TWI584406B - 用於去接合及處置半導體晶圓之方法之裝置 - Google Patents

用於去接合及處置半導體晶圓之方法之裝置 Download PDF

Info

Publication number
TWI584406B
TWI584406B TW105100597A TW105100597A TWI584406B TW I584406 B TWI584406 B TW I584406B TW 105100597 A TW105100597 A TW 105100597A TW 105100597 A TW105100597 A TW 105100597A TW I584406 B TWI584406 B TW I584406B
Authority
TW
Taiwan
Prior art keywords
wafer
cassette
frame
carrier
cleaning
Prior art date
Application number
TW105100597A
Other languages
English (en)
Chinese (zh)
Other versions
TW201614763A (en
Inventor
史蒂芬 卡納爾
大衛Ｊ 塞普
丹尼爾Ｅ 桑切斯
杭格Ｖ 芬恩
亨恩Ｙ 李
詹斯Ａ 理吉
艾蓮娜Ｂ 伍雅德
丹尼爾Ｋ 伯柯
Original Assignee
西凱渥資訊處理科技公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/898,627 external-priority patent/US8888085B2/en
Priority claimed from US12/898,623 external-priority patent/US8758552B2/en
Priority claimed from US12/898,648 external-priority patent/US8758553B2/en
Application filed by 西凱渥資訊處理科技公司 filed Critical 西凱渥資訊處理科技公司
Publication of TW201614763A publication Critical patent/TW201614763A/zh
Application granted granted Critical
Publication of TWI584406B publication Critical patent/TWI584406B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW105100597A 2010-06-07 2011-06-07 用於去接合及處置半導體晶圓之方法之裝置 TWI584406B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US35232410P 2010-06-07 2010-06-07
US12/898,627 US8888085B2 (en) 2010-10-05 2010-10-05 Devices and methodologies for handling wafers
US12/898,623 US8758552B2 (en) 2010-06-07 2010-10-05 Debonders and related devices and methods for semiconductor fabrication
US12/898,648 US8758553B2 (en) 2010-10-05 2010-10-05 Fixtures and methods for unbonding wafers by shear force

Publications (2)

Publication Number Publication Date
TW201614763A TW201614763A (en) 2016-04-16
TWI584406B true TWI584406B (zh) 2017-05-21

Family

ID=45098602

Family Applications (2)

Application Number Title Priority Date Filing Date
TW105100597A TWI584406B (zh) 2010-06-07 2011-06-07 用於去接合及處置半導體晶圓之方法之裝置
TW100119898A TWI531024B (zh) 2010-06-07 2011-06-07 用於去接合及處置半導體晶圓之方法之裝置

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW100119898A TWI531024B (zh) 2010-06-07 2011-06-07 用於去接合及處置半導體晶圓之方法之裝置

Country Status (2)

Country Link
TW (2) TWI584406B (fr)
WO (1) WO2011156292A2 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8758552B2 (en) 2010-06-07 2014-06-24 Skyworks Solutions, Inc. Debonders and related devices and methods for semiconductor fabrication
US8888085B2 (en) 2010-10-05 2014-11-18 Skyworks Solutions, Inc. Devices and methodologies for handling wafers
US8758553B2 (en) 2010-10-05 2014-06-24 Skyworks Solutions, Inc. Fixtures and methods for unbonding wafers by shear force
US20120080832A1 (en) 2010-10-05 2012-04-05 Skyworks Solutions, Inc. Devices for methodologies related to wafer carriers
JP2013060489A (ja) * 2011-09-12 2013-04-04 Three M Innovative Properties Co 部材剥離方法及び部材剥離装置
TWI608875B (zh) * 2016-05-11 2017-12-21 All Ring Tech Co Ltd Stage and wafer residue cleaning device using the same
TWI829673B (zh) * 2018-03-07 2024-01-21 美商康寧公司 玻璃基板黏接控制
TWI735115B (zh) * 2019-12-24 2021-08-01 力成科技股份有限公司 晶圓儲存裝置及晶圓承載盤

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61272927A (ja) * 1985-05-29 1986-12-03 Hitachi Electronics Eng Co Ltd ウエハとマスクとの分離方法
US6032715A (en) * 1996-06-28 2000-03-07 Sony Corporation Wafer bonding device
US20020104616A1 (en) * 2001-02-06 2002-08-08 Bhola De Wafer demount receptacle for separation of thinned wafer from mounting carrier
EP1286385A2 (fr) * 2001-08-21 2003-02-26 Infineon Technologies AG Dispositif pour séparer des plaquettes semiconductrices minces
JP2007294717A (ja) * 2006-04-26 2007-11-08 Mitsubishi Electric Corp 半導体ウエハ分離装置及び分離方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61272927A (ja) * 1985-05-29 1986-12-03 Hitachi Electronics Eng Co Ltd ウエハとマスクとの分離方法
US6032715A (en) * 1996-06-28 2000-03-07 Sony Corporation Wafer bonding device
US20020104616A1 (en) * 2001-02-06 2002-08-08 Bhola De Wafer demount receptacle for separation of thinned wafer from mounting carrier
EP1286385A2 (fr) * 2001-08-21 2003-02-26 Infineon Technologies AG Dispositif pour séparer des plaquettes semiconductrices minces
JP2007294717A (ja) * 2006-04-26 2007-11-08 Mitsubishi Electric Corp 半導体ウエハ分離装置及び分離方法

Also Published As

Publication number Publication date
TW201207989A (en) 2012-02-16
WO2011156292A3 (fr) 2012-04-19
WO2011156292A2 (fr) 2011-12-15
TW201614763A (en) 2016-04-16
TWI531024B (zh) 2016-04-21

Similar Documents

Publication Publication Date Title
US9865491B2 (en) Devices for methodologies related to wafer carriers
US9533484B2 (en) Debonders with a recess and a heater for semiconductor fabrication
TWI584406B (zh) 用於去接合及處置半導體晶圓之方法之裝置
US9799507B2 (en) Devices and methodologies to clean wafers with solvent
US8758553B2 (en) Fixtures and methods for unbonding wafers by shear force
KR101097682B1 (ko) 플라즈마 다이싱 장치 및 반도체 칩의 제조 방법
TWI462834B (zh) 利用熱機械效應製作經調節之多層構造之方法
JP5705873B2 (ja) 自動熱スライド剥離装置
TWI559430B (zh) A stripping device, a peeling system, and a peeling method
US10269782B2 (en) Apparatuses and methods for forming die stacks
US8834662B2 (en) Apparatus and method of separating wafer from carrier
EP2826065A1 (fr) Procédé et appareil permettant de souder provisoirement des tranches ultra-minces
US7758717B2 (en) Wafer treating apparatus
JP2023054100A (ja) 分離装置及び分離方法
JP2023508867A (ja) ダイレクトボンディングによる基板への複数のチップの接合方法
TW202224080A (zh) 清潔和處理微電子裝置的方法及相關的工具及組件
EP4156238A2 (fr) Procédé de traitement d'une pièce en forme de plaque
EP4156237A2 (fr) Procédé de traitement d'une pièce en forme de plaque
JP2012039039A (ja) 加工方法