TWI584581B - Apparatus and methods for envelope tracking - Google Patents

Description

Device and method for wave seal tracking

Embodiments of the present invention relate to electronic systems, and more particularly to wave seal tracking systems for radio frequency (RF) electronic devices.

A power amplifier can be included in the mobile device to amplify one of the RF signals transmitted via an antenna. For example, mobile devices found in one of the Time Division Multiple Access (TDMA) architectures, such as Global System for Mobile Communications (GSM), Code Division Multiple Access (CDMA), and Wideband Code Division Multiple Access (W-CDMA) systems. A power amplifier can be used to amplify an RF signal having a relatively low power. Managing RF signal amplification can be important because the level of power to be transmitted can depend on the distance of the user from a base station and/or the mobile environment. A power amplifier can also be employed to assist in adjusting the power level of the RF signal over time to prevent transmission signal interference during the assignment of the receive time slot.

The power consumption of a power amplifier can be an important consideration. A technique for reducing the power consumption of a power amplifier is a wave envelope tracking in which one of the power amplifiers is supplied with respect to a wave seal or signal envelope of the RF signal. Therefore, when one of the voltage levels of the signal envelope increases, the voltage level of the power amplifier supply voltage can be increased. Similarly, when the voltage level of the signal envelope is lowered, the voltage level of the power amplifier supply voltage can be lowered to reduce power consumption.

There is a need for an improved power amplifier system. In addition, there is a need for an improved wave seal tracker.

In certain embodiments, the present invention is directed to a mobile device. The mobile device includes a power amplifier, a buck converter, and an error amplifier. The power amplifier is configured to receive a power amplifier supply voltage and amplify a radio frequency (RF) input signal to produce an RF output signal. The buck converter is configured to convert a battery voltage to a step-down voltage and to control a magnitude of the step-down voltage based on an error current. The error amplifier is configured to generate an output current based on a wave seal of the RF input signal and to generate the power amplifier supply voltage by adjusting the magnitude of the step-down voltage using the output current. The error amplifier is configured to control the buck converter by varying a magnitude of the error current relative to a magnitude of the output current.

In various embodiments, the mobile device further includes an AC coupling capacitor electrically coupled between the power amplifier supply voltage and one of the error amplifiers configured to generate an output current.

In some embodiments, the buck converter includes a buck controller, a buck inductor, and a plurality of buck switches, and the buck controller is configured to use an error current to control the plurality of bucks One of the states of the switch controls the current through one of the buck inductors.

In several embodiments, the error current includes a non-inverting error current component and an inverting error current component, and the buck converter includes a current comparator configured to compare the non-inverting The error current component and the inverted error current component control the state of the plurality of buck switches.

According to several embodiments, the error amplifier includes a first pair of transistors configured to generate an output current and a second pair of transistors configured to generate an error current, and the second pair of transistors is implemented as the first A copy of one of the transistors.

In some embodiments, the mobile device further includes an antenna configured to receive one of the RF output signals.

In several embodiments, the mobile device further includes a transceiver configured to generate a wave seal of the RF input signal.

In some embodiments, the mobile device further includes a battery configured to generate a battery voltage.

In several embodiments, the error amplifier is powered using the battery voltage.

In some embodiments, the mobile device further includes a boost converter configured to convert the battery voltage to a boost voltage having one of a voltage magnitude greater than one of the battery voltages. The boost amplifier is used to power the error amplifier.

In certain embodiments, the present invention is directed to a wave seal tracker for generating a power amplifier supply voltage. The envelope tracker includes a buck converter and an error amplifier. The buck converter is configured to convert a battery voltage to a step-down voltage and to control a magnitude of the step-down voltage based on an error current. The error amplifier is configured to generate an output current based on a envelope signal and to generate the power amplifier supply voltage by adjusting the magnitude of the step-down voltage using the output current. The error amplifier is configured to control the buck converter by varying a magnitude of the error current relative to a magnitude of the output current.

According to several embodiments, the error amplifier includes a first input configured to receive the wave seal signal, a second input, and an output configured to generate an output current. In some embodiments, the wave seal tracker further includes a feedback circuit electrically coupled between the second input of the error amplifier and the output of the error amplifier. In several embodiments, the wave seal tracker further includes an AC coupling capacitor disposed between the output of the error amplifier and the power amplifier supply voltage.

In some embodiments, the error amplifier is powered using a battery voltage.

According to several embodiments, the wave seal tracker further includes a boost converter configured to convert the battery voltage to one of a voltage magnitude greater than one of the battery voltages . The boost voltage is used to power the error amplifier.

In various embodiments, the buck converter includes a buck controller, a buck inductor, and a plurality of buck switches. The buck controller is configured to use an error current to control a state of one of the plurality of buck switches to control current flow through the buck inductor.

In several embodiments, the error current includes a non-inverting error current component and an inverting error current component, and the buck converter includes a current comparator configured to compare the non-inverting The error current component and the inverted error current component control the state of the plurality of buck switches.

In some embodiments, the error amplifier includes a first pair of transistors configured to generate an output current and a second pair of transistors configured to generate an error current, and the second pair of transistors is implemented as the first A replica of a pair of transistors. In various embodiments, the first pair of transistors comprises a first p-type field effect transistor (PFET) and a first n-type field effect transistor (NFET), and the second pair of transistors comprises a second A PFET and a second NFET.

In certain embodiments, the present invention is directed to a method of generating a power amplifier supply voltage. The method includes: using a buck converter to generate a step-down voltage from a battery voltage; controlling a magnitude of the step-down voltage based on an error current; generating an output current based on a wave-sealing signal using an error amplifier; The output current is used to adjust the magnitude of the step-down voltage to generate a power amplifier supply voltage; and the buck converter is controlled by varying a magnitude of the error current relative to a magnitude of the output current.

In various embodiments, the buck converter includes a buck inductor and a plurality of buck switches, and the method further includes controlling the pass by controlling the state of one of the plurality of buck switches based on the error current One of the inductors of the current.

In some embodiments, the error current includes a non-inverted error current component and an inverted error current component, and the method further comprises controlling the plurality of drops by comparing the non-inverted error current component with the inverted error current component The state of the pressure switch.

In some embodiments, the method further includes providing a power amplifier supply voltage to a power amplifier.

According to several embodiments, the method further includes powering the error amplifier using a battery voltage.

In various embodiments, the method further includes generating a boost using a boost converter The boost voltage and the boost voltage are used to power the error amplifier.

In certain embodiments, the present invention is directed to a multi-chip module (MCM). The MCM includes a buck converter and an error amplifier. The buck converter is configured to convert a battery voltage to a step-down voltage and to control a magnitude of the step-down voltage based on an error current. The error amplifier is configured to generate an output current based on a envelope signal and to generate a power amplifier supply voltage by adjusting the magnitude of the step-down voltage using the output current. The error amplifier is configured to control the buck converter by varying a magnitude of the error current relative to a magnitude of the output current.

In various embodiments, the error amplifier includes a first input configured to receive a wave seal signal, a second input, and an output configured to generate a power amplifier supply voltage. According to some embodiments, the MCM further includes a feedback circuit electrically coupled between the second input of the error amplifier and the output of the error amplifier. In some embodiments, the MCM further includes an AC coupling capacitor disposed between the output of the error amplifier and a power amplifier supply voltage.

In some embodiments, the MCM further includes a power amplifier configured to receive one of the power amplifier supply voltages.

In certain embodiments, the present invention is directed to a wave seal tracking system for generating a power amplifier supply voltage. The envelope tracking system includes a DC converter and an error amplifier. The DC to DC converter is configured to generate a regulated voltage from a battery voltage and to control a voltage magnitude of the regulated voltage using a low frequency feedback signal based on one of the low frequency components of the power amplifier supply voltage. The error amplifier is configured to generate an output current using a wave envelope signal and a high frequency feedback signal based on one of the high frequency components of the power amplifier supply voltage. The error amplifier is configured to generate the power amplifier supply voltage by adjusting the magnitude of the regulated voltage using the output current, as desired.

In various embodiments, the error amplifier includes a first input configured to receive one of the wave seal signals, a second input configured to receive the high frequency feedback signal, and configured to generate One of the output currents is output. According to some embodiments, the envelope tracking system further includes an AC coupling capacitor electrically coupled between the output of the error amplifier and the power amplifier supply voltage. According to some embodiments, the envelope tracking system further includes a feedback circuit configured to generate the high frequency feedback signal. In various embodiments, the feedback circuit includes a first feedback resistor electrically coupled between the output of the error amplifier and a second input of the error amplifier and electrically coupled to the second input of the error amplifier and a low power A second feedback resistor between the supply voltages.

In several embodiments, the error amplifier is powered using the battery voltage.

According to some embodiments, the envelope tracking system further includes an inductor electrically coupled between the regulated voltage and a power amplifier supply voltage.

In some embodiments, the DC to DC converter includes a buck converter configured to generate a regulated voltage.

In various embodiments, the envelope tracking system further includes a low pass filter configured to filter the power amplifier supply voltage to generate a filtered power amplifier supply voltage, and the low frequency feedback signal is based in part on the filtered power amplifier Supply voltage. According to some embodiments, the envelope tracking system further includes a comparator configured to generate a low frequency feedback signal by comparing the filtered power amplifier supply voltage to a reference voltage. In several embodiments, the envelope tracking system further includes a reference voltage generator configured to generate the reference voltage.

In several embodiments, the envelope tracking system further includes a high pass filter configured to filter the power amplifier supply voltage to produce a filtered power amplifier supply voltage. In some embodiments, the envelope tracking system further includes a comparator configured to compare the filtered power amplifier supply voltage to the envelope signal to generate a high frequency envelope signal, and the error amplifier includes configured to receive A first input of the high frequency envelope signal, configured to receive a second input of the high frequency feedback signal and configured to produce one of the output current outputs.

In certain embodiments, the present invention is directed to a wireless device. The wireless device includes a power management integrated circuit (PMIC) and a power amplifier module. The PMIC includes a DC to DC converter configured to generate a regulated voltage from a battery voltage and to control one of the regulated voltage levels based on a voltage level of a control voltage. The power amplifier module includes a power amplifier configured to amplify a radio frequency (RF) signal and an error amplifier configured to generate an output current based on a envelope signal. The error amplifier is configured to generate a power amplifier supply voltage for one of the power amplifiers by adjusting the voltage level of the regulated voltage using the output current. The power amplifier module is configured to vary a voltage level of the control voltage based at least in part on the power amplifier supply voltage.

According to several embodiments, the wireless device further includes a transceiver configured to generate one of an RF signal and a wave seal signal.

In some embodiments, the wireless device further includes a battery configured to generate a battery voltage.

In several embodiments, the power amplifier module further includes an inductor electrically coupled between the regulated voltage and the power amplifier supply voltage.

According to some embodiments, the wireless device further includes one feedback circuit configured to generate one of the feedback signals in response to one of the high frequency components of the power amplifier supply voltage, and the error amplifier includes the configured to receive the wave seal signal A first input, configured to receive a second input of the feedback signal and configured to produce an output current output. In some embodiments, the power amplifier module further includes an AC coupling capacitor electrically coupled between the output of the error amplifier and the power amplifier supply voltage.

In various embodiments, the power amplifier module further includes a low pass filter configured to filter the power amplifier supply voltage to generate a filtered power amplifier supply voltage, and the control voltage is based at least in part on the filtered power amplifier Supply voltage. In some embodiments, the power amplifier module further includes being configured to compare the The filtered power amplifier supply voltage is compared to a reference voltage generating control voltage.

In certain embodiments, the present invention is directed to a method of generating a power amplifier supply voltage. The method includes: generating a regulated voltage from a battery voltage using a DC-DC converter; controlling a magnitude of the adjusted voltage based on a control voltage; generating an output current based on a sealed signal using an error amplifier; The output current adjusts the magnitude of the regulated voltage to produce a power amplifier supply voltage for a power amplifier; and controls the DC to DC by changing a voltage level of the control voltage based at least in part on the power amplifier supply voltage converter.

In several embodiments, the method further includes providing an output current to the power amplifier supply voltage through an AC coupling capacitor.

According to various embodiments, the method further includes generating a high frequency feedback signal for the error amplifier using a feedback circuit, and the high frequency feedback signal is configured to change in response to one of the high frequency components of the power amplifier supply voltage.

In several embodiments, the method further includes powering the error amplifier using a battery voltage.

According to various embodiments, the method further includes filtering the power amplifier supply voltage using a low pass filter to generate a filtered power amplifier supply voltage and comparing the filtered power amplifier supply voltage to a reference voltage to generate a control voltage.

In certain embodiments, the present invention is directed to a radio frequency system. The RF system includes a power management integrated circuit (PMIC), a first power amplifier module, and a second power amplifier module. The PMIC includes a DC to DC converter configured to generate a regulated voltage from a battery voltage and control a voltage level of the regulated voltage using a plurality of control voltages. The first power amplifier module includes: a first power amplifier configured to amplify a first radio frequency (RF) signal; and a first error amplifier configured to be based on the first RF signal One of the wave seals adjusts the regulated electricity The voltage level of the voltage is generated for the first power amplifier supply voltage of one of the first power amplifiers. The first power amplifier module is configured to change a voltage level of the first control voltage of the plurality of control voltages based at least in part on a voltage level of the first power amplifier supply voltage when the first power amplifier is enabled . The second power amplifier module includes: a second power amplifier configured to amplify a second RF signal; and a second error amplifier configured to generate a wave based on the second RF signal The capacitor adjusts the voltage level of the regulated voltage to generate a second power amplifier supply voltage for the second power amplifier. The second power amplifier module is configured to change a voltage level of the second control voltage of the plurality of control voltages based at least in part on a voltage level of the second power amplifier supply voltage when the second power amplifier is enabled .

In various embodiments, the first power amplifier module includes a first inductor electrically coupled between the regulated voltage and a first power amplifier supply voltage, and the second power amplifier module includes an electrical connection between the regulated voltage and The second power amplifier supplies a voltage between the second inductor.

In some embodiments, the radio frequency system further includes a telephone board, a first inductor, and a second inductor. The first inductor is disposed on the telephone board and electrically coupled between the regulated voltage and a first power amplifier supply voltage. The second inductor is disposed on the telephone board and electrically coupled between the regulated voltage and a second power amplifier supply voltage.

According to some embodiments, the radio frequency system further includes a third power amplifier module, the third power amplifier module comprising: a third power amplifier configured to amplify a third RF signal; and a third error amplifier Configuring to generate a third power amplifier supply voltage for the third power amplifier by adjusting a voltage level of the regulated voltage based on one of the third RF signals. The third power amplifier module is configured to change a voltage level of one of the plurality of control voltages and a third control voltage based at least in part on a voltage level of the third power amplifier supply voltage when the third power amplifier is enabled .

10‧‧‧Power Amplifier Module (PAM)

11‧‧‧Mobile devices

12‧‧‧Switcher

13‧‧‧ transceiver

14‧‧‧Antenna

15‧‧‧Transmission path

16‧‧‧Receiving path

17‧‧‧Power Amplifier

18‧‧‧Control components

19‧‧‧ Computer readable media/computer readable memory

20‧‧‧ processor

21‧‧‧Battery

24‧‧‧Directional coupler

26‧‧‧Power Amplifier System

27‧‧‧Inductors

29‧‧‧Bipolar transistor

30‧‧‧ Wave Seal Tracker

31‧‧‧ impedance matching block

32‧‧‧Power Amplifier

33‧‧‧ transceiver

34‧‧‧Baseband processor

35‧‧‧ wave seal shaped block

36‧‧‧Digital to analog converter (DAC)

37‧‧‧I/Q Modulator

38‧‧‧ Mixer

39‧‧‧ Analog to Digital Converter (ADC)

40‧‧‧Power Amplifier System

41‧‧‧RF (RF) signal

42‧‧‧ wave seal

43‧‧‧Power amplifier supply voltage

44‧‧‧Power amplifier supply voltage

47‧‧‧Chart

48‧‧‧Graph

50‧‧‧ Wave Sealing System

51‧‧‧Error amplifier

52‧‧‧Feedback circuit

53‧‧‧Buck Converter

54‧‧‧Boost Converter

55‧‧‧Inductors

60‧‧‧Boost Converter

63‧‧‧Boost circuit

64‧‧‧Boost control block

65‧‧‧Inductors

66a‧‧‧First switcher

66b‧‧‧Second switcher

67‧‧‧ Bypass capacitor

70‧‧‧Buck Converter

73‧‧‧Buck circuit

74‧‧‧Buck Control Block

75‧‧‧Inductors

76a‧‧‧First switcher

76b‧‧‧Second switcher

77‧‧‧ Bypass capacitor

78‧‧‧hysteresis current comparator

80‧‧‧hysteresis current comparator

81‧‧‧First n-type field effect transistor (NFET)

82‧‧‧Second n-type field effect transistor (NFET)

83‧‧‧ Third n-type field effect transistor (NFET)

84‧‧‧ Fourth n-type field effect transistor (NFET)

85‧‧‧ Fifth n-type field effect transistor (NFET)

86‧‧‧ Sixth n-type field effect transistor (NFET)

87‧‧‧The seventh n-type field effect transistor (NFET)

88‧‧‧The eighth n-type field effect transistor (NFET)

89‧‧‧Ninth n-type field effect transistor (NFET)

91‧‧‧First p-type field effect transistor (PFET)

92‧‧‧Second p-type field effect transistor (PFET)

93‧‧‧ Third p-type field effect transistor (PFET)

94‧‧‧ Fourth p-type field effect transistor (PFET)

100‧‧‧Error amplifier

101‧‧‧First n-type field effect transistor (NFET)

102‧‧‧Second n-type field effect transistor (NFET)

103‧‧‧ Third n-type field effect transistor (NFET)

104‧‧‧ Fourth n-type field effect transistor (NFET)

105‧‧‧ Fifth n-type field effect transistor (NFET)

106‧‧‧ Sixth n-type field effect transistor (NFET)

107‧‧‧The seventh n-type field effect transistor (NFET)

108‧‧‧The eighth n-type field effect transistor (NFET)

111‧‧‧First p-type field effect transistor (PFET)

112‧‧‧Second p-type field effect transistor (PFET)

113‧‧‧ Third p-type field effect transistor (PFET)

114‧‧‧Four p-type field effect transistor (PFET)

115‧‧‧ Fifth p-type field effect transistor (PFET)

116‧‧‧ Sixth p-type field effect transistor (PFET)

117‧‧‧The seventh p-type field effect transistor (PFET)

118‧‧‧The eighth p-type field effect transistor (PFET)

119‧‧‧Ninth p-type field effect transistor (PFET)

120‧‧‧bias circuit

130‧‧‧Bomb Tracking System

150‧‧‧Graph

151‧‧‧First curve

152‧‧‧second curve

153‧‧‧ third curve

160‧‧‧ Wave Sealing System

161‧‧•AC (AC) coupling capacitor

162‧‧‧Bypass capacitor

170‧‧‧ Wave Sealing Module/Power Amplifier Module

171‧‧‧ Wave Sealing Grain

172a‧‧‧First pin/pad

172b‧‧‧Second pin/pad

172c‧‧‧3rd pin/pad

172d‧‧‧fourth pin/pad

172e‧‧‧5th pin/pad

172f‧‧‧6th pin/pad

172g‧‧‧7th pin/pad

174‧‧‧n type field effect transistor (NFET)

175‧‧‧p type field effect transistor (PFET)

180‧‧‧ Wave Sealing Module

181‧‧‧ wave seal tracking grain

182a‧‧‧First pin/pad

182b‧‧‧Second pin/pad

182c‧‧‧3rd pin/pad

182d‧‧‧4th pin/pad

182e‧‧‧5th pin/pad

182f‧‧‧6th pin/pad

182g‧‧‧7th pin/pad

183‧‧‧Error amplifier

184‧‧‧n type field effect transistor (NFET)

185‧‧‧p type field effect transistor (PFET)

186‧‧‧DC to DC controller

187‧‧‧reference voltage generator

188‧‧‧Low-pass filter

189a‧‧‧First feedback resistor

189b‧‧‧second feedback resistor

190‧‧‧Phone board

191‧‧‧Transceiver Integrated Circuit (IC)

192‧‧‧Power Management Integrated Circuit (PMIC)

193‧‧‧Power Amplifier (PA) Module

200‧‧‧ Radio Frequency (RF) System

201‧‧‧Power Management Integrated Circuit (PMIC)

202a‧‧‧first pin

202b‧‧‧second pin

202c‧‧‧third pin

205‧‧‧Power Management Integrated Circuit (PMIC) Inductors

207‧‧‧Power Management Integrated Circuit (PMIC) Capacitors

211‧‧‧Power Amplifier (PA) Module

212a‧‧‧first pin

212b‧‧‧second pin

212c‧‧‧third pin

212d‧‧‧fourth pin

212e‧‧‧5th pin

212f‧‧‧6th pin

212g‧‧‧ seventh pin

215‧‧‧Inductors

216‧‧‧High-pass filter

220‧‧‧ Radio Frequency (RF) System

221‧‧‧Power Amplifier Module

228‧‧‧ Comparator

229‧‧‧ Comparator

230‧‧‧Multi-band power amplifier system

231‧‧‧First Power Amplifier Module

232‧‧‧Second power amplifier module

233‧‧‧ Third Power Amplifier Module

234‧‧‧Power Management Integrated Circuit (IC)

240‧‧‧Multi-band power amplifier system

241‧‧‧First Inductor

242‧‧‧second inductor

243‧‧‧ Third Inductor

250‧‧‧Curve

251‧‧‧First curve

252‧‧‧second curve

260‧‧‧Multimode Power Amplifier (PA) Module

262a‧‧‧first pin

262b‧‧‧second pin

262c‧‧‧ third pin

262d‧‧‧fourth pin

262e‧‧‧5th pin

262f‧‧‧6th pin

262g‧‧‧ seventh pin

262h‧‧‧8th pin

262i‧‧‧ninth pin

262j‧‧‧10th pin

262k‧‧‧11st pin

262l‧‧‧12th pin

262m‧‧‧13th pin

262n‧‧‧fourteenth pin

262o‧‧‧15th pin

262p‧‧‧16th pin

262q‧‧‧17th pin

262r‧‧‧18th pin

262s‧‧‧19th pin

263‧‧‧High-band 3G/4G power amplifier circuit

264‧‧‧High-band 2G power amplifier circuit

265‧‧‧Low-band 2G power amplifier circuit

266‧‧‧Low-band 3G/4G power amplifier circuit

267‧‧‧Switcher

268‧‧‧Switch control block

269‧‧‧Digital Control Block

270‧‧‧Power Amplifier Control Block

275‧‧‧Directional coupler

ENVELOPE‧‧‧ wave seal signal

HB ANT‧‧‧High-band antenna

I _ERROR ‧‧‧Error current

I _ERROR- ‧‧‧Differential error current

I _ERROR+ ‧‧‧Differential error current

I _REF ‧‧‧Reference current

LB ANT‧‧‧Low Band Antenna

OUT‧‧‧ output signal

RF SIGNAL‧‧‧RF signal

RF_IN‧‧‧RF (RF) signal

RF_OUT‧‧‧Amplified Radio Frequency (RF) Signal

V ₁ ‧‧‧Power low supply voltage

V ₂ ‧‧‧Power high supply voltage

V _BATT ‧‧‧Battery voltage

V _BIAS ‧‧‧ bias voltage

V _{BIAS1 ‧‧‧First} bias voltage

V _{BIAS2 ‧‧‧second} bias voltage

V _BIAS3 ‧‧‧ Third bias voltage

V _{BIAS4 ‧‧‧fourth} bias voltage

V _BOOST ‧‧‧Boost voltage

V _BUCK ‧‧‧Buck Voltage

V _{CC_PA ‧‧‧Power} amplifier supply voltage

V _{CC_PA1 ‧‧‧First} power amplifier supply voltage

V _{CC_PA2 ‧‧‧second} power amplifier supply voltage

V _{CC_PA3} ‧‧‧ Third power amplifier supply voltage

V _CONTROL ‧‧‧Control voltage

V _CONTROL1 ‧‧‧First control voltage

V _CONTROL2 ‧‧‧second control voltage

V _CONTROL3 ‧‧‧ third control voltage

V _IN- ‧‧‧Differential input voltage / negative or second input voltage

V _IN+ ‧‧‧Differential input voltage / positive or first input voltage

V _OUT ‧‧‧ output voltage

V _REF ‧‧‧reference voltage

V _REG ‧‧‧Adjusted voltage

1 is a schematic diagram of a power amplifier module for amplifying a radio frequency (RF) signal.

2 is a schematic block diagram of one exemplary wireless device that may include one or more of the power amplifier modules of FIG. 1.

Figure 3A is a schematic block diagram of one example of a power amplifier system including a wave seal tracker.

Figure 3B is a schematic block diagram of another example of a power amplifier system including a wave seal tracker.

4A-4B show two examples of power amplifier supply voltage versus time.

Figure 5 is a schematic block diagram of one embodiment of a wave seal tracking system.

Figure 6 is a circuit diagram of one embodiment of a boost converter.

Figure 7 is a circuit diagram of one embodiment of a buck converter.

Figure 8 is a circuit diagram of one embodiment of a hysteresis current comparator.

Figure 9 is a circuit diagram of one embodiment of an error amplifier.

Figure 10 is a schematic block diagram of another embodiment of a wave seal tracking system.

Figure 11 shows an example of a plot of current vs. time for the envelope seal tracking system of Figure 5.

Figure 12 is a schematic block diagram of another embodiment of a wave seal tracking system.

Figure 13 is a schematic block diagram of one embodiment of a wave blocking tracking module.

Figure 14 is a schematic block diagram of another embodiment of a wave blocking tracking module.

Figure 15 is a schematic block diagram of one embodiment of a telephone board.

Figure 16A is a schematic block diagram of one embodiment of an RF system.

Figure 16B is a schematic block diagram of another embodiment of an RF system.

17A is a schematic block diagram of one of a multi-band power amplifier system in accordance with an embodiment.

Figure 17B is a schematic block diagram of one of the multi-band power amplifier systems in accordance with another embodiment.

Figure 18 shows an example of a plot of voltage versus time for the envelope tracking system of Figure 12.

19 is a schematic block diagram of one of a multi-mode power amplifier module in accordance with an embodiment.

The headings, if any, provided herein are for convenience only and do not necessarily affect the scope and meaning of the invention.

Overview of an exemplary power amplifier system with a wave seal tracker

1 is a schematic diagram of one of a power amplifier module (PAM) 10 for amplifying a radio frequency (RF) signal. The illustrated power amplifier module 10 can be configured to amplify an RF signal (RF_IN) to produce an amplified RF signal (RF_OUT). As described herein, the power amplifier module 10 can include one or more power amplifiers.

2 is a schematic block diagram of one exemplary wireless or mobile device 11 that may include one or more of the power amplifier modules 10 of FIG. The wireless device 11 can also include a wave seal tracking system that implements one or more of the features of the present invention.

The exemplary wireless device 11 depicted in FIG. 2 may represent a multi-band and/or multi-mode device such as a multi-band/multi-mode mobile phone. For example, the Global System for Mobile Communications (GSM) standard is used in one of the digital cellular communications modes in many parts of the world. The GSM mode mobile phone can operate in one or more of the four frequency bands: 850 MHz (about 824 MHz to 849 MHz for Tx, about 869 MHz to 894 MHz for Rx), 900 MHz (for Tx, about 880) MHz to 915 MHz, approximately 925 MHz to 960 MHz for Rx, 1800 MHz (approximately 1710 MHz to 1785 MHz for Tx, approximately 1805 MHz to 1880 MHz for Rx) and 1900 MHz (for Tx, approximately 1850 MHz to 1910 MHz, for Rx, approximately 1930 MHz to 1990 MHz). GSM band change The physical and/or regional/national implementation schemes can also be used in different regions of the world.

Code division multiple access (CDMA) is another standard that can be implemented in mobile phone devices. In some embodiments, a CDMA device can operate in one or more of the 800 MHz, 900 MHz, 1800 MHz, and 1900 MHz bands, while some W-CDMA and Long Term Evolution (LTE) devices can be, for example, about 22 Operation in the RF spectrum band.

One or more features of the present invention can be implemented in the foregoing exemplary modes and/or frequency bands and in other communication standards. For example, 802.11, 2G, 3G, 4G, LTE, and LTE-Advanced are non-limiting examples of such standards.

In some embodiments, the wireless device 11 can include a switch 12, a transceiver 13, an antenna 14, a power amplifier 17, a control component 18, a computer readable medium 19, a processor 20, and a battery 21. And a wave of tracker 30.

The transceiver 13 can generate an RF signal transmitted via the antenna 14. Additionally, the transceiver 13 can receive an incoming RF signal from the antenna 14.

It will be appreciated that various functionalities associated with the transmission and reception of RF signals can be achieved by collectively representing one or more components of transceiver 13 in FIG. For example, a single component can be configured to provide both transmission and reception functionality. In another example, the transmission and reception functionality can be provided by separate components.

Similarly, it will be appreciated that various antenna functionality associated with the transmission and reception of RF signals can be achieved by collectively representing one or more components of antenna 14 in FIG. For example, a single antenna can be configured to provide both transmission and reception functionality. In another example, transmission and reception functionality may be provided by separate antennas. In yet another example, different frequency bands associated with the wireless device 11 can be provided with different antennas.

In FIG. 2, one or more output signals from the transceiver 13 are depicted as being provided to the antenna 14 via one or more transmission paths 15. In the illustrated example, different transmission paths 15 may represent output paths associated with different frequency bands and/or different power outputs. For example, the two exemplary power amplifiers 17 shown can represent different power output configurations (eg, low power output and high power output) associated amplification and/or amplification associated with different frequency bands. Although FIG. 2 illustrates the configuration using one of two transmission paths 15 and two power amplifiers 17, the wireless device 11 can be adapted to include more or fewer transmission paths 15 and/or more or fewer power amplifiers. 17.

In FIG. 2, one or more detection signals from the antenna 14 are depicted as being provided to the transceiver 13 via one or more receive paths 16. In the illustrated example, different receive paths 16 may represent paths associated with different frequency bands. For example, the four exemplary paths 16 shown may represent the four-band capabilities of some wireless devices. Although FIG. 2 illustrates the configuration using one of the four receive paths 16, the wireless device 11 can be adapted to include more or fewer receive paths 16.

To facilitate switching between the receive path and the transmit path, the switches 12 can be configured to electrically connect the antenna 14 to a selected transmission or receive path. Thus, the switches 12 can provide a number of switching functionality associated with the operation of the wireless device 11. In some embodiments, the switches 12 can include configurations to provide for switching between, for example, different frequency bands, switching between different power modes, switching between transmission modes and reception modes, or the like A number of switches associated with some combination of functionality. The switches 12 can also be configured to provide additional functionality including filtering and/or duplexing of the signals.

2 shows that in some embodiments, a control component 18 can be provided to control various controls associated with the operation of the switches 12, the power amplifiers 17, the envelope tracker 30, and/or other operational components. Feature.

In some embodiments, a processor 20 can be configured to facilitate the implementation of the various programs described herein. The processor 20 can implement various computer program instructions. The processor 20 can be a general purpose computer, a special purpose computer or other programmable data processing device.

In some embodiments, the computer program instructions can also be stored in a computer readable memory 19 that can boot the processor 20 in a particular manner such that the instructions are stored in the computer readable memory 19 in.

The illustrated wireless device 11 also includes a wave seal tracker 30 that can be used to provide a power amplifier supply voltage to one or more of the power amplifiers 17. For example, the envelope tracker 30 can be configured to vary the supply voltage provided to the power amplifiers 17 based on one of the RF signals to be amplified. In the illustrated embodiment, the envelope signal is provided from the transceiver 13 to the envelope tracker 30. However, other implementations are possible, including, for example, where the envelope signal is provided to the envelope tracker 30 from a baseband processor or a power management integrated circuit (PMIC). Moreover, in some embodiments, the envelope signal can be generated from the RF signal by detecting the envelope of the RF signal using any suitable wave seal detector.

The envelope tracker 30 can be electrically coupled to a battery 21, which can be any suitable battery for use in the wireless device 11, including, for example, a lithium ion battery. As will be described in further detail below, by controlling the voltage supplied to one or more of the power amplifiers 17, the power consumed by the battery 21 can be reduced, thereby improving the battery life of the wireless device 11.

3A is a schematic block diagram of one example of a power amplifier system 26 that includes a wave seal tracker 30. The illustrated power amplifier system 26 includes a switch 12, an antenna 14, a battery 21, a directional coupler 24, a wave seal tracker 30, a power amplifier 32, and a transceiver 33. The illustrated transceiver 33 includes a baseband processor 34, a wave shaped block 35, a digital to analog converter (DAC) 36, an I/O modulator 37, a mixer 38, and A type of analog-to-digital converter (ADC) 39.

The baseband processor 34 can be used to generate an I signal and a Q signal corresponding to a signal component of a sine wave or signal of a desired amplitude, frequency and phase. For example, the I signal can be used to represent one of the sinusoidal in-phase components, and the Q signal can be used to represent one of the sinusoidal orthogonal components, which can be an equivalent representation of one of the sinusoids. In some embodiments, the I and Q signals can be provided to the I/O modulator 37 in a digital format. The baseband processor 34 can be any suitable processor configured to process a baseband signal. For example, the baseband processor 34 can include a digital signal processor, a microprocessor, and a Stylized core or any combination of the same. Moreover, in some embodiments, two or more baseband processors 34 may be included in the power amplifier system 26.

The I/O modulator 37 can be configured to receive the I and Q signals from the baseband processor 34 and process the I and Q signals to produce an RF signal. For example, the I/O modulator 37 can include a mixer configured to convert the I and Q signals into an analog format, a mixer for upconverting the I and Q signals to a radio frequency, and The upconverted I and Q signals are combined into a signal combiner suitable for amplifying one of the RF signals by the power amplifier 32. In some embodiments, the I/O modulator 37 can include one or more filters configured to filter the frequency content of the signal processed therein.

The wave shaped shaped block 35 can be used to convert the envelope or amplitude data associated with the I and Q signals into shaped wave seal data. Shaping data from the baseband processor 34 can be assisted by, for example, adjusting the envelope signal to optimize linearity of the power amplifier 32 and/or achieve desired gain compression of one of the power amplifiers 32. The performance of the power amplifier system 26 is enhanced. In some embodiments, the wave shaped shaped block 35 is a digital block and the DAC 36 is used to convert the shaped wave seal data into one suitable for use by the wave seal tracker 30. Analog wave seal signal. However, in other embodiments, the DAC 36 can be omitted to facilitate providing a digital envelope signal to the envelope tracker 30 to assist the envelope tracker 30 in further processing the envelope signal.

The envelope tracker 30 can receive the envelope signal from the transceiver 33 and receive a battery voltage V _BATT from the battery 21 and can use the envelope signal to generate for the power amplifier 32 and change with respect to the envelope One of the power amplifiers supplies a voltage V _{CC — PA} . The power amplifier 32 can receive RF signals from the I/O modulator 37 of the transceiver 33 and can provide an amplified RF signal to the antenna 14 via the switches 12.

The directional coupler 24 can be positioned between the output of the power amplifier 32 and one of the inputs of the switches 12, thereby allowing one of the power amplifiers 32 to not include an output power measurement. The insertion loss of these switches 12. The sensed output signal from the directional coupler 24 can be provided to a mixer 38 that can frequency shift the spectrum of the sensed output signal by multiplying the sensed output signal by one of the control frequency reference signals. The down-shifted signal can be provided to an ADC 39 that can convert the down-converted signal into a digital format suitable for processing by the baseband processor 34. The baseband processor 34 can be configured to dynamically adjust the I and Q signals and/or with I and by including a feedback path between the output of the power amplifier 32 and one of the input of the baseband processor 34. The Q-switch associated data is optimized to operate the power amplifier system 26. For example, configuring the power amplifier system 26 in this manner can assist in controlling the power added efficiency (PAE) and/or linearity of the power amplifier 32.

Although the power amplifier system 26 is illustrated as including a single power amplifier, the teachings herein are applicable to power amplifier systems including multiple power amplifiers, including, for example, multi-band and/or multi-mode power amplifier systems.

3B is a schematic block diagram of another example of a power amplifier system 40 that includes a wave seal tracker 30. The illustrated power amplifier system 40 includes a wave seal tracker 30, a power amplifier 32, an inductor 27, an impedance matching block 31, a switch 12, and an antenna 14. The illustrated wave seal tracker 30 is configured to receive a wave seal of one of the RF signals and to generate a power amplifier supply voltage V _{CC —} PA for the power amplifier 32 using a battery voltage V _BATT .

The illustrated power amplifier 32 includes a bipolar transistor 29 having an emitter, a base, and a collector. Exit 29 of the bipolar transistor may be electrically connected to the electrode power is a low supply voltage V _1, which may be (e.g.) a ground supply (ground supply). Additionally, a radio frequency (RF) signal can be provided to the base of the bipolar transistor 29. The bipolar transistor 29 amplifies the RF signal to produce an amplified RF signal at the collector. The bipolar transistor 29 can be any suitable device. In one embodiment, the bipolar transistor 29 is a heterojunction bipolar transistor (HBT).

The power amplifier 32 can be configured to provide an amplified RF signal to the switches 12. The impedance matching block 31 can be used to terminate the electrical connection between the power amplifier 32 and the switches 12 to assist in increasing power transfer and/or reducing the reflection of the amplified RF signal generated using the power amplifier 32. .

The inductor 27 can be included to power the power amplifier 32 using the power amplifier supply voltage V _{CC —} PA generated by the envelope tracker 30 while clamping or blocking the high frequency RF signal component. The inductor 27 can include a first end electrically coupled to the wave seal tracker 30 and a second end electrically coupled to the collector of the bipolar transistor 29.

Although FIG. 3B illustrates one embodiment of the power amplifier 32, it will be apparent to those skilled in the art that the teachings herein can be applied to a variety of power amplifier configurations, such as multi-stage power amplifiers and power amplifiers employing other transistor configurations. For example, in some embodiments, the bipolar transistor 29 can be omitted to employ a field effect transistor (FET), such as a germanium FET, a gallium arsenide (GaAs) high electron mobility transistor (HEMT), or a laterally diffused metal. An oxide semiconductor (LDMOS) transistor. Moreover, the power amplifier 32 can be adapted to include additional circuitry such as a biasing circuit.

4A-4B show two examples of power amplifier supply voltage versus time.

In Fig. 4A, a graph 47 illustrates an example of the voltage of an RF signal 41 and a power amplifier supply voltage 43 versus time. The RF signal 41 has a wave seal 42.

Importantly, the power amplifier supply voltage 43 of a power amplifier can have a voltage greater than the voltage of the RF signal 41. For example, powering a power amplifier with a power amplifier supply voltage having a magnitude less than one of the magnitudes of the RF signal can trim the RF signal, thereby producing signal distortion and/or other problems. Therefore, it is important that the power amplifier supply voltage 43 can be greater than the voltage of the envelope 42. However, it may be desirable to reduce the voltage difference between the power amplifier supply voltage 43 and the wave seal 42 of the RF signal 41 because the area between the power amplifier supply voltage 43 and the wave seal 42 may represent loss energy, This can reduce battery life and increase the heat generated in a wireless device.

In FIG. 4B, a graph 48 illustrates another example of the voltage of an RF signal 41 and a power amplifier supply voltage 44 versus time. The power amplifier supply voltage 44 of FIG. 4B is varied relative to the wave seal 42 of the RF signal 41 as compared to the power amplifier supply voltage 43 of FIG. 4A. The area between the power amplifier supply voltage 44 and the wave seal 42 in FIG. 4B is smaller than the area between the power amplifier supply voltage 43 and the wave seal 42 in FIG. 4A, and thus the graph 48 of FIG. 4B can be combined with a larger energy. One of the efficiency is associated with a power amplifier system.

Overview of the wave seal tracking system

Apparatus and methods for wave seal tracking are disclosed herein. In some embodiments, a wave seal tracking system for generating a power amplifier supply voltage for a power amplifier is provided. The envelope tracking system can include a buck converter and an error amplifier configured to operate in parallel to control a voltage level of the power amplifier supply voltage based on one of the RF signals amplified by the power amplifier. The buck converter can be configured to convert a battery voltage to a reduced or stepped voltage, and the error amplifier can generate a power amplifier by adjusting the magnitude of the reduced voltage using a rapidly varying output current Supply voltage.

In some embodiments, the error amplifier can generate one of the error currents based on the magnitude of the error amplifier's output current, and the buck converter can control one of the step-down voltages based on the error current. Using this error current to control the buck converter can aid in improving the overall efficiency of the envelope tracking system. For example, the error amplifier can have a power efficiency that is less than one of the power efficiencies of the buck converter, but has a speed that is faster than one of the speeds of the buck converter. Therefore, configuring the buck converter to control the buck voltage based on the error current and thus the power amplifier supply voltage can help improve the overall power of the wave seal tracking system by reducing the amount of current provided by the error amplifier effectiveness.

5 is a schematic block diagram of one embodiment of a wave seal tracking system 50. The envelope tracking system 50 includes a battery 21, an error amplifier 51, a feedback circuit 52, a buck converter 53, and a boost converter 54.

The error amplifier 51 includes: a first input configured to receive a envelope signal (ENVELOPE); a second input electrically coupled to one of the first terminals of the feedback circuit 52; and an output, the electrical Connected to a power amplifier supply voltage V _{CC — PA} , one of the output of the buck converter 53 and a second terminal of the feedback circuit 52 . The error amplifier 51 is configured to generate an error current I _ERROR and provide the error current I _ERROR to the buck converter 53.

The feedback circuit 52 can be any suitable circuit and can include active and/or passive circuits. In one embodiment, the feedback circuit 52 includes a resistor electrically coupled between the first terminal and the second terminal of the feedback circuit. However, any suitable implementation of the feedback circuit 52 can be used.

The boost converter 54 is configured to receive a battery voltage V _BATT from the battery 21 . The boost converter 54 is configured to generate a boost voltage V _BOOST that can have a voltage level greater than one of the battery voltages V _BATT . As shown in FIG. 5, the boost voltage V _BOOST can be used to power the error amplifier 51. Although the boost converter 54 is illustrated as generating a single boost output voltage, in some embodiments, the boost converter 54 can be configured to generate a plurality of boost output voltages to set a desired voltage level. One of the power supplies is supplied to other components or circuits.

The buck converter 53 is configured to receive the battery voltage V _BATT from the battery 21 and receive the error current I _ERROR from the error amplifier 51. The buck converter 53 includes an _{output configured} to control one of the voltage _levels of the power amplifier supply voltage V _CC — PA by sinking or flowing current through an internal inductor to the power amplifier supply voltage V _{CC —} PA . The buck converter 53 can be used to control the power amplifier supply voltage V _{CC —} PA to a voltage _{level that} is less than one of the voltage _levels of the battery voltage V _BATT . As will be described in further detail below, the buck converter 53 can control the magnitude of the power amplifier supply voltage V _{CC —} PA over time based on the error current I _ERROR .

The illustrated wave seal tracking system 50 includes a buck converter 53 and an error amplifier 51 that are configured to operate in parallel to control the voltage level of the power amplifier supply voltage V _{CC —} PA based on the envelope signal. The buck converter 53 can have a power efficiency that is greater than one of the power efficiencies of the error amplifier, but has a tracking speed that is slower than one of the tracking speeds of the error amplifier. Thus, the error amplifier 51 can be used to provide tracking of the high frequency components of the envelope signal, and the buck converter 53 can be used to provide tracking of the low frequency components of the envelope signal. In the illustrated configuration, the error amplifier 51 is powered using the boost voltage V _BOOST , and thus the error amplifier 51 can also be used to control the voltage level of the power amplifier supply voltage V _{CC — PA} to be higher than the battery. Voltage V _BATT .

In the configuration shown in FIG. 5, the error amplifier 51 supplies the error current I _ERROR to the buck converter 53 to assist the buck converter 53 in tracking the envelope signal. The error current I _ERROR may indicate that the power amplifier supply voltage _V CC_PA one current or one voltage level of the power amplifier supply current to the voltage difference between the voltage _V CC_PA a desired level. Since the error amplifier 51 can have a power efficiency lower than one of the power efficiencies of the buck converter 53, but has a speed faster than one of the speeds of the buck converter 53, the buck converter 53 is configured to Controlling the power amplifier supply voltage V _{CC —} PA based on the error current I _ERROR can help improve the overall power efficiency of the envelope tracking system 50 by reducing the amount of current provided by the error amplifier 51 . For example, the error current I _ERROR may change when the error amplifier 51 sinks or flows current to the power amplifier supply voltage V _CC — PA , and the buck converter 53 can control the voltage bit of the power amplifier supply voltage V _{CC —} PA with time. The magnitude of the error current I _ERROR and the output current of the error amplifier 51 is reduced.

As previously described, the boost converter 54 can generate the boost voltage V _BOOST , which can have a voltage magnitude greater than the voltage magnitude of the battery voltage V _BATT . The inclusion of the boost converter 54 in the envelope tracking system 50 allows the error amplifier 51 to control the power amplifier supply voltage V _{CC — PA} above a voltage level of the battery voltage V _BATT . Configuring the envelope tracking system 50 in this manner may allow one of the power amplifiers powered by the envelope tracking system 50 to drive a relatively large load line impedance. For example, when the power amplifier amplifies a relatively large RF input signal, one of the power amplifiers driving a large load line impedance has a relatively large voltage swing at the output of the power amplifier. Therefore, configuring the envelope tracking system 50 to control the power amplifier supply voltage V _{CC — PA} above the battery voltage V _BATT can be allowed by not clipping or otherwise distorting the output signal of the power amplifier. The output signal of the power amplifier exceeds the battery voltage V _BATT to increase the maximum load line impedance that the power amplifier can drive.

The envelope tracking system 50 can provide several advantages over other wave seal tracking schemes. For example, the envelope tracking system 50 can provide relatively robust envelope tracking while providing high power efficiency. Moreover, the envelope tracking system 50 can have a relatively small component count including, for example, a relatively small number of external components, such as discrete inductors. In some embodiments, the envelope tracking system 50 is integrated with a power amplifier on a common module such as a multi-chip module (MCM). However, other configurations are also possible.

6 is a circuit diagram of one embodiment of a boost converter 60 that can be used, for example, in the envelope tracking system 50 of FIG. The boost converter 60 includes a boost circuit 63 and a boost control block 64. The boost circuit 63 is configured to receive a battery voltage V _BATT and boost or increase one of the battery voltages V _BATT to generate a boost voltage V _BOOST . The boost control block 64 includes a feedback input configured to receive the boost voltage V _BOOST and to control a control output of the boost circuit 63.

The booster circuit 63 includes an inductor 65, a first switch 66a and a second switch 66b, and a bypass capacitor 67. The inductor 65 includes a first end electrically connected to the battery voltage V _{BATT and a} first end electrically connected to the first switch 66 a and a second end of the first end of the second switch 66 b . The first switch 66a is electrically connected to the first further comprises a power or low supply voltage V ₁ (which may be (e.g.) a grounding supply) end of the second one. The second switch 66b further includes a second end electrically coupled to the boost voltage _VBOOST and one of the first ends of the capacitor 67. The bypass capacitor 67 further comprising a power supply connected to the low voltage terminal of a second one ₁ V. The bypass capacitor 67 can be used to filter the boost voltage V _BOOST . In some embodiments, the bypass capacitor 67 can be placed or positioned a relatively short distance from the load of the boost converter.

The boost control block 64 can be configured to control the boost circuit 63 to generate a boost voltage V _BOOST . For example, when the boost circuit 63 is continuously operated, the boost control block 64 can be associated with the boost circuit by being configured in one of the first boost phases associated with the boost circuit 63. The state of the first switch 66a and the second switch 66b is regularly switched between one of the second boost phase configurations to generate the boost voltage V _BOOST . For example, during the first boosting phase of the boost circuit 63, the boost control block 64 can open the second switch 66b and close the first switch 66a to pass through the inductor 65 and the The first switch 66a supplies a current from the battery voltage V _BATT to the power low supply voltage V ₁ to increase the magnetic field of the inductor 65. In addition, during the second boosting phase of the boosting circuit 63, the boosting control block 64 can close the second switch 66b and open the first switch 66a, so that the magnetic field of the inductor 65 is transmitted through The inductor 65 and the second switch 66b have a current from the battery voltage V _BATT to the boost voltage V _BOOST .

Although the boost circuit 63 is described as operating via two phases when the boost voltage V _BOOST is generated, the boost circuit 63 can be configured to operate with an additional phase. For example, the boost circuit 63 can be configured to be associated with one of the first booster phase, the second booster phase, and the first switch 66a and the second switch 66b. The booster circuit 63 is switched between the three boost phases to intermittently operate using the boost control block 64.

Although FIG. 6 illustrates an example of one of the boost converters 60 suitable for use in the wave seal tracking system described herein, other configurations of the boost converter 60 may also be used, including, for example, where other connections are made. And/or operating the configuration of the first switch 66a and the second switch 66b.

7 is a circuit diagram of one embodiment of a buck converter 70 that can be used, for example, in the wave seal tracking system 50 of FIG. The buck converter 70 includes a buck circuit 73 and a buck control block 74. 73 by the step-down circuit configured to receive a battery voltage V _BATT and generates a step-down voltage V _BUCK, the step-down voltage V _BUCK may have one less than the voltage magnitude of the battery voltage V _BATT voltage magnitude. The buck control block 74 includes a feedback input configured to receive one of the buck voltages V _BUCK , an error input for receiving an error current I _{ERROR ,} and a control output for controlling the buck circuit 73 . As described above with reference to Figure 5, the buck converter 70 can be electrically coupled in parallel with an error amplifier to produce a power amplifier supply voltage. Thus, in some embodiments, the output of the buck converter 70 configured to generate the buck voltage V _BUCK is electrically coupled to the power amplifier supply voltage.

The step-down circuit 73 includes an inductor 75, a first switch 76a and a second switch 76b, and a bypass capacitor 77. The first switch 76a includes a first end electrically coupled to the battery voltage V _{BATT and a} first end electrically coupled to one of the second switch 76b and a second end of the first end of the inductor 75. Which further comprises a second switch 76b is electrically connected to one end of _a second low-power supply voltage V. The inductor 75 further includes a second end electrically coupled to the buck voltage V _BUCK and one of the first ends of the bypass capacitor 77. The bypass capacitor 77 further comprises a lower electrically connected to the power supply voltage terminal of a second one ₁ V. The bypass capacitor 77 can be used to filter the step-down voltage V _BUCK . In some embodiments, the bypass capacitor 77 can be placed relatively close to or near the load of the buck converter.

The buck control block 74 can be configured to control the buck circuit 73 to generate the buck voltage V _BUCK . For example, when the buck circuit 73 is continuously operated, the buck control block 74 can be associated with the buck circuit by being configured in one of the first buck phases associated with the buck circuit 73. The voltage of the first switch 76a and the second switch 76b is regularly switched between one of the second step-down phases of one of the configurations to generate the step-down voltage V _BUCK . For example, during the first step-down phase of the buck circuit 73, the buck control block 74 can open the second switch 76b and close the first switch 76a to pass through the inductor 75 and the The first switch 76a supplies a current from the battery voltage V _BATT to the step-down voltage V _BUCK to charge the magnetic field of the inductor 75 . Moreover, during the second step-down phase of the buck circuit 73, the buck control block 74 can be configured to close the second switch 76b and open the first switch 76a such that the inductor 75 The magnetic field generates a current from the power low supply voltage V ₁ to the battery voltage V _BATT through the second switch 76b and the inductor 75.

Although the buck circuit 73 is described as operating via two phases while generating the buck voltage V _BUCK , the buck circuit 73 can be configured to operate with additional phases. For example, the buck control block 74 is configured to be associated with each of the first buck phase, the second buck phase, and each of the first switch 76a and the second switch 76b. In the case where the buck circuit 73 is switched between a third boosting phase, the buck circuit 73 can be configured to operate intermittently.

The buck control block 74 includes a hysteresis current comparator 78 that can be used to control the buck circuit 73 based on the error current I _ERROR . As previously described with respect to Figure 5, the error current I _ERROR can be varied relative to one of the error amplifier output currents. The hysteresis current comparator 78 can be used to control a magnitude of the buck voltage V _BUCK based on the error current I _ERROR to reduce one of the output currents of the error amplifier and improve the overall efficiency of the envelope tracking system. In some embodiments, the error current I _ERROR is a differential error current, and the hysteresis current comparator 78 is configured to compare one of the positive or non-inverted current components of the error current I _ERROR with the error current One of the I _ERROR negative or inverted current components, and the buck voltage V _{BUCK is} controlled based on the result. Additional details of the hysteresis current comparator 77 can be as described further below.

Although FIG. 7 illustrates one example of a buck converter 70 suitable for use in the wave seal tracking system described herein, other buck converter configurations may be used.

8 is a circuit diagram of one embodiment of a hysteresis current comparator 80 that can be used, for example, in buck converter 70 of FIG. The hysteresis current comparator 80 includes a first n-type field effect transistor (NFET) 81 to a ninth n-type field effect transistor (NFET) 89 and a first p-type field effect transistor (PFET) 91 to a fourth p Type field effect transistor (PFET) 94. The hysteresis current comparator 80 is configured to receive a reference current I _REF and a differential error current I _ERROR+ , I _ERROR- and generate an output signal OUT that can be used to control one of the buck converters. The differential error currents I _ERROR+ , I _ERROR- may correspond to a difference between a positive or non-inverted error current I _ERROR+ and a negative or inverted error current I _ERROR- .

The first NFET 81 includes a drain configured to receive the reference current I _REF . The drain of the first NFET 81 is electrically coupled to one of the gates of the first NFET 81 and one of the gates of the second NFET 82. The second NFET 82 further includes a drain electrically connected to one of the drains of one of the first PFETs 91. The first NFET 81 and the second NFET 82 each comprise a source electrically coupled to a low power supply voltage V ₁ (which may be, for example, a ground supply). The third NFET 83 includes one of the drains configured to receive a negative error current I _ERROR . The drain of the third NFET 83 is electrically coupled to one of the gates of the third NFET 83 and one of the gates of the fourth NFET 84. The fourth NFET 84 further includes a gate electrically connected to one of the first PFETs 91, one gate and one drain of the second PFET 92, one of the drains of the seventh NFET 87, and one of the drains of the third PFET 93. One of the gates of the ninth NFET 89 and one of the gates of the fourth PFET 94 is a drain. The third NFET 83 and the fourth NFET 84 each further include a source electrically connected to one of the power low supply voltages V ₁ . The first PFET 91 and the second PFET 92 each further include a source electrically coupled to a second or power high supply voltage V ₂ . In certain embodiments, the power supply voltage V ₂ is high based produce one of the boosted voltage by a boost converter. However, in other embodiments, the high power supply voltage V ₂ can be other voltages such as a battery voltage.

The fifth NFET 85 includes one of the drains configured to receive a positive error current I _ERROR+ . The drain of the fifth NFET 85 is electrically coupled to one of the gates of the fifth NFET 85 and one of the gates of the sixth NFET 86. The sixth NFET 86 further includes a drain electrically connected to one of the source of the seventh NFET 87 and one of the sources of the eighth NFET 88. The fifth NFET 85 and the sixth NFET 86 each further include a source electrically connected to one of the power low supply voltages V ₁ . The seventh NFET 87 further includes a gate electrically coupled to a bias voltage V _BIAS . In one embodiment, the bias voltage V _BIAS is biased to have a voltage level selected to be in a range from about 2.2 V to about 3.6 V. However, one of ordinary skill should readily determine other suitable voltage values, including, for example, voltage values associated with a particular application and/or manufacturing process.

The eighth NFET 88 further includes a gate electrically coupled to the one of the power high supply voltages V ₂ and electrically coupled to one of the gates of the third PFET 93 at a node configured to generate the output signal OUT One of the drains of one of the fourth PFETs 94 and one of the drains of one of the ninth NFETs 89. The NFET 89 further comprising a ninth electrically connected to the lower power supply voltage source V _1, one electrode, and the fourth PFET 94 further comprising electrically coupled to the high power supply voltage source V _2, one electrode.

The output signal OUT can be varied with respect to the differential error currents I _ERROR+ , I _ERROR- . For example, when the positive error current I _{ERROR+ is} relatively large, the voltages of the gates of the ninth NFET 89 and the fourth PFET 94 may be pulled high and the ninth NFET 89 and the fourth PFET 94 may output the signal The OUT control is logic low. Further, when the relative error current I _ERROR- negative large, the ninth voltage NFET gate 89 of the PFET 94 and the fourth electrode of the ninth and can be pulled down NFET 89 and the PFET 94 may be the fourth output The signal OUT is controlled to a logic high. Therefore, the output signal OUT can track the differential error currents I _ERROR+ , I _ERROR- . Although the illustrated configuration illustrates one configuration of the output signal OUT, the teachings herein are applicable to configurations in which the polarity of the output signal OUT is inverted.

The illustrated hysteresis current comparator 80 employs hysteresis to prevent the output signal OUT from changing state in response to relatively small fluctuations in the differential error currents I _ERROR+ , I _ERROR- . For example, the eighth NFET 88 and the third PFET 93 can provide hysteresis.

Although FIG. 8 illustrates one example of a hysteresis current comparator 80 for use in the buck converter 70 of FIG. 7, other embodiments of the hysteresis current comparator 80 may be used, including having other configurations. The configuration of the transistor. Moreover, in some embodiments, the hysteresis current comparator 80 can be omitted to facilitate control of the buck converter in other ways, such as by using a low pass filter.

9 is a circuit diagram of one embodiment of an error amplifier 100 that can be used, for example, in the wave seal tracking system 50 of FIG. The error amplifier 100 includes a first NFET 101 to an eighth NFET 108, first to ninth PFETs 119, and a bias circuit 120. The error amplifier 100 is configured to receive a differential input voltage V _IN+ , V _IN- to generate an output voltage V _OUT and to generate a differential error current I _ERROR+ , I _ERROR- . The differential input voltages V _IN+ , V _IN- can be associated with a difference between a positive or first input voltage V _IN+ and a negative or second input voltage V _IN- .

The first PFET 111 includes a gate configured to receive the positive input voltage V _IN+ and is electrically coupled to one of the source of the second PFET 112 and one of the drains of one of the third PFETs 113. The first PFET 111 further includes a drain electrically connected to one of the first NFET 101, one of the third NFET 103, and one of the source of the fifth NFET 105. The second PFET 112 further includes a gate configured to receive a negative input voltage V _IN- and a source electrically coupled to one of the second NFET 102, one of the fourth NFET 104, and one of the sixth NFET 106 One of the poles. The third PFET 113 further includes a source configured to receive a gate of a first bias voltage V _BIAS1 and to electrically connect to one of the power supply voltages V ₂ . The first NFET 101 is further configured to be electrically coupled to one of the gates of the second NFET 102, one of the gates of the third NFET 103, and the fourth NFET 104 at a node configured to receive a second bias voltage V _BIAS2 One of the gates of a gate. Each of the first NFET 101 to the fourth NFET 104 further includes a source electrically connected to one of the power low supply voltages V ₁ .

The fifth NFET 105 is further configured to be electrically coupled to one of the gates of one of the sixth NFETs 106 at a node configured to receive a third bias voltage V _BIAS3 . The fifth NFET 105 further includes a gate electrically connected to one of the sixth PFET 116, one of the seventh PFET 117, and one of the drains of the fourth PFET 114. The fourth PFET 114 further includes a gate electrically coupled to one of the gates of the fifth PFET 115 at one of the nodes configured to receive a fourth bias voltage V _BIAS4 . The fourth PFET 114 further includes a source electrically coupled to one of the drains of the sixth PFET 116. The sixth PFET 116 and the seventh PFET 117 each further include a source electrically connected to one of the power high supply voltages V ₂ . The seventh PFET 117 further includes a drain electrically connected to one of the sources of the fifth PFET 115. The fifth PFET 115 further includes a gate electrically connected to one of the eighth PFET 118, one of the ninth PFET 119, and one of the first terminals of the bias circuit 120.

The eighth PFET 118 further includes a drain electrically connected to one of the seventh NFETs 107 and configured to generate one of the output voltages V _OUT . The ninth PFET 119 further includes one of the gates configured to generate a positive error current I _ERROR+ . The eighth PFET 118 and the ninth PFET 119 each further include a source electrically connected to one of the power high supply voltages V ₂ . Further comprising an eighth NFET 108 configured to generate one of the error current I _ERROR- negative electrode and the drain is electrically connected to one of the seventh NFET gate 107, a sixth one of NFET 106 and the drain bias circuit 120, one One of the gates of the second terminal. Seventh NFET 107 and NFET 108 are each further comprising an eighth power supply connected to the low voltage source V _1, one electrode.

The biasing circuit 120 can be any suitable biasing circuit. For example, in some embodiments, the biasing circuit 120 includes a PFET and an NFET electrically coupled in parallel with the PFET and NFET channels disposed between the first terminal and the second terminal of the biasing circuit 120. However, other configurations of the biasing circuit 120 can be used.

The error amplifier 100 can be used to amplify the differential input voltages V _IN+ , V _IN- to produce the output voltage V _OUT . For example, the first PFET 111 and the second PFET 112 can operate as a differential transistor pair, and the first NFET 101 to the sixth NFET 106 and the fourth PFET 114 to the seventh PFET 117 can operate as a folded cascade amplification structure. . Further, the seventh NFET 107 and the eighth PFET 118 are operable as one of the output stages of the error amplifier 100.

As shown in FIG. 9, the eighth NFET 108 and the ninth PFET 119 can be configured to receive the gate voltages of the seventh NFET 107 and the eighth PFET 118, respectively. Since the seventh NFET 107 and the eighth PFET 118 are operable as one of the output stages of the error amplifier 100, the gates of the eighth NFET 108 and the ninth PFET 119 are electrically connected in this manner to generate an output that tracks the error amplifier 100. One of the current differential error currents I _ERROR+ , I _ERROR- . In some embodiments, the eighth NFET 108 is a replica transistor of the seventh NFET 107 and the ninth PFET 119 is a replica transistor of the eighth PFET 118. For example, in an embodiment, the widths of the eighth NFET 108 and the ninth PFET 119 are selected to be between about 100 times and about 200 times less than the widths of the seventh NFET 107 and the eighth PFET 118, respectively. However, the average technician should be able to easily determine other suitable widths.

The first bias voltage V _BIAS1 to the fourth bias voltage V _BIAS4 may be any suitable voltage. In one embodiment, the first bias voltage V _BIAS1 has a voltage _level selected to be in a range from about 2 V to about 3.8 V, the second bias voltage V _BIAS2 having a selectivity of about 0.6 V to a voltage level in a range of about 1 V, the third bias voltage V _BIAS3 having a voltage _level selected to be in a range of about 2.2 V to about 3.6 V, and the fourth bias voltage V _BIAS4 has One of the voltage levels in the range of about 2.4 V to about 3.8 V is selected. However, one of ordinary skill should readily determine other voltages, including, for example, voltage levels associated with a particular application and/or program.

Although FIG. 9 illustrates one example of an error amplifier suitable for use with the wave seal tracking system described herein, other error amplifier configurations in accordance with the wave seal tracking scheme described herein may also be used.

10 is a schematic block diagram of another embodiment of a envelope tracking system 130. The envelope tracking system 130 includes a battery 21, an error amplifier 51, a feedback circuit 52, and a buck converter 53.

The envelope seal tracking system 130 of FIG. 10 is similar to the envelope seal tracking system 50 of FIG. 5, except that the envelope seal tracking system 130 of FIG. 10 illustrates that the boost converter 54 of FIG. 5 has been omitted to facilitate use of the battery voltage V _BATT pair Except for one configuration of the error amplifier 51 power supply. Configuring the envelope tracking system 130 in this manner can reduce the complexity of the envelope tracking system by reducing component counts such as the number of inductors. However, configuring the envelope tracking system 130 in this manner can also reduce the maximum voltage level at which the envelope tracking system 130 can control the power amplifier supply voltage V _{CC — PA} . For example, as previously described with respect to FIG. 5, when a power amplifier drives a relatively large load impedance, the power amplifier can use a relatively large maximum power amplifier supply voltage. Thus, the envelope tracking system 130 can be adapted to power one or more power amplifiers that drive a relatively small load line impedance, such as one or less than 5 Ω load line impedance. Additional details of the power amplifier system 130 may be similar to those previously described with respect to the power amplifier system 50 of FIG.

11 shows an example of a plot 150 of current versus time for the envelope tracking system 50 of FIG. The graph 50 includes a first curve 151 of current versus time, a second curve 152 of current versus time, and a third curve 153 of current versus time. The graph 150 may correspond to one example of a current waveform of a particular wave seal tracking system (such as the wave seal tracking system 50 of FIG. 5) described herein. For example, the first curve 151 may correspond to one output current versus time of the error amplifier 51, the second curve 152 may correspond to one output current versus time of the buck converter 53, and the third curve 153 may correspond to A current is supplied to a power amplifier, which may be equal to the sum of the output current of the error amplifier 51 and the output current of the buck converter 53. As shown in graph 150, the buck converter 53 can be configured to generate over time by providing an error current signal I _ERROR to the buck converter 53 relative to the portion of the current supplied by the error amplifier 51. A larger portion of the current supplied to a power amplifier. Since the buck converter 53 can have a higher power efficiency than the one of the error amplifiers 51, configuring the wave seal tracking system in this manner can improve power efficiency.

12 is a schematic block diagram of another embodiment of a wave seal tracking system 160. The envelope tracking system 160 includes a battery 21, an error amplifier 51, a feedback circuit 52, a buck converter 53, an AC coupling capacitor 161, and a bypass capacitor 162.

The envelope seal tracking system 160 of FIG. 12 is similar to the envelope seal tracking system 130 of FIG. 10 except that the envelope seal tracking system 160 of FIG. 12 further includes an AC coupling capacitor 161 and a bypass capacitor 162. The bypass capacitor 162 is electrically coupled between the power amplifier supply voltage V _{CC — PA} and the power low supply voltage V ₁ and may be included to reduce output supply noise. In addition, the envelope tracking system 160 includes an AC coupling capacitor 161 that is electrically coupled between the output of the error amplifier 51 and the power amplifier supply voltage V _{CC — PA} .

Inserting the AC coupling capacitor 161 into an electrical path between the output of the error amplifier and the power amplifier supply voltage V _{CC —} PA allows the error amplifier 51 to be powered using the battery voltage V _BATT while allowing the error amplifier 51 to control the power amplifier supply voltage V _{CC — PA} to Above the voltage level of the battery voltage V _BATT . Thus, the illustrated wave seal tracking system 160 can be used in applications associated with a relatively high maximum voltage level of one of the power amplifier supply voltages V _{CC —} PA , such as one of the power amplifiers driving a relatively large load impedance and having A configuration of one of the relatively large output voltage swings.

In some embodiments, the envelope tracking system 160 is integrated with a power amplifier on a common module. For example, in one embodiment, a multi-chip module (MCM) includes a power amplifier die attached to a common module substrate and a waveguide tracking die. However, other implementations are also possible, such as embodiments in which a wave seal tracking system 160 is implemented for a wave seal tracking module that is separate from a power amplifier module.

FIG. 13 is a schematic block diagram of one embodiment of a wave seal tracking module 170. The envelope tracking module 170 is configured to generate a power amplifier supply voltage V _{CC —} PA that can be used to power one or more power amplifiers.

The envelope tracking module 170 includes a waveguide tracking die 171. The envelope tracking die 171 includes a first pin or pad 172a to a seventh pin or pad 172g, a buck controller 74, and an error amplifier. 51. An n-type field effect transistor (NFET) 174 and a p-type field effect transistor (PFET) 175. The envelope tracking module 170 further includes an inductor 55, a feedback circuit 52, an AC coupling capacitor 161, and a bypass capacitor 162. In some embodiments, the inductor 55, the feedback circuit 52, the AC coupling capacitor 161, and the bypass capacitor 162 are implemented as one of the power amplifier modules 170 on which the wave seal tracking die 171 is attached. Components on the module substrate. For example, the inductor 55, the feedback circuit 52, the AC coupling capacitor 161, and/or the bypass capacitor 162 can be implemented at least in part using a surface mount component (SMC). However, other embodiments are also possible. Although only certain components and pins are illustrated in FIG. 13 for clarity, the envelope tracking module 170 and/or the envelope tracking die 171 can be configured to include additional components and/or pins. Moreover, in certain embodiments, the inductor 55, the feedback circuit 52, the AC coupling capacitor 161, and/or the bypass Capacitor 162 may be implemented in whole or in part on the envelope tracking die 171.

The buck controller 74 is electrically coupled to a first or V _BATT pin 172a that can be used to power the wave seal tracking die 171. Buck controller 74 includes a first control output electrically coupled to one of the gates of NFET 174 and a second control output electrically coupled to one of the gates of PFET 175. The NFET 174 further comprises a low electrically connected to the power supply voltage V and one of _a source electrode electrically connected to the drain of PFET 175 and one of the second pins and one or BUCK _OUT drain 172b. PFET 175 further includes a source electrically coupled to one of V _BATT pins 172a.

Buck controller 74 is configured to receive error current I _ERROR from error amplifier 51. In addition, the buck controller 74 is electrically coupled to the third or I _HI pin 172c and the fourth or I _LO pin 172d, which can be used to provide a threshold current, and the buck controller 74 can compare the error current I _ERROR with Current limit. For example, buck controller 74 can include a hysteresis current comparator 77 that can be configured to control NFET 174 and PFET 175 to have an error current I _ERROR greater than the current received on pin 172c of I _HI The power amplifier supply voltage V _{CC —} PA is increased, and the power amplifier supply voltage V _{CC —} PA is decreased when the error current I _{ERROR is} less than the current received on the I _LO pin 172d. The comparison error current I _ERROR and the threshold current allowable buck controller 74 track one of the low frequency components of the power amplifier supply voltage V _{CC — PA} . Although one configuration of the buck controller 74 is illustrated in FIG. 13, other embodiments of the buck controller 74 may be utilized, such as configurations in which hysteresis is otherwise implemented.

The error amplifier 51 includes a non-inverting input electrically coupled to a fifth or ENVELOPE pin 172e that can receive a wave seal signal associated with one of the power amplifiers powered by the wave seal tracking module 170. In some embodiments, the envelope signal is provided by using at least one of a transceiver IC, a baseband processor, or a power management IC. Error amplifier 51 further includes an inverting input electrically coupled to a sixth or FBK pin 172f. The error amplifier 51 further includes an output electrically coupled to one of the seventh or ERR _OUT pins 172g. The error amplifier 51 is configured to generate an error current I _ERROR and provide an error current I _ERROR to the buck controller 74.

The inductor 55 includes a first end electrically coupled to the BUCK _OUT pin 172b and a second end electrically coupled to the power amplifier supply voltage V _CC — PA . The AC coupling capacitor 161 includes a first end electrically coupled to the ERR _OUT pin 172g and a second end electrically coupled to the power amplifier supply voltage V _CC — PA. The bypass capacitor 162 includes a first end electrically coupled to one of the power amplifier supply voltages V _CC — PA and a second end electrically coupled to the power low supply voltage V ₁ .

The illustrated wave seal tracking module 170 can control the voltage level of the power amplifier supply voltage V _{CC —} PA by receiving a wave seal signal on the ENVELOPE pin 172e. In addition, the envelope tracking module 170 employs a step-down converter and an error amplifier that operate in parallel to control the voltage level of the power amplifier supply voltage V _{CC —} PA . In particular, the buck controller 74 including the hysteresis current comparator 77 can be used to track one of the low frequency components of the envelope signal, and the error amplifier 51 can be used to pass the high frequency based on the envelope signal and the receive feedback circuit 52. A difference between the feedback signals controls the AC current delivered to the power amplifier supply voltage V _{CC — PA} to track one of the high frequency components of the envelope signal. In addition, since the output of the error amplifier 51 is electrically connected to the power amplifier supply voltage V _CC — PA through the AC coupling capacitor 161 , the envelope tracking module 170 can be used to control the voltage level of the power amplifier supply voltage V _{CC — PA} to be greater than the V. _A battery voltage is received on the _BATT pin 172a.

As described in various configurations above, a buck converter can be configured to generate a buck voltage having one of the magnitudes of the error current generated by an error amplifier. However, the buck converter can be controlled in other ways. For example, in some embodiments, a power amplifier voltage can be filtered and used to generate a control voltage for controlling one of the buck converters. For example, in some embodiments, the filtered power amplifier supply voltage and a reference voltage can be compared to generate a control voltage.

14 is a schematic block diagram of another embodiment of a wave seal tracking module 180. The envelope tracking module 180 is configured to generate a power amplifier supply voltage V _{CC —} PA that can be used to power one or more power amplifiers.

The envelope tracking module 180 includes a wave seal tracking die 181 that tracks the die The 181 includes a first pin or pad 182a to a seventh pin or pad 182g, an error amplifier 183, an NFET 184, a PFET 185, a DC DC controller 186, a reference voltage generator 187, and a low pass. Filter 188 and a comparator 228. The envelope tracking module 180 further includes an inductor 55, an AC coupling capacitor 161, a bypass capacitor 162, a first feedback resistor 189a, and a second feedback resistor 189b.

In some embodiments, the inductor 55, the AC coupling capacitor 161, the bypass capacitor 162, the first feedback resistor 189a, and the second feedback resistor 189b are implemented to be disposed in association with the envelope tracking die 181. The components on the package substrate. However, other embodiments are also possible. Although only certain components and pins are illustrated in FIG. 14 for clarity, the envelope tracking module 180 and/or the envelope tracking die 181 can be configured to include additional components and/or pins. .

The DC to DC controller 186 is electrically coupled to the first or V _BATT pin 182a. The DC to DC controller 186 includes a first control output electrically coupled to one of the gates of the NFET 184 and a second control output electrically coupled to one of the gates of the PFET 185. The NFET 184 further includes a source electrically coupled to one of the low power supply voltages V ₁ and electrically coupled to one of the drains of the PFET 185 and one of the second or V _REG contacts 182b. The PFET 185 further includes a source electrically coupled to one of the V _BATT pins 182a. The DC to DC controller 186 is configured to receive a control voltage V _CONTROL from the comparator 228. The DC to DC controller 186 can be configured to control the gate voltage of the NFET 184 and the PFET 185 based on a voltage level of a control voltage V _CONTROL operable as a low frequency feedback signal to control the power amplifier supply voltage V. The voltage level of _{CC_PA} . Although the DC-to-DC controller 186 is illustrated in a buck converter configuration, the teachings herein can also be applied to a boost converter configuration.

The error amplifier 183 includes a non-inverting input electrically coupled to a third or ENVELOPE pin 182c, the third or ENVELOPE pin 182c being configurable to receive and power a power amplifier using the wave seal tracking module 180 The input signal is associated with one of the enveloped signals. In some embodiments, the envelope signal is provided using at least one of a transceiver IC, a baseband processor, or a power management IC. As will be described in detail, which further comprises an error amplifier 183 is electrically connected to the fourth or inverting input of one of these pins 182d FBK _HIGH, the fourth or FBK _HIGH configured to have pins and 182d from the first feedback resistor 189a and The second feedback resistor 189b receives a high frequency feedback signal. The error amplifier 183 further includes an output electrically coupled to one of the fifth or ERR _OUT pins 182e. Although FIG. 14 illustrates the configuration in which a resistor is used to generate one of the high frequency feedback signals for an error amplifier, other configurations are also possible, including, for example, omitting resistors and/or including other means. Configuration of the configured resistors.

Low pass filter 188 comprises an electrical input connected to one of the sixth or 182e FBK _LOW Pins, the sixth or FBK _LOW Pins 182f has been configured to receive the power amplifier supply voltage _V CC_PA. The low pass filter 188 can be configured to filter or attenuate high frequency components of the power amplifier supply voltage V _{CC — PA} to produce a filtered power amplifier supply voltage. The reference voltage generator 187 can generate a reference voltage V _REF , and the comparator 228 can compare the reference voltage V _REF with the filtered power amplifier supply voltage to generate a control voltage V _{CONTROL for} controlling the DC to DC controller 186.

In the illustrated configuration, the reference voltage generator 187 is electrically coupled to a seventh or SPI pin 182g that can be associated with a data input pin of a serial peripheral interface (SPI). Although not illustrated in FIG. 14 for clarity, the envelope tracking module 180 can include additional pins associated with the series of peripheral interfaces, including, for example, a series of clock contacts, Data output pin and / or a select pin. The SPI pin 182g can be associated with a serial peripheral interface or busbar for providing one of the data for controlling the voltage level of the reference voltage V _REF . For example, the reference voltage generator 187 can include a digital to analog analog (D-to-A) converter that can convert the digital data received on the SPI pin 182g into an analog signal for generating the reference voltage V _REF . . In some embodiments, the SPI pin 182g can be used to dynamically change the reference voltage V _REF to optimize the energy efficiency of one of the power amplifiers powered by the envelope tracking module 180. For example, the reference voltage generator 187 can be used to dynamically change the reference voltage V _REF between transmission slots of the power amplifier to, for example, vary the characteristics of the power amplifier supply voltage V _{CC — PA} across different power modes.

The inductor 55 includes a first end electrically coupled to the V _REG pin 182b and a second end electrically coupled to the power amplifier supply voltage V _CC — PA . The AC coupling capacitor 161 includes a first end electrically coupled to one of the ERR _OUT pins 182e and a second end electrically coupled to the power amplifier supply voltage V _CC — PA. The bypass capacitor 162 includes a first end electrically coupled to one of the power amplifier supply voltages V _CC — PA and a second end electrically coupled to the power low supply voltage V ₁ . The first feedback resistor 189a includes a first end electrically coupled to the FBK _HIGH pin 182d and a second end electrically coupled to the ERR _OUT pin 182e. Comprising a second feedback resistor 189b is electrically connected to the one end 182d of the second end of a first one of _a low power supply voltage V FBK _HIGH and electrically connected to the contact pins.

In the illustrated configuration, the error amplifier 183 receives a high frequency feedback signal from the first feedback resistor 189a and the second feedback resistor 189b. For example, in the illustrated configuration, the AC coupling capacitor 161 has been placed between the power amplifier supply voltage V _{CC — PA} and the first feedback resistor 189a and the second feedback resistor 189b, thereby operating to block The low frequency component of the power amplifier supply voltage V _{CC — PA} reaches the inverting input of the error amplifier 183. Configuring the power amplifier module 180 in this manner can assist in increasing the module by allowing the DC-to-DC controller 186 to track low frequency variations of the envelope signal and allowing the error amplifier 183 to track high frequency variations of the envelope signal. Power efficiency.

In the illustrated configuration, the error amplifier 183 is only operated using high frequency feedback and thus one of the error currents generated by the error amplifier 183 does not necessarily include low frequency information suitable for tracking by the DC to DC controller 186. Therefore, the illustrated wave seal tracking module 180 filters the power amplifier supply voltage V _{CC —} PA using the low pass filter 188 and compares the filtered power amplifier supply voltage with the reference voltage V _REF to generate an operation as a low frequency feedback. The control voltage V _{CONTROL of the} signal is instead controlled by the error current I _ERROR from the error amplifier 183 to control the DC to DC controller 186.

15 is a schematic block diagram of one embodiment of a telephone board 190. The phone board 190 includes a transceiver IC 191, a power management IC (PMIC) 192, and a power amplifier (PA) module 193. The transceiver IC 191 is configured to generate a radio frequency signal (RF SIGNAL) and a envelope signal (ENVELOPE). The PA module 193 is configured to receive the envelope signal and the radio frequency signal from the transceiver IC 191. Additionally, the PA module 193 is configured to receive a regulated voltage V _REG from the PMIC 192 and provide a control voltage V _CONTROL to the PMIC 192. The PMIC 192 can be configured to control one of the regulated voltages V _REG based on a voltage level of the control voltage V _CONTROL .

The PA module 193 can be, for example, a multi-chip module (MCM) comprising one or more dies mounted on one surface of a module or carrier substrate. By integrating a plurality of dies and/or other components into a module, various advantages can be achieved including, for example, reducing cost, improving manufacturing convenience, and/or reducing the length of the interconnect.

The PMIC 192 can include one or more dies and/or other components configured to generate a regulated voltage for one of the PA modules 193. The PMIC 192 can include, for example, one or more DC to DC converters, low dropout (LDO) regulators, and/or configured to generate components for the phone board 190 (including, for example, the PA module 193) One or more other circuits that are regulated to supply voltage. The PMIC 192 can be configured to generate the one or more power supply voltages using a battery voltage from one of the batteries. In some embodiments, the PMIC 192 can include a battery charger for providing power path management for the battery.

The PA module 193 may generate a control voltage V _CONTROL, the voltage V _CONTROL The PMIC 192 may be used to control the PA module 193 is provided to the one of the regulated voltage V _REG voltage level. As will be described in greater detail below, the PA module 193 can include an error amplifier configured to adjust a voltage level of the regulated voltage V _REG based on a envelope signal ENVELOPE received from the transceiver IC 191. Additionally, the PA module 193 can include a feedback circuit configured to adjust one of the voltage _levels of the control voltage V _CONTROL . The PA module 193 can use the control voltage V _CONTROL to control one of the regulated voltages V _REG voltage levels in a manner similar to that previously described with respect to FIG. Accordingly, the PA module 193 and the PMIC 192 can collectively operate to provide envelope tracking for a power amplifier disposed on the PA module 193.

The phone board 190 of Figure 9 includes a wave seal tracking system for providing wave seal signal tracking without the need for a dedicated wave seal tracking module or die. Thus, the phone board 190 can operate using the wave seal tracking function while having a reduced motherboard cost and/or area compared to one of the phone boards including a dedicated wave seal tracking module or die. Although FIG. 15 illustrates a configuration in which the transceiver IC 191 is used to generate a wave seal signal, other configurations are also possible.

16A is a schematic block diagram of one embodiment of an RF system 200. The RF system 200 includes a power amplifier (PA) module 211 and a power management integrated circuit (PMIC) 201. In one embodiment, the RF system 200 is part of a telephone board of one of the wireless devices.

The PMIC 201 includes an NFET 184, a PFET 185, a DC to DC controller 186, first to third pins 202a to 202c, a PMIC inductor 205, and a PMIC capacitor 207. Although PMIC 201 is illustrated as including particular components and pins for clarity, the PMIC 201 can be adapted to include additional components and/or pins.

The DC-to-DC controller 186 includes a supply input electrically coupled to one of the first or V _BATT pins 202a that can be configured to receive a battery voltage V _BATT from a battery. The DC to DC controller 186 further includes a control input electrically coupled to the second or V _CONTROL pin 202b. The DC to DC controller 186 includes a first control output electrically coupled to one of the gates of the NFET 184 and a second control output electrically coupled to one of the gates of the PFET 185. The PFET 185 further includes a source electrically coupled to one of the V _BATT pins 202a and electrically coupled to one of the NFET 184 and one of the first ends of the PMIC inductor 205. The NFET 184 further comprises one of _a power source connected to the power supply voltage V extremely low, and the PMIC 205 further includes an inductor electrically coupled to the power amplifier module may be used to provide 211 or a third regulated voltage V _REG Pins One of the second ends of 202c. The PMIC capacitor 207 is electrically connected between the V _REG pin 202c and the power low supply voltage V ₁ . The DC to DC controller 186 can be configured to control the gate voltage of the NFET 184 and the PFET 185 to control the V _REG pin 202c based on a voltage level of one of the control voltages received on the V _CONTROL pin 202b. Voltage level. Although the PMIC 201 is illustrated for a buck converter configuration, the PMIC 201 can be adapted to provide a boost voltage. Therefore, the regulated voltage V _REG can be a step-down voltage, a boost voltage, or a voltage that changes between a step-down voltage and a boost voltage over time.

The power amplifier module 211 includes a power amplifier 32, an AC coupling capacitor 161, a bypass capacitor 162, an error amplifier 183, a reference voltage generator 187, a low pass filter 188, a first feedback resistor 189a, a second feedback resistor 189b, The first to seventh pins 212a to 212g, an inductor 215, and a comparator 228. Although the power amplifier module 211 is illustrated as including particular components and pins for clarity, the power amplifier module 211 can be adapted to include additional components and/or pins.

The second feedback resistor 189b includes a first end electrically connected to one of the low power supply voltages V1 and _one of the first ends of the first input of the first feedback terminal 189a electrically connected to the inverting input of the error amplifier 183 end. The first feedback resistor 189a further includes a first end electrically coupled to one of the AC coupling capacitors 161 and a second end of one of the outputs of the error amplifier 183. The error amplifier 183 further includes a supply input electrically coupled to one of the first or V _BATT contacts 212a that can be configured to receive the battery voltage V _BATT . The error amplifier 183 further includes a non-inverting input electrically coupled to the second or ENVELOPE pin 212b. The AC coupling capacitor 161 further includes a second end electrically coupled to one of the power amplifier supply voltages V _CC — PA .

The inductor 215 includes a first end electrically coupled to the third or V _REG pin 212c and a second end electrically coupled to the power amplifier supply voltage V _CC — PA . The capacitor 162 includes a first end electrically coupled to one of the power amplifier supply voltages V _CC — PA and a second end electrically coupled to the power low supply voltage V ₁ . The low pass filter 188 includes an input electrically coupled to one of the power amplifier supply voltages V _CC — PA and electrically coupled to one of the first inputs of the comparator 228 . The comparator 228 further includes a second input electrically coupled to one of the fourth or V _CONTROL pins 212d and configured to receive a reference voltage V _{REF from} one of the reference voltage generators 187. The reference voltage generator 187 further includes an input electrically coupled to one of a fifth or SPI pin 212e that is associated with a data input pin of a series of peripheral interfaces. Power amplifier 32 includes a supply input configured to receive one of the power amplifier supply voltages V _{CC — PA} , a signal input electrically coupled to a sixth or RF_IN pin 212f , and a signal output electrically coupled to a seventh or RF_OUT pin 212g .

The low pass filter 188 can be configured to filter or attenuate high frequency components of the power amplifier supply voltage V _{CC — PA} to generate a filtered power amplifier supply voltage for the comparator 228 . The comparator 228 can also receive the reference voltage V _REF from the reference voltage generator 187 and compare the reference voltage V _REF with the filtered power amplifier supply voltage to generate a DC-to-DC controller for controlling the PMIC 201. 186 control voltage V _CONTROL . In the illustrated configuration, the reference voltage generator 187 is electrically coupled to the SPI pin 212e, which can be coupled to one of the data provided to control one of the voltage levels of the reference voltage V _REF Serialize the peripheral interface or busbar. For example, the reference voltage generator 187 can include a digital to analog (D to A) converter that converts the digital data received on the SPI pin 212e into an analog signal for generating the reference voltage V _REF .

In the illustrated configuration, the AC coupling capacitor 161 has been placed between the power amplifier supply voltage V _CC — PA and the series combination of the first feedback resistor 189a and the second feedback resistor 189b, thereby operating The low frequency component associated with the power amplifier supply voltage V _{CC —} PA is prevented from reaching the inverting input of the error amplifier 183 . Therefore, the error amplifier 183 shown in Fig. 16A is operated only using the high frequency feedback. In addition, the comparator 228 generates a control voltage V _CONTROL which controls the operation based on the voltage V _CONTROL filtered amplifier supply voltage is generated by the sum of the low pass filter 188 and the reference voltage generated by the reference voltage of the generator of 187 V _REF A comparison of one of the low frequency feedback signals.

The RF system 200 illustrates one of the schemes in which the error amplifier 183 is already included on the power amplifier module 211. The inclusion of both error amplifier 183 and power amplifier 32 on power amplifier module 211 can reduce the size of an inductor (such as inductor 27 of FIG. 3B) used to provide a supply voltage to power amplifier 32. For example, both the error amplifier 183 and the power amplifier 32 are electrically coupled to the second end of the inductor 215, and thus one of the high frequency error currents generated by the error amplifier 183 does not have to pass through the inductor 215 and contributes to the L*dI/ of the inductor. Dt noise. Thus, for a given amount of power supply noise, integrating the error amplifier 183 with the power amplifier 32 on a common module reduces the size of the inductor used to provide a supply voltage to the power amplifier 32.

16B is a schematic block diagram of another embodiment of an RF system 220. The RF system 220 includes a power amplifier module 221 and a PMIC 201. The RF system 220 of Figure 16B is similar to the RF system 200 of Figure 16A except that the RF system 220 of Figure 16B includes a different power amplifier module configuration. In particular, the power amplifier module 221 of FIG. 16B further includes a high pass filter 216 and a comparator 229 as compared to the power amplifier module 211 of FIG. 16A. The high pass filter 216 includes an output configured to receive one of the power amplifier supply voltages V _{CC — PA} and configured to provide the comparator 229 with a filtered power amplifier supply voltage. The high pass filter 216 can filter or remove the low frequency component of the power amplifier supply voltage V _{CC — PA} to generate a high pass filtered power amplifier supply voltage. The comparator 229 is further configured to receive a envelope signal from the ENVELOPE pin 212b and compare the high pass filtered power amplifier supply voltage to the envelope signal to generate one of the non-inverting inputs for the error amplifier 183 High frequency envelope signal.

Although FIGS. 16A-16B illustrate the configuration of an RF system including an AC coupling capacitor 161, in some embodiments, the AC coupling capacitor 161 can be omitted to reduce component count. For example, although omitting the AC coupling capacitor 161 may reduce the error amplifier 183 to control the power amplifier supply voltage V _{CC — PA} to the maximum voltage level, such RF systems may be used to, for example, drive a relatively high The small load line impedance and therefore has a relatively small output voltage swing that is powered by one or more amplifiers.

17A is a schematic block diagram of one of the multi-band power amplifier systems 230 in accordance with an embodiment. The illustrated multi-band power amplifier system 230 includes a first power amplifier module 231, a second power amplifier module 232, a third power amplifier module 233, and a power management IC 234. The first power amplifier module 231 includes a first inductor 241 , the second power amplifier module 232 includes a second inductor 242 , and the third power amplifier module 233 includes a third inductor 243 . While the multi-band power amplifier system 230 is illustrated as including three power amplifier modules, the multi-band power amplifier system 230 can be adapted to include more or fewer power amplifier modules.

The first power amplifier module 231 to the third power amplifier module 233 can each be configured to communicate via a different RF communication band. Providing a plurality of power amplifiers in a multi-band power amplifier system can help increase the power efficiency of the system and/or relax design constraints on the power amplifier because each power amplifier can be individually and exclusively for a particular frequency band amplified by the power amplifier. Jiahua.

PMIC 234 has been configured to generate a regulated voltage V _REG, the regulated voltage V _REG is supplied to the first end of one of the third inductor 241 to 243 are each of the first inductor. The first inductor 241 to the third inductor 243 each include a second end electrically connected to one of the power amplifier supply voltages of the respective ends of the power amplifier modules. For example, the first inductor 241 includes a second end electrically coupled to one of the first power amplifier supply voltages V _{CC — PA1} associated with the first power amplifier module 231 , the second inductor 242 including an electrical connection to The second power amplifier module 232 is associated with one of the second power amplifiers to supply one of the second ends of the voltage V _{CC — PA2} , and the third inductor 243 includes an electrical connection to one of the third power amplifier modules 233 . The third power amplifier supplies a second end of one of the voltages V _{CC — PA3} . The first power amplifier module 231 to the third power amplifier module 233 are also configured to generate a first control voltage V _CONTROL1 to a third control voltage V _CONTROL3 that have been supplied to the PMIC 234.

The PMIC 234 can be used to control the voltage level of the regulated voltage V _REG based on a control voltage received from one of the enabled or active power amplifier modules. For example, when the first power amplifier module to enable one of the power amplifier 231, the PMIC 234 may be used to control voltage based on the first voltage level V _CONTROL1 one controlling the first one of the power amplifier supply voltage V _{CC_PA1} Voltage level. Similarly, when the second power amplifier module to enable one of the power amplifier 232, the PMIC 234 may be used based on the second control voltage V _CONTROL2 one voltage level to control the second power amplifier supply voltage _V CC_PA2 of A voltage level. Similarly, when one of the power amplifiers on the third power amplifier module 233 is enabled, the PMIC 234 can be used to control the third power amplifier supply voltage V _{CC — PA3} based on one of the third control voltages V _CONTROL3 . A voltage level. In some embodiments, the first control voltage V _CONTROL1 to the third control voltage V _{CONTROL3 can be} provided to the PMIC 234 using a common electrical connection such as a common telephone board trace, and the multi-band power amplifier System 230 can be configured such that at most one of the first control voltage V _CONTROL1 to the third control voltage V _CONTROL3 is active at a time.

In a manner similar to that previously described with respect to Figures 14A-14B, each of the power amplifier modules 231 through 233 can include one for adjusting a respective power amplifier supply voltage to track one of the amplifications by the power amplifier module. One of the wave amplifiers of the RF signal is an error amplifier. Accordingly, the multi-band power amplifier system 230 of FIG. 17A illustrates that the first power amplifier supply voltage V _{CC — PA1} to the third power amplifier supply voltage V _{CC — PA3} may be a common regulated voltage V _REG generated by the PMIC 234. Wave seal tracking provider.

Figure 17B is a schematic block diagram of one of the multi-band power amplifier systems 240 in accordance with another embodiment. The illustrated multi-band power amplifier system 240 includes a first power The amplifier module 231 is connected to the third power amplifier module 233, the PMIC 234, and the first to third inductors 241 to 234. The multi-band power amplifier system 240 of Figure 17B is similar to the multi-band power amplifier system 230 of Figure 17A, except that the multi-band power amplifier system 240 of Figure 17B illustrates that the first inductor 241 to the third inductor 243 have been separately disposed. Except for one configuration outside the first power amplifier module 231 to the third power amplifier module 233. For example, the first inductor 241 to the third inductor 234 can be disposed on a telephone board associated with the multi-band power amplifier system 240. The teachings herein may be applied to configurations in which an inductor is implemented on a combination of a power amplifier module, a telephone board, or the like.

18 shows an example of a graph 250 of voltage versus time for the envelope tracking system 160 of FIG. The graph 250 includes a first curve 251 of voltage versus time and a second curve 252 of voltage versus time. The graph 250 may correspond to one of the voltages of the envelope tracking system 160 of FIG. For example, the first curve 251 can correspond to the power amplifier supply voltage V _{CC —} PA of FIG. 12 , and the second curve 252 can correspond to the output voltage of the error amplifier 51 of FIG. 12 .

19 is a schematic block diagram of one of a multi-mode power amplifier (PA) module 260 in accordance with an embodiment.

The multi-mode PA module 260 includes a first or V _BATT pin 262a configured to receive a battery voltage and a second or GND pin 262b configured to receive a ground voltage. In addition, the multi-mode PA module 260 further includes one of the high-band 3G/4G signals configured to receive one of the high-band 3G/4G signals that can be amplified by the high-band 3G/4G power amplifier circuit 263 and provided to a ninth pin 262i. Or HB_3G/4G pin 262c. The amplified high band 3G/4G signal provided to the ninth pin 262i can be filtered using an external filter and/or duplexer. The multi-mode PA module 260 further includes a fourth or HB-2G pin 262d that can receive one of the high-band 2G signals that can be amplified by the high-band 2G power amplifier circuit 264. The multi-mode PA module 260 further includes a fifth or LB-2G pin 262e configured to receive one of the low band 2G signals that can be amplified by the low band 2G power amplifier circuit 265. In addition, the multi-mode PA module 260 includes one of the low-band 3G/4G signals configured to be amplified by the low-band 3G/4G power amplifier circuit 266 and provided to a thirteenth pin 262m. LB_3G/4G pin 262f. The amplified low band 3G/4G signal provided to the thirteenth pin 262m can be filtered using an external filter and/or duplexer.

A seventh pin 262g (POWER CTRL) can be used to provide a power control signal to a power amplifier control block 270. In some embodiments, the power amplifier control block 270 can be a millimeter wave mobile broadband (MMB). ) Power amplifier control system. The multi-mode PA module 260 further includes an eighth or serial peripheral interface (SPI) header 262h electrically connectable to a digital control block 269. The power amplifier control block 270 and the digital control block 269 can be used to allow external circuitry to control the functionality of the multi-mode PA module 260, such as selecting a power mode or active path. The power amplifier control block 270 and/or the digital control block 269 can be configured to control other components or blocks of the multi-mode PA module 260. For example, in the illustrated configuration, the power amplifier control block 270 is configured to control a switch control block 268.

The switch control block 268 can be used to control the active path of the multi-mode PA module 260 by controlling the switch 267. In the illustrated configuration, the switch 267 is configured to receive a bipolar seven-throw (DP7T) switch of one of the seventh input signals. In particular, the switch 267 is configured to receive a first signal from a twelfth or PCS pin 262l; to receive a second signal from an eleventh or DCS pin 262k; from a tenth or RX1 The pin 262j receives a third signal; receives a fourth signal from the high band 2G power amplifier circuit 264; receives a fifth signal from the low band 2G power amplifier circuit 265; receives from a fourteenth or RX2 pin 262n a sixth signal; and receiving a seventh signal from a fifteenth or GSM pin 262o. The switch 267 includes a first output electrically coupled to a sixteenth pin 262p that is connectable to one of the high frequency band antennas (HB ANT). The switch 267 further includes a second output electrically coupled to one of the seventeenth pins 262q that is connectable to one of the low band antennas (LB ANT). A directional coupler 275 can be used to sense the signals provided to the high band antenna and the low band antenna on the sixteenth pin 262p and the seventeenth pin 262q, respectively. The directional coupler 275 includes a first turn electrically connected to one of the eighteenth pins 262r and a second turn electrically connected to one of the nineteenth pins 262s.

Although FIG. 19 illustrates one example of a multi-mode PA, multi-mode PA may be implemented in other implementations, including configuration using a different circuit configuration, configuration of a different combination of amplified signal bands, and use more or Less component and / or pin configuration.

application

Some of the embodiments described above have been provided in connection with wireless devices or mobile phones. However, the principles and advantages of such embodiments can be applied to any other system or device that requires a wave seal tracker.

These wave seal trackers can be implemented in a variety of electronic devices. Examples of such electronic devices may include, but are not limited to, consumer electronic products, portions of such consumer electronic products, electronic testing devices, and the like. Examples of such electronic devices may also include, but are not limited to, memory chips, memory modules, circuits of optical networks or other communication networks, and disk drive circuits. The consumer electronic products may include, but are not limited to, a mobile phone, a telephone, a television, a computer monitor, a computer, a palmtop computer, a PDA, a microwave oven, a refrigerator, a car, a stereo system, a video cassette recorder or player, a DVD player, a CD player, a VCR, an MP3 player, a radio, a video camera, a camera, a digital camera, a portable A memory chip, a washer, a clothes dryer, a washer/dryer, a photocopier, a facsimile machine, a scanner, a multifunction peripheral device, a wristwatch, a clock, and the like. Additionally, the electronic devices can include unfinished products.

in conclusion

Unless the context clearly requires otherwise, the words "including" and the like are understood to be inclusive and not to be construed as exclusive or exhaustive. Meaning; that is, the meaning of "including but not limited to". As used herein, the word "coupled" refers to two or more elements that may be directly connected or connected by one or more intermediate elements. Similarly, the term "connected" as used herein refers to two or more elements that can be directly connected or connected by one or more intervening elements. In addition, the words "herein", "above", "below" and the like are used in this application to refer to the whole of this application and not to any particular part of this application. Where the context permits, the use of the singular or plural <RTI ID=0.0> </ RTI> in the above detailed description may also include the plural or singular. The word "or" refers to a list of two or more items that cover all of the following interpretations of a word: any item in the list, all items in the list, or any combination of items in the list.

In addition, the terms used herein (especially such as "may", "may", "will", "may", "for example", "", unless otherwise expressly stated or otherwise understood in the context of use. The use of certain features, elements and/or states in the embodiments of the present invention is not intended to be limited. Therefore, such conditional terms are generally not intended to imply that one or more embodiments are always required to require features, elements and/or states or one or more embodiments must be included for use in the case of author input or prompts or without author input or prompts. It is determined whether such features, elements and/or states are included or performed in the logic of any of the embodiments.

The above detailed description of the embodiments of the invention is not intended to Although certain embodiments and examples of the invention have been described above for illustrative purposes, various equivalent modifications are possible within the scope of the invention as appreciated by those skilled in the art. For example, although a program or block is presented in a given order, alternative embodiments can perform a routine with steps or a system with blocks in a different order, and some programs or blocks can be deleted, moved, added, subdivided, combined, and / or modify. Each of these programs or blocks can be implemented in a number of different ways. Also, although the program or block is sometimes shown as being executed in tandem, it may be performed in parallel or alternatively at different times. Execute these programs or blocks.

The teachings of the present invention provided herein are applicable to other systems and are not necessarily the systems described above. The elements and acts of the various embodiments described above can be combined to provide further embodiments.

Although certain embodiments of the present invention have been described, the embodiments are presented by way of example only and are not intended to limit the scope of the disclosure. In fact, the novel methods and systems described herein may be embodied in a variety of other forms. Also, various omissions, substitutions and changes in the form of the methods and systems described herein may be made without departing from the spirit of the disclosure. The scope of the accompanying claims and the equivalents thereof are intended to cover such forms or modifications as may fall within the scope and spirit of the disclosure.

21‧‧‧Battery

50‧‧‧ Wave Sealing System

51‧‧‧Error amplifier

52‧‧‧Feedback circuit

53‧‧‧Buck Converter

54‧‧‧Boost Converter

ENVELOPE‧‧‧ wave seal signal

I _ERROR ‧‧‧Error current

V _BATT ‧‧‧Battery voltage

V _BOOST ‧‧‧Boost voltage

V _{CC_PA ‧‧‧Power} amplifier supply voltage

Claims (31)

A mobile device comprising: a power amplifier configured to receive a power amplifier supply voltage and amplify a radio frequency (RF) input signal to generate an RF output signal; a buck converter configured to a battery voltage is converted to a step-down voltage, the buck converter is configured to control a magnitude of the step-down voltage based on an error current; and an error amplifier configured to be based on the one of the RF input signals The wave seal generates an output current, and the power amplifier supply voltage is generated by adjusting the magnitude of the buck voltage using the output current, the error amplifier being configured to be measured by a magnitude relative to the output current The buck converter is controlled by varying the magnitude of the error current. The mobile device of claim 1, further comprising an AC coupling capacitor electrically coupled between the power amplifier supply voltage and an output of the error amplifier configured to generate the output current. The mobile device of claim 1, wherein the buck converter comprises a buck controller, a buck inductor, and a plurality of buck switches, the buck controller configured to use the error current to control the One of a plurality of buck switches is in a state to control current through one of the buck inductors. The mobile device of claim 3, wherein the error current comprises a non-inverting error current component and an inverting error current component, the buck converter comprising a current comparator configured to compare by The non-inverting error current component and the inverted error current component control the state of the plurality of buck switches. The mobile device of claim 1, wherein the error amplifier includes a first pair of transistors configured to generate the output current and configured to generate the error current A pair of transistors, the second pair of electromorphic systems being implemented as a replica of the first pair of transistors. The mobile device of claim 1, further comprising an antenna configured to receive the RF output signal. The mobile device of claim 1, further comprising one of the wave seals configured to generate the RF input signal. The mobile device of claim 1, further comprising a battery configured to generate the battery voltage. The mobile device of claim 8, wherein the error amplifier is powered using the battery voltage. The mobile device of claim 1, further comprising a boost converter configured to convert the battery voltage to a boost voltage having a voltage greater than one of the battery voltages One of the values of the voltage magnitude that is used to power the error amplifier. A wave seal tracker for generating a power amplifier supply voltage, the wave seal tracker comprising: a buck converter configured to convert a battery voltage to a step-down voltage, the buck converter Configuring to control a magnitude of the step-down voltage based on an error current; and an error amplifier configured to generate an output current based on a envelope signal and adjusting the step-down voltage by using the output current The magnitude produces the power amplifier supply voltage, the error amplifier being configured to control the buck converter by varying a magnitude of the error current relative to a magnitude of the output current. The wave seal tracker of claim 11, wherein the error amplifier includes a first input configured to receive the wave seal signal, a second input, and configured to generate the output One of the current outputs. The wave seal tracker of claim 12, further comprising a feedback circuit electrically coupled between the second input of the error amplifier and the output of the error amplifier. The wave seal tracker of claim 12, further comprising an AC coupling capacitor disposed between the output of the error amplifier and the power amplifier supply voltage. A wave seal tracker as claimed in claim 11, wherein the error amplifier is powered using the battery voltage. The wave seal tracker of claim 11, further comprising a boost converter configured to convert the battery voltage to a boost voltage having one of greater than the battery voltage A voltage magnitude of a voltage magnitude that is used to power the error amplifier. The wave seal tracker of claim 11, wherein the buck converter comprises a buck controller, a buck inductor, and a plurality of buck switches, the buck controller configured to use the error current to A state of one of the plurality of buck switches is controlled to control a current through the buck inductor. The wave seal tracker of claim 17, wherein the error current comprises a non-inverting error current component and an inverting error current component, the buck converter comprising a current comparator configured to borrow The state of the plurality of buck switches is controlled by comparing the non-inverted error current component with the inverted error current component. The wave seal tracker of claim 11, wherein the error amplifier includes a first pair of transistors configured to generate the output current and a second pair of transistors configured to generate the error current, the second The electro-crystalline system is implemented as a replica of the first pair of transistors. The wave seal tracker of claim 19, wherein the first pair of transistors comprises a first p-type field effect transistor (PFET) and a first n-type field effect transistor (NFET), and the second pair of cells The crystal includes a second PFET and a second NFET. A method of generating a power amplifier supply voltage, the method comprising: generating a step-down voltage from a battery voltage using a buck converter; controlling a magnitude of the step-down voltage based on an error current; using an error amplifier based on a The envelope signal generates an output current; the power amplifier supply voltage is generated by adjusting the magnitude of the step-down voltage using the output current; and the amount of the error current is changed by a magnitude relative to the output current The buck converter is controlled by the value. The method of claim 21, wherein the buck converter comprises a buck inductor and a plurality of buck switches, the method further comprising controlling by controlling a state of the plurality of buck switches based on the error current A current through one of the buck inductors. The method of claim 22, wherein the error current comprises a non-inverted error current component and an inverted error current component, the method further comprising controlling the complex by comparing the non-inverted error current component with the inverted error current component This state of the buck switch. The method of claim 21, further comprising providing the power amplifier supply voltage to a power amplifier. The method of claim 21, further comprising powering the error amplifier using the battery voltage. The method of claim 21, further comprising generating a boost voltage using a boost converter and using the boost voltage to power the error amplifier. A multi-chip module (MCM) comprising: a buck converter configured to convert a battery voltage to a step-down voltage, the buck converter configured to control the drop based on an error current One of the voltages; and An error amplifier configured to generate an output current based on a envelope signal and to generate the power amplifier supply voltage by adjusting the magnitude of the step-down voltage using the output current, the error amplifier configured to lend The buck converter is controlled by varying a magnitude of the error current relative to a magnitude of the output current. The MCM of claim 27, wherein the error amplifier includes a first input configured to receive the envelope signal, a second input, and an output configured to generate the power amplifier supply voltage. The MCM of claim 28, further comprising a feedback circuit electrically coupled between the second input of the error amplifier and the output of the error amplifier. The MCM of claim 28, further comprising an AC coupling capacitor disposed between the output of the error amplifier and the power amplifier supply voltage. The MCM of claim 27, further comprising a power amplifier configured to receive the power amplifier supply voltage.