3(b). Further, the swaying member 18 is swayed and pressed against any one of the springs 29a and 29b, and the upper end portion 25b of the extended portion 25 abuts against the tubular members 28a and 28b, thereby restricting the sway angle. Furthermore, FIG. 3 schematically shows the movement of the swaying member 18.

The cylinder 19 is fixed to the upper surface of the cylinder supporting member 30. The cylinder support member 30 is disposed on the upper portion of the holder 17 and is fixed to the base 16 . A hole penetrating in the vertical direction is formed in the cylinder supporting member 30, and a piston rod (not shown) of the cylinder 19 penetrates the through hole, and the rod end is coupled to the holder 17.

Further, a spring supporting member 31 is provided on the upper portion of the susceptor 16. A spring 32 is provided between the spring support member 31 and the holder 17, and the holder 17 is pressed upward by the spring 32. By the spring 32, the dead weight of the holder 17 can be substantially eliminated.

On the left and right sides of the holder 17, a pair of air supply portions 34a are provided, 34b. Each of the pair of air supply portions 34a and 34b has the same configuration, and has a joint 35 and an air nozzle 36, respectively.

[Control Department]

The groove processing device has a control unit 40 that controls each unit. As shown in FIG. 4, image data from the camera 4 is input to the control unit 40. Further, the control unit 40 is connected to the cylinder 19 of the head 3, the Y-direction drive mechanism 6a for moving the platform 1 in the Y direction, the X-direction drive mechanism 6c for moving the head 3 in the X direction, and A θ drive mechanism 6b that rotates the platform 1 in a horizontal plane.

The control unit 40 is constituted by a microcomputer and has the following functions.

Substrate posture determination function: Based on the image data obtained by the camera 4, it is determined whether or not the planned line is tilted within a predetermined angle range with respect to the Y direction based on the substrate W placed on the stage 1.

Substrate posture control function: When the planned line of the substrate W is not within a predetermined tilt angle range, the θ drive mechanism is controlled to control the posture of the substrate W in such a manner that the planned line of the substrate W is within a predetermined angle range. Features.

The machining position calculation function is a function of calculating a machining start position and a machining end position of the machining planned line in the substrate W controlled by the posture of the substrate posture control function.

Movement control function: The function of controlling the X and Y moving mechanism 6 to move the tool 2 from the machining start position to the machining end position according to the calculation result of the machining position calculation mechanism.

[tool]

A knife is formed at the end of the tool 2 before. Specifically, as shown in FIG. 2, the first blade 38a and the second blade 38b are formed on both sides in the moving direction at the front end of the blade. Here, the first blade 38a is a blade for performing groove processing during the forward movement, and the second blade 38b is for performing groove during the movement. Slot processing knife.

[groove processing action]

The operation of groove processing the thin film solar cell substrate using the above apparatus will be described using the flowchart of Fig. 5 .

When the substrate W is placed on the stage 1, the posture of the substrate W is photographed using the camera 4 in step S1. In step S2, the direction of the planned line is calculated based on the photographed data. That is, for example, an alignment mark or the like on the substrate W is photographed, and the inclination angle of the planned line in the substrate W with respect to the Y direction is calculated.

Next, in step S3, it is determined whether or not the inclination angle obtained in step S2 is a predetermined inclination angle. When the inclination angle is not within the predetermined angle range, the process proceeds from step S3 to step S4. In step S4, as shown in FIGS. 6(a) and (b), the stage 1 is rotated by the θ drive mechanism 6b to control the posture of the substrate W. Further, the inclination angle of the planned line of the substrate W with respect to the Y direction is entered within a predetermined angle range (here, the inclination angle is θ 1). Thereafter, the process proceeds to step S5.

Further, in a state where the substrate W is placed on the stage 1, when the inclination angle of the planned line with respect to the Y direction is already within a predetermined angle range, the process proceeds from step S3 to step S5.

In step S5, the machining start position and the machining end position of the machining planned line are based on the direction of the machining planned line obtained in step S2 or the inclination angle θ1 of the posture control by step S4 (refer to FIG. 6(b). )) Perform calculations.

In step S6, the tool 2 is moved from the machining start position to the machining end position, and groove machining is performed.

Specifically, first, the air cylinder 19 is driven to lower the holder 17 and the swaying member 18, and the front end of the tool 2 is brought into contact with the film. At this time, the tool 2 applies pressure to the film by The air pressure supplied to the cylinder 19 is adjusted. In the following description, the substrate W is placed on the stage 1 in a posture inclined only by the angle θ 1 with respect to the Y direction.

Next, the X-direction drive mechanism 6c and the Y-direction drive mechanism 6b are driven to scan the head portion 3 along the groove processing planned line L. Fig. 3 schematically shows the posture of the swaying member 18 and the tool 2 at this time.

When moving in the forward direction shown in Fig. 3 (a) (when moving to the right side in Fig. 3), the first blade 38a comes into contact with the film on the substrate. Here, as shown in FIG. 6(b) and FIG. 7, the processing line L is inclined only by the angle θ1 with respect to the Y direction, so that the tool 2 is moved in the +M direction to generate the machining resistance (R), and along the 揺The first component force (Fy) that is swayed around the moving shaft and the second component force (Fx) that is pressed against the holder body 22 side act on the swaying member 18.

With the above first component force (Fy), the swaying member 18 is pivoted clockwise around the pin 26. As shown in FIG. 3(a), the sway is restricted by abutting the upper end portion 25b of the swaying member 18 against the right cylindrical member 28a. Further, by the second component force (Fx), the swaying member 18 moves toward the holder body 22 side and is pressed against the holder body 22. That is, the holder body 22 limits the movement of the swaying axis along the swaying member 18 and the tool 2 held by the swaying member 18.

As described above, the tool 2 is stabilized in the posture shown in FIGS. 3( a ) and 7 , and moves in the +M direction in this state to form a groove.

Next, in step S7, it is judged whether or not the groove processing is completed for all the planned lines. When the groove processing is not completed for all the processing lines, the process returns from step S7 to step S5, and the same processing as described above is repeatedly executed.

That is, the head 3 is relatively moved with respect to the substrate, and the tool 2 is moved to the groove processing planned line which is to be lowered next. Further, in the same manner as described above, the tool 2 is pressed against the film on the substrate, and the head 3 is moved in the opposite direction to the above.

At the time of this movement (when moving to the left in FIG. 3), the second blade 38b is in contact with the film on the substrate. Here, as shown in the schematic diagram of FIG. 8, as opposed to when moving to the opposite direction, A machining resistance (-R) occurs. Then, the first component force (-Fy) that is swayed along the periphery of the sway shaft and the second component force (-Fx) that is pressed against the support member 23 side act on the swaying member 18.

With the above first component force (-Fy), the swaying member 18 is tilted counterclockwise around the pin 26. As shown in FIG. 3(c), the sway is restricted by abutting the upper end portion 25b of the swaying member 18 against the right cylindrical member 28b. Further, by the second component force (-Fx), the swaying member 18 is moved toward the support member 23 side and pressed against the support member 23. That is, the support member 23 restricts the movement of the sway axis along the swaying member 18 and the tool 2 held by the swaying member 18.

As described above, the tool 2 is stabilized in the posture shown in FIGS. 3(c) and 8 and moves in the -M direction in this state to form a groove.

Further, when the moving direction is calculated, when calculating the machining start position and the machining end position, it is necessary to perform the distance of the moving portion (gap portion) of the tool 2 along the sway axis in addition to the distance from the portion between the planned lines. The coordinates are corrected.

The above processing is repeated, and if the groove processing for all the planned lines is completed, the processing is terminated.

[feature]

Since the planned line for moving the head 3 is inclined only by a predetermined angle with respect to the Y direction, the squeezing member 18 is pressed against the axial direction side of the swaying shaft by machining resistance during machining. Therefore, the posture of the swaying member 18 is stabilized during processing, and the groove can be formed with high precision.

[Other Embodiments]

The present invention is not limited to the above embodiments, and various modifications and changes can be made without departing from the scope of the invention.

18‧‧‧ 揺 moving components

22‧‧‧ Keeping the body

23‧‧‧Support members

26‧‧ ‧ sales

Fx‧‧‧2nd force

Fy‧‧1st force

L‧‧‧ groove processing line

R‧‧‧Processing resistance

θ 1‧‧‧ tilt angle

Claims (7)

A method for processing a groove of a substrate, wherein the groove is formed on the surface of the substrate along a predetermined line extending in the Y direction by a processing device, the processing device comprising: a platform having a mounting surface on which the substrate is placed; a head having a swaying shaft that slidably supports the groove machining tool and extends in the X direction, and a restriction mechanism that restricts movement of the groove machining tool along the sway axis; and a movement mechanism for The platform moves relative to the head in a horizontal plane in the X direction and a Y direction orthogonal to the X direction; the head has a base; and a holder that moves freely in the up and down direction with respect to the base The holder is supported and holds the groove processing tool; and a pressing member that presses the groove processing tool held by the holder to the substrate with a predetermined pressing force; the holder has: a holder body; a support member The holder body is fixed to the holder body; and the swaying member is slidably supported by the holder body and the support member, and is movably supported along the axial direction of the swaying shaft, and is mounted at the front end Have a groove processing tool, pulsing along the periphery of the swaying axis and obtaining a moving position and a moving position; the groove processing method of the substrate includes: a substrate mounting step, wherein the predetermined line of processing of the substrate is relative to the The Y direction is placed on the platform in a manner of tilting within a predetermined angle range; and the processing position calculation step is performed on the processing start position and the processing end position of the processing line of the substrate; In the processing step, the groove processing is performed along the planned processing line while the groove processing tool relatively moves the substrate in the X direction and the Y direction based on the calculated machining start position and the machining end position. The method for processing a substrate according to the first aspect of the invention, wherein the substrate loading step comprises: a first step of loading the substrate on the platform; and a second step of confirming the substrate placed on the substrate a third step of determining whether the planned line in the substrate is within a predetermined tilt angle with respect to the Y direction; and in the fourth step, the planned line on the substrate is not the predetermined tilt angle range In the case of the inside, the posture of the substrate is controlled so as to be within the predetermined angle range. The method of processing a substrate according to claim 2, wherein in the second step, an alignment mark of the substrate placed on the stage is photographed to confirm the posture of the substrate. The method for processing a groove of a substrate according to any one of claims 1 to 3, wherein between the holder body and the support member, the swaying member supported by the swaying shaft is formed. In the space, the restriction mechanism is constituted by the holder body and the support member. A groove processing device for a substrate, wherein the groove processing device for forming a groove on a surface of the substrate along a predetermined line extending in the Y direction comprises: a platform having a mounting surface on which the substrate is placed; and a head portion a raking shaft extending in an X direction orthogonal to the Y direction, the swaying shaft slidably supporting the groove machining tool, and having a restriction mechanism for restricting movement of the groove machining tool along the sway axis; a moving mechanism for moving the platform and the head relative to the head in a horizontal direction in the X direction and the Y direction; and a substrate posture confirming device for confirming a posture of the substrate placed on the platform; a substrate posture control mechanism that controls a posture of the substrate on the platform with respect to the head; and a control means that controls the movement mechanism and the substrate posture control mechanism based on a confirmation result from the substrate posture confirmation device; the control The method includes: a machining position calculation function that calculates a machining start position and a machining end position of a machining planned line placed in a substrate of the platform in such a manner that a predetermined line of processing of the substrate is within the predetermined angle range; and a movement control function that controls the movement mechanism to move the groove machining tool from the machining start position to the machining end position according to a calculation result of the machining position calculation function; the head has a base; a holder, which is opposite to the holder The base is movably supported in the up and down direction and holds the groove processing tool; and a pressing member that presses the groove processing tool held by the holder to the substrate with a predetermined pressing force; the holder Having: a holder body; a support member fixed to the holder body; and a swaying member, which is protected The main body and the support member are slidably supported and movably supported along the axial direction of the swaying shaft, and the groove machining tool is mounted at the front end, and is moved along the periphery of the swaying shaft. Get the moving position and the moving position. The groove processing device for a substrate according to claim 5, wherein the groove processing device further comprises a substrate posture control mechanism for controlling a posture of the substrate on the platform with respect to the head; The control means further includes a substrate posture determining function for determining whether or not the planned line is inclined within a predetermined angle range with respect to the Y direction based on the result of the confirmation by the substrate posture checking means. And a substrate posture control function for controlling the substrate posture control mechanism so that the planned line of the substrate becomes within the predetermined angle range when the planned line of the substrate is not within the predetermined tilt angle range The posture of the substrate is controlled, and the substrate posture control mechanism and the moving mechanism are controlled based on the confirmation result from the substrate posture confirming device. The groove processing apparatus for a substrate according to claim 5 or 6, wherein a space for accommodating the swaying member supported by the swaying shaft is formed between the holder main body and the support member, the restriction The mechanism is constituted by the holder body and the support member.