TWI579216B - Fixed pin for fixed wafer in crystal boat and its manufacturing method - Google Patents
Fixed pin for fixed wafer in crystal boat and its manufacturing method Download PDFInfo
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- TWI579216B TWI579216B TW103121066A TW103121066A TWI579216B TW I579216 B TWI579216 B TW I579216B TW 103121066 A TW103121066 A TW 103121066A TW 103121066 A TW103121066 A TW 103121066A TW I579216 B TWI579216 B TW I579216B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
本發明涉及一種在晶圓加工及晶舟通過加工設備的過程中,將晶圓固定於晶舟的固定銷,以及製造此種固定銷的方法。 The present invention relates to a fixing pin for fixing a wafer to a wafer boat during wafer processing and wafer processing through a processing apparatus, and a method of manufacturing such a fixing pin.
晶舟可以是由CFC、石墨、陶瓷、金屬、或是以上材料的組合製成。為了在加工過程及運送晶舟的過程中,能夠將晶圓確實且不受力影響的固定住,通常會將晶圓以站立方式插入分佈在一個平面上類似蘑菇的固定銷。視晶圓大小而定,每一個晶圓通常需要兩個或三個固定銷。 The boat can be made of CFC, graphite, ceramic, metal, or a combination of the above. In order to be able to fix the wafer without being affected by force during the processing and transport of the wafer boat, the wafer is usually inserted in a standing manner on a fixed pin similar to a mushroom distributed on a flat surface. Depending on the size of the wafer, each wafer typically requires two or three fixed pins.
這些固定銷也是由CFC、石墨、陶瓷、或金屬製成,並經由插塞連接、螺絲連接、或夾緊連接等方式與晶舟連接。由於晶圓必須被運送通過各式各樣不同的加工設備,因此石墨有可能因某些加工影響受到侵蝕。受侵蝕的石墨構件的抵抗力較差,因此較易磨損,導致必須頻繁的更換磨損的固定銷。 These fixing pins are also made of CFC, graphite, ceramic, or metal, and are connected to the boat via a plug connection, a screw connection, or a clamp connection. Because wafers must be transported through a variety of different processing equipment, graphite can be eroded by certain processing effects. Eroded graphite members are less resistant and therefore more susceptible to wear, resulting in frequent replacement of worn pins.
為了在加工過程中對固定銷提供較好的保護,可以在晶舟及固定銷上額外加上一層鍍膜。例如碳鍍膜或石墨鍍膜。這種鍍膜是在加工室中以加熱化學氣相沉積法形成。另一種可能的方式是在擺放晶舟的加工工具上形成這種鍍膜。 In order to provide better protection for the fixing pins during processing, an additional coating can be applied to the boat and the fixing pins. For example, carbon coating or graphite coating. This coating is formed by a heated chemical vapor deposition process in a processing chamber. Another possible way is to form this coating on the processing tool on which the boat is placed.
晶舟的鍍膜是以電漿輔助化學氣相沉積法(PECVD)形成。在 此同時也可以對固定銷進行鍍膜。但由於在安裝及拆卸晶圓時,固定銷仍會受到一定程度的磨損,因此必須定期更換固定銷。上述的鍍膜雖然能夠改善抗磨損性,但對於長時間持續性的生產作業仍嫌不足。 The coating of the boat is formed by plasma assisted chemical vapor deposition (PECVD). in At the same time, the fixing pin can also be coated. However, since the fixing pin is still subject to a certain degree of wear during the mounting and dismounting of the wafer, the fixing pin must be replaced periodically. Although the above-mentioned coating can improve the abrasion resistance, it is still insufficient for a long-term continuous production operation.
本發明的目的是提出一種在晶圓加工及晶舟通過加工設備的過程中,將晶圓固定於晶舟的固定銷,此種固定銷必須具有很好的抗磨損性,此外本發明還要提出一種製造此種固定銷的方法。 The object of the present invention is to provide a fixing pin for fixing a wafer to a wafer boat during wafer processing and wafer processing through a processing device, and the fixing pin must have good wear resistance, and the present invention further A method of manufacturing such a fixing pin is proposed.
為達到上述目的,本發明提出的固定銷至少在表面及連接在整個表面下方的區域有鍍上一層碳化矽,或是由碳化矽構成,其中碳化矽是由固定銷的石墨轉化而成。 In order to achieve the above object, the fixing pin proposed by the present invention is coated with a layer of tantalum carbide at least on the surface and a region below the entire surface, or is formed of tantalum carbide, wherein the tantalum carbide is converted from graphite of a fixed pin.
本發明之固定銷的優點是具有很高的抗磨損性。 The fixing pin of the present invention has the advantage of having high abrasion resistance.
根據本發明的一種改良方式,具有由碳化矽轉化成的表面的固定銷具有與完全由CFC或石墨製成的固定銷相同的尺寸穩定性及相同的尺寸,原因是在材料轉換的過程中並未出現材料增長的現象。 According to a further development of the invention, the fixing pin having the surface converted from tantalum carbide has the same dimensional stability and the same size as the fixing pin made entirely of CFC or graphite, because during the material conversion process There is no material growth.
因此可以直接將磨損的CFC或石墨製成的固定銷更換為具有碳化矽鍍膜的固定銷。 Therefore, it is possible to directly replace the fixing pin made of worn CFC or graphite with a fixing pin having a ruthenium carbide coating.
為達到本發明的另一個目的,本發明提出一種製造固定銷的方法,這種方法是使CFC或石墨製成的固定銷在含有矽蒸汽的保護氣體氛圍中進行加熱轉化過程,在此過程中,至少固定銷的表面會被轉化為碳化矽。 In order to achieve another object of the present invention, the present invention provides a method of manufacturing a fixing pin by heating a conversion pin made of CFC or graphite in a protective gas atmosphere containing helium vapor, in the process. At least the surface of the pin can be converted to tantalum carbide.
加熱轉化過程較佳是在一個可在過壓下運轉的真空爐/保護氣體爐或隔焰爐中進行。 The heat conversion process is preferably carried out in a vacuum furnace/protective gas furnace or a muffle furnace which can be operated under an overpressure.
此外,加熱轉化過程較佳是在1200℃至2200℃的溫度範圍進 行。 In addition, the heating conversion process is preferably in the temperature range of 1200 ° C to 2200 ° C Row.
本發明的另一種實施方式的特徵是以氫或氬作為保護氣體。 Another embodiment of the invention features hydrogen or argon as the shielding gas.
本發明的一種改良方式是將含有矽的粒料加熱蒸發,以產生矽蒸汽。 An improved form of the invention is the heating and evaporation of pellets containing cerium to produce hydrazine vapor.
本發明的方法能夠將固定銷的石墨表面或(視時間而定)完全轉化成碳化矽。 The method of the invention enables complete conversion of the graphite surface of the pin or (depending on time) to tantalum carbide.
本發明之方法的特殊優點是能夠製造出抗磨損性非常高的固定銷,而且在轉化過程中,固定銷的尺寸完全保持不變,因此能夠被儲存作為替換零件,也就是說可以毫無困難的將石墨或CFC製的一般固定銷更換為本發明的固定銷。 The special advantage of the method according to the invention is that it is possible to produce a fixing pin which is very resistant to wear, and the size of the fixing pin remains completely unchanged during the conversion process, so that it can be stored as a replacement part, that is to say without difficulty Replace the general fixing pin made of graphite or CFC with the fixing pin of the present invention.
1‧‧‧晶圓 1‧‧‧ wafer
2‧‧‧框架元件 2‧‧‧Frame components
3‧‧‧開孔 3‧‧‧ Opening
4‧‧‧固定銷 4‧‧‧fixed pin
5‧‧‧本體 5‧‧‧Ontology
6‧‧‧端面 6‧‧‧ end face
7‧‧‧止動件 7‧‧‧stops
8‧‧‧側凹/溝槽 8‧‧‧Side/groove
以下將配合圖式及實施例對本發明的內容做進一步的說明。其中:第1圖:一個晶舟的立體透視圖。 The contents of the present invention will be further described below in conjunction with the drawings and embodiments. Among them: Figure 1: A perspective view of a boat.
第2圖:蘑菇狀的固定銷的不同的實施方式。 Figure 2: Different embodiments of mushroom shaped fixing pins.
第1圖顯示一個晶舟1的立體透視圖,其中晶舟1是由多個排成一列且彼此連接的框架元件2構成。每一個框架元件2都帶有容納可更換之蘑菇狀的固定銷4的開孔3,其中固定銷4的任務是容納及固定未在圖式中繪出的晶圓。此處所稱的晶圓可以是矽片、玻璃片、或其他扁平元件。 Fig. 1 shows a perspective perspective view of a wafer boat 1 in which the boat 1 is composed of a plurality of frame members 2 arranged in a row and connected to each other. Each of the frame members 2 has an opening 3 for receiving a replaceable mushroom-shaped fixing pin 4, wherein the fixing pin 4 is tasked with accommodating and fixing a wafer not shown in the drawings. The wafer referred to herein may be a slab, a glass sheet, or other flat element.
如第2圖所示,由石墨或CFC製成的蘑菇狀的固定銷4可以具有非常多種的形狀。整體而言,所有的固定銷4都是由一圓柱體狀的本體5 構成,其中本體5的兩個端面6都帶有凸出的止動件7,而且止動件7帶有容納晶圓用的側凹或溝槽8。圓柱形本體5的厚度與框架元件2的厚度相等。如果將固定銷插入框架元件2的相應的開孔3,並使本體5與開孔3齊平,則止動件7會從框架元件2的兩邊凸出,因此在框架元件2的每一邊都可以穩妥的設置一個晶圓,而且晶圓與框架元件2的表面會間隔一小段距離。 As shown in Fig. 2, the mushroom-shaped fixing pin 4 made of graphite or CFC can have a very wide variety of shapes. Overall, all the fixing pins 4 are made of a cylindrical body 5 It is constructed in which both end faces 6 of the body 5 have protruding stoppers 7, and the stoppers 7 are provided with undercuts or grooves 8 for accommodating the wafer. The thickness of the cylindrical body 5 is equal to the thickness of the frame member 2. If the fixing pin is inserted into the corresponding opening 3 of the frame member 2 and the body 5 is flush with the opening 3, the stopper 7 will protrude from both sides of the frame member 2, and thus on each side of the frame member 2 A wafer can be securely placed and the wafers are spaced a short distance from the surface of the frame member 2.
固定銷4的表面及連接在表面下方的區域是由碳化矽構成,其中碳化矽是由固定銷4的石墨經過轉化過程而產生。因此這種固定銷4具有特別好的抗磨損性。 The surface of the fixing pin 4 and the region connected below the surface are composed of tantalum carbide, wherein the tantalum carbide is produced by the conversion process of the graphite of the fixing pin 4. This fixing pin 4 therefore has a particularly good abrasion resistance.
具有碳化矽鍍膜的固定銷4具有與完全由石墨或CFC製成的固定銷相同的尺寸穩定性,原因是在材料轉換的過程中並未出現材料增長的現象。 The fixing pin 4 having the ruthenium carbide coating has the same dimensional stability as the fixing pin made entirely of graphite or CFC because the material growth does not occur during the material conversion.
因此本發明的一個很大的優點是,可以直接將磨損的固定銷及/或由CFC或石墨製成的固定銷更換為具有碳化矽鍍膜的固定銷。 A great advantage of the invention is therefore that the worn fixing pins and/or the fixing pins made of CFC or graphite can be directly replaced with fixing pins having a ruthenium carbide coating.
製造至少是部分由碳化矽構成的固定銷4的方法是,使石墨或CFC製成的固定銷4在含有矽蒸汽的保護氣體氛圍中以1200℃至2200℃的溫度進行加熱轉化過程。在此加熱轉化過程中,至少固定銷4的表面會被轉化為碳化矽。將含有矽的粒料蒸發,即可產生必要的矽蒸汽。這個加熱轉化過程是在一個可在過壓下運轉的真空爐/保護氣體爐或隔焰爐中進行。 The method of manufacturing the fixing pin 4 which is at least partially composed of tantalum carbide is to carry out a heating conversion process of the fixing pin 4 made of graphite or CFC at a temperature of 1200 ° C to 2200 ° C in a protective gas atmosphere containing helium vapor. During this heating conversion, at least the surface of the fixing pin 4 is converted into tantalum carbide. Evaporation of the cerium-containing pellets produces the necessary hydrazine vapor. This heating conversion process is carried out in a vacuum furnace/protective gas furnace or muffle furnace which can be operated under an overpressure.
氫或氬均適於作為保護氣體。 Both hydrogen and argon are suitable as protective gases.
本發明的方法至少可將石墨表面轉化成碳化矽。視時間而定,也可以將石墨完全轉化成碳化矽。 The method of the invention converts at least the surface of the graphite into tantalum carbide. Depending on the time, it is also possible to completely convert the graphite into niobium carbide.
4‧‧‧固定銷 4‧‧‧fixed pin
5‧‧‧本體 5‧‧‧Ontology
6‧‧‧端面 6‧‧‧ end face
7‧‧‧止動件 7‧‧‧stops
8‧‧‧側凹/溝槽 8‧‧‧Side/groove
Claims (7)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102013106461.2A DE102013106461B4 (en) | 2013-06-20 | 2013-06-20 | Holding pens for holding wafers in wafer boats and methods of making such pegs |
Publications (2)
Publication Number | Publication Date |
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TW201505937A TW201505937A (en) | 2015-02-16 |
TWI579216B true TWI579216B (en) | 2017-04-21 |
Family
ID=52010273
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW103121066A TWI579216B (en) | 2013-06-20 | 2014-06-18 | Fixed pin for fixed wafer in crystal boat and its manufacturing method |
Country Status (3)
Country | Link |
---|---|
DE (1) | DE102013106461B4 (en) |
MY (1) | MY186749A (en) |
TW (1) | TWI579216B (en) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5817156A (en) * | 1994-10-26 | 1998-10-06 | Tokyo Electron Limited | Substrate heat treatment table apparatus |
WO2000008401A1 (en) * | 1998-08-06 | 2000-02-17 | Persys Technology Ltd. | Furnace for processing semiconductor wafers |
TW488009B (en) * | 2000-01-28 | 2002-05-21 | Steag Rtp Systems Gmbh | Heat treatment device for substrate |
EP1511077A2 (en) * | 2003-02-27 | 2005-03-02 | Applied Materials, Inc. | Substrate support |
JP2005509275A (en) * | 2001-05-22 | 2005-04-07 | アプライド マテリアルズ インコーポレイテッド | Smooth substrate support member with multiple parts for CVD |
TWI310413B (en) * | 2005-03-24 | 2009-06-01 | Siltronic Ag | Silicon wafer and process for the heat treatment of a silicon wafer |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6113702A (en) * | 1995-09-01 | 2000-09-05 | Asm America, Inc. | Wafer support system |
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2013
- 2013-06-20 DE DE102013106461.2A patent/DE102013106461B4/en active Active
-
2014
- 2014-06-18 TW TW103121066A patent/TWI579216B/en active
- 2014-06-19 MY MYPI2014701671A patent/MY186749A/en unknown
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5817156A (en) * | 1994-10-26 | 1998-10-06 | Tokyo Electron Limited | Substrate heat treatment table apparatus |
WO2000008401A1 (en) * | 1998-08-06 | 2000-02-17 | Persys Technology Ltd. | Furnace for processing semiconductor wafers |
TW488009B (en) * | 2000-01-28 | 2002-05-21 | Steag Rtp Systems Gmbh | Heat treatment device for substrate |
JP2005509275A (en) * | 2001-05-22 | 2005-04-07 | アプライド マテリアルズ インコーポレイテッド | Smooth substrate support member with multiple parts for CVD |
EP1511077A2 (en) * | 2003-02-27 | 2005-03-02 | Applied Materials, Inc. | Substrate support |
TWI310413B (en) * | 2005-03-24 | 2009-06-01 | Siltronic Ag | Silicon wafer and process for the heat treatment of a silicon wafer |
Also Published As
Publication number | Publication date |
---|---|
DE102013106461B4 (en) | 2016-10-27 |
TW201505937A (en) | 2015-02-16 |
DE102013106461A1 (en) | 2014-12-24 |
MY186749A (en) | 2021-08-17 |
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