TWI585378B - Temperature sensing circuit and its conversion circuit - Google Patents
Temperature sensing circuit and its conversion circuit Download PDFInfo
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Description
本發明係有關一種感測電路及其轉換電路,其係尤指一種溫度感測電路及其轉換電路。 The present invention relates to a sensing circuit and a conversion circuit thereof, and more particularly to a temperature sensing circuit and a conversion circuit thereof.
按,溫度感測電路用於控制各式各樣的積體電路功能,這些動態功能包括動態隨機存取記憶體的更新頻率和延遲單元的延遲時間,兩者都隨溫度而變化,晶片溫度感測器係隨著溫度的變化而作調節或改變動態隨機存取記憶體之更新的頻率;同樣的,晶片溫度感測器也用於調節或穩定所發生的電路延遲時間的變化,電路延遲時間的穩定性對電路而言是很重要的,其取決於提供給正確電路應用上所需的電路延遲的精確性,例如一電路延遲連鎖電路;另外,晶片溫度感測電路也被寄與可以實現數位溫度計應用之期望。 Press, the temperature sensing circuit is used to control a variety of integrated circuit functions, including the update frequency of the dynamic random access memory and the delay time of the delay unit, both of which vary with temperature, and the temperature of the wafer The detector adjusts or changes the frequency of the dynamic random access memory as the temperature changes; similarly, the wafer temperature sensor is also used to adjust or stabilize the variation of the circuit delay time that occurs, the circuit delay time. The stability of the circuit is important to the circuit, depending on the accuracy of the circuit delay required to provide the correct circuit application, such as a circuit delay chain circuit; in addition, the wafer temperature sensing circuit is also implemented Expectations of digital thermometer applications.
由於溫度感測電路佔用部分具有其它整合功能的積體電路,那麼這些整合的溫度感測電路佔用最小的晶片面積和消耗最少的晶片功率是非常重要的,此外,對整合的溫度感測電路之其它重要設計參數則是溫度測量本身的精確性。 Since the temperature sensing circuit occupies part of the integrated circuit with other integrated functions, it is very important that these integrated temperature sensing circuits occupy the smallest wafer area and consume the least amount of wafer power. In addition, for the integrated temperature sensing circuit Other important design parameters are the accuracy of the temperature measurement itself.
請參閱第一圖,係為習知技術之溫度感測電路的電路圖。如圖所示,習知技術的溫度感測電路9包含一第一延遲單元90、一第二延遲單元92與一及閘94。第一延遲單元90接收一輸入訊號START ,並延遲輸入訊號START而產生一第一延遲訊號T1,第二延遲單元92接收輸入訊號START,並延遲輸入訊號START而產生一第二延遲訊號T2,及閘94接收第一延遲訊號T1與第二延遲訊號T2,並邏輯運算第一延遲訊號T1與第二延遲訊號T2而產生一溫度訊號TOT。 Please refer to the first figure, which is a circuit diagram of a temperature sensing circuit of the prior art. As shown, the temperature sensing circuit 9 of the prior art includes a first delay unit 90, a second delay unit 92, and a gate 94. The first delay unit 90 receives an input signal START and delays the input signal START to generate a first delay signal T 1 . The second delay unit 92 receives the input signal START and delays the input signal START to generate a second delay signal T 2 . And the gate 94 receives the first delay signal T 1 and the second delay signal T 2 , and logically operates the first delay signal T 1 and the second delay signal T 2 to generate a temperature signal T OT .
請一併參閱第二圖,係為習知技術之溫度感測電路的波形圖。如圖所示,由於第一延遲單元90所輸出的第一延遲訊號T1會隨溫度變動而變動,而第二延遲單元92所輸出的第二延遲訊號T2並不會隨溫度變動而變動,所以第一延遲訊號T1與第二延遲訊號T2之間的差異就為含有溫度因素的訊號,也就是說,及閘94在第一延遲訊號T1之準位與第二延遲訊號T2之準位皆為高準位時,而產生溫度訊號TOT,以得知溫度大小。 Please refer to the second figure together, which is a waveform diagram of a temperature sensing circuit of the prior art. As shown in the figure, the first delay signal T 1 outputted by the first delay unit 90 fluctuates with temperature fluctuation, and the second delay signal T 2 output by the second delay unit 92 does not change with temperature fluctuation. Therefore, the difference between the first delay signal T 1 and the second delay signal T 2 is a signal containing a temperature factor, that is, the gate 94 is at the level of the first delay signal T 1 and the second delay signal T When the level of 2 is high level, the temperature signal T OT is generated to know the temperature.
然而,不隨溫度變動而變動的第二延遲單元92的電路複雜,並且成本高,所以,習知技術的溫度感測電路因使用不隨溫度變動而變動的第二延遲單元92而增加整體地電路面積,並且增加成本。 However, the circuit of the second delay unit 92 that does not fluctuate with temperature changes is complicated and costly. Therefore, the temperature sensing circuit of the prior art increases overall by using the second delay unit 92 that does not fluctuate with temperature fluctuations. Circuit area and increase cost.
因此,如何針對上述問題而提出一種新穎溫度感測電路及其轉換電路,其可縮小整體的電路面積,並且節省成本,使可解決上述之問題。 Therefore, how to solve the above problems and propose a novel temperature sensing circuit and a conversion circuit thereof, which can reduce the overall circuit area and save cost, so that the above problems can be solved.
本發明之目的之一,係提供一種溫度感測電路及其轉換電路,其不需使用不隨溫度變動而變動的延遲單元,而縮小整體電路面積,進而達到節省成本的目的。 One of the objects of the present invention is to provide a temperature sensing circuit and a conversion circuit thereof that do not need to use a delay unit that does not vary with temperature fluctuations, thereby reducing the overall circuit area, thereby achieving cost saving.
本發明之目的之一,係提供一種溫度感測電路及其轉換電路,其藉由一電容設置於一反相器與一輸出端之間,以縮小整體電路面 積,並增加溫度感測的解析度。 One of the objectives of the present invention is to provide a temperature sensing circuit and a conversion circuit thereof, which are disposed between an inverter and an output terminal by a capacitor to reduce the overall circuit surface. Accumulate and increase the resolution of temperature sensing.
為了達到上述所指稱之各目的與功效,本發明係揭示了一種溫度感測電路,其包含一第一轉換電路、一計數電路與一第二轉換電路。第一轉換電路接收一輸入訊號,並依據一溫度而延遲輸入訊號,產生一延遲訊號;計數電路接收延遲訊號與輸入訊號,並依據一時脈計數延遲訊號與輸入訊號的時間差,產生一計數資料;第二轉換電路接收計數資料,並依據一溫度對照表而對應計數資料產生一溫度資料。如此,本發明不需使用不隨溫度變動而變動的延遲單元,進而達到節省成本的目的。 In order to achieve the above-mentioned various purposes and effects, the present invention discloses a temperature sensing circuit including a first conversion circuit, a counting circuit and a second conversion circuit. The first conversion circuit receives an input signal and delays the input signal according to a temperature to generate a delay signal; the counting circuit receives the delay signal and the input signal, and generates a count data according to the time difference between the delay signal and the input signal according to a clock count; The second conversion circuit receives the count data, and generates a temperature data corresponding to the count data according to a temperature comparison table. Thus, the present invention does not require the use of a delay unit that does not vary with temperature fluctuations, thereby achieving cost saving.
再者,本發明之第一轉換電路為一延遲電路,延遲電路包含一第一電晶體、一第二電晶體與一電容。第一電晶體之一第一端耦接一電源端,第一電晶體之一第二端耦接延遲電路之一輸出端,第一電晶體之一控制端接收輸入訊號;第二電晶體之一第一端耦接第一電晶體之第二端與輸出端,第二電晶體之一第二端耦接一接地端,第二電晶體之一控制端接收輸入訊號;電容之一端耦接電源端與第一電晶體之第一端,電容之另一端耦接輸出端、第一電晶體第二端與第二電晶體之第一端。如此,本發明藉由電容而達到縮小整體電路面積,並增加溫度感測的解析度。 Furthermore, the first conversion circuit of the present invention is a delay circuit, and the delay circuit includes a first transistor, a second transistor and a capacitor. The first end of the first transistor is coupled to a power terminal, and the second end of the first transistor is coupled to one of the output ends of the delay circuit, and one of the first transistors receives the input signal; the second transistor A first end is coupled to the second end of the first transistor and the output end, and a second end of the second transistor is coupled to a ground end, and one of the second transistors receives the input signal; one end of the capacitor is coupled The power terminal is coupled to the first end of the first transistor, and the other end of the capacitor is coupled to the output end, the second end of the first transistor, and the first end of the second transistor. As such, the present invention achieves a reduction in overall circuit area by capacitance and increases resolution of temperature sensing.
另外,本發明之延遲電路另一實施例也可包含一第一電晶體、一第二電晶體與一電容。第一電晶體之一第一端耦接一電源端,第一電晶體之一第二端耦接延遲電路之一輸出端,第一電晶體之一控制端接收輸入訊號;第二電晶體之一第一端耦接第一電晶體之第二端與輸出端,第二電晶體之一第二端耦接一接地端,第二電晶體之一控制端接收輸入訊號;電容之一端耦接電源端與第 一電晶體之該第二端、第二電晶體之該第一端與輸出端,電容之另一端耦接接地端。如此,本發明藉由電容而達到縮小整體電路面積,並增加溫度感測的解析度。 In addition, another embodiment of the delay circuit of the present invention may also include a first transistor, a second transistor, and a capacitor. The first end of the first transistor is coupled to a power terminal, and the second end of the first transistor is coupled to one of the output ends of the delay circuit, and one of the first transistors receives the input signal; the second transistor A first end is coupled to the second end of the first transistor and the output end, and a second end of the second transistor is coupled to a ground end, and one of the second transistors receives the input signal; one end of the capacitor is coupled Power terminal and The second end of the transistor, the first end and the output end of the second transistor, and the other end of the capacitor are coupled to the ground end. As such, the present invention achieves a reduction in overall circuit area by capacitance and increases resolution of temperature sensing.
1、9‧‧‧溫度感測電路 1, 9‧‧‧ Temperature sensing circuit
10‧‧‧第一轉換電路 10‧‧‧First conversion circuit
12、14‧‧‧反相器 12, 14‧‧‧Inverter
120‧‧‧第一電晶體 120‧‧‧First transistor
122‧‧‧第二電晶體 122‧‧‧Second transistor
20‧‧‧計數電路 20‧‧‧Counting circuit
200‧‧‧邏輯單元 200‧‧‧ logical unit
202‧‧‧計數單元 202‧‧‧counting unit
30‧‧‧第二轉換電路 30‧‧‧Second conversion circuit
90‧‧‧第一延遲電路 90‧‧‧First delay circuit
92‧‧‧第二延遲電路 92‧‧‧second delay circuit
94‧‧‧及閘 94‧‧‧ and gate
START‧‧‧輸入訊號 START‧‧‧Input signal
T1‧‧‧第一延遲訊號 T 1 ‧‧‧first delay signal
T2‧‧‧第二延遲訊號 T 2 ‧‧‧second delay signal
TOT‧‧‧溫度訊號 T OT ‧‧‧temperature signal
DA、DA1、DA2‧‧‧延遲訊號 DA, DA1, DA2‧‧‧ delay signal
XR、XR1、XR2‧‧‧差異訊號 XR, XR1, XR2‧‧‧ difference signal
CNT、CNT1、CNT2‧‧‧計數資料 CNT, CNT1, CNT2‧‧‧ count data
CLK‧‧‧時脈 CLK‧‧‧ clock
C、C1、C2‧‧‧電容 C, C1, C2‧‧‧ capacitor
R、R1、R2‧‧‧電阻 R, R1, R2‧‧‧ resistance
IN‧‧‧輸入端 IN‧‧‧ input
OUT‧‧‧輸出端 OUT‧‧‧ output
VDD‧‧‧電源端 V DD ‧‧‧ power terminal
第一圖為習知技術之溫度感測電路的電路圖。 The first figure is a circuit diagram of a temperature sensing circuit of the prior art.
第二圖為習知技術之溫度感測電路的波形圖。 The second figure is a waveform diagram of a temperature sensing circuit of the prior art.
第三圖為本發明之一實施例之溫度感測電路的電路圖。 The third figure is a circuit diagram of a temperature sensing circuit according to an embodiment of the present invention.
第四圖為本發明之一第一實施例之溫度感測電路的波形圖。 The fourth figure is a waveform diagram of a temperature sensing circuit according to a first embodiment of the present invention.
第五圖為本發明之一第二實施例之溫度感測電路的波形圖。 Fig. 5 is a waveform diagram of a temperature sensing circuit according to a second embodiment of the present invention.
第六A圖為本發明之一第一實施例之第一轉換電路的電路圖。 Figure 6A is a circuit diagram of a first conversion circuit of a first embodiment of the present invention.
第六B圖為本發明之一第二實施例之第一轉換電路的電路圖。 Figure 6B is a circuit diagram of a first conversion circuit of a second embodiment of the present invention.
第六C圖為本發明之一第三實施例之第一轉換電路的電路圖。 Figure 6C is a circuit diagram of a first conversion circuit of a third embodiment of the present invention.
第七A圖為本發明之一第四實施例之第一轉換電路的電路圖。 Figure 7A is a circuit diagram of a first conversion circuit according to a fourth embodiment of the present invention.
第七B圖為本發明之一第五實施例之第一轉換電路的電路圖。 Figure 7B is a circuit diagram of a first conversion circuit according to a fifth embodiment of the present invention.
第七C圖為本發明之一第六實施例之第一轉換電路的電路圖。 Figure 7C is a circuit diagram of a first conversion circuit of a sixth embodiment of the present invention.
第八A圖為本發明之一第七實施例之第一轉換電路的電路圖。 Figure 8A is a circuit diagram of a first conversion circuit of a seventh embodiment of the present invention.
第八B圖為本發明之一第八實施例之第一轉換電路的電路圖。 Figure 8B is a circuit diagram of a first conversion circuit of an eighth embodiment of the present invention.
第八C圖為本發明之一第九實施例之第一轉換電路的電路圖。 Figure 8C is a circuit diagram of a first conversion circuit of a ninth embodiment of the present invention.
第九A圖為本發明之一第十實施例之第一轉換電路的電路圖。 Figure 9A is a circuit diagram of a first conversion circuit of a tenth embodiment of the present invention.
第九B圖為本發明之一第十一實施例之第一轉換電路的電路圖。 Figure IXB is a circuit diagram of a first conversion circuit of an eleventh embodiment of the present invention.
第九C圖為本發明之一第十二實施例之第一轉換電路的電路圖。 Ninth C is a circuit diagram of a first conversion circuit according to a twelfth embodiment of the present invention.
在說明書及後續的申請專利範圍當中使用了某些詞彙來指稱特定的元件。所屬領域中具有通常知識者應可理解,硬體製造商可能會用不同的名詞來稱呼同一個元件。本說明書及後續的申請專利範圍並不以名稱的差異來作為區分元件的方式,而是以元件在功能上的差異來作為區分的準則。在通篇說明書及後續的請求項當中所提及的「包含」係為一開放式的用語,故應解釋成「包含但不限定於」。以外,「耦接」一詞在此係包含任何直接及間接的電氣連接手段。因此,若文中描述一第一裝置耦接於一第二裝置,則代表該第一裝置可直接電氣連接於該第二裝置,或透過其他裝置或連接手段間接地電氣連接至該第二裝置。 Certain terms are used throughout the description and following claims to refer to particular elements. Those of ordinary skill in the art should understand that a hardware manufacturer may refer to the same component by a different noun. The scope of this specification and the subsequent patent application do not use the difference of the names as the means for distinguishing the elements, but the difference in function of the elements as the criterion for distinguishing. The term "including" as used throughout the specification and subsequent claims is an open term and should be interpreted as "including but not limited to". In addition, the term "coupled" is used herein to include any direct and indirect electrical connection. Therefore, if a first device is coupled to a second device, it means that the first device can be directly electrically connected to the second device or indirectly electrically connected to the second device through other devices or connection means.
為使 貴審查委員對本發明之特徵及所達成之功效有更進一步之瞭解與認識,謹佐以較佳之實施例及配合詳細之說明,說明如後:請參閱第三圖,係為本發明之一實施例之溫度感測電路的電路圖。如圖所示,本發明之溫度感測電路1包含一第一轉換電路10、一計數電路20與一第二轉換電路30。 In order to provide a better understanding and understanding of the features of the present invention and the efficacies of the present invention, the preferred embodiments and the detailed description are as follows: please refer to the third figure, which is the present invention. A circuit diagram of a temperature sensing circuit of an embodiment. As shown, the temperature sensing circuit 1 of the present invention includes a first conversion circuit 10, a counting circuit 20 and a second conversion circuit 30.
第一轉換電路10接收一輸入訊號START,並依據一溫度而延遲輸入訊號START,產生一延遲訊號DA,於本實施例中,第一轉換電路10為一延遲電路。第一轉換電路10會隨溫度變動而產生不同延 遲時間的延遲訊號DA,例如當溫度為30度時,第一轉換電路10係延遲輸入訊號START於10豪秒(ms)後,產生延遲訊號DA;當溫度為40度時,第一轉換電路10則延遲輸入訊號START於20豪秒(ms)後,產生延遲訊號DA,所以,第一轉換電路10會依據不同的溫度而產生不同延遲時間的延遲訊號DA,因此,第一轉換電路10可以稱為溫度對時間的轉換電路。 The first conversion circuit 10 receives an input signal START and delays the input signal START according to a temperature to generate a delay signal DA. In the embodiment, the first conversion circuit 10 is a delay circuit. The first conversion circuit 10 will have different delays depending on temperature changes. The delay signal DA of the late time, for example, when the temperature is 30 degrees, the first conversion circuit 10 delays the input signal START after 10 ft (ms), and generates the delay signal DA; when the temperature is 40 degrees, the first conversion circuit 10, after the delayed input signal START is at 20 megaseconds (ms), the delay signal DA is generated. Therefore, the first conversion circuit 10 generates delay signals DA of different delay times according to different temperatures. Therefore, the first conversion circuit 10 can It is called temperature-to-time conversion circuit.
計數電路20耦接第一轉換電路10,計數電路20接收延遲訊號DA與輸入訊號START,並依據一時脈CLK而計數延遲訊號DA與輸入訊號START之間的時間差,產生一計數資料CNT。於此,計數電路20接收延遲訊號DA與輸入訊號START,並比較延遲訊號DA與輸入訊號START之間的差異,而依據時脈CLK而計數延遲訊號DA與輸入訊號START之間延遲的時間差,而產生計數資料CNT,其中,由於第一轉換電路10會依據不同溫度而延遲不同時間產生延遲訊號DA,所以,計數電路20計數延遲訊號DA與輸入訊號START之間的時間差而產生的計數資料,就包含溫度的訊息。 The counting circuit 20 is coupled to the first converting circuit 10, and the counting circuit 20 receives the delay signal DA and the input signal START, and counts the time difference between the delayed signal DA and the input signal START according to a clock CLK to generate a count data CNT. In this case, the counting circuit 20 receives the delay signal DA and the input signal START, and compares the difference between the delay signal DA and the input signal START, and counts the time difference between the delay signal DA and the input signal START according to the clock CLK. The count data CNT is generated. The first conversion circuit 10 delays the generation of the delay signal DA according to different temperatures. Therefore, the counting circuit 20 counts the count data generated by the time difference between the delay signal DA and the input signal START. A message containing temperature.
第二轉換電路30耦接計數電路20,第二轉換電路接收計數資料CNT,並依據一溫度對照表而對應計數資料CNT產生一溫度資料。也就是說,第二轉換電路30內建溫度對照表,此溫度對照表包含複數的計數資料CNT,而每一筆計數資料CNT皆對應一個溫度,例如當計數資料CNT為20時,其所對應的溫度為25度,所以第二轉換電路30輸出的溫度資料為25度;當計數資料CNT為30時,其所對應溫度則為30度,所以第二轉換電路30所輸出的溫度資料為30度,因此本發明之第二轉換電路30相當於時間對溫度的轉換電路。如此,本發明不需使用不隨溫度變動而變動的延遲電路,而 縮小整體電路面積,進而達到節省成本的目的。 The second conversion circuit 30 is coupled to the counting circuit 20, and the second conversion circuit receives the count data CNT, and generates a temperature data corresponding to the count data CNT according to a temperature comparison table. That is, the second conversion circuit 30 has a built-in temperature comparison table. The temperature comparison table includes a plurality of count data CNTs, and each of the count data CNTs corresponds to a temperature. For example, when the count data CNT is 20, the corresponding The temperature is 25 degrees, so the temperature data output by the second conversion circuit 30 is 25 degrees; when the count data CNT is 30, the corresponding temperature is 30 degrees, so the temperature data output by the second conversion circuit 30 is 30 degrees. Therefore, the second conversion circuit 30 of the present invention is equivalent to a time-to-temperature conversion circuit. Thus, the present invention does not need to use a delay circuit that does not vary with temperature fluctuations, and Reduce the overall circuit area, and thus achieve cost savings.
另外,由於溫度對照表的溫度對應曲線可以為一線性曲線,但不以此為限,例如當計數資料CNT分分別為20、30與40時,則分別對應的溫度為25度、30度與35度,所以,第二轉換電路30可以利用內差運算的方式,得知解析度更高的溫度大小,也就是說,第二轉換電路30所接收計數資料CNT在溫度對照表中並無直接對應的溫度時,第二轉換電路30可以利用最接近所接收的計數資料CNT的二筆計數資料CNT所對應的溫度資料,而利用內差運算的方式得知所接收計數資料CNT對應的溫度資料,例如,溫度對照表中的計數資料CNT分別為20、30與40時,而分別對應的溫度為25度、30度與35度。當第二轉換電路30所接收的計數資料CNT為25時,由於溫度對照表中並無計數資料CNT為25所對應的溫度,此時,第二轉換電路30即可利用內差運算的方式,先取得最接近計數資料CNT為25的二筆計數資料CNT分別為20與30所對應的溫度資料為25與30,再以進行內差運算得知計數資料CNT為25所對應的溫度為27.5度。如此,本發明即可藉由內差運算的方式而增加溫度感測的解析度。 In addition, since the temperature corresponding curve of the temperature comparison table can be a linear curve, but not limited thereto, for example, when the count data CNT points are 20, 30, and 40, respectively, the corresponding temperatures are 25 degrees, 30 degrees, and 35 degrees, so the second conversion circuit 30 can use the method of the internal difference operation to know the temperature of the higher resolution, that is, the count data CNT received by the second conversion circuit 30 is not directly in the temperature comparison table. At the corresponding temperature, the second conversion circuit 30 can use the temperature data corresponding to the two count data CNT of the received count data CNT, and use the internal difference calculation method to know the temperature data corresponding to the received count data CNT. For example, the count data CNT in the temperature comparison table is 20, 30, and 40, respectively, and the corresponding temperatures are 25 degrees, 30 degrees, and 35 degrees, respectively. When the count data CNT received by the second conversion circuit 30 is 25, since the temperature data in the temperature comparison table is not corresponding to the temperature of 25, the second conversion circuit 30 can use the internal difference calculation method. First, the two pieces of count data CNT with the closest count data CNT of 25 are 20 and 30, and the temperature data corresponding to 20 and 30 are respectively 25 and 30, and then the internal difference calculation is performed to know that the temperature corresponding to the count data CNT is 25 is 27.5 degrees. . Thus, the present invention can increase the resolution of temperature sensing by means of internal difference operation.
此外,本實施例之計數電路20包含一邏輯單元200與一計數單元202。邏輯單元200接收延遲訊號DA與輸入訊號START,並依據延遲訊號DA與輸入訊號START間的時間差,而產生一差異訊號XR(如第四圖所示),於本實施例中,邏輯單元200為一互斥或閘,所以,邏輯單元200所產生的差異訊號XR即是表示延遲訊號DA與輸入訊號START間的時間差。計數單元202耦接邏輯單元200,計數單元202接收差異訊號XR,並依據時脈CLK計數差異訊號XR,產生計 數資料CNT。 In addition, the counting circuit 20 of the embodiment includes a logic unit 200 and a counting unit 202. The logic unit 200 receives the delay signal DA and the input signal START, and generates a difference signal XR according to the time difference between the delay signal DA and the input signal START (as shown in the fourth figure). In this embodiment, the logic unit 200 is A mutual exclusion or gate, therefore, the difference signal XR generated by the logic unit 200 is the time difference between the delay signal DA and the input signal START. The counting unit 202 is coupled to the logic unit 200, and the counting unit 202 receives the difference signal XR and counts the difference signal XR according to the clock CLK to generate a meter. Number of data CNT.
請一併參閱第四圖,係為本發明之一第一實施例之溫度感測電路的波形圖。如圖所示,輸入訊號START傳送至第一轉換電路10,第一轉換電路10延遲輸入訊號START,產生延遲訊號DA,邏輯單元200接收延遲訊號DA與輸入訊號START,而進行邏輯運算產生差異訊號XR,於本實施例中,邏輯單元200為互斥或閘,所以,在輸入訊號START之準位為高準位,而延遲訊號DA之準位為低準位時,則差異訊號XR之準位為高準位,所以差異訊號XR的高準位的部分即為溫度所造成的時間,計數單元202依據依據時脈CLK計數差異訊號XR之高準位的部位,所產生的計數資料CNT即可相當於溫度所造成的時間,之後再經過第二轉換電路30從溫度對照表找出計數資料CNT所對應的溫度,在本實施例中,計數資料CNT為5,而對應計數資料CNT的溫度為17.5度,此外,輸入訊號START的頻率小於第一轉換電路10所產生之一延遲時間之倒數,亦即計數資料CNT的時間之倒數。 Please refer to the fourth figure, which is a waveform diagram of the temperature sensing circuit according to the first embodiment of the present invention. As shown, the input signal START is transmitted to the first conversion circuit 10, the first conversion circuit 10 delays the input signal START, generates a delay signal DA, and the logic unit 200 receives the delay signal DA and the input signal START, and performs a logic operation to generate a difference signal. XR, in this embodiment, the logic unit 200 is a mutual exclusion or a gate. Therefore, when the level of the input signal START is a high level and the level of the delay signal DA is a low level, the difference signal XR is accurate. The bit is a high level, so the portion of the high level of the difference signal XR is the time caused by the temperature, and the counting unit 202 generates the count data CNT according to the position of the high level of the difference signal XR according to the clock CLK. It can be equivalent to the time caused by the temperature, and then the temperature corresponding to the count data CNT is found from the temperature comparison table through the second conversion circuit 30. In the present embodiment, the count data CNT is 5, and the temperature of the corresponding count data CNT is In addition, the frequency of the input signal START is smaller than the reciprocal of one of the delay times generated by the first conversion circuit 10, that is, the reciprocal of the time of the count data CNT.
請一併參閱第五圖,係為本發明之一第二實施例之溫度感測電路的波形圖。如圖所示,本實施例與第四圖之實施例不同之處,在於本實施例之第一轉換電路10在不同溫度產生了延遲訊號DA1與DA2,而經由邏輯單元200分別產生差異訊號XR1與差異訊號XR2,由於溫度對第一轉換電路10的延遲時間是成線性的,所以,計數單元202分別計數差異訊號XR1與差異訊號XR2的計數資料CNT1與CNT2分別5和10,所以經過第二轉換電路30所產生的溫度資料即為17.5度與20度。 Please refer to FIG. 5, which is a waveform diagram of a temperature sensing circuit according to a second embodiment of the present invention. As shown in the figure, the first embodiment of the present embodiment differs from the embodiment of the fourth embodiment in that the first conversion circuit 10 of the present embodiment generates delay signals DA1 and DA2 at different temperatures, and generates a difference signal XR1 via the logic unit 200. With the difference signal XR2, since the delay time of the temperature to the first conversion circuit 10 is linear, the counting unit 202 counts the difference data CNT1 and CNT2 of the difference signal XR1 and the difference signal XR2 respectively 5 and 10, so that after the second The temperature data generated by the conversion circuit 30 is 17.5 degrees and 20 degrees.
請參閱第六A圖,係為本發明之一第一實施例之第一轉換電路的 電路圖。如圖所示,本發明之第一轉換電路10為延遲電路,於本實施例中,延遲電路包含一級的延遲單元,此延遲單元包含一反相器12與一電容C。反相器12之一輸入端IN接收輸入訊號START,並反相輸入訊號START;電容C耦接反相器12,並依據溫度而延遲反相器12反相後的輸入訊號START而產生延遲訊號DA。 Please refer to FIG. 6A, which is a first conversion circuit of a first embodiment of the present invention. Circuit diagram. As shown in the figure, the first conversion circuit 10 of the present invention is a delay circuit. In this embodiment, the delay circuit includes a delay unit of one stage, and the delay unit includes an inverter 12 and a capacitor C. The input terminal IN of the inverter 12 receives the input signal START and inverts the input signal START; the capacitor C is coupled to the inverter 12, and delays the input signal START after the inverter 12 is inverted according to the temperature to generate a delay signal. DA.
承上所述,反相器12包含一第一電晶體120與一第二電晶體122。第一電晶體120之一第一端耦接一電源端VDD,第一電晶體120之一第二端耦接一輸出端OUT,第一電晶體120之一控制端接收輸入訊號START;第二電晶體122之一第一端耦接第一電晶體120之第二端與輸出端OUT,第二電晶體122之一第二端耦接一接地端。第二電晶體之一控制端接收輸入訊號START。於本實施例中,電容C之一端耦接電源端VDD與第一電晶體120之第一端,電容C之另一端耦接輸出端OUT、第一電晶體120之第二端與第二電晶體122之第一端。其中,電容C具有一正溫度係數,即當溫度上升時,電容C的電容量也對應增加,反之,當溫度下降時,電容C的電容量也對應減少。 As described above, the inverter 12 includes a first transistor 120 and a second transistor 122. The first end of the first transistor 120 is coupled to a power terminal V DD , and the second terminal of the first transistor 120 is coupled to an output terminal OUT. The control terminal of the first transistor 120 receives the input signal START. The first end of the second transistor 122 is coupled to the second end of the first transistor 120 and the output end OUT, and the second end of the second transistor 122 is coupled to a ground end. One of the control terminals of the second transistor receives the input signal START. In this embodiment, one end of the capacitor C is coupled to the power terminal V DD and the first end of the first transistor 120, and the other end of the capacitor C is coupled to the output end OUT, the second end of the first transistor 120, and the second end. The first end of the transistor 122. The capacitor C has a positive temperature coefficient, that is, when the temperature rises, the capacitance of the capacitor C also increases correspondingly. Conversely, when the temperature decreases, the capacitance of the capacitor C also decreases accordingly.
基於上述,由於本實施例主要使用的是反相器12,並在輸出端OUT使用具有正溫度係數的電容C,當溫度上升時,第一電晶體120與第二電晶體122的遷移率(Mobility)會下降,因此等效通道電阻值會上升,另外由於輸出端OUT的電容C為正溫度係數,如此電容C的電容值也會隨溫度上生而增加,故,整體第一轉換電路10的延遲時間隨溫度上升的增加量可近似於通道電阻乘上輸出端OUT之電容C的電容值。反之,溫度下降亦同,第一轉換電路10的延遲時間會隨溫度下降而減少。如此,本發明藉由電容C設置於 反相器12與輸出端OUT之間,以縮小整體電路面積,進而達到節省成本的目的。 Based on the above, since the present embodiment mainly uses the inverter 12 and uses the capacitor C having a positive temperature coefficient at the output terminal OUT, the mobility of the first transistor 120 and the second transistor 122 when the temperature rises ( Mobility) will decrease, so the equivalent channel resistance value will rise. In addition, since the capacitance C of the output terminal OUT is a positive temperature coefficient, the capacitance value of the capacitor C will also increase with temperature, so the overall first conversion circuit 10 The increase in delay time with temperature rise can be approximated by the capacitance of the channel resistance multiplied by the capacitance C of the output terminal OUT. Conversely, as the temperature drops, the delay time of the first switching circuit 10 decreases as the temperature decreases. Thus, the present invention is provided by the capacitor C Between the inverter 12 and the output terminal OUT, the overall circuit area is reduced, thereby achieving cost saving.
另外,上述本發明所述的正溫度係數並不一定僅指電容C,並且電容C可以採用MIM,空乏型MOS,增強型MOS來做,達成正溫度係數或負溫度係數皆可。而本發明所述的正溫度係數是指整體第一轉換電路10的特性為正溫度係數,也就是說,反相器12與電容C組合後的特性造就第一轉換電路10的特性為正溫度係數。反之,負溫度係數也是指整體第一轉換電路10而言為負溫度係數。 In addition, the positive temperature coefficient described above is not necessarily only referred to as the capacitance C, and the capacitance C can be performed by using MIM, depletion type MOS, and enhanced MOS, and a positive temperature coefficient or a negative temperature coefficient can be achieved. The positive temperature coefficient according to the present invention means that the characteristic of the overall first conversion circuit 10 is a positive temperature coefficient, that is, the characteristic of the combination of the inverter 12 and the capacitance C causes the characteristic of the first conversion circuit 10 to be a positive temperature. coefficient. On the contrary, the negative temperature coefficient also means a negative temperature coefficient as a whole of the first conversion circuit 10.
請一併參閱第六B圖,係為本發明之一第二實施例之第一轉換電路的電路圖。如圖所示,本實施例與第六A圖之實施例不同之處,在於本實施例之電容C係由場效電晶體組成等效的電容C,而本實施例的電容C也會隨溫度變動而改變。 Please refer to FIG. 6B, which is a circuit diagram of a first conversion circuit according to a second embodiment of the present invention. As shown in the figure, the difference between the embodiment and the embodiment of the sixth embodiment is that the capacitor C of the embodiment is composed of a field-effect transistor, and the capacitor C of the embodiment is also used. The temperature changes and changes.
請一併參閱第六C圖,係為本發明之一第三實施例之第一轉換電路的電路圖。如圖所示,本實施例與第六A圖與第六B圖之實施例不同之處,在於本實施例之第一轉換電路10更包含一電組R。電阻R之一端耦接第一電晶體120之第二端與第二電晶體122之第一端,電阻R之另一端耦接輸出端OUT與電容C。如此,電阻R可以增加充放電路徑之電阻值。 Please refer to FIG. 6C, which is a circuit diagram of a first conversion circuit according to a third embodiment of the present invention. As shown in the figure, the embodiment differs from the embodiment of the sixth and sixth embodiments in that the first conversion circuit 10 of the embodiment further includes a power pack R. One end of the resistor R is coupled to the second end of the first transistor 120 and the first end of the second transistor 122, and the other end of the resistor R is coupled to the output terminal OUT and the capacitor C. Thus, the resistance R can increase the resistance value of the charge and discharge path.
此外,由於電阻R可以為poly電阻,well電阻,high R poly電阻,等不同材料所形成的電阻,其溫度係數都可能是正負,然而以本發明來說,是要看反相器12、電容C與電阻R三者整體的第一轉換電路10,其效應是正溫度係數還是負溫度係數。所以,不管反相器12、電容C與電阻R為正溫度係數還是負溫度係數,主要還 是要看反相器12、電容C與電阻R三者組合後,整體的第一轉換電路10的效應是正溫度係數還是負溫度係數。 In addition, since the resistor R can be a poly resistor, a well resistor, a high R poly resistor, or the like formed by different materials, the temperature coefficient thereof may be positive or negative. However, in the present invention, it is necessary to look at the inverter 12 and the capacitor. The first conversion circuit 10, which is integrated with C and the resistor R, has an effect of a positive temperature coefficient or a negative temperature coefficient. Therefore, regardless of the inverter 12, the capacitance C and the resistance R are positive temperature coefficient or negative temperature coefficient, mainly It is to look at the combination of the inverter 12, the capacitor C and the resistor R, whether the effect of the overall first conversion circuit 10 is a positive temperature coefficient or a negative temperature coefficient.
請一併參閱第七A圖、第七B圖與第七C圖,係分別為本發明之一第四、五與六實施例之第一轉換電路的電路圖。如圖所示,第四、五與六實施例之第一轉換電路係分別對應第一、二與三實施例的第一轉換電路,而與第一、二與三實施例的第一轉換電路不同之處,在於第四、五與六實施例之第一轉換電路的電容C之一端耦接電源端VDD與第一電晶體120之第二端、第二電晶體122之第一端與輸出端OUT,電容C之另一端耦接接地端,其動作原理與第一實施例的第一轉換電路10相同,於此就不再加以贅述。 Please refer to FIG. 7A, FIG. 7B and FIG. 7C together, which are respectively circuit diagrams of the first conversion circuit of the fourth, fifth and sixth embodiments of the present invention. As shown, the first conversion circuits of the fourth, fifth, and sixth embodiments respectively correspond to the first conversion circuits of the first, second, and third embodiments, and the first conversion circuits of the first, second, and third embodiments, respectively. The difference is that one end of the capacitor C of the first conversion circuit of the fourth, fifth and sixth embodiments is coupled to the power terminal V DD and the second end of the first transistor 120 and the first end of the second transistor 122 The output terminal OUT and the other end of the capacitor C are coupled to the ground. The operation principle is the same as that of the first conversion circuit 10 of the first embodiment, and details are not described herein.
請一併參閱第八A圖至第八C圖,係分別為一第七、八與九實施例之第一轉換電路的電路圖。如圖所示,第七、八與九實施例之第一轉換電路10和第一、二與三實施例之第一轉換電路10不同之處,在於第七、八與九實施例的第一轉換電路10更包含一級的反相器14與電容C2,以增加第一轉換電路10的延遲時間,其結構皆與第一、二與三實施例之第一轉換電路10相同,於此就不再加以贅述。 Please refer to FIGS. 8A to 8C together, which are circuit diagrams of the first conversion circuits of the seventh, eighth and ninth embodiments, respectively. As shown, the first conversion circuit 10 of the seventh, eighth and ninth embodiments is different from the first conversion circuit 10 of the first, second and third embodiments in the first of the seventh, eighth and ninth embodiments. The conversion circuit 10 further includes a first-stage inverter 14 and a capacitor C2 to increase the delay time of the first conversion circuit 10. The structure is the same as that of the first conversion circuit 10 of the first, second and third embodiments, and thus Let me repeat them.
基於上述可知,本發明之第一轉換電路10除了可以是一級的延遲單元之外,第一轉換電路10也可以二級或甚至是多級的延遲單元。 Based on the above, the first conversion circuit 10 of the present invention can be a second-order or even a multi-stage delay unit in addition to the one-stage delay unit.
請一併參閱第九A圖至第九C圖,係分別為一第十、十一與十二實施例之第一轉換電路的電路圖。如圖所示,第十、十一與十二實施例之第一轉換電路10和第四、五與六實施例之第一轉換電路10 不同之處,在於第十、十一與十二實施例的第一轉換電路10更包含一級的反相器14與電容C2,以增加第一轉換電路10的延遲時間,其結構皆與第四、五與六實施例之第一轉換電路10相同,於此就不再加以贅述。 Please refer to the ninth to fifth ninth C drawings, which are circuit diagrams of the first conversion circuits of the tenth, eleventh and twelfth embodiments, respectively. As shown, the first conversion circuit 10 of the tenth, eleventh and twelfth embodiments and the first conversion circuit 10 of the fourth, fifth and sixth embodiments The difference is that the first conversion circuit 10 of the tenth, eleventh and twelfth embodiments further includes the inverter 14 and the capacitor C2 of the first stage to increase the delay time of the first conversion circuit 10, and the structure thereof is the same as the fourth The fifth and sixth embodiments of the first conversion circuit 10 are the same and will not be described again.
綜上所述,本發明係有關一種溫度感測電路及其轉換電路,溫度感測電路係由第一轉換電路接收一輸入訊號,並依據一溫度而延遲輸入訊號,產生一延遲訊號;一計數電路接收延遲訊號與輸入訊號,並依據時脈計數延遲訊號與輸入訊號的時間差,產生一計數資料;以及一第二轉換電路接收計數資料,並依據一溫度對照表而對應計數資料產生一溫度資料。如此,本發明不需使用不隨溫度變動而變動的延遲單元,而縮小整體電路面積,進而達到節省成本的目的。 In summary, the present invention relates to a temperature sensing circuit and a conversion circuit thereof. The temperature sensing circuit receives an input signal from the first conversion circuit, and delays the input signal according to a temperature to generate a delay signal; The circuit receives the delay signal and the input signal, and generates a count data according to the time difference between the clock delay signal and the input signal; and a second conversion circuit receives the count data, and generates a temperature data corresponding to the count data according to a temperature comparison table. . Thus, the present invention does not need to use a delay unit that does not vary with temperature fluctuations, and reduces the overall circuit area, thereby achieving cost saving.
1‧‧‧溫度感測電路 1‧‧‧Temperature sensing circuit
10‧‧‧第一轉換電路 10‧‧‧First conversion circuit
20‧‧‧計數電路 20‧‧‧Counting circuit
200‧‧‧邏輯單元 200‧‧‧ logical unit
202‧‧‧計數單元 202‧‧‧counting unit
30‧‧‧第二轉換電路 30‧‧‧Second conversion circuit
START‧‧‧輸入訊號 START‧‧‧Input signal
DA‧‧‧延遲訊號 DA‧‧‧delay signal
XR‧‧‧差異訊號 XR‧‧‧ difference signal
CNT‧‧‧計數資料 CNT‧‧‧counting data
CLK‧‧‧時脈 CLK‧‧‧ clock
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101447781A (en) * | 2007-11-29 | 2009-06-03 | Nec液晶技术株式会社 | Delay element, variable delay line, and voltage controlled oscillator, as well as display device and system comprising the same |
CN101915625A (en) * | 2010-07-14 | 2010-12-15 | 北京北大众志微系统科技有限责任公司 | Temperature sensor |
US20110170366A1 (en) * | 2007-10-31 | 2011-07-14 | Mosaid Technologies Incorporated | Temperature detector in an integrated circuit |
TW201303276A (en) * | 2011-07-04 | 2013-01-16 | Holtek Semiconductor Inc | Time-domain temperature sensor |
TW201407143A (en) * | 2012-08-03 | 2014-02-16 | United Microelectronics Corp | Temperature sensor |
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2014
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US20110170366A1 (en) * | 2007-10-31 | 2011-07-14 | Mosaid Technologies Incorporated | Temperature detector in an integrated circuit |
CN101447781A (en) * | 2007-11-29 | 2009-06-03 | Nec液晶技术株式会社 | Delay element, variable delay line, and voltage controlled oscillator, as well as display device and system comprising the same |
CN101915625A (en) * | 2010-07-14 | 2010-12-15 | 北京北大众志微系统科技有限责任公司 | Temperature sensor |
TW201303276A (en) * | 2011-07-04 | 2013-01-16 | Holtek Semiconductor Inc | Time-domain temperature sensor |
TW201407143A (en) * | 2012-08-03 | 2014-02-16 | United Microelectronics Corp | Temperature sensor |
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