TWI578650B - Insulated metal socket - Google Patents

Description

Insulated metal socket (priority)

This case is to request the priority rights of the US Provisional Patent Application No. 61/493,720 filed on June 6, 2011, the contents of which are hereby attached.

Field of invention

This disclosure relates to test systems that use a plurality of aligned connectors to test and characterize integrated circuit (IC) wafers, and more particularly to the use of sockets in test systems and materials, compositions, and methods of manufacture. .

Background of the invention

In the electronics and semiconductor industries, systems used to test and characterize integrated circuit (IC) wafers during the sub-manufacturing process have traditionally been referred to as "test systems." 1 to 3 illustrate various views of a conventional test system 100 that can provide an electronic device 110 (which can be an IC chip and can also be referred to as a "device under test" or "DUT") and a Electrical connections between printed circuit boards (PCBs) (not shown). The test system 100 can include a plurality of aligned connectors 140 (which can be spring probes) for providing an electrical connection between the electronic device 110 and the PCB. The test system 100 can further include a socket 130 and a socket holder 120 each including a plurality of openings for receiving the plurality of aligned connectors 140, wherein the plurality of the socket holders 120 The apertures are configured to align with the plurality of apertures in the receptacle 130. 1 is an exploded view of the test system 100, and FIG. 2 is a cross-sectional view of the test system 100 showing that the plurality of aligned connectors and at least one of the electronic devices 110 Alignment one and FIG. 3 show an enlarged view of a portion of FIG.

The socket 130 and the socket holder 120 in the test system 100 are constructed of a composite plastic material to insulate the connectors 140 from each other.

Another conventional test system 400 is shown in Figures 4-6, in which a portion of the socket assembly and the plurality of connectors 440 provide a coaxial structure. As with the test system 100, the test system 400 can include a plurality of aligned connectors 440 (which can be configured as spring probes to operate in a coaxial configuration) for providing the electronic device 110 and the PCB Electrical connection between. The test system 400 can include a top socket layer 430, a middle socket layer 450, and a bottom socket layer 420. The top socket layer 430, the middle socket layer 450 and the bottom socket layer 420 each include a plurality of openings for the plurality of aligned connectors 440, and the top socket layer 430, the middle socket layer 450 and the bottom socket layer The plurality of apertures in 420 are configured to align to accommodate the plurality of connectors 440 when the test system 400 is used to provide electrical signals to the electronic device 110. 4 is an exploded view of the test system 400, and FIG. 5 is a cross-sectional view of the test system 400 showing that the plurality of aligned connectors 440 are aligned with at least a portion of the electronic device 110 - and Figure 6 shows an enlarged view of a portion of Figure 5.

The top socket layer 430 and the bottom socket layer 420 of the test system 400 are constructed of a composite plastic material that insulates the connectors 440 from each other. The middle socket layer 450 is a conductive material, such as a metal, and can provide a coaxial connection as a part of the connection between the PCB and the electronic device 110, wherein a pair passes through the socket layer 450 (which can The signal of the path associated with the connector 440 in the hole provided by the ground is represented by the electrical impedance The value of a hole diameter D475 and a connector diameter d485. Unlike the middle socket layer 450, the top socket layer 430 and the bottom socket layer 420 in the test system 400 conventionally do not provide a coaxial structure when combined with the connector 440.

Yet another conventional test system 700 is shown in Figures 7-9, wherein a portion of the socket assembly and the plurality of connectors 440 also provide a coaxial structure. As with the test system 400, the test system 700 can include a plurality of aligned connectors 440 (which can also be configured as spring probes to operate in a coaxial configuration). The test system 700 can include a socket body 730, a top socket layer 760, a middle socket layer 750, a bottom socket layer 720, and an insulating sleeve 745. The socket body 730, the top socket layer 760, the middle socket layer 750, and the bottom socket layer 720 each include a plurality of openings for the plurality of aligned connectors 440, and the socket body 730, the top socket layer 760, The plurality of apertures in the middle socket layer 750 and the bottom socket layer 720 are configured to align to accommodate the plurality of connectors 440. The insulating collar 745 can be used to hold the plurality of aligned connectors 440 in the cavities formed by the aligned openings. 7 is an exploded view of the test system 700, and FIG. 8 is a cross-sectional view of the test system 700 showing the alignment of the plurality of aligned connectors 440 with at least a portion of the electronic device 110. 9 shows an enlarged view of a portion of FIG.

The socket body 730, the bottom socket layer 720, and the insulating sleeve 745 of the test system 700 are constructed of a composite plastic material that insulates the connectors 440 from each other. The top socket layer 760 and the middle socket layer 750 are a conductive material, such as a metal, and can provide a coaxial structure as a part of the connection between the PCB and the electronic device 110, wherein the one through and the socket in the socket Connector in the cavity provided by layer 750 and top socket layer 760 (which can be grounded) The electrical impedance of the signal associated with the 440 path is dependent on the value of a hole diameter D775 and a connector diameter d485. Unlike the middle socket layer 750 and the top socket layer 760, the socket body 730 and the bottom socket layer 720 in the test system 700 do not provide a coaxial structure when combined with the connector 440.

Summary of invention

In one aspect, the present disclosure is directed to a socket for use in a test system that is configured to align at least a portion of an electronic device with a plurality of aligned connectors. In one aspect, the socket can include a metal structure having a plurality of apertures spaced apart to accommodate the plurality of aligned connectors. At least one of the plurality of apertures can extend through a thickness of one of the metal structures and can have an annular inner surface. The annular inner surface can be at least a portion of one of the electrically conductive outer surfaces of the connector that is adjacent to at least one of the plurality of aligned connectors of the test system. The socket may further include an insulating layer disposed on the annular inner surface.

In one aspect, the present disclosure is directed to a socket assembly for use in a test system that is configured to align at least a portion of an electronic device with a plurality of aligned connectors. The socket assembly can include a socket that can itself include a metal structure having a plurality of apertures spaced apart to accommodate the plurality of aligned connectors. At least one of the plurality of apertures can extend through a thickness of one of the metal structures and can have an annular inner surface. The annular inner surface can be at least one aligned connection of the plurality of aligned connectors in the test system At least a portion of one of the outer surfaces of the connector. The socket may include an insulating layer disposed on the annular inner surface. The socket assembly may further include a socket holding member, which may include a metal fastening member having a plurality of annular guiding holes extending through the metal fastening member and configured to be the socket holding member and the socket pair The plurality of aligned connectors can be accommodated on time, and at least one of the annular guide holes of the plurality of annular guide holes has an annular retaining surface. In one aspect, the socket assembly can include a fastener insulating layer disposed on the annular fastening surface, and the fastener insulation layer is configured to be aligned with the socket when the socket holder is aligned with the socket Can be aligned with the insulating layer.

In another aspect, the present disclosure is directed to a coaxial jack assembly for use in a test system configured to align at least a portion of an electronic device with a plurality of aligned connections. Device. The coaxial jack assembly can include a socket that can itself include a metal structure having a plurality of apertures spaced apart to accommodate the plurality of aligned connectors. At least one of the plurality of apertures may extend through a thickness of one of the metal structures and may have an annular inner surface. The annular inner surface can be at least a portion of one of the electrically conductive outer surfaces of the connector that is adjacent to at least one of the plurality of aligned connectors of the test system. The socket may include an insulating layer disposed on the annular inner surface. The coaxial socket assembly can further include a socket fastening member, which can include a metal fastening member having a plurality of annular guide holes extending through the metal fastening member and configured to be the socket holding member and the socket The plurality of aligned connectors will be receivable when aligned, and at least one of the annular guide holes of the plurality of annular guide holes has an annular latching surface. In one aspect, the coaxial socket assembly can include a fastener insulating layer disposed on the ring The fastener retaining surface is configured to align with the insulating layer when the socket retaining member is aligned with the socket. The socket retaining member and the socket can be configured to present a cavity interface to the at least one aligned connector, and the socket holder and the socket can be configured to pass the at least one tone The electrical signal of the quasi-connector exhibits a substantially fixed impedance throughout the cavitation interface.

In yet another aspect, the present disclosure is directed to a coaxial jack for use in a test system that is configured to align a portion of an electronic device with a plurality of alignments. Connector. The coaxial socket can include a conductive structure having a plurality of apertures spaced apart to accommodate the plurality of aligned spring probes. At least one of the plurality of apertures may extend through a thickness of one of the electrically conductive structures and may have an annular inner surface. The annular inner surface can be at least a portion of one of the electrically conductive outer surfaces of the connector that is adjacent to at least one of the plurality of aligned connectors of the test system. The coaxial socket may further include a socket holding member, which may include a metal fastening member having a plurality of annular guiding holes extending through the metal fastening member and configured to be opposite to the conductive structure The plurality of aligned connectors can be accommodated on time, and at least one of the annular guide holes of the plurality of annular guide holes has an annular retaining surface. In one aspect, the coaxial socket can include a fastener insulating layer disposed on the annular fastening surface, and the fastener insulating layer is configured to be aligned when the socket holding member is aligned with the conductive structure Will be aligned with the insulation. The socket holder and the conductive structure can be configured to present a cavity interface to the at least one aligned connector, and the socket holder and the conductive structure can be configured to pass one through The electrical signal of the at least one aligned connector exhibits a substantially fixed impedance throughout the hole interface.

Additional features and advantages will be set forth in part in the description which follows. The features and advantages will be recognized and attained by the elements and combinations particularly pointed in the appended claims. The above general description and the following detailed description are intended to be illustrative and not restrictive.

Simple illustration

The accompanying drawings, which are incorporated in FIG

Figure 1 is an exploded view of a conventional test system; Figure 2 is a cross-sectional view of the test system of Figure 1; Figure 3 is a partial detail of the test system of Figure 2; Figure 4 is an exploded view of another conventional test system Figure 5 is a cross-sectional view of the test system of Figure 4; Figure 6 is a partial detail of the test system of Figure 5; Figure 7 is an exploded view of another conventional test system; Figure 8 is a test of Figure 7 Figure 1 is a partial detail view of the test system of Figure 8; Figure 10 is an exploded view of a test system in accordance with an embodiment; Figure 11 is a cross-sectional view of the test system of Figure 10 Figure 12 is a partial detail view of the test system of Figure 11; Figure 13 is an exploded view of a test system in accordance with another embodiment; Figure 14 is a cross-sectional view of the test system of Figure 13; Figure 15 is a partial detail view of the test system of Figure 14; Figure 16 is a An exploded view of one of the test systems in accordance with yet another embodiment; FIG. 17 is a cross-sectional view of the test system of FIG. 16; and FIG. 18 is a partial detail view of the test system of FIG.

Detailed description of the preferred embodiment

Embodiments of the present invention will now be described in detail, and such embodiments are shown in the drawings. Wherever possible, the same reference numerals will be

10-12 show various views of a test system 1000 in accordance with an embodiment. The test system 1000 can include a plurality of aligned connectors 140 for providing an electrical connection between the electronic device 110 and a PCB. In an embodiment, the connectors 140 can be spring probes or can be used in any other suitable electrical connector in a test system. The test system 1000 can include a socket 1030 and a socket holder 1020 each including a plurality of apertures for receiving the plurality of aligned connectors 140. As shown in FIG. 11, for example, the plurality of apertures in the socket retainer 1020 are configured to align with the plurality of apertures in the receptacle 1030. 10 is an exploded view of the test system 1000, and FIG. 11 is a cross-sectional view of the test system 1000 showing at least a portion of the plurality of aligned connectors 140 and the electronic device 110. FIG. 12 and FIG. 12 show an enlarged view of a portion of FIG.

As shown in FIG. 12, for example, the socket 1030 can include a metal structure 1037 and an insulating layer 1035. In addition, the socket holding member 1020 can include a metal fastening member 1027 and a fastener insulating layer 1025. The connectors 140 are electrically conductive to transmit current and remain in contact with one another to avoid an electrical short. The insulating layer 1035 and the holding insulating layer 1025 can prevent the connectors 140 from contacting the metal structure 1037 and the metal holding member 1027. The insulating layer 1035 and the holding member insulating layer 1025, as shown in FIG. 12, are respectively disposed on one of the annular inner surfaces of the opening of the metal structure 1037, and the metal holding member 1027 is opened. One of the holes is on the annular surface (as used herein, the latter is a "ring-bearing surface"). Therefore, the insulating layer 1035 and the clasp insulating layer 1025 can prevent the connectors 140 from contacting the metal structure 1037 and the metal clasp 1027. In an embodiment, the metal structure 1037 and the metal holding member 1027 may comprise a metal such as, but not limited to, Al, Mg, Ti, Zr, Cu, Fe, and/or one of alloys thereof. In addition, the insulating layer 1035 and the holding member insulating layer 1025 may include an insulating layer, such as an anode film (or any such film layer formed on the metal surface by an anodizing method) generated on the metal. A polytetrafluoroethylene (PTFE) coating (such as the commonly known Du Pont brand name Teflon ^® ) is added. In a preferred embodiment, the metal structure 1037 and the metal retaining member 1027 can comprise an Al alloy. Moreover, in a preferred embodiment, the insulating layer 1035 and the clasp insulating layer 1025 may comprise anodized Al (eg, according to an electrolytic passivation process, such as in Sheasby, PG, Pinner, R. (2001). "The Surface Treatment and Finishing of Aluminum and its Alloys" vol. 2 (sixth ed.) (hereinafter referred to as " Sheasby "); and Edwards, Joseph (1997) "Coating and Surface Treatment Systems for Metals," hereinafter referred to as As described in " Edwards "). Further, in a preferred embodiment, the insulating layer 1035 and insulating layer 1025 retaining member may comprise a PTFE Teflon ^® sealing layer (e.g., produced by the person in Sheasby). The anodized Al layer in either or both of the insulating layer 1035 and the clasp insulating layer 1025 can have a thickness greater than about 0.02 mm. In any of the insulating layer 1035 and insulating layer 1025 of latches of one or both of the PTFE Teflon ^® layer may have a thickness of about 0.001mm is greater than one.

As previously mentioned, other suitable materials for the metal structure 1037 and the metal retaining member 1027 can comprise Mg, Ti, Zr, Cu, Fe, and/or one of its alloys. For these other materials, the thickness Δ1095 of either or both of the insulating layer 1035 and the clasp insulating layer 1025 may be based on the resistivity of the insulating layer 1035 and the clasp insulating layer 1025 and the desired collapse. The voltage is chosen. For example, if the breakdown voltage of an insulating layer as a function of one thickness is 30 V/μm, a 10 μm thick insulating layer can meet a required breakdown voltage value of 300 V. These technical requirements, i.e., a desired electrical breakdown value of 300V, can drive the selection of a suitable material and thickness Δ1095 for the insulating layer 1035 and the fastener insulating layer 1025.

The socket 1030 shown in Figures 10-12 can have a much higher strength than conventional plastic composites used in conventional test systems 100. For example, the socket 130 of the test system 100 can be deformed by a force associated with the connector 140 in the socket 130 (where the connectors 140 can be spring probes - and especially when they are numerous) . This deformation can affect the electrical performance of the test system 100. Moreover, the amount of deformation will be related to the strength of the socket material. In contrast, the socket 1030 including the metal structure 1037 and the insulating layer 1035 may have a higher strength than conventional plastics used in the socket 130. For example, an indicator of the strength of a material is the modulus of elasticity of a material. The socket 1030 comprising an aluminum alloy (metal structure 1037) and a layer of anodized aluminum and PTFE Teflon ^® (insulating layer 1035) may have an elastic modulus approximately 10 times greater than that of a single high strength composite plastic material. Using the same overall socket structure and force, the deformation of a socket 1030 can be only about 0.06 mm, which is about 0.25 mm compared to the deformation of a high strength composite plastic material. Among other features, and by way of example only, a test system 1000 having a socket 1030 is used to test any electronic device that requires a large number of spring probe connectors - such as an electronic device test system that uses more than 1500 spring probe connectors, It will be useful.

In accordance with another embodiment, a method of making the socket 1030 includes fabricating the metal structure 1037 to accommodate the plurality of connectors 140. In conjunction with an embodiment, the fabricated metal structure 1037 can be coated (and/or a layer can be created on the surface) using surface coating techniques and/or chemical processes. For example, if the metal structure 1037 is an aluminum alloy, a layer of anodized aluminum can be produced on the surface of the metal structure 1037 in accordance with conventional anodization techniques, such as the electrolytic passivation process described in Sheasby and Edwards . Other methods of anodizing the metal structure 1037 can include micro-plasma anodization and can be applied, for example, to a metal structure 1037 comprising Mg, Ti, Zr, Cu, Fe, and/or one of its alloys. Further, in a preferred embodiment, the insulating layer 1035 may comprise a PTFE Teflon ^® sealing layer (e.g. the person to be generated in Sheasby), or another suitable coating provides electrical insulation.

Moreover, a method of making the socket retaining member 1020 includes fabricating the metal retaining member 1027 to receive the plurality of connectors 140 and align with the plurality of apertures in the metal structure 1037. The fabricated metal clasp 1027 can be coated (and/or a layer can be created on the surface) using surface mount techniques and/or chemical processes. For example, if the metal retaining member 1027 is an aluminum alloy, a layer of anodized aluminum can be produced on the surface of the metal retaining member 1027 according to conventional techniques, such as one of the electrolytic passivation processes described in Sheasby and Edwards . Other methods of anodizing the metal clasp 1027 can include a micro-plasma anodization process and can be applied to, for example, a metal clasp 1027 comprising an alloy of Mg, Ti, Zr, Cu, Fe, and/or one of them. Further, in a preferred embodiment, the retaining member suitably coating the insulating layer 1025 may comprise a PTFE Teflon ^® sealing layer (e.g., those described in Sheasby to producers), will provide, or another electrically insulating .

Figures 13-15 illustrate a test system 1100 in conjunction with another embodiment. The test system 1100, as will be described later, is provided with a coaxial structure. As with test system 1000, the test system 1100 can include a plurality of aligned connectors 440 (which can be configured as spring probes to operate in a coaxial configuration). The plurality of aligned connectors 440 can provide an electrical connection between the electronic device 110 and the PCB. The test system 1100 can include a socket body 1130, a coaxial socket 1150, and a socket holder 1120. The socket body 1130, the coaxial socket 1150, and the socket holder 1120 each include a plurality of openings for the plurality of aligned connectors 440. Moreover, in the socket body 1130, the coaxial socket 1150, and the plurality of openings in the socket holding member 1120 are configured to be aligned to accommodate the plurality of aligned connectors. 440. 13 is an exploded view of the test system 1100, and FIG. 14 is a cross-sectional view of the test system 1100 showing the alignment of the plurality of aligned connectors 440 with at least a portion of the electronic device 110 - and 15 shows an enlarged view of a portion of FIG.

As shown in FIG. 15, for example, the socket body 1130 can include a metal structure 1137 and an insulating layer 1135. In addition, the socket holding member 1120 can include a metal fastening member 1127 and a fastener insulating layer 1125. As with test system 1000, connector 440 is electrically conductive in the test system 1100 to carry current and will remain out of contact with each other to avoid an electrical short. The insulating layer 1135 and the fastener insulating layer 1125 can prevent the connectors 440 from contacting the metal structure 1137 and the metal holding member 1127. The insulating layer 1135 and the holding member insulating layer 1125, as shown in FIG. 15, are respectively disposed on one of the annular inner surfaces of the opening of the metal structure 1137, and the metal holding member 1127 is opened. One of the holes is on the annular surface (as used for this, the latter is a "ring-bearing surface"). In an embodiment, the metal structure 1137 and the metal holding member 1127 may comprise a metal such as, but not limited to, Al, Mg, Ti, Zr, Cu, Fe, and/or one of alloys thereof. In addition, the insulating layer 1135 and the clasp insulating layer 1125 may comprise an insulating layer, such as an anodic film (or any such layer produced by an anodizing process on the metal surface). Previous PTFE Teflon ^® coating. In a preferred embodiment, the metal structure 1137 and the metal clasp 1127 can comprise an aluminum alloy. Also, in a preferred embodiment, the insulating layer 1135 and the clasp insulating layer 1125 can comprise anodized aluminum (e.g., produced according to an electrolytic passivation process as described in Sheasby and Edwards ). Further, in a preferred embodiment, the insulating layer 1135 and the insulating layer latching member 1125 may comprise a PTFE Teflon ^® sealing layer (e.g. Sheasby to those in the generators). The anodized aluminum layer in either or both of the insulating layer 1135 and the clasp insulating layer 1125 can have a thickness greater than about 0.02 mm. The insulating layer 1135 and the latch member 1125 of the insulating layer according to any one or both of the PTFE Teflon ^® layer may have a thickness of about 0.001mm is greater than one.

As previously mentioned, other suitable materials for the metal structure 1137 and the metal clasp 1127 may comprise alloys of Mg, Ti, Zr, Cu, Fe, and/or one of them. For other materials, the thickness Δ of either or both of the insulating layer 1135 and the clasp insulating layer 1125 may be based on the resistivity of the insulating layer 1135 and the clasp insulating layer 1125 and the desired collapse. The voltage is chosen. For example, if a breakdown voltage as a function of thickness is 30 V/μm, a 10 μm thick insulating layer can meet a required electrical breakdown value of 300 V. These technical requirements (i.e., a required electrical breakdown value of 300V) can drive the selection of suitable materials and thicknesses for the insulating layer 1135 and the fastener insulating layer 1125.

The coaxial socket 1150 can comprise a copper alloy and can be grounded. Moreover, the socket body 1130, the coaxial socket 1150, and the socket holder 1120 can be configured to have a coaxial relationship with a signal through the connector 400 through a PCB and the electronic device 110. The cavity of the structure. For example, the coaxial socket 1150 can be in electrical contact with the metal structure 1137 and the fastener metal structure 1127, and all of the coaxial socket 1150, the metal structure 1137, and the fastener metal structure 1127 can be configured. Ground. Thus, the test system 1100 can be configured to present a controlled impedance to electrical signals passing between the PCB and the electronic device. For example, FIG. 15 illustrates a portion of a hole interface 1190 associated with an opening between one of the coaxial sockets 1150 and an opening of one of the socket holders 1120. In particular, and in conjunction with an embodiment, the coaxial receptacle 1150 and the receptacle retaining member 1120 can be configured to exhibit a substantially fixed impedance throughout the electrical interface through the connector 440 throughout the cavity interface 1190. Part. The impedance may be from an opening in the lower portion of the socket holding member 1120 (which is configured to be aligned with a PCB) to an opening in the upper portion of the socket body 1130 (constructed to be aligned with the electronic device 110) A substantial portion of the cavity is more controlled to provide a matching impedance to the incoming electrical signal and current. For example, a transmission line impedance Z _{0 of} a coaxial transmission path (such as the path associated with the connector 440, the hole diameter D1175, and the connector diameter d 485 shown in FIG. 15) can be expressed by the following formula:

For example only, the hole diameter D1175 may be filled with air. =1.0. Therefore, depending on the hole diameter in the socket body 1130 and the hole diameter associated with the cavity and the relative permittivity associated with the combination of air and the insulating layer 1135, as shown in FIG. The value, and the relative permittivity associated with the hole diameter of D1175 in the socket holder 1120 and the combination of the air and the fastener insulating layer 1125 The value, a coaxial transmission path can be provided, which is an improvement over the conventional coaxial transmission path shown in Figures 6 and 9.

The complete performance of the test system 1100 is greater than about The 15 GHz signal frequency can be an improvement over the test system 400 and test system 700. In particular, the test system 1100 has a signal integrity performance greater than about 20 GHz, about 25 GHz, and about 30 GHz, which is better than conventional test systems having coaxial structures, such as the test system 400 and test system 700.

As with the test system 1000, the socket body 1130 shown in Figures 13-15 can have much higher strength than conventional plastic composite materials used in conventional test systems. Similar to the previous test system 100, the top socket layer 430 of the test system 400 is in a connector 440 with the top socket layer 430 (the connectors 440 can be spring pins - especially when they are In many cases, the associated forces will deform. This deformation can affect the electrical performance of the test system 400. Moreover, the amount of deformation will be related to the strength of the socket material. In contrast, the socket body 1130 including the metal structure 1137 and the insulating layer 1135 may have a higher strength than the conventional plastic used in the top socket layer 430. Further, the socket body 1130 comprising an aluminum alloy (the metal structure 1137) and a layer of anodized aluminum and PTFE Teflon ^® (the insulating layer 1135) has a modulus of elasticity which is about 10 times larger than that of the high strength composite plastic material. Using the same overall socket structure and force, the socket body 1130 can be deformed by only about 0.06 mm, which is about 0.25 mm compared to a high strength composite plastic material. Among other features, and by way of example only, it would be useful to test any electronic device that requires a large number of spring probe connectors, such as a test system that uses more than 1500 spring probe connectors.

In accordance with yet another embodiment, a method of making the socket body 1130 includes fabricating the metal structure 1137 to accommodate the plurality of connectors 440. In conjunction with an embodiment, the fabricated metal structure 1137 can be coated (and/or a layer can be created on the surface) using surface coating techniques and/or chemical processes. For example, if the metal structure 1137 is an aluminum alloy, a layer of anodized aluminum can be produced on the surface of the metal structure 1137 according to conventional anodization techniques, such as the electrolytic passivation process described in Sheasby and Edwards . . Other methods of anodizing the metal structure 1137 can include micro-plasma anodization and can be applied to, for example, a metal structure 1137 comprising Mg, Ti, Zr, Cu, Fe, and/or one of its alloys. Further, in a preferred embodiment, the insulating layer 1135 may comprise a PTFE Teflon ^® sealing layer (e.g., those described in Sheasby to producers), will provide, or another suitable electrically insulating coating.

Additionally, a method of making the socket retaining member 1120 includes fabricating the metal clip 1127 to receive the plurality of connectors 440 and align with the plurality of openings in the metal structure 1137. The fabricated metal clasp 1127 can be coated (and/or a layer can be created on the surface) using surface coating techniques and/or chemical processes. For example, if the metal clasp 1127 is an aluminum alloy, a layer of anodized aluminum can be produced on the surface of the metal clasp 1127 according to conventional techniques, such as electrolytic passivation as described in Sheasby and Edwards . on. Other methods of anodizing the metal clasp 1127 can include micro-plasma anodization and can be applied to, for example, a metal clasp 1127 comprising Mg, Ti, Zr, Cu, Fe, and/or one of its alloys. Further, in a preferred embodiment, the retaining member suitably coating the insulating layer 1125 may comprise a PTFE Teflon ^® sealing layer (e.g., those described in Sheasby to producers), will provide, or another electrically insulating .

16-18 illustrate a test system 1600 that is compatible with yet another embodiment. Like the test system 1100, the test system 1600 is provided with a coaxial structure. Moreover, as with test system 1100, test system 1600 can include a plurality of aligned connectors 440 (which can be configured as spring probes to operate in a coaxial configuration). The plurality of aligned connectors 440 can provide an electrical connection between the electronic device 110 and the PCB. The test system 1600 can include a socket body 1630 and a socket holder 1620. The socket body 1630 and the socket retaining member 1620 each include a plurality of openings for the plurality of aligned connectors 440. Moreover, the plurality of apertures in the socket body 1630 and the socket holder 1620 are configured to align to accommodate the plurality of aligned connectors 440. 16 is an exploded view of the test system 1600, and FIG. 17 is a cross-sectional view of the test system 1600 showing the alignment of the plurality of aligned connectors 440 with at least a portion of the electronic device 110 - and 18 shows an enlarged view of a portion of Fig. 17.

As shown in FIG. 18, for example, the socket body 1630 can include a metal structure 1637 and an insulating layer 1635. In addition, the socket holding member 1620 can include a metal fastening member 1627 and a fastening insulating layer 1625. As with test system 1100, connectors 440 in test system 1600 are electrically conductive to carry current and remain in contact with each other to avoid an electrical short. The insulating layer 1635 and the clasp insulating layer 1625 can prevent the connectors 440 from contacting the metal structure 1637 and the metal clasp 1627. The insulating layer 1635 and the retaining member insulating layer 1625, as shown in FIG. 18, are respectively provided on one of the annular inner surfaces of the opening of the metal structure 1637 and the opening of the metal holding member 1627, respectively. One of the annular surfaces (as used herein, the latter is a "ring-bearing surface"). In one embodiment, the metal structure 1637 and the metal clasp 1627 can comprise a metal such as, but not limited to, Al, Mg, Ti, Zr, Cu, Fe, and/or one of its alloys. In addition, the insulating layer 1635 and the holding member insulating layer 1625 may comprise an insulating layer, such as an anode film (or any such film layer formed on the metal surface by an anodizing method), which is generated on the metal. Previous PTFE Teflon ^® coating. In a preferred embodiment, the metal structure 1637 and the metal clasp 1627 can comprise an aluminum alloy. Also, in a preferred embodiment, the insulating layer 1635 and the clasp insulating layer 1625 can comprise anodized aluminum (e.g., as produced by electrolysis passivation, as described in Sheasby and Edwards ). Further, in a preferred embodiment, the insulating layer 1635 and the insulating layer latching member 1625 may comprise a PTFE Teflon ^® sealing layer (e.g. Sheasby to those in the generators). The anodized aluminum layer in either or both of the insulating layer 1635 and the clasp insulating layer 1625 can have a thickness greater than about 0.02 mm. The insulating layer 1635 and the latch member 1625 of the insulating layer according to any one or both of the PTFE Teflon ^® layer may have a thickness of about 0.001mm is greater than one.

As mentioned previously, other suitable materials that can be used for the metal structure 1637 and the metal clasp 1627 can comprise Mg, Ti, Zr, Cu, Fe, and/or one of its alloys. For these other materials, the thickness Δ of either or both of the insulating layer 1635 and the clasp insulating layer 1625 can be selected in accordance with the resistivity and breakdown voltage of the insulating layer 1635 and the clasp insulating layer 1625. For example, if the breakdown voltage of an insulating layer as a function of thickness is 30 V/μm, a 10 μm thick insulating layer can meet a required electrical breakdown value of 300 V. These technical requirements (ie a required electrical breakdown of 300V) can be used to drive the insulation 1635 and a selection of suitable material and thickness Δ of the fastener insulating layer 1625.

The socket body 1630 and the socket holder 1620 can be configured to present a cavity having a coaxial structure through a signal between the PCB and the electronic device 110 via the connector 440. For example, the metal structure 1637 of the socket body 1630 can be in electrical contact with the buckle metal structure 1627 of the socket holder 1620, and the metal structure 1637 and the fastener metal structure 1627 can all be grounded. Thus, the test system 1600 can be configured to exhibit a controlled impedance to electrical signals passing between the PCB and the electronic device. For example, FIG. 18 illustrates a portion of a void interface 1690 associated with an opening between one of the socket bodies 1630 and an opening between one of the socket retaining members 1620. In particular, and in conjunction with an embodiment, the socket body 1630 and the socket retaining member 1620 can be configured to present a substantially fixed impedance throughout the portion of the electrical signal through the connector 440. Interface 1690. The impedance can be formed by an opening (aligned with a PCB) at a lower portion of the socket retaining member 1620 to an opening (aligned with the electronic device 110) at an upper portion of the socket body 1630. More control over the majority of the cavity provides a matching impedance to the incoming electrical signal and current. If the hole is filled with air, it depends on the hole diameter in the socket body 1630 that is close to D1675 and associated with the cavity shown in FIG. 18 and the relative permittivity associated with the combination of air and the insulating layer 1635. The value, and the hole diameter of the socket holder 1620 near D1675 and the relative permittivity associated with the combination of air and insulating layer 1625 The value, a coaxial transmission path can be provided, which is an improvement over the conventional coaxial transmission path shown in Figures 6 and 9.

Like the test system 1100, the signal of the test system 1600 is complete. Performance can be an improvement over the test system 400 and test system 700 at signal frequencies greater than about 15 GHz. In particular, at signal frequencies greater than about 20 GHz, about 25 GHz, and about 30 GHz, the test system 1600 will have better signal integrity than a conventional test system having a coaxial structure.

Moreover, as with test system 1100, socket body 1630 shown in Figures 15-18 can have a much higher strength than conventional plastic composite materials used in conventional test systems. As previously described with respect to the test system 400, a socket layer 430 is deformed by a force associated with the connector 440 in the top socket layer 430 (where the connectors 440 can be spring pins - special Is when they are numerous.) This deformation can affect the electrical performance of the test system 400. Moreover, the amount of deformation will be related to the strength of the socket material. In contrast, the socket 1630 including the metal structure 1637 and the insulating layer 1635 can have a higher strength than the conventional plastic used in the top socket layer 430. Further, the socket body 1630 comprising an aluminum alloy (the metal structure 1637) and an anodized aluminum and Teflon coating (the insulating layer 1635) may have a modulus of elasticity about 10 times larger than that of the high strength composite plastic material. Using the same overall socket structure and force, the socket body 1630 can be deformed by only 0.06 mm, which is about 0.25 mm compared to a high strength composite plastic material. Among other features, and by way of example only, this would be useful for test systems that use a large number of spring probe connectors - such as test systems that use more than 1500 spring probe connectors.

In accordance with yet another embodiment, a method of making the socket body 1630 includes fabricating the metal structure 1637 to accommodate the plurality of connectors 440. In conjunction with an embodiment, the fabricated metal structure 1637 can be coated (and/or a layer can be created on the surface) using surface coating techniques and/or chemical processes. For example, if the metal structure 1637 is an aluminum alloy, a layer of anodized aluminum can be produced on the surface of the metal structure 1637 in accordance with conventional anodization techniques, such as the electrolytic passivation process described in Sheasby and Edwards . Other methods of anodizing the metal structure 1637 can include micro-plasma anodization and can be applied to, for example, a metal structure 1637 comprising Mg, Ti, Zr, Cu, Fe, and/or one of its alloys. Further, in a preferred embodiment, the insulating layer 1635 may comprise a PTFE Teflon ^® sealing layer (e.g., to be produced by the person in the Sheasby), or another suitable coating provides electrical insulation.

Additionally, a method of making the socket retainer 1620 includes fabricating the metal clip 1627 to accommodate the plurality of connectors 440 and align with a plurality of apertures in the metal structure 1637. The fabricated metal clasp 1627 can be coated (and/or a layer can be created on the surface) using surface coating techniques and/or chemical processes. For example, if the metal clasp 1627 is an aluminum alloy, a layer of anodized aluminum can be produced on the surface of the metal clasp 1627 in accordance with conventional techniques, such as the electrolytic passivation process described in Sheasby and Edwards . Other methods of anodizing the metal clasp 1627 can include micro-plasma anodization and can be applied to, for example, a metal clasp 1627 comprising Mg, Ti, Zr, Cu, Fe, and/or one of its alloys. Further, in a preferred embodiment, the retaining member suitably coating the insulating layer 1625 may comprise a PTFE Teflon ^® sealing layer (e.g., those described in Sheasby to producers), will provide, or another electrically insulating .

Those skilled in the art will appreciate that various modifications and variations can be made in the disclosed systems and methods without departing from the disclosure. range. That is, other embodiments will be readily apparent to those skilled in the art from this disclosure. It is intended that the specification and the claims be regarded as

100,400,700,1100,1600‧‧‧Test system

110‧‧‧Electronic devices

120, 1120, 1620‧‧‧ socket holders

130,1030‧‧‧ socket

140,440‧‧‧Connectors

420,720‧‧‧ bottom socket layer

430,760‧‧‧ top socket layer

450, 750‧‧‧ socket layer

730, 1130, 1630‧‧‧ socket body

745‧‧‧Insulated bushings

1000‧‧‧Test System

1020‧‧‧ socket holding parts

1025,1125,1625‧‧‧Button insulation

1027, 1127, 1627‧‧‧ metal holding parts

1035, 1135, 1635‧‧‧ insulation

1037, 1137, 1637‧‧‧Metal structures

1095‧‧‧ thickness

1150‧‧‧ coaxial socket

1190, 1690‧‧‧ hole interface

D475, D775, D1175, D1675‧‧‧ hole diameter

D485‧‧‧Connector diameter

Figure 1 is an exploded view of a conventional test system; Figure 2 is a cross-sectional view of the test system of Figure 1; Figure 3 is a partial detail of the test system of Figure 2; Figure 4 is an exploded view of another conventional test system Figure 5 is a cross-sectional view of the test system of Figure 4; Figure 6 is a partial detail of the test system of Figure 5; Figure 7 is an exploded view of another conventional test system; Figure 8 is a test of Figure 7 Figure 1 is a partial detail view of the test system of Figure 8; Figure 10 is an exploded view of a test system in accordance with an embodiment; Figure 11 is a cross-sectional view of the test system of Figure 10 Figure 12 is a partial detail view of the test system of Figure 11; Figure 13 is an exploded view of a test system in accordance with another embodiment; Figure 14 is a cross-sectional view of the test system of Figure 13; Figure 15 is a cross-sectional view of the test system of Figure 13; Figure 14 is an exploded view of a test system in accordance with yet another embodiment; Figure 17 is a cross-sectional view of the test system of Figure 16; and Figure 18 is a cross-sectional view of the test system of Figure 16; A partial detail of the test system.

110‧‧‧Electronic devices

1020‧‧‧ socket holding parts

140‧‧‧Connector

1030‧‧‧ socket

1000‧‧‧Test System

Claims (46)

A socket for a test system, the test system being configured to align at least a portion of an electronic device with a plurality of aligned connectors, the socket comprising: a metal structure having a plurality of openings, The plurality of apertures are spaced apart to receive the plurality of aligned connectors, and at least one of the plurality of apertures extends through a thickness of the metal structure, the at least one aperture having a ring An inner surface of the annular inner surface proximate to at least a portion of one of the electrically conductive outer surfaces of the one of the plurality of aligned connectors of the test system; and disposed on the annular inner surface An insulating layer having an insulating layer and a sealing layer. The socket of claim 1, wherein the insulating layer is configured to insulate the electrically conductive outer surface of the at least one aligned connector from the annular inner surface. The socket of claim 1, wherein the at least one aligned connector is a spring probe. The socket of claim 1, wherein the metal structure comprises an aluminum alloy material. The socket of claim 1, wherein the metal structure comprises at least one of the group of materials: Mg, Ti, Zr, Cu, and Fe. The socket of claim 1, wherein the insulating layer comprises an anodized aluminum and a polytetrafluoroethylene (PTFE) coating. Such as the socket of claim 6 of the patent scope, wherein the anodized aluminum has a large A thickness of about 0.02 mm. The socket of claim 6 wherein the polytetrafluoroethylene (PTFE) coating has a thickness greater than about 0.001 mm. A socket assembly comprising: the socket of claim 1; and a socket holding member comprising: a metal fastening member including a plurality of annular guiding holes, the plurality of annular guiding holes extending through The metal retaining member is configured to receive the plurality of aligned connectors when the socket retaining member is aligned with the socket, and at least one of the plurality of annular guide holes has a ring shape a fastening surface; and a fastening layer of the fastener disposed on the annular fastening surface, the fastening layer of the fastening member has an insulating layer and a sealing layer, and is configured to be in the pair of the socket holding member and the socket It can be aligned with the insulating layer on time. The socket assembly of claim 9, wherein the at least one aligned connector is a spring probe. The socket assembly of claim 9, wherein the metal structure comprises an aluminum alloy material. The socket assembly of claim 9, wherein the metal structure comprises at least one of the group of materials: Mg, Ti, Zr, Cu, and Fe. The socket assembly of claim 9, wherein the insulating layer comprises an anodized aluminum and a polytetrafluoroethylene (PTFE) coating. a socket assembly according to claim 13 of the patent scope, wherein in the insulating layer The anodized aluminum has a thickness greater than about 0.02 mm. The socket assembly of claim 13, wherein the polytetrafluoroethylene (PTFE) coating in the insulating layer has a thickness greater than about 0.001 mm. The socket assembly of claim 9, wherein the metal fastening member comprises an aluminum alloy material. The socket assembly of claim 9, wherein the metal fastening member comprises at least one of the group of materials: Mg, Ti, Zr, Cu, and Fe. The socket assembly of claim 9, wherein the fastening layer of the fastener comprises an anodized aluminum and a polytetrafluoroethylene (PTFE) coating. The socket assembly of claim 18, wherein the anodized aluminum in the fastening layer of the fastener has a thickness greater than about 0.02 mm. The socket assembly of claim 18, wherein the polytetrafluoroethylene (PTFE) coating in the fastening layer of the fastener has a thickness greater than about 0.001 mm. A coaxial socket for a test system, the test system being configured to align at least a portion of an electronic device with a plurality of aligned connectors, the coaxial socket comprising: a conductive structure having a plurality of openings The plurality of apertures are spaced apart to receive the plurality of aligned connectors, and at least one of the plurality of apertures extends through a thickness of the conductive structure, the at least one aperture having An annular inner surface proximate to at least a portion of one of the electrically conductive outer surfaces of the one of the plurality of aligned connectors of the plurality of aligned connectors in the test system; a socket holding member comprising: a metal fastening member including a plurality of annular guiding holes extending through the metal fastening member and configured to be in the socket holding member and the When the conductive structures are aligned, the plurality of aligned connectors can be accommodated, and at least one of the plurality of annular guide holes has an annular fastening surface; and a buckle disposed on the annular fastening surface Holding a insulating layer, the fastening layer of the fastener is configured to be aligned with the annular inner surface when the socket holding member is aligned with the conductive structure, and the socket holding member and the conductive structure are assembled The at least one aligned connector presents a hole interface; wherein the socket retaining member and the conductive structure are configured to provide an electrical signal through one of the at least one aligned connector, presenting a cross across the hole interface The impedance is essentially fixed. The coaxial socket of claim 21, wherein the at least one aligned connector is a spring probe. The coaxial socket of claim 21, wherein the metal fastening member comprises an aluminum alloy material. The coaxial socket of claim 21, wherein the metal holding member comprises at least one of the group of materials: Mg, Ti, Zr, Cu, and Fe. The coaxial socket of claim 21, wherein the fastening layer of the fastening member comprises an anodized aluminum and a polytetrafluoroethylene (PTFE) coating. A coaxial socket according to claim 25, wherein the anodized aluminum has a thickness greater than about 0.02 mm. A coaxial socket according to claim 25, wherein the polytetrafluoroethylene (PTFE) coating has a thickness greater than about 0.001 mm. A coaxial socket according to claim 21, wherein the conductive structure comprises a copper alloy. A coaxial jack of claim 21, wherein the electrical signal is at a frequency greater than about 20 GHz. A coaxial jack of claim 21, wherein the electrical signal is at a frequency greater than about 25 GHz. A coaxial jack of claim 21, wherein the electrical signal is at a frequency greater than about 30 GHz. A coaxial socket assembly comprising: the socket of claim 1; and a socket holding member comprising: a metal fastening member including a plurality of annular guiding holes, the plurality of annular guiding holes extending through Passing the metal latching member and configured to receive the plurality of aligned connectors when the socket retaining member is aligned with the socket, at least one of the plurality of annular guide holes having a ring a fastening surface; and a fastening layer of the fastener disposed on the annular fastening surface, the fastening layer of the fastening component being assembled to be disposed on the annular inner surface when the socket holding member is aligned with the socket The insulating layer is aligned, the socket holder and the socket are assembled to present a cavity interface to the at least one aligned connector; wherein the socket holder and the socket are assembled to provide a pass One of the at least one aligned connectors presents a substantially fixed impedance across the hole interface. The coaxial jack assembly of claim 32, wherein the at least one aligned connector is a spring probe. The coaxial socket assembly of claim 32, wherein the metal structure comprises an aluminum alloy material. The coaxial socket assembly of claim 32, wherein the metal structure comprises at least one of the group of materials: Mg, Ti, Zr, Cu, and Fe. The coaxial socket assembly of claim 32, wherein the insulating layer comprises anodized aluminum and a polytetrafluoroethylene (PTFE) coating. A coaxial jack assembly according to claim 36, wherein the anodized aluminum in the insulating layer has a thickness greater than about 0.02 mm. The coaxial socket assembly of claim 36, wherein the polytetrafluoroethylene (PTFE) coating in the insulating layer has a thickness greater than about 0.001 mm. The coaxial socket assembly of claim 32, wherein the metal fastening member comprises an aluminum alloy material. The coaxial socket assembly of claim 32, wherein the metal fastening member comprises at least one of the group of materials: Mg, Ti, Zr, Cu, and Fe. The coaxial socket assembly of claim 32, wherein the fastening layer of the fastener comprises an anodized aluminum and a polytetrafluoroethylene (PTFE) coating. The coaxial jack assembly of claim 41, wherein the anodized aluminum in the clasp insulation layer has a thickness greater than about 0.02 mm. The coaxial socket assembly of claim 41, wherein the polytetrafluoroethylene (PTFE) coating in the fastening layer of the fastener has a thickness greater than about 0.001 mm. A coaxial jack assembly according to claim 32, wherein the electrical signal is at a frequency greater than about 20 GHz. A coaxial jack assembly according to claim 32, wherein the electrical signal is at a frequency greater than about 25 GHz. A coaxial jack assembly according to claim 32, wherein the electrical signal is at a frequency greater than about 30 GHz.