TWI576881B - Fabricating method of keyboard membrane - Google Patents
Fabricating method of keyboard membrane Download PDFInfo
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- TWI576881B TWI576881B TW104133161A TW104133161A TWI576881B TW I576881 B TWI576881 B TW I576881B TW 104133161 A TW104133161 A TW 104133161A TW 104133161 A TW104133161 A TW 104133161A TW I576881 B TWI576881 B TW I576881B
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- film
- melt adhesive
- hot melt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
- H01H13/88—Processes specially adapted for manufacture of rectilinearly movable switches having a plurality of operating members associated with different sets of contacts, e.g. keyboards
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2229/00—Manufacturing
- H01H2229/056—Laminating
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Description
本發明是有關於一種製作方法，且特別是有關於一種鍵盤薄膜的製作方法。The present invention relates to a method of fabrication, and more particularly to a method of making a keyboard film.
傳統的鍵盤的薄膜電路板的製作為先將防水膠印刷於兩電路軟板上，然後將絕緣用的隔片置於兩個電路軟板之間且對準後，使兩電路軟板與隔片黏合在一起。The traditional keyboard thin film circuit board is manufactured by first printing the waterproof glue on the two circuit soft boards, and then placing the insulating spacer between the two circuit soft boards and aligning them, so that the two circuit boards are separated from each other. The sheets are glued together.
然而，如果兩個電路軟板貼合時沒有對準，雖然可以經由施力將電路軟板與隔片分開，但是因為防水膠是直接印刷在電路軟板的表面上，因此在將電路軟板撕下的同時，防水膠會被破壞掉，而被防水膠所覆蓋的電路層也有可能被破壞掉而使得該片電路軟板需要報廢無法重複黏貼使用。However, if the two circuit boards are not aligned when they are attached, although the circuit board can be separated from the spacer by force application, since the waterproof glue is directly printed on the surface of the circuit board, the circuit board is soft. At the same time as the tearing off, the waterproof glue will be destroyed, and the circuit layer covered by the waterproof glue may be destroyed, so that the circuit soft board needs to be scrapped and cannot be repeatedly used.
本發明提供一種鍵盤薄膜的製作方法，其可以提升鍵盤薄膜的良率。The invention provides a method for manufacturing a keyboard film, which can improve the yield of the keyboard film.
本發明的一種鍵盤薄膜的製作方法，至少包括下列步驟：提供第一薄膜以及第二薄膜；於常溫下在第一薄膜以及第二薄膜之間設置熱熔膠，其中第一薄膜、熱熔膠以及第二薄膜互相對準；以及提供熱壓合設備，熱壓合設備對相互堆疊的第一薄膜、熱熔膠以及第二薄膜進行圖案化式的熱壓合，以形成鍵盤薄膜。A method for fabricating a keyboard film according to the present invention comprises at least the steps of: providing a first film and a second film; and providing a hot melt adhesive between the first film and the second film at a normal temperature, wherein the first film and the hot melt adhesive And the second film is aligned with each other; and a thermocompression device is provided, and the first film, the hot melt adhesive and the second film stacked on each other are patterned and thermocompression-bonded to form a keyboard film.
在本發明的製作方法的一實施例中，上述的熱熔膠於常溫下呈固體狀且不具黏性，而在進行熱壓合時，熱熔膠受熱而發生形變且具黏性的同時受壓合以與第一薄膜及第二薄膜黏合在一起。In an embodiment of the manufacturing method of the present invention, the hot-melt adhesive is solid at normal temperature and is not viscous, and when hot-pressed, the hot melt adhesive is deformed by heat and is viscous. Pressing to bond with the first film and the second film.
在本發明的製作方法的一實施例中，上述的進行圖案化式的熱壓合的方法為使熱壓合設備具有圖案化的壓合板，以對第一薄膜、熱熔膠以及第二薄膜進行一次性的熱壓合。In an embodiment of the manufacturing method of the present invention, the method of performing the patterning thermocompression is such that the thermocompression bonding apparatus has a patterned pressing plate for the first film, the hot melt adhesive, and the second film. Perform a one-time thermal compression.
在本發明的製作方法的一實施例中，上述的進行圖案化式的熱壓合的方法為使熱壓合設備的壓合板對第一薄膜、熱熔膠以及第二薄膜進行多次區域性的熱壓合。In an embodiment of the manufacturing method of the present invention, the method for performing the patterning thermocompression is to make the first film, the hot melt adhesive and the second film of the hot pressing device to be multi-regional. Hot pressing.
在本發明的製作方法的一實施例中，上述的熱壓合為單面熱壓合或是雙面熱壓合。In an embodiment of the manufacturing method of the present invention, the above-mentioned thermocompression bonding is one-sided thermocompression bonding or double-sided thermocompression bonding.
在本發明的製作方法的一實施例中，上述的第一薄膜上設置有第一圖案化電路層，且第一圖案化電路層具有多個第一接點，第二薄膜上設置有第二圖案化電路層，且第二圖案化電路層具有多個第二接點，使第一薄膜、熱熔膠以及第二薄膜互相對準的方法為，將第一圖案化電路層面向第二圖案化電路層，且在第一薄膜、熱熔膠及第二薄膜的堆疊方向上，第二接點的正投影透過熱熔膠的通孔至少部分地重合於第一接點。In an embodiment of the manufacturing method of the present invention, the first film is provided with a first patterned circuit layer, and the first patterned circuit layer has a plurality of first contacts, and the second film is provided with a second The circuit layer is patterned, and the second patterned circuit layer has a plurality of second contacts, and the first film, the hot melt adhesive, and the second film are aligned with each other by facing the first patterned circuit layer toward the second pattern The circuit layer, and in the stacking direction of the first film, the hot melt adhesive and the second film, the orthographic projection of the second contact penetrates at least partially through the through hole of the hot melt adhesive to the first contact.
在本發明的製作方法的一實施例中，上述的第一薄膜、熱熔膠以及第二薄膜的材料為苯二甲酸乙酯(PET)。In an embodiment of the manufacturing method of the present invention, the material of the first film, the hot melt adhesive and the second film is ethyl phthalate (PET).
在本發明的製作方法的一實施例中，更包括提供隔片，並將熱熔膠設置於隔片的上表面及下表面，且隔片的材質為苯二甲酸乙酯(PET)。In an embodiment of the manufacturing method of the present invention, the method further includes providing a spacer, and disposing the hot melt adhesive on the upper surface and the lower surface of the spacer, and the spacer is made of phthalic acid (PET).
基於上述，於本發明的鍵盤薄膜的製作方法中，藉由熱熔膠的物理特性而讓在常溫下對位擺置的第一薄膜、熱熔膠以及第二薄膜彼此間還不會黏附在一起，而是在確認第一薄膜、熱熔膠以及第二薄膜的對位準確之後，才會施加熱壓合步驟，使熱熔膠受熱而形變且具黏性，讓對位準確的第一薄膜、熱熔膠以及第二薄膜彼此黏附在一起。Based on the above, in the method for fabricating the keyboard film of the present invention, the first film, the hot melt adhesive and the second film which are placed in position at normal temperature are not adhered to each other by the physical properties of the hot melt adhesive. Together, after confirming that the alignment of the first film, the hot melt adhesive and the second film is accurate, the hot pressing step is applied, so that the hot melt adhesive is deformed and viscous by heat, so that the alignment is accurate first. The film, the hot melt adhesive, and the second film are adhered to each other.
為讓本發明的上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。The above described features and advantages of the invention will be apparent from the following description.
圖1為第一薄膜、第二薄膜以及熱熔膠的平面示意圖。請參考圖1，於常溫的狀況下提供第一薄膜10、第二薄膜20以及熱熔膠30。所述第一薄膜10、熱熔膠30以及第二薄膜20例如是由苯二甲酸乙酯(PET)製作而成的，但並不以本實施例所舉的例子為限制，也可以選用其他合適的材料來分別製作第一薄膜10、第二薄膜20及/或熱熔膠30。另外，雖然本實施例中是在同一個步驟中同時提供熱熔膠30、第一薄膜10以及第二薄膜20，但是也可以依照實際的需求而有順序地先後提供熱熔膠30、第一薄膜10及第二薄膜20。例如，可依序先提供熱熔膠30，後再提供第一薄膜10與第二薄膜20；亦可以依序先提供第一薄膜10，後再提供熱熔膠30與第二薄膜20；或者也可以依序先提供第二薄膜20，後再提供第一薄膜10與熱熔膠30…等等。1 is a schematic plan view of a first film, a second film, and a hot melt adhesive. Referring to FIG. 1, the first film 10, the second film 20, and the hot melt adhesive 30 are provided under normal temperature conditions. The first film 10, the hot melt adhesive 30, and the second film 20 are made of, for example, ethyl phthalate (PET), but are not limited by the examples in the embodiment, and other options may be used. A suitable material is used to make the first film 10, the second film 20, and/or the hot melt adhesive 30, respectively. In addition, although the hot melt adhesive 30, the first film 10, and the second film 20 are simultaneously provided in the same step in the embodiment, the hot melt adhesive 30 may be sequentially provided in sequence according to actual needs. Film 10 and second film 20. For example, the hot melt adhesive 30 may be provided first, and then the first film 10 and the second film 20 may be provided; the first film 10 may be provided first, followed by the hot melt adhesive 30 and the second film 20; It is also possible to provide the second film 20 first, followed by the first film 10 and the hot melt adhesive 30, and the like.
圖2為將熱熔膠、第一薄膜以及第二薄膜疊置且互相對位的示意圖。請同時參考圖1及圖2，熱熔膠30具有多個通孔32，且熱熔膠30在常溫下呈固體狀且不具黏性，因此此時互相疊置的第一薄膜10、熱熔膠30以及第二薄膜20彼此間並不會互相黏附在一起。第一薄膜10上設置有第一圖案化電路層12，且第一圖案化電路層12具有多個第一接點14，第二薄膜20上設置有第二圖案化電路層22，且第二圖案化電路層22具有多個第二接點26。2 is a schematic view showing the hot melt adhesive, the first film, and the second film stacked and aligned with each other. Referring to FIG. 1 and FIG. 2 simultaneously, the hot melt adhesive 30 has a plurality of through holes 32, and the hot melt adhesive 30 is solid at normal temperature and is not viscous. Therefore, the first film 10 and the hot melt are superposed on each other at this time. The glue 30 and the second film 20 do not adhere to each other. The first film 10 is provided with a first patterned circuit layer 12, and the first patterned circuit layer 12 has a plurality of first contacts 14, the second film 20 is provided with a second patterned circuit layer 22, and the second The patterned circuit layer 22 has a plurality of second contacts 26.
如圖2所示，將熱熔膠30置於第一薄膜10以及第二薄膜20之間，並使第一薄膜10、熱熔膠30以及第二薄膜20互相對準。使第一薄膜10、熱熔膠30以及第二薄膜20互相對準的方法為：使第一圖案化電路層12面向第二圖案化電路層22，且在第一薄膜10、熱熔膠30及第二薄膜20的堆疊方向上，第二圖案化電路層22的第二接點26的正投影穿過通孔32至少部分地重合於第一圖案化電路層12的第一接點14。使第一薄膜10、熱熔膠30以及第二薄膜20互相對準可以是透過人力辨識(例如人眼觀察)或機械辨識(例如攝影鏡頭、圖像重疊辨識)等方式來確認第一薄膜10、熱熔膠30以及第二薄膜20是否有對位準確。As shown in FIG. 2, the hot melt adhesive 30 is placed between the first film 10 and the second film 20, and the first film 10, the hot melt adhesive 30, and the second film 20 are aligned with each other. The first film 10, the hot melt adhesive 30, and the second film 20 are aligned with each other by: facing the first patterned circuit layer 12 toward the second patterned circuit layer 22, and at the first film 10 and the hot melt adhesive 30. And the stacking direction of the second film 20, the orthographic projection of the second contact 26 of the second patterned circuit layer 22 at least partially coincides with the first contact 14 of the first patterned circuit layer 12 through the via 32. Aligning the first film 10, the hot melt adhesive 30, and the second film 20 with each other may confirm the first film 10 by means of human identification (for example, human eye observation) or mechanical identification (for example, photographic lens, image overlap recognition). Whether the hot melt adhesive 30 and the second film 20 are aligned accurately.
圖3為對第一薄膜、熱熔膠以及第二薄膜進行熱壓合的示意圖。請參考圖3，提供熱壓合設備50，且熱壓合設備50對相互堆疊且互相對準而定位的第一薄膜10、熱熔膠30以及第二薄膜20進行圖案化式的熱壓合，以形成如圖4示的鍵盤薄膜。詳細地說，在進行熱壓合時，熱熔膠30受熱而發生形變且變得具黏性，而在此同時會將黏合位於上、下兩側的一同受壓合的第一薄膜10以及第二薄膜20黏合在一起。3 is a schematic view showing thermal compression bonding of a first film, a hot melt adhesive, and a second film. Referring to FIG. 3, a thermocompression bonding apparatus 50 is provided, and the thermocompression bonding apparatus 50 performs patterning thermal pressing on the first film 10, the hot melt adhesive 30, and the second film 20 which are stacked and aligned with each other. To form a keyboard film as shown in FIG. In detail, when the thermocompression bonding is performed, the hot melt adhesive 30 is deformed by heat and becomes viscous, and at the same time, the first film 10 which is bonded together on the upper and lower sides is bonded together, and The second film 20 is bonded together.
請繼續參考圖3及圖4，於本實施例中，圖案化式的熱壓合的施行方法為使熱壓合設備50的壓合板52對第一薄膜10、熱熔膠30以及第二薄膜20可以施行一次性的熱壓合。換言之，此壓合板52的尺寸大小對應於第一薄膜10(或第二薄膜20)的尺寸大小，而可以略大或略小，只要壓合板52的範圍可以完全覆蓋待壓合區域即可。Referring to FIG. 3 and FIG. 4 , in the embodiment, the patterned thermal compression is performed by pressing the pressing plate 52 of the thermal compression device 50 against the first film 10 , the hot melt adhesive 30 and the second film. 20 can be used for one-time thermal compression. In other words, the size of the pressure plate 52 corresponds to the size of the first film 10 (or the second film 20), and may be slightly larger or smaller as long as the range of the pressure plate 52 can completely cover the area to be pressed.
附帶一提，圖3的壓合板52於此剖面圖中為平整的，以施行一次性的熱壓合步驟；但是在另一種實施方式中，壓合板52’也可以依照需求而圖案化(例如在熱壓合過程中會朝向第一薄膜10或第二薄膜20的表面部分形成多個凹槽520)，如圖5示。因此在施行一次性的熱壓合步驟的時候，凹槽520所對應的部分即是不欲被壓合的地方。Incidentally, the plywood 52 of FIG. 3 is flat in this cross-sectional view to perform a one-time thermal compression step; however, in another embodiment, the plywood 52' may also be patterned as desired (eg, A plurality of grooves 520) may be formed toward the surface portion of the first film 10 or the second film 20 during the thermocompression bonding process, as shown in FIG. Therefore, when a one-time thermal compression step is performed, the portion corresponding to the groove 520 is a place where it is not desired to be pressed.
圖6為壓合板相對於第一薄膜或第二薄膜的尺寸較小，而沿著壓合方向前進以對第一薄膜、熱熔膠以及第二薄膜施行多次區域性的熱壓合的示意圖。請參考圖6，在另一種實施方式中，壓合板54的尺寸較小，因此進行圖案化式的熱壓合的方法為使熱壓合設備50的壓合板54沿著壓合方向前進，以對第一薄膜10、熱熔膠30以及第二薄膜20進行多次區域性的熱壓合，同樣也可以達到形成如圖4示的鍵盤薄膜100的目的。更進一步來說，例如壓合板54在圖6的位置處，先沿著向下的箭頭向下施加熱壓合，然後壓合板54回到原來的高度之後，再沿著朝右的箭頭向右方前進，壓合板54重複上述的步驟對下一個區域進行熱壓合。藉由這個方式，可以僅對欲熱壓合的區域進行熱壓合，而跳過不欲熱壓合的區域。相較於如圖5的壓合板52’，圖6的壓合板54不需要設置凹槽520。6 is a schematic view showing that the size of the pressure plate relative to the first film or the second film is small, and advancing along the pressing direction to perform multiple regional thermocompression bonding on the first film, the hot melt adhesive, and the second film. . Referring to FIG. 6 , in another embodiment, the size of the pressure plate 54 is small, so the method of performing the pattern thermal compression is to advance the pressing plate 54 of the thermal compression device 50 along the pressing direction. The first film 10, the hot melt adhesive 30, and the second film 20 are subjected to a plurality of regional thermocompression bonding, and the purpose of forming the keyboard film 100 shown in FIG. 4 can also be achieved. Further, for example, at the position of FIG. 6, the pressure plate 54 is first applied with a downward pressure along the downward arrow, and then the pressure plate 54 is returned to the original height, and then the right arrow is turned to the right. As the square advances, the plywood 54 repeats the above steps to thermally press the next zone. By this means, it is possible to perform thermocompression only on the region to be thermocompression-bonded, and to skip the region where the thermocompression is not desired. The plywood 54 of Fig. 6 does not need to be provided with a recess 520 as compared to the plywood 52' of Fig. 5.
上述如圖3及圖6所示的熱壓合方式為在被固定住高度或位置的平台(未繪示)上由下而上堆疊第一薄膜10、熱熔膠30及第二薄膜20，且從第二薄膜20的上方進行單面熱壓合。圖7為對第一薄膜、熱熔膠及第二薄膜施行雙面熱壓合的示意圖。如圖7所示，其上承置有堆疊的第一薄膜10、熱熔膠30及第二薄膜20的平台或下方壓合板 56可與上方的壓合板52同時移動且相對靠近以進行壓合。附帶一提，經過熱壓合後而形成的鍵盤薄膜100可能會具有氣道102，如圖8示。The thermal compression bonding method shown in FIG. 3 and FIG. 6 is that the first film 10, the hot melt adhesive 30 and the second film 20 are stacked from bottom to top on a platform (not shown) fixed in height or position. And one side thermocompression is performed from above the second film 20. Fig. 7 is a schematic view showing double-sided thermocompression bonding of a first film, a hot melt adhesive and a second film. As shown in FIG. 7, the platform on which the stacked first film 10, the hot melt adhesive 30, and the second film 20 or the lower press plate 56 can be simultaneously moved and relatively close to the upper press plate 52 for pressing. . Incidentally, the keyboard film 100 formed by thermocompression may have an air passage 102 as shown in FIG.
上述所形成的鍵盤薄膜100適用於筆記型電腦，而鍵盤按鍵適於對應設置在於堆疊方向上重合的第一接點32及第二接點26上。而當鍵盤按鍵受到按壓時，第二接點26受壓而接觸第一接點32以電性導通。The keyboard film 100 formed above is suitable for a notebook computer, and the keyboard keys are adapted to be correspondingly disposed on the first contact 32 and the second contact 26 which are coincident in the stacking direction. When the keyboard button is pressed, the second contact 26 is pressed to contact the first contact 32 to be electrically connected.
另外，第二薄膜20上還設置有第一結構孔24，且熱熔膠30也設置有第二結構孔34，且在第一薄膜10、熱熔膠30以及第二薄膜20堆疊在一起時，第一結構孔24的正投影大致上重合於第二結構孔34。In addition, the second film 20 is further provided with a first structural hole 24, and the hot melt adhesive 30 is also provided with the second structural hole 34, and when the first film 10, the hot melt adhesive 30 and the second film 20 are stacked together The orthographic projection of the first structural aperture 24 substantially coincides with the second structural aperture 34.
上述的實施例中是經由熱壓合的方式使熱熔膠30直接形成為第一薄膜10以及第二薄膜20之間的絕緣膜層，但是在另一個實施例中，更可以是使用單獨的片材做為第一薄膜10以及第二薄膜20之間的絕緣膜層。In the above embodiment, the hot melt adhesive 30 is directly formed into an insulating film layer between the first film 10 and the second film 20 via thermocompression bonding, but in another embodiment, it is more preferable to use a separate film. The sheet serves as an insulating film layer between the first film 10 and the second film 20.
圖9為第二實施例的剖面示意圖。請參考圖9，也可以是於第一膜片10以及第二膜片20之間提供隔片40，其中在隔片40的上表面40a及下表面40b分別設置有熱熔膠30，然後將在高度方向上堆疊的第一膜片10、熱熔膠30、隔片40、熱熔膠30、第二膜片20進行熱壓合，以形成如圖9的鍵盤薄膜100’。Figure 9 is a schematic cross-sectional view showing a second embodiment. Referring to FIG. 9, a spacer 40 may be provided between the first diaphragm 10 and the second diaphragm 20, wherein the upper surface 40a and the lower surface 40b of the spacer 40 are respectively provided with a hot melt adhesive 30, and then The first film 10, the hot melt adhesive 30, the spacer 40, the hot melt adhesive 30, and the second film 20 stacked in the height direction are thermocompression bonded to form the keyboard film 100' of FIG.
綜上所述，在本發明的鍵盤薄膜的製作方法中，藉由熱熔膠的物理特性而讓在常溫下對位擺置的第一薄膜、熱熔膠(甚至隔片)以及第二薄膜彼此間在受到熱壓合前還不會黏附在一起，因此是在確認第一薄膜、熱熔膠以及第二薄膜的對位準確之後，才會施加熱壓合步驟，熱熔膠受熱而形變且具黏性，才會讓對位準確的第一薄膜、熱熔膠以及第二薄膜彼此黏附在一起。簡單來說，即是在施加熱壓合之前，互相疊置的第一薄膜、熱熔膠以及第二薄膜的對位是否準確都還可以視狀況調整，減少了因為對位不準確即黏附而後又撕開毀壞需報廢的材料，增加鍵盤薄膜的良率。In summary, in the manufacturing method of the keyboard film of the present invention, the first film, the hot melt adhesive (or even the separator) and the second film which are placed at a normal temperature by the physical properties of the hot melt adhesive are disposed. They do not stick together before being subjected to thermocompression bonding. Therefore, after confirming the alignment of the first film, the hot melt adhesive and the second film, the hot pressing step is applied, and the hot melt adhesive is deformed by heat. The adhesiveness is such that the first film, the hot melt adhesive and the second film which are accurately aligned are adhered to each other. In short, it is possible to adjust the alignment of the first film, the hot melt adhesive and the second film which are superposed on each other before applying the thermocompression, and it is also possible to adjust the condition according to the condition, thereby reducing the adhesion due to the inaccuracy of the alignment. Also tear and destroy the materials that need to be scrapped, increasing the yield of the keyboard film.
再者，相較於習知通常的作法是將圖案化防水膠直接印刷在第一薄膜及第二薄膜上，因為熱熔膠在室溫是呈固體狀，因此可以方便地擺置，且不需要如於薄膜上印刷防水膠時考慮薄膜上的圖案化電路層的線寬及印刷範圍。Moreover, compared with the conventional practice, the patterned waterproof adhesive is directly printed on the first film and the second film, because the hot melt adhesive is solid at room temperature, so it can be conveniently placed without It is desirable to consider the line width and printing range of the patterned circuit layer on the film when printing the waterproof adhesive on the film.
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明的精神和範圍內，當可作些許的更動與潤飾，故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.
10‧‧‧第一薄膜10‧‧‧First film
12‧‧‧第一圖案化電路層12‧‧‧First patterned circuit layer
14‧‧‧第一接點14‧‧‧First contact
20‧‧‧第二薄膜20‧‧‧Second film
22‧‧‧第二圖案化電路層22‧‧‧Second patterned circuit layer
24‧‧‧第一結構孔24‧‧‧First structural hole
26‧‧‧第二接點26‧‧‧second junction
30‧‧‧熱熔膠30‧‧‧Hot melt adhesive
32‧‧‧通孔32‧‧‧through hole
34‧‧‧第二結構孔34‧‧‧Second structural hole
40‧‧‧隔片40‧‧‧ spacer
40a‧‧‧上表面40a‧‧‧ upper surface
40b‧‧‧下表面40b‧‧‧ lower surface
50‧‧‧熱壓合設備50‧‧‧Hot press equipment
52、52’、54‧‧‧壓合板52, 52', 54‧‧‧ plywood
56‧‧‧平台或下方壓合板56‧‧‧ Platform or lower plywood
100、100’‧‧‧鍵盤薄膜100, 100'‧‧‧ keyboard film
102‧‧‧氣道102‧‧‧ airway
520‧‧‧凹槽520‧‧‧ Groove
圖1為第一薄膜、第二薄膜以及熱熔膠的平面示意圖。 圖2為將熱熔膠、第一薄膜以及第二薄膜疊置且互相對位的示意圖。 圖3為對第一薄膜、熱熔膠以及第二薄膜進行熱壓合的示意圖。 圖4為鍵盤薄膜的剖面示意圖。 圖5為壓合板的表面形成有凹槽的示意圖。 圖6為壓合板的尺寸較小，而沿著壓合方向前進以對第一薄膜、熱熔膠以及第二薄膜施行多次區域性的熱壓合的示意圖。 圖7為對第一薄膜、熱熔膠及第二薄膜施行雙面熱壓合的示意圖。 圖8為經過熱壓合後而形成的鍵盤薄膜的示意圖。 圖9為第二實施例的剖面示意圖。1 is a schematic plan view of a first film, a second film, and a hot melt adhesive. 2 is a schematic view showing the hot melt adhesive, the first film, and the second film stacked and aligned with each other. 3 is a schematic view showing thermal compression bonding of a first film, a hot melt adhesive, and a second film. 4 is a schematic cross-sectional view of a keyboard film. Fig. 5 is a schematic view showing a groove formed on the surface of the pressure plate. Fig. 6 is a schematic view showing that the size of the pressure-bonding plate is small and proceeds in the nip direction to perform a plurality of regional thermocompression bonding on the first film, the hot-melt adhesive, and the second film. Fig. 7 is a schematic view showing double-sided thermocompression bonding of a first film, a hot melt adhesive and a second film. Figure 8 is a schematic view of a keyboard film formed by thermocompression bonding. Figure 9 is a schematic cross-sectional view showing a second embodiment.
10‧‧‧第一薄膜 10‧‧‧First film
14‧‧‧第一接點 14‧‧‧First contact
20‧‧‧第二薄膜 20‧‧‧Second film
26‧‧‧第二接點 26‧‧‧second junction
30‧‧‧熱熔膠 30‧‧‧Hot melt adhesive
32‧‧‧通孔 32‧‧‧through hole
50‧‧‧熱壓合設備 50‧‧‧Hot press equipment
52‧‧‧壓合板 52‧‧‧Plywood
Claims (8)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104133161A TWI576881B (en) | 2015-10-08 | 2015-10-08 | Fabricating method of keyboard membrane |
| CN201510943584.0A CN106571259A (en) | 2015-10-08 | 2015-12-16 | Method for manufacturing keyboard film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104133161A TWI576881B (en) | 2015-10-08 | 2015-10-08 | Fabricating method of keyboard membrane |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI576881B true TWI576881B (en) | 2017-04-01 |
| TW201714195A TW201714195A (en) | 2017-04-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104133161A TWI576881B (en) | 2015-10-08 | 2015-10-08 | Fabricating method of keyboard membrane |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106571259A (en) |
| TW (1) | TWI576881B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200839823A (en) * | 2007-03-23 | 2008-10-01 | Jensin Intl Technology Corp | Membrane switch |
| CN202095176U (en) * | 2011-06-02 | 2011-12-28 | 宝利时(深圳)胶粘制品有限公司 | Plastic film for manufacturing multilayer circuit board |
| TW201344731A (en) * | 2012-04-27 | 2013-11-01 | Primax Electronics Ltd | Luminous keying module of handheld device |
| TW201415980A (en) * | 2012-10-08 | 2014-04-16 | Darfon Electronics Corp | Membrane manufacturing method and membrane thereof |
| CN103745859A (en) * | 2014-01-26 | 2014-04-23 | 昆山兴协和光电科技有限公司 | Thin-film switch and manufacturing method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103794396A (en) * | 2012-10-31 | 2014-05-14 | 英属盖曼群岛商科嘉国际股份有限公司台湾分公司 | Manufacturing method and structure of thin-film circuit of two-layer thin-film keyboard |
-
2015
- 2015-10-08 TW TW104133161A patent/TWI576881B/en active
- 2015-12-16 CN CN201510943584.0A patent/CN106571259A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200839823A (en) * | 2007-03-23 | 2008-10-01 | Jensin Intl Technology Corp | Membrane switch |
| CN202095176U (en) * | 2011-06-02 | 2011-12-28 | 宝利时(深圳)胶粘制品有限公司 | Plastic film for manufacturing multilayer circuit board |
| TW201344731A (en) * | 2012-04-27 | 2013-11-01 | Primax Electronics Ltd | Luminous keying module of handheld device |
| TW201415980A (en) * | 2012-10-08 | 2014-04-16 | Darfon Electronics Corp | Membrane manufacturing method and membrane thereof |
| CN103745859A (en) * | 2014-01-26 | 2014-04-23 | 昆山兴协和光电科技有限公司 | Thin-film switch and manufacturing method thereof |
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| TW201714195A (en) | 2017-04-16 |
| CN106571259A (en) | 2017-04-19 |
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