TWI578462B - An anti-sticking heat sink - Google Patents

Description

Anti-stick heat sink

The invention relates to a heat sink, in particular to an anti-stick heat sink for preventing vacuum adhesion.

As the semiconductor process continues to advance, the existing semiconductor wafers have gradually reduced in size in addition to their efficiencies. For example, the thickness of smart phones and tablets is being thinned, so the components in the products are also The thickness must be reduced to be placed in a limited space within the product.

Since the efficiency of the semiconductor wafer is accelerated, the heat generated in the wafer must also be transferred to the heat by the heat sink. When the heat sink manufacturer stamps the heat sink, the heat sink is stacked on the wafer package factory. The packaging operation is performed, and the packaging factory removes the heat sink pieces one by one from the wafer and the substrate by means of mechanical arm clamping or suction.

Referring to FIG. 1, a plurality of heat sinks 10 stacked in a stacked manner are used. When a vacuum suction nozzle 11 is used to take a material from the uppermost heat sink 10, the heat sink 10 of the uppermost layer will be the same as the heat sink 10 of the lower layer. The surface causes a gap 12 to generate a vacuum suction force, so that the lower heat sink 10 is brought together, resulting in a vacuum sticking condition when the heat sink 10 is moved.

Therefore, how to eliminate the occurrence of the heat sink in the upper side of the heat sink when the heat sink is removed by the vacuum suction generated by the gap between them, causes a problem in the product of the semiconductor package. How to achieve a quick and accurate removal of a single piece of heat sink for use has become an urgent need of the skilled artisan.

In view of the above, an object of the present invention is to provide an anti-stick heat sink comprising a body unit and an anti-sticking unit. The body unit includes a first body having a first upper surface and a first lower surface.

The anti-adhesion unit includes a plurality of first anti-stick protrusions protruding from the first lower surface, and when the plurality of fins are stacked together, the adjacent body units are spaced apart from each other by the first anti-stick tab A distance.

Another technical means of the present invention is that the first lower surface is square, and the plurality of first anti-stick projections are respectively disposed on four sides of the first lower surface.

According to still another aspect of the present invention, the first lower surface is formed in a square shape, and the plurality of first anti-stick projections are respectively disposed on the four corners of the first lower surface.

Another technical means of the present invention is that the main body unit further includes a through hole disposed in the first body and extending through the first upper surface and the first lower surface.

According to still another aspect of the present invention, the first anti-smear tab is looped along the peripheral frame of the through hole on the first lower surface.

According to still another aspect of the present invention, the main body unit further includes a second body disposed on the first body and having a second upper surface and a second lower surface, the first body and the second body The outer edges are aligned with each other.

Another technical means of the present invention is that the anti-sticking unit further comprises a plurality of second anti-stick projections protruding from the second lower surface, the main body unit further comprising a first upper body connected to the first main body a connecting layer of the surface and the second lower surface of the second body.

Another technical means of the present invention is that the main body unit further includes a second body disposed above the first body and having a second upper surface and a second lower surface, and a first body and a first body The second The connecting portion of the main body, the area of the lower surface of the second body is not larger than the through hole, and the connecting portion is respectively connected to the outer periphery of the second body and the periphery of the through hole of the first body.

Still another technical means of the present invention is that the thickness of the first body is less than 0.3 mm.

Another technical means of the present invention is that the first anti-sticking projection is formed into an L-shape.

The utility model has the beneficial effects that the main body unit is provided with a first anti-sticking protrusion protruding from the first lower surface, and when the plurality of fins are stacked together, the main unit adjacent to the upper and lower sides is protected by the first The gravitational ridges are spaced apart from each other to allow the air in the gap to circulate with the outside air without generating vacuum suction, so that vacuum adhesion is not generated during the semiconductor packaging process, and a single heat sink can be sucked and adhered to On a semiconductor wafer.

3‧‧‧Substrate unit

31‧‧‧Substrate

32‧‧‧ wafer

4‧‧‧Main unit

41‧‧‧ first subject

411‧‧‧ first upper surface

412‧‧‧First lower surface

42‧‧‧through hole

43‧‧‧Second subject

431‧‧‧Second upper surface

432‧‧‧Second lower surface

44‧‧‧Connection layer

45‧‧‧Connection section

5‧‧‧Anti-sticking unit

51‧‧‧First anti-stick crown

52‧‧‧Second anti-stick

1 is a schematic view showing a state of a conventional heat sink; FIG. 2 is a schematic view showing a first preferred embodiment of the heat-resistant heat sink of the present invention; and FIG. 3 is a cross-sectional view showing the FIG. 4 is a schematic view showing the movement of the first preferred embodiment; FIG. 5 is a schematic view showing the use of the first preferred embodiment. Figure 6 is a schematic view showing a second preferred embodiment of the anti-adhesion heat sink of the present invention; Figure 7 is a cross-sectional view showing the cross-sectional aspect of the second preferred embodiment; Figure 8 is a schematic view showing a third preferred embodiment of the anti-adhesive heat sink of the present invention; and Figure 9 is a schematic view showing the use state of a fourth preferred embodiment of the anti-adhesion heat sink of the present invention. Figure 10 is a schematic view showing a fifth preferred embodiment of the anti-adhesive heat sink of the present invention; Figure 11 is a side elevational view showing the side view of the second preferred embodiment; 12 is a schematic diagram showing the use of the fifth preferred embodiment.

The details of the related patents and the technical contents of the present invention will be apparent from the following detailed description of the preferred embodiments of the accompanying drawings.

It should be noted that, before the detailed description, similar elements are denoted by the same reference numerals. Moreover, the semiconductor packaging process mentioned in the specification can be used for Flip Chip Package (FC), Plastic Ball Grid Array Package (PBGA), Ball Grid Array (BGA). , Quad Flat Package (QFP), Quad Flat No-lead Package (QFN), and Chip Scale Package (CSP).

2, 3, and 4, a first preferred embodiment of the anti-adhesion heat sink of the present invention is applied to a substrate unit 3, the substrate unit 3 includes a substrate 31, and a substrate 31 is disposed on the substrate 31. The upper wafer 32, the anti-adhesive heat sink can transfer the heat generated by the wafer 32 to the outside, and includes a main body unit 4 and an anti-sticking unit 5.

The main body unit 4 includes a first body 41 having a first upper surface 411 and a first lower surface 412. The first lower surface 412 is substantially Into a square. The anti-sticking unit 5 includes a plurality of first anti-stick tabs 51 protruding from the first lower surface 412. When the plurality of anti-adhesion fins are stacked together, the adjacent main unit 4 is The anti-stick tabs 51 are spaced apart from one another such that the plurality of anti-stick fins do not create vacuum suction between each other.

The tangential line aa in the figure is a section line of the first preferred embodiment, and the first body 41 is a sheet-type heat sink (Lid), and the first anti-sticking protrusion 51 protrudes from the first lower surface 412. Preferably, the main body unit 4 can be made of a material of a white copper, and the anti-adhesion unit 5 is made of an epoxy resin (Epoxy) and coated on the first by a coating technique. On the lower surface 412, the material of the main body unit 4 can also be made of a metal heat conductive material such as copper, aluminum or stainless steel. In addition, the anti-adhesion unit 5 may also be configured to shape the anti-adhesion unit 5 on the stamping die when the heat sink is manufactured. When the heat sink is manufactured by stamping, the anti-sticking unit is formed on the main body unit 4 at the same time. Sticking unit 5 should not be limited to this.

Here, it is worth noting that since mobile communication devices and tablet computers are moving in a lighter and thinner direction, semiconductor manufacturers must insert many electronic components in a limited space, resulting in semiconductor components must be made. The thinner.

In the early days, the total thickness of semiconductor components (including heat sinks) was about 0.35mm~0.5mm, and the current semiconductor technology can reduce the total thickness to 2.3~3.0mm, which not only reduces the thickness of the substrate and the wafer, but also lies above the wafer. The thickness of the heat sink has also been improved from the early 0.2mm~0.3mm to 0.1mm~0.2mm, and even 0.03~0.06mm can be achieved by using the higher stamping technology, but the thinner the heat sink is, the higher the cost is. .

As can be seen from the above description, the thickness of the heat sink can be very thin due to the demand of the product and the advancement of the process technology, but the weight of the heat sink is also becoming lighter due to the thickness reduction factor, resulting in When thinner heat sinks are stacked in a stacked manner, they are adjacent to each other. The vacuum suction generated by the gap between the heat sinks may cause adhesion to the lower heat sink when the upper heat sink is moved, resulting in an error in the packaging process.

Further, in the early stage, due to the manufacturing technology, the thickness of the heat sink is thick and the weight is heavy. When the heat sink is laminated, the heat sink of the topmost end is sucked from above, and the heat sink below it can offset the gap due to the weight. The vacuum suction generated by the vacuum is separated from the upper heat sink, and the adjacent heat sink is not affected by the vacuum suction force during the moving, resulting in sticking. However, as the heat sink is thinner and lighter, the semiconductor package factory draws the heat sink from the top of the stacked heat sink, and the adjacent heat sink below the weight may be too light, so that the weight cannot be offset. Vacuum suction causes sticking.

The inventors have found through test that when the thickness of the first body 41 is less than 0.3 mm, the first body 41 adjacent to each other in the upper and lower sides may be vacuum-sticked due to the vacuum suction generated in the liquid. The anti-sticking heat sink of the present invention is provided with a plurality of first anti-sticking protrusions 51 under the first main body 41 so that air is circulated in the gaps of the first main bodies 41 adjacent to each other, and the vacuum suction force is eliminated to eliminate the sticking condition. Preferably, the thickness of the plurality of first anti-sticking protrusions 51 is about 0.01 mm to 0.03 mm, so as to prevent vacuum adhesion between the adjacent first main bodies 41, and can be respectively disposed under the first At the intermediate point of the four sides of the surface 412, in practice, the thickness of the first anti-sticking protrusion 51 must match the area and thickness of the first body 41 to determine the thickness of the coating, and should not be limited thereto. .

Referring to FIG. 5, the first preferred embodiment is adhered to the wafer 32 to conduct heat generated by the wafer 32 to the outside. Preferably, the first lower surface 412 has the same area as the wafer. When the anti-sticking unit 5 is made of the epoxy resin material and the adhesive material used for bonding the substrate unit 3, the anti-adhesion heat sink of the present invention is adhered to the substrate unit 3, and the first anti-sticking protrusion 51 is attached. It can be closely adhered to the adhesive, and the anti-sticking unit 5 is attached to the main body using the coating technology. In the element 4, the main unit 4 is not easily peeled off after being adhered to the substrate unit. Moreover, the heat sink coated with the anti-sticking unit 5 also helps to identify the front and back surfaces, and contributes to the situation in which the semiconductor package operation does not occur.

Referring to Figures 6 and 7, a second preferred embodiment of the anti-adhesion heat sink of the present invention is substantially the same as the first preferred embodiment, and the same is not described herein again. The main body unit 4 further includes a through hole 42 disposed in the first body 41 and penetrating the first upper surface 411 and the first lower surface 412, so that the first body 41 is formed with the through hole 42. A ring-shaped heat sink is disposed on the first lower surface 412 along the peripheral frame of the through hole 42.

The tangential line bb in the drawing is a section line of the second preferred embodiment. When the stacked first body 41 is moved, the air in the gap between the first bodies 41 adjacent to each other can be passed by the first anti-stick embossing The through hole 42 and the through hole 42 are circulated to the outside, so that the first main bodies 41 adjacent to each other do not generate vacuum suction force and stick together. Preferably, the thickness of the first body 41 and the through hole 42 is not greater than the thickness of the wafer 32. When the first body 41 is adhered to the substrate 31, the through hole 42 can accommodate the wafer 32. The thickness must be selected in accordance with the conditions of the semiconductor process, and should not be limited to this.

Referring to FIG. 8 , a third preferred embodiment of the anti-adhesion heat sink of the present invention is substantially the same as the second preferred embodiment. The main body unit 4 further includes a second body 43 disposed on the first body 41 and having a second upper surface 431 and a second lower surface 432. The outer edges of the first and second bodies 41 and 43 are mutually The first body 41 and the second body 43 are integrally formed of the same material.

In addition, the plurality of first anti-smear tabs 51 disposed on the first lower surface 412 can distance the first lower surface 412 of the upper layer main unit 4 from the second upper surface 431 of the lower layer main unit 4 by a distance. The gaps between the main body units 4 adjacent to each other do not cause vacuum suction and stick together.

When the third preferred embodiment is adhered to the substrate unit 3, the first lower surface 412 is adhered to the substrate 31, and the second lower surface 432 is adhered to the wafer 32 by a heat conductive material. It can help the heat generated by the operation of the wafer 32 to be dissipated to achieve the heat dissipation effect.

Referring to FIG. 9 , a fourth preferred embodiment of the anti-adhesion heat sink of the present invention is substantially the same as the third preferred embodiment. The first body 41 is spaced apart from the second body 43. The body unit 4 further includes a connecting layer connecting the first upper surface 411 of the first body 41 and the second lower surface 432 of the second body 43. 44. The anti-sticking unit 5 further includes a plurality of second anti-sticking protrusions 52 protruding from the second lower surface 432.

The plurality of second anti-sticking protrusions 52 are identical in shape and material to the first anti-sticking protrusions 51, and are disposed on four sides of the second lower surface 432, and the plurality of second main bodies 43 are stacked together. The adjacent second main bodies 43 are spaced apart from each other by the second anti-sticking protrusions 52 such that the plurality of second main bodies 43 are laminated together without generating vacuum suction force.

Then, the connecting layer 44 is adhered to the same material as the adhesive of the heat sink and the substrate unit 3, and the first body 41 and the second body 43 are adhered together, and the connecting layer 44 and the second anti-sticking tab are attached. 52 have epoxy resin materials, which can increase the adhesion between each other when pasting. Finally, the first anti-sticking protrusion 51 can cause the main body unit 4 adjacent to each other (including the first main body 41, the connecting layer 44, and the second main body 43) to adhere to each other without generating vacuum suction force. together.

10, 11, and 12 are the fifth preferred embodiment of the anti-adhesion heat sink of the present invention. The fifth preferred embodiment is substantially the same as the second preferred embodiment. The main body unit 4 further includes a second body 43 disposed above the first body 41 and having a second upper surface 431 and a second lower surface 432, and a The connecting portion 45 to which the first and second bodies 41 and 43 are connected, the area of the lower surface of the second body 43 is not larger than the through hole 42 , and the connecting portion 45 is respectively connected to the outer periphery of the second body 43 and the first portion The periphery of the through hole 42 of a body 41.

The first body 41, the second body 43, and the connecting portion 45 are made of the same material and integrally formed, and the first lower surface 412 of the main body unit 4 has a square shape. The plurality of first anti-sticking protrusions 51 are respectively disposed on the four corners of the first lower surface 412 by coating, and the surface shape of the first anti-sticking protrusion 51 is L-shaped. . When the plurality of fifth preferred embodiments are stacked together, the first anti-sticking projection 51 can be spaced apart from the adjacent main body unit 4 so that the adjacent slits do not generate vacuum suction and stick. .

When the anti-adhesive heat sink of the present invention is adhered to the substrate unit 3, the first and second bodies 41, 43 and the connecting portion 45 cooperate with the substrate 31 to protect the wafer 32. The heat generated by 32 can be conducted to the outside by the second body 43.

As can be seen from the above description, the anti-adhesive heat sink of the present invention does have the following advantages:

First, avoid sticking

When the plurality of anti-sticking heat sinks are stacked together, the plurality of first anti-sticking protrusions 51 disposed on the first lower surface 412 of each of the main body units 4 may space the lower layer main body unit 4 at a distance so as to be mutually The adjacent gaps do not create vacuum suction and stick together.

Second, increase product yield

As described above, the anti-sticking unit 5 can prevent the vacuum suction from being generated and the adjacent main body units 4 from sticking to each other, that is, the error in the adhesion of the heat sink in the semiconductor packaging process can be reduced, and the production speed can be increased. Increase the yield of the product.

Third, increase adhesion

The anti-sticking unit 5 is the same as the adhesive material used for adhering the substrate unit 3. When the anti-sticking heat-dissipating fin of the present invention is adhered to the substrate unit 3, the anti-sticking unit 5 can be closely adhered to the adhesive. Together, the main unit 4 is adhered to the substrate unit 3, and is not easily peeled off.

In summary, the main unit 4 is provided with a first anti-sticking protrusion 51 protruding from the first lower surface 412, so that when the plurality of anti-adhesive fins are stacked together, the adjacent one is adjacent. The main body unit 4 is separated from each other by the first anti-sticking protrusions 51, so that no vacuum suction is generated in the gap, and the adhesive is applied to the substrate unit for fast and suctioning a single heat sink to be adhered to the substrate unit. 3, it is indeed possible to achieve the object of the present invention.

However, the above is only the five preferred embodiments of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes made by the scope of the invention and the description of the invention are Modifications are still within the scope of the invention.

4‧‧‧Main unit

41‧‧‧ first subject

51‧‧‧First anti-stick crown

Claims (10)

An anti-sticking heat sink comprising: a body unit comprising a first body having a first upper surface and a first lower surface; and an anti-sticking unit comprising a plurality of protrusions on the first lower surface a first anti-sticking ridge, when the plurality of fins are stacked together, the adjacent body units are spaced apart from each other by the first anti-stick bulge so that the main unit stacked one above another does not generate a vacuum between each other suction. The anti-adhesion heat sink of claim 1, wherein the first lower surface is square, and the plurality of first anti-stick tabs are respectively disposed on four sides of the first lower surface. . The anti-adhesive heat sink of claim 1, wherein the first lower surface is square, and the plurality of first anti-stick tabs are respectively disposed on four corners of the first lower surface. . The anti-adhesive heat sink of claim 2, wherein the body unit further comprises a through hole disposed in the first body and extending through the first upper surface and the first lower surface. The anti-adhesion heat sink of claim 4, wherein the first anti-stick projection is looped along the peripheral frame of the through hole on the first lower surface. The anti-adhesive heat sink of claim 4, wherein the body unit further comprises a second body disposed on the first body and having a second upper surface and a second lower surface, The outer edges of the first body and the second body are aligned with each other. The anti-adhesion heat sink of claim 6, wherein the anti-sticking unit further comprises a plurality of second anti-stick projections protruding from the second lower surface, the main body unit further comprising a connection a connecting layer of the first upper surface of the first body and the second lower surface of the second body. The anti-adhesive heat sink of claim 4, wherein the body unit further comprises a second body disposed above the first body and having a second upper surface and a second lower surface, and a connecting portion of the first body and the second body, the lower surface of the second body is not larger than the through hole, and the connecting portion is respectively connected to the outer periphery of the second body and the first body Peripheral circumference. The anti-adhesion heat sink of claim 1, wherein the first body has a thickness of less than 0.3 mm. The anti-adhesion heat sink of claim 3, wherein the first anti-stick projection is L-shaped.