TWI574429B - Substrate trench processing tools and substrate trench processing device - Google Patents

Substrate trench processing tools and substrate trench processing device Download PDF

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TWI574429B
TWI574429B TW102134255A TW102134255A TWI574429B TW I574429 B TWI574429 B TW I574429B TW 102134255 A TW102134255 A TW 102134255A TW 102134255 A TW102134255 A TW 102134255A TW I574429 B TWI574429 B TW I574429B
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blade
tool
substrate
groove processing
moving
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TW201417330A (en
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山田充
曾山正信
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三星鑽石工業股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064Devices for the automatic drive or the program control of the machines
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67092Apparatus for mechanical treatment
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Milling, Broaching, Filing, Reaming, And Others (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Nonmetal Cutting Devices (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Description

基板之溝槽加工工具及基板用溝槽加工裝置 Groove processing tool for substrate and groove processing device for substrate

本發明係關於一種溝槽加工工具,尤其係關於一種由保持具保持,且用於在作為加工對象之基板上與保持具共同相對往返移動而於基板形成溝槽之基板之溝槽加工工具及具有溝槽加工工具之溝槽加工裝置。 The present invention relates to a groove processing tool, and more particularly to a groove processing tool which is held by a holder and used for reciprocating relative movement of a holder on a substrate as a processing object to form a groove on the substrate. A groove processing device having a groove processing tool.

薄膜太陽電池係例如藉由如專利文獻1所示之方法而製造。於該專利文獻1記載之製造方法中,藉由於玻璃等基板上形成由Mo膜所構成之下部電極膜,其後,於下部電極膜上形成溝槽而分割成短條狀。其次,於下部電極膜形成包含CIGS膜等黃銅礦構造化合物半導體膜之化合物半導體膜。然後,利用溝槽加工將該等半導體膜之一部分呈條紋狀地除去從而分割成短條狀,並以覆蓋該等之方式形成上部電極膜。最後,利用溝槽加工將上部電極膜之一部分呈條紋狀地剝離從而分割成短條狀。 The thin film solar cell is manufactured, for example, by the method as disclosed in Patent Document 1. In the manufacturing method described in Patent Document 1, a lower electrode film made of a Mo film is formed on a substrate such as glass, and then a groove is formed in the lower electrode film to be divided into short strips. Next, a compound semiconductor film containing a chalcopyrite structure compound semiconductor film such as a CIGS film is formed on the lower electrode film. Then, one of the semiconductor films is removed in a stripe shape by trench processing to be divided into strips, and the upper electrode film is formed to cover the film. Finally, one portion of the upper electrode film is peeled off in a stripe shape by groove processing to be divided into short strips.

作為如以上之步驟中之溝槽加工技術之一,使用利用金剛石等機械工具來除去薄膜之一部分之機械刻劃法。於該機械刻劃法中,為了可有效率地進行溝槽加工,而提出有專利文獻2所示之溝槽加工裝置。 As one of the groove processing techniques in the above steps, a mechanical scribing method using a mechanical tool such as diamond to remove a part of the film is used. In the mechanical scribing method, a groove processing device disclosed in Patent Document 2 has been proposed in order to efficiently perform groove processing.

專利文獻2之裝置於頭部可上下移動地安裝有工具保持具,進而,擺動構件可於規定之角度範圍內擺動地安裝於該工具保持具。於擺動構件保持有溝槽加工工具,擺動構件使去向移動時之前進切削姿勢與來向移動時之後進切削姿勢反轉。於溝槽加工工具中,於去向移動側及 來向移動側設置有對稱之前部刀尖及後部刀尖。而且,擺動構件處於去向移動(前進)切削姿勢時前部刀尖與太陽電池基板接觸,處於來向移動(後進)切削姿勢時後部刀尖與太陽電池基板接觸。 In the device of Patent Document 2, a tool holder is attached to the head so as to be movable up and down, and further, the swing member is swingably attached to the tool holder within a predetermined angular range. The oscillating member holds a groove machining tool, and the oscillating member reverses the forward cutting posture and the backward cutting posture when moving in the forward direction. In the groove processing tool, on the moving side and The symmetrical front and rear tips are provided to the moving side. Further, when the swinging member is in the forward moving (advancing) cutting posture, the front cutting edge is in contact with the solar cell substrate, and the rear cutting edge is in contact with the solar cell substrate in the backward moving (backward) cutting posture.

[先行技術文獻] [Advanced technical literature] [專利文獻] [Patent Literature]

[專利文獻1]日本實開昭63-16439號公報 [Patent Document 1] Japanese Unexamined Gazette No. 63-16439

[專利文獻2]日本特開2012-146954號公報 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2012-146954

當使用如以上之溝槽加工工具進行溝槽加工時,可有效率地進行溝槽加工。然而,當工具兩端之刀尖逐漸磨耗時,刀之移動方向之寬度越磨耗越變寬,無法長期維持良好之加工品質。 When the groove processing is performed using the groove processing tool as described above, the groove processing can be efficiently performed. However, when the tip of the tool is gradually worn, the width of the moving direction of the knife becomes wider and the wear becomes wider, and the good processing quality cannot be maintained for a long period of time.

因此,本案發明者開發了因磨耗而導致之刀之寬度之變化較少、且可實現長壽命化之溝槽加工工具,並已提出申請(日本專利特願2011-212148)。該溝槽加工工具中,工具之刀尖部連續地形成為形成於去向移動側之前端之第1刀、及形成於來向移動側之前端之第2刀。此處,於第1刀與第2刀之間,不存在未形成有刀之部分。因此,當第1刀磨耗時會削去第2刀,再者,相反地當第2刀磨耗時會削去第1刀。因此,即使第1刀及第2刀磨耗,亦可抑制各刀之寬度變化。 Therefore, the inventors of the present invention have developed a groove processing tool which has a small change in the width of the blade due to abrasion and which can achieve a long life, and has been filed (Japanese Patent Application No. 2011-212148). In the groove machining tool, the tip end portion of the tool is continuously formed as a first blade formed on the front end of the moving side and a second blade formed on the front side toward the moving side. Here, between the first blade and the second blade, there is no portion where the blade is not formed. Therefore, when the first blade is worn, the second blade is scraped off, and conversely, when the second blade is worn, the first blade is scraped off. Therefore, even if the first blade and the second blade are worn, the change in the width of each blade can be suppressed.

此處,第1刀及第2刀相對於移動方向以相同角度向工具本體側傾斜。該傾斜角度與工具之擺動角度相等。因此,當自去向移動時向來向移動時之移動方向切換時,工具擺動傾斜角度之兩倍。因此,於傾斜角度較大之情形時,自一傾斜角度向另一傾斜角度移動之時間(即擺動時 間)變長,於該時間內無法進行準確之溝槽加工。再者,工具擺動期間需要使工具之移動速度成為低速,而導致花費加工時間。 Here, the first blade and the second blade are inclined toward the tool body side at the same angle with respect to the moving direction. The tilt angle is equal to the swing angle of the tool. Therefore, the tool swings twice as much as the tilt angle when moving from the direction of movement to the moving direction when moving. Therefore, when the tilt angle is large, the time from one tilt angle to the other tilt angle (ie, when swinging) The length is long, and accurate groove processing cannot be performed during this time. Furthermore, during the tool swing, it is necessary to make the moving speed of the tool low, which results in processing time.

另一方面,若使傾斜角度變小,則利用一刀進行加工時所產生之切削屑無法自另一刀一側順利地排出。因此,存在因切削屑而導致加工品質降低之情形。 On the other hand, if the inclination angle is made small, the chips generated when machining with one blade cannot be smoothly discharged from the other blade side. Therefore, there is a case where the processing quality is lowered due to the chips.

本發明之課題在於:當使工具相對於基板相對地往返移動而進行溝槽加工時,可使工具之擺動角度較小,且使切削屑良好地排出從而使加工品質穩定。 An object of the present invention is to reduce the swing angle of the tool and to smoothly discharge the chips to stabilize the processing quality when the tool is reciprocated relative to the substrate to perform the groove processing.

本發明之第1方面中之基板之溝槽加工工具係由保持具保持,且用於在作為加工對象之基板上與保持具共同相對地往返移動而於基板形成溝槽之工具,且具有由保持具保持之工具本體、及形成於工具本體之前端部之刀尖部。刀尖部具有第1刀、第2刀、及退避部。第1刀形成於工具本體之前端部,且形成於移動方向之去向移動側之前端。第2刀形成於來向移動側之前端。退避部形成於第1刀與第2刀之間,且以向工具本體側凹陷之方式形成。 The groove processing tool for a substrate according to the first aspect of the present invention is a tool for holding a groove on a substrate, and a tool for forming a groove on the substrate, which is held by a holder on a substrate to be processed and which is reciprocally opposed to the holder. The tool body that holds the tool holder and the tip end portion that is formed at the front end of the tool body are held. The tip end portion has a first blade, a second blade, and a retracting portion. The first blade is formed at a front end portion of the tool body, and is formed at a front end of the moving direction on the moving side. The second knife is formed at the front end of the coming side toward the moving side. The relief portion is formed between the first blade and the second blade, and is formed to be recessed toward the tool body side.

此處,由於在第1刀與第2刀之間形成有退避部,因此即便使第1刀及第2刀之傾斜角度變小亦可經由退避部而良好地排出切削屑。因此,當使工具往返移動而進行溝槽加工時,可於移動方向之切換時提高加工品質,另外可縮短加工時間。 In this case, since the retracting portion is formed between the first blade and the second blade, even if the inclination angles of the first blade and the second blade are made small, the chips can be favorably discharged through the retracting portion. Therefore, when the tool is moved back and forth to perform the groove processing, the processing quality can be improved at the time of switching the moving direction, and the processing time can be shortened.

本發明之第2方面中之基板之溝槽加工工具係如第1方面之溝槽加工工具,其中第1刀及第2刀均相對於與工具本體之長度方向之軸正交之基準面,以朝向移動方向離開基準面之方式傾斜。 The groove processing tool for a substrate according to the second aspect of the present invention, wherein the first blade and the second blade are each a reference plane orthogonal to an axis of a longitudinal direction of the tool body, Tilting away from the reference plane in the direction of movement.

藉由使第1刀及第2刀傾斜,而於工具擺動時使各刀之整個面與基板抵接。因此,可有效率地進行加工。再者,加之於第1刀與第2 刀之間形成有退避部,從而即使各刀磨耗亦可使刀之狀態之變化較小。 By tilting the first blade and the second blade, the entire surface of each blade is brought into contact with the substrate when the tool is swung. Therefore, the processing can be performed efficiently. Furthermore, plus the first knife and the second A relief portion is formed between the knives, so that even if the knives wear, the change in the state of the knives can be made small.

本發明之第3方面中之基板之溝槽加工工具係如第2方面之溝槽加工工具,其中退避部具有第1退避面與第2退避面。第1退避面形成於第1刀之第2刀側,且相對於基準面以朝向第2刀側離開基準面之方式傾斜。第2退避面形成於第2刀之第1刀側,且相對於基準面以朝向第1刀側離開基準面之方式傾斜。 A groove processing tool for a substrate according to a third aspect of the invention is the groove machining tool of the second aspect, wherein the relief portion has a first retracting surface and a second retracting surface. The first evacuation surface is formed on the second blade side of the first blade, and is inclined with respect to the reference surface so as to be apart from the reference surface toward the second blade side. The second evacuation surface is formed on the first blade side of the second blade, and is inclined with respect to the reference surface so as to be apart from the reference surface toward the first blade side.

藉由使各退避面之傾斜角度較大,而可更加順利地排出切削屑。 By making the angle of inclination of each of the retreating surfaces large, the chips can be discharged more smoothly.

本發明之第4方面中之基板之溝槽加工工具係如第3方面之溝槽加工工具,其中退避部之傾斜角度大於各刀之傾斜角度。 A groove machining tool for a substrate according to a fourth aspect of the invention is the groove machining tool of the third aspect, wherein the inclination angle of the relief portion is larger than the inclination angle of each of the blades.

此處,使刀之傾斜角度、即工具之擺動角度較小從而可提高移動方向切換時之加工品質,再者,使退避部之傾斜角度較大從而可使切削屑之排出順利。 Here, the inclination angle of the blade, that is, the swing angle of the tool is made small, so that the processing quality at the time of switching the movement direction can be improved, and further, the inclination angle of the escape portion is made large, and the discharge of the chips can be smoothly performed.

本發明之第5方面中之基板之溝槽加工工具係如第2至第4方面中任一項之溝槽加工工具,其中退避部之沿基準面之方向之長度比第1刀及第2刀之沿基準面之長度長。 The groove processing tool according to any one of the second to fourth aspect, wherein the length of the escape portion in the direction of the reference surface is longer than the first blade and the second The length of the knife along the reference plane is long.

此處,由於退避部之移動方向之長度形成為相對較長,因此可使切削屑之排出更加順利。 Here, since the length of the moving direction of the retracting portion is formed to be relatively long, the discharge of the chips can be made smoother.

本發明之第6方面中之基板之溝槽加工工具係如第2至第5方面中任一項之溝槽加工工具,其中工具本體由擺動自如地支承於保持具之擺動構件支承,且第1刀及第2刀之傾斜角度與擺動構件之擺動角度相等。 The groove processing tool according to any one of the second to fifth aspect, wherein the tool body is supported by the swinging member supported by the holder in a swingable manner, and The inclination angle of the 1 knife and the 2nd knife is equal to the swing angle of the swinging member.

此處,分別於去向移動時及來向移動時,各刀之寬度整體與基板接觸,從而可有效率地進行加工。 Here, the width of each blade is entirely in contact with the substrate when moving in the forward direction and in the forward direction, so that the processing can be performed efficiently.

本發明之第7方面中之基板之溝槽加工工具係如第1至第6 方面中任一項之溝槽加工工具,其中刀尖部係以移動方向之寬度越朝向前端越變窄之方式,傾斜且對稱地形成有相對向之去向移動側之側面與來向移動側之側面。 The groove processing tool for a substrate according to the seventh aspect of the present invention is the first to sixth The groove processing tool according to any one of the preceding claims, wherein the cutting edge portion is formed to have a side opposite to the moving side and a side to the moving side obliquely and symmetrically in such a manner that the width of the moving direction becomes narrower toward the front end. .

此處,較理想為刀尖部之移動方向之寬度全部相同。於該情形時,即使第1刀及第2刀磨耗,移動方向之寬度之變化亦較小。 Here, it is preferable that the widths of the blade tips are all the same in the moving direction. In this case, even if the first blade and the second blade are worn, the change in the width of the moving direction is small.

然而,通常,刀尖部之寬度非常小,若使較小寬度之刀尖部變長,則強度會降低,且加工中破損之可能性變高。 However, in general, the width of the tip portion is extremely small, and if the tip portion having a small width is made long, the strength is lowered and the possibility of breakage during processing becomes high.

因此,於該第7方面之工具中,刀尖部係以前端較細,且越離開前端越變粗之方式形成。因此,可抑制強度之降低,並且可抑制因磨耗而導致之寬度變化從而可實現長壽命化。 Therefore, in the tool of the seventh aspect, the tip end portion is formed such that the tip end is thinner and becomes thicker as it goes away from the tip end. Therefore, it is possible to suppress a decrease in strength, and it is possible to suppress a change in width due to abrasion and to achieve a long life.

本發明之第8方面中之基板之溝槽加工工具係如第1至第7方面中任一項之溝槽加工工具,其中刀尖部之與移動方向正交之方向之寬度較工具本體之該方向之寬度窄。 The groove processing tool of the substrate according to any one of the first to seventh aspect, wherein the width of the blade tip portion orthogonal to the moving direction is larger than the tool body The width of this direction is narrow.

刀尖部之與移動方向正交之方向之寬度需要根據加工之溝槽之寬度尺寸而設定。而且,通常溝槽寬度尺寸非常窄。另一方面,由於工具本體安裝於保持具上,再者,為了確保強度,因此需要一定之寬度。 The width of the blade tip in the direction orthogonal to the direction of movement needs to be set according to the width dimension of the groove being machined. Moreover, the groove width is usually very narrow. On the other hand, since the tool body is attached to the holder, in addition, in order to secure strength, a certain width is required.

因此,於該溝槽加工工具中,使刀尖部之與移動方向正交之方向之寬度較窄,另一方面使工具本體之該方向之寬度較寬。 Therefore, in the groove processing tool, the width of the blade tip portion in the direction orthogonal to the moving direction is narrowed, and on the other hand, the width of the tool body in the direction is wide.

本發明之第9方面中之基板用溝槽加工裝置係用於在基板上加工溝槽之裝置,且具備載置基板之載台、頭部、及移動機構。頭部配置於載台之上方,且具有:安裝有第1至第8方面中任一項之溝槽加工工具之保持具、及用於使保持具移動於上下方向之驅動部。移動機構使頭部於與載台之載置面平行之面內,相對於載台而相對地移動。 A groove processing device for a substrate according to a ninth aspect of the invention is the device for processing a groove on a substrate, and includes a stage on which the substrate is placed, a head, and a moving mechanism. The head is disposed above the stage, and has a holder to which the groove processing tool according to any one of the first to eighth aspects is attached, and a driving unit for moving the holder in the vertical direction. The moving mechanism relatively moves the head in a plane parallel to the mounting surface of the stage with respect to the stage.

如以上之本發明,於進行往返移動而可進行溝槽加工之溝槽 加工工具,可使工具之擺動角度較小,且可良好地排出切削屑從而可使加工品質穩定。 According to the above invention, the trench can be grooved for reciprocating movement The processing tool can make the tool have a small swing angle and can discharge the chips well, so that the processing quality can be stabilized.

2‧‧‧工具 2‧‧‧ Tools

3‧‧‧頭部 3‧‧‧ head

17‧‧‧保持具 17‧‧‧Holding

18‧‧‧擺動構件 18‧‧‧Wobble member

36‧‧‧工具本體 36‧‧‧Tool body

37‧‧‧刀尖部 37‧‧‧The tip of the knife

38a、38b‧‧‧刀 38a, 38b‧‧‧ knife

39‧‧‧退避部 39‧‧‧Retreating Department

39a、39b‧‧‧退避面 39a, 39b‧‧‧ retreating surface

圖1係安裝有本發明之一實施形態中之溝槽加工工具之溝槽加工裝置之外觀立體圖。 Fig. 1 is an external perspective view of a groove processing apparatus to which a groove processing tool according to an embodiment of the present invention is attached.

圖2係溝槽加工裝置之頭部之前視圖。 Figure 2 is a front elevational view of the head of the groove processing apparatus.

圖3係用於說明溝槽加工時之動作之示意圖。 Fig. 3 is a schematic view for explaining the action at the time of groove processing.

圖4係溝槽加工工具之前視圖及側視圖。 Figure 4 is a front view and a side view of the groove machining tool.

圖5係放大地表示溝槽加工時之刀之姿勢之圖。 Fig. 5 is an enlarged view showing the posture of the blade during the groove processing.

將安裝有本發明之一實施形態中之溝槽加工工具之集成型薄膜太陽電池用溝槽加工裝置之外觀立體圖示於圖1中。 An external perspective view of a groove processing apparatus for an integrated thin film solar cell to which a groove processing tool according to an embodiment of the present invention is attached is shown in Fig. 1.

[溝槽加工裝置之整體構成] [The overall composition of the groove processing device]

該裝置具備:載台1,其載置太陽電池基板W;頭部3,其安裝有溝槽加工工具(以下僅記為工具)2;及相機4與監視器5各兩個。 This apparatus includes a stage 1 on which a solar cell substrate W is placed, a head 3 to which a groove processing tool (hereinafter simply referred to as a tool) 2, and two cameras 4 and a monitor 5 are attached.

載台1可於水平面內沿圖1之Y方向移動。再者,載台1可於水平面內以任意之角度旋轉。又,於圖1中,表示頭部3之概略外觀,頭部3之詳細情形將於下文中敍述。 The stage 1 is movable in the horizontal direction of FIG. 1 in the horizontal direction. Furthermore, the stage 1 can be rotated at any angle in the horizontal plane. Further, in Fig. 1, the outline appearance of the head portion 3 is shown, and the details of the head portion 3 will be described later.

頭部3可利用移動機構6而於載台1之上方沿X、Y方向移動。又,如圖1所示,X方向係於水平面內與Y方向正交之方向。移動機構6具有:一對支承柱7a、7b、跨及一對支承柱7a、7b間而設置之導桿8、及驅動形成於導桿8之導件9之馬達10。頭部3可沿導件9如上述般於X 方向上移動。 The head 3 is movable in the X and Y directions above the stage 1 by the moving mechanism 6. Further, as shown in FIG. 1, the X direction is a direction orthogonal to the Y direction in the horizontal plane. The moving mechanism 6 has a pair of support columns 7a and 7b, a guide rod 8 provided between the pair of support columns 7a and 7b, and a motor 10 for driving the guide 9 formed on the guide rod 8. The head 3 can be along the guide 9 as described above in the X Move in the direction.

兩個相機4分別固定於台座12上。各台座12可沿設置於支承台13上之於X方向上延伸之導件14移動。兩個相機4可進行上下移動,利用各相機4拍攝到之影像被顯示於對應之監視器5中。 The two cameras 4 are fixed to the pedestal 12, respectively. Each of the pedestals 12 is movable along a guide 14 that is disposed on the support table 13 and extends in the X direction. The two cameras 4 are movable up and down, and the images captured by the respective cameras 4 are displayed on the corresponding monitor 5.

[頭部] [head]

將頭部3抽出而表示於圖2中。頭部3具有板狀之基座16、保持具17、擺動構件18、及氣缸19。 The head 3 is taken out and shown in FIG. The head 3 has a plate-shaped base 16, a holder 17, a swinging member 18, and a cylinder 19.

保持具17經由未圖示之軌道而相對於基座16沿上下方向滑動自如地支承。保持具17具有保持具本體22、及固定於保持具本體22之表面上之支承構件23。保持具本體22形成為板狀,且於上部具有開口22a。支承構件23為橫方向較長之矩形狀之構件,且於內部形成有供擺動構件18插通之貫通孔23a。 The holder 17 is slidably supported in the vertical direction with respect to the susceptor 16 via a rail (not shown). The holder 17 has a holder body 22 and a support member 23 fixed to the surface of the holder body 22. The holder body 22 is formed in a plate shape and has an opening 22a at the upper portion. The support member 23 is a rectangular member that is long in the lateral direction, and has a through hole 23a through which the swinging member 18 is inserted.

擺動構件18由保持具本體22及支承構件23擺動自如地支承。擺動構件18具有下部之工具安裝部24、及自工具安裝部24向上方延伸而形成之延長部25。 The swinging member 18 is rotatably supported by the holder main body 22 and the support member 23. The swinging member 18 has a lower tool mounting portion 24 and an extended portion 25 formed to extend upward from the tool mounting portion 24.

於工具安裝部24形成有溝槽,於該溝槽中插入有工具2,進而利用固定板24a而將工具2固定於溝槽內。 A groove is formed in the tool mounting portion 24, and the tool 2 is inserted into the groove, and the tool 2 is fixed in the groove by the fixing plate 24a.

於延長部25之下部,於水平方向上形成有貫通於與溝槽形成方向正交之方向之孔25a。而且,擺動構件18以貫通該孔25a之銷26為中心而擺動自如。銷26由保持具本體22與支承構件23支承。 A hole 25a penetrating in a direction orthogonal to the groove forming direction is formed in the lower portion of the extension portion 25 in the horizontal direction. Further, the swinging member 18 is swingable about the pin 26 penetrating the hole 25a. The pin 26 is supported by the holder body 22 and the support member 23.

於延長部25之上端部25b之左右兩側,設置有一對限制構件27a、27b。如圖3所示,各限制構件27a、27b具有固定於保持具本體22上之筒狀構件28a、28b、及插入筒狀構件28a、28b之內部之彈簧29a、29b。而且,藉由使各彈簧29a、29b之前端抵接於延長部25之上端部25b,而將擺動構件18維持於如圖2及圖3(b)所示之中立位置上。再者,擺動構件 18擺動而按壓任一彈簧29a、29b,使延長部25之上端部25b抵接於筒狀構件28a、28b,由此限制擺動角度。於該實施形態中,設定為擺動構件18之擺動角度於±3°之角度範圍內受到限制,但較佳於±7°以內受到限制。 A pair of restriction members 27a and 27b are provided on the left and right sides of the upper end portion 25b of the extension portion 25. As shown in Fig. 3, each of the restricting members 27a and 27b has cylindrical members 28a and 28b fixed to the holder main body 22, and springs 29a and 29b inserted into the inside of the cylindrical members 28a and 28b. Further, by abutting the front ends of the springs 29a and 29b against the upper end portion 25b of the extension portion 25, the swinging member 18 is maintained at the neutral position as shown in Figs. 2 and 3(b). Furthermore, the swing member 18 swings and presses any of the springs 29a and 29b, and the upper end portion 25b of the extension portion 25 abuts against the tubular members 28a and 28b, thereby restricting the swing angle. In this embodiment, the swing angle of the swinging member 18 is set to be within an angle range of ±3°, but it is preferably limited to within ±7°.

如圖2所示,氣缸19固定於缸體支承構件30之上表面上。缸體支承構件30配置於保持具17之上部,且固定於基座16上。於缸體支承構件30中形成有貫通於上下方向之孔,氣缸19之活塞桿(未圖示)貫通於該貫通孔中,且桿前端連結於保持具17。 As shown in FIG. 2, the cylinder 19 is fixed to the upper surface of the cylinder supporting member 30. The cylinder support member 30 is disposed on the upper portion of the holder 17 and is fixed to the base 16. A hole penetrating in the vertical direction is formed in the cylinder support member 30, and a piston rod (not shown) of the cylinder 19 penetrates through the through hole, and the rod tip is coupled to the holder 17.

再者,於基座16之上部設置有彈簧支承構件31。於彈簧支承構件31與保持具17之間設置有彈簧32,利用彈簧32而對保持具17向上方施力。利用該彈簧32而可大致抵消保持具17之自重。 Further, a spring supporting member 31 is provided on the upper portion of the susceptor 16. A spring 32 is provided between the spring support member 31 and the holder 17, and the holder 33 is biased upward by the spring 32. The self-weight of the holder 17 can be substantially offset by the spring 32.

於保持具17之左右兩側,設置有一對空氣供給部34a、34b。一對空氣供給部34a、34b均為相同構成,分別具有接頭35與空氣噴嘴36。 A pair of air supply portions 34a and 34b are provided on the left and right sides of the holder 17. Each of the pair of air supply portions 34a and 34b has the same configuration, and has a joint 35 and an air nozzle 36, respectively.

[工具] [tool]

於圖4中表示工具2之詳細情形。圖4(a)為工具2之前視圖,該圖(b)為其側視圖。再者,圖5為刀尖部之部分放大圖,(a)表示中立時之姿勢,(b)表示向右方向移動時之姿勢,(c)表示向左方向移動時之姿勢。 The details of the tool 2 are shown in FIG. Figure 4 (a) is a front view of the tool 2, and Figure (b) is a side view thereof. FIG. 5 is a partial enlarged view of the blade edge portion, wherein (a) shows the posture in the neutral direction, (b) shows the posture when moving in the right direction, and (c) shows the posture when moving in the left direction.

工具2具有由保持具17保持之工具本體36、及形成於工具本體36之前端部之刀尖部37。 The tool 2 has a tool body 36 held by a holder 17 and a tip end portion 37 formed at a front end portion of the tool body 36.

如圖5所示,於刀尖部37之前端,具有形成於移動方向之兩側之第1刀38a及第2刀38b、以及形成於該等刀38a、38b之間之退避部39。此處,第1刀38a係用於在去向移動時進行溝槽加工之刀,第2刀38b係用於在來向移動時進行溝槽加工之刀。 As shown in Fig. 5, at the front end of the cutting edge portion 37, there are a first blade 38a and a second blade 38b formed on both sides in the moving direction, and a retracting portion 39 formed between the blades 38a and 38b. Here, the first blade 38a is a blade for performing groove processing when moving in the forward direction, and the second blade 38b is a blade for performing groove processing when moving in the forward direction.

如圖4及圖5所示,刀尖部37之移動方向之寬度越朝向前端越變窄(於該例中,刀之前端之寬度為0.1mm)。即,刀尖部37之相對 向之去向移動側之側面37a與來向移動側之側面37b傾斜且對稱地形成。兩側面37a、37b之相對於基準面S之傾斜角度α1(參照圖4(a))作為一例為73度,刀尖部37之前端部之角度α2作為一例為34度。又,基準面S係與工具2之長度方向之軸N正交之平面。 As shown in FIGS. 4 and 5, the width of the blade edge portion 37 in the moving direction is narrower toward the tip end (in this example, the width of the front end of the blade is 0.1 mm). That is, the relative position of the tip portion 37 The side surface 37a to the moving side and the side surface 37b to the moving side are inclined and symmetrically formed. The inclination angle α1 (see FIG. 4( a )) of the both side faces 37 a and 37 b with respect to the reference plane S is 73 degrees as an example, and the angle α2 of the front end portion of the blade edge portion 37 is 34 degrees as an example. Further, the reference plane S is a plane orthogonal to the axis N of the tool 2 in the longitudinal direction.

如圖5(a)所示,第1刀38a及第2刀38b均相對於基準面S以朝向移動方向離開基準面S之方式傾斜。第1刀38a及第2刀38b之傾斜角度β1作為一例為3度。該傾斜角度β1設定為與擺動構件18之擺動角度β3相等。因此,於加工時,第1刀38a及第2刀38b均成為刀尖面與載台1之載置面(基板表面)平行,從而使各刀38a、38b之整個面抵接於基板表面。再者,於該例中,各刀38a、38b之移動方向之寬度W1均為0.01mm。 As shown in FIG. 5( a ), both the first blade 38 a and the second blade 38 b are inclined with respect to the reference plane S so as to be apart from the reference plane S in the moving direction. The inclination angle β1 of the first blade 38a and the second blade 38b is, for example, 3 degrees. This inclination angle β1 is set to be equal to the swing angle β3 of the swinging member 18. Therefore, at the time of processing, both the first blade 38a and the second blade 38b are parallel to the mounting surface (substrate surface) of the stage 1 so that the entire surfaces of the respective blades 38a and 38b abut against the surface of the substrate. Further, in this example, the width W1 of the moving direction of each of the blades 38a and 38b is 0.01 mm.

退避部39以於移動方向上於第1刀38a與第2刀38b之間向工具本體36側(圖4及圖5中為上方)凹陷之方式形成。具體而言,退避部39具有第1退避面39a及第2退避面39b。第1退避面39a形成於第1刀38a之第2刀38b側,且相對於基準面S以朝向第2刀38b側離開基準面S之方式傾斜。再者,第2退避面39b形成於第2刀38b之第1刀38a側,且相對於基準面S以朝向第1刀38a側離開基準面S之方式傾斜。而且,各退避面39a、39b之傾斜角度β2大於各刀38a、38b之傾斜角度β1,作為一例為14度。再者,於該例中,退避部39之移動方向之寬度W2為0.08mm。 The relief portion 39 is formed to be recessed toward the tool body 36 side (upward in FIGS. 4 and 5 ) between the first blade 38 a and the second blade 38 b in the moving direction. Specifically, the evacuation unit 39 has a first evacuation surface 39a and a second evacuation surface 39b. The first evacuation surface 39a is formed on the second blade 38b side of the first blade 38a, and is inclined with respect to the reference surface S so as to be apart from the reference surface S toward the second blade 38b side. In addition, the second evacuation surface 39b is formed on the side of the first blade 38a of the second blade 38b, and is inclined with respect to the reference plane S so as to be apart from the reference plane S toward the first blade 38a side. Further, the inclination angle β2 of each of the escape faces 39a and 39b is larger than the inclination angle β1 of each of the blades 38a and 38b, and is 14 degrees as an example. Further, in this example, the width W2 of the moving direction of the escape portion 39 is 0.08 mm.

再者,如圖4(b)所示,刀尖部37與之移動方向正交之方向之寬度W3形成為較工具本體36之該方向之寬度窄。該方向之刀尖部37之寬度遍及全長相同,於該例中為0.04~0.380mm。 Further, as shown in FIG. 4(b), the width W3 of the blade edge portion 37 in the direction orthogonal to the moving direction is formed to be narrower than the width of the tool body 36 in the direction. The width of the tip end portion 37 in this direction is the same throughout the entire length, and is 0.04 to 0.380 mm in this example.

又,工具本體36之刀尖部37側之部分如圖4(b)所示,以與移動方向正交之方向之寬度越接近刀尖部37越變窄之方式傾斜。 Further, as shown in FIG. 4(b), the portion of the tool body 36 on the blade edge portion 37 is inclined such that the width in the direction orthogonal to the moving direction becomes narrower as the blade edge portion 37 becomes narrower.

總結以上,作為一實施例之刀尖部37之各規格如下所述。 In summary, the specifications of the tip end portion 37 as an embodiment are as follows.

α1:73° 11:73°

α2:34° 22:34°

β1:3°(=擺動構件之擺動角度β3) 11:3° (=swing angle β3 of the oscillating member)

β2:14° 22:14°

W1:0.01mm W1: 0.01mm

W2:0.08mm W2: 0.08mm

W3:0.04~0.380mm W3: 0.04~0.380mm

[溝槽加工動作] [groove processing action]

於使用如以上之裝置對薄膜太陽電池基板進行溝槽加工之情形時,利用移動機構6使頭部3移動並且使載台1移動,使用相機4及監視器5,使工具2位於要形成溝槽之預定線上。 When the thin film solar cell substrate is grooved using the above apparatus, the moving mechanism 6 is used to move the head 3 and the stage 1 is moved, and the camera 4 and the monitor 5 are used to position the tool 2 to form a groove. The predetermined line of the tank.

進行如以上之位置對準後,驅動氣缸19使保持具17及擺動構件18下降,從而使工具2之前端接觸薄膜。此時之工具2之對於薄膜之加壓力係藉由供給至氣缸19之氣壓而調整。 After the alignment as described above, the cylinder 19 is driven to lower the holder 17 and the swinging member 18 so that the front end of the tool 2 contacts the film. At this time, the pressing force of the tool 2 for the film is adjusted by the air pressure supplied to the cylinder 19.

其次,驅動馬達10,使頭部3沿溝槽加工預定線掃描。將此時之擺動構件18及工具2之姿勢模式性地表示於圖3及圖5中。 Next, the motor 10 is driven to scan the head 3 along the groove processing predetermined line. The postures of the swinging member 18 and the tool 2 at this time are schematically shown in FIGS. 3 and 5.

於去向移動時(於圖3中為向右側移動時),如圖3(a)及圖5(b)所示,利用第1刀38a與基板上之薄膜之接觸阻力,而使擺動構件18以銷26為中心順時針擺動。該擺動藉由擺動構件18之上端部25b抵接於右側之筒狀構件28a而受到限制。因此,工具2保持如圖3(a)及圖5(b)所示之傾斜姿勢,於第1刀38a抵接於基板上之薄膜,且第2刀38b未抵接於基板之表面之狀態下向+M方向移動,從而形成溝槽。 When moving in the forward direction (when moving to the right side in FIG. 3), as shown in FIGS. 3(a) and 5(b), the swinging member 18 is made by the contact resistance of the first blade 38a with the film on the substrate. The clock 26 is pivoted clockwise. This swing is restricted by the upper end portion 25b of the swinging member 18 abutting against the right cylindrical member 28a. Therefore, the tool 2 is held in the inclined posture as shown in FIGS. 3(a) and 5(b), and the first blade 38a abuts against the film on the substrate, and the second blade 38b does not abut against the surface of the substrate. Moves down in the +M direction to form a groove.

此後,使頭部3相對於基板相對地移動,使工具2移動至接下來應下降之溝槽加工預定線上。然後,與上述同樣地,將工具2抵壓於基板上之薄膜上,沿與上述為相反之方向移動頭部3。 Thereafter, the head 3 is relatively moved relative to the substrate, and the tool 2 is moved to the groove processing planned line which should be lowered next. Then, in the same manner as described above, the tool 2 is pressed against the film on the substrate, and the head portion 3 is moved in the opposite direction to the above.

於該來向移動時(於圖3中為向左側移動時),如圖3(c)及圖5(c)所示,利用第2刀38b與基板上之薄膜之接觸阻力,而使擺動構件18以銷26為中心逆時針地擺動。該擺動藉由擺動構件18之上端部25b抵接於左側之筒狀構件28b而受到限制。因此,工具2保持如圖3(c)及圖5(c)所示之傾斜姿勢,於第2刀38b抵接於基板上之薄膜,且第1刀38a未抵接於基板之表面之狀態下向-M方向移動,從而形成溝槽。 When the movement is moved (in the case of moving to the left in FIG. 3), as shown in FIGS. 3(c) and 5(c), the swinging member is made by the contact resistance of the second blade 38b with the film on the substrate. 18 swings counterclockwise around the pin 26. This swing is restricted by the upper end portion 25b of the swinging member 18 abutting against the left cylindrical member 28b. Therefore, the tool 2 is held in the inclined posture as shown in FIGS. 3(c) and 5(c), and the second blade 38b is in contact with the film on the substrate, and the first blade 38a is not in contact with the surface of the substrate. Moves downward in the -M direction to form a groove.

又,於溝槽加工中或溝槽加工結束時,自各空氣供給部34a、34b之空氣噴嘴36噴出空氣,從而除去自基板剝離之膜。 Further, during the groove processing or at the end of the groove processing, air is ejected from the air nozzles 36 of the air supply portions 34a and 34b to remove the film peeled off from the substrate.

於如以上之溝槽加工時,於移動方向之切換時,工具2擺動(2×β3)=6°。因此,工具2於擺動中移行之距離變得相對較短,從而於擺動中加工之距離較短。因此,存在成為加工不良之可能性之距離變短,從而良率提高。再者,必須降低移動速度之距離變短,從而整體之加工時間縮短。 When the groove is processed as above, the tool 2 is swung (2 × β3) = 6° when switching in the moving direction. Therefore, the distance traveled by the tool 2 in the swing becomes relatively short, so that the distance processed in the swing is short. Therefore, there is a possibility that the distance which is a possibility of processing failure is shortened, and the yield is improved. Furthermore, the distance at which the moving speed must be reduced becomes shorter, so that the overall processing time is shortened.

再者,於往返之加工時,切削屑沿退避部39之退避面39a、39b而排出。此處,退避面39a、39b與基板表面之間確保有相對較寬之空間,因此,可順利地排出切削屑。 Further, at the time of the round-trip machining, the chips are discharged along the escape faces 39a and 39b of the escape portion 39. Here, a relatively wide space is secured between the evacuation surfaces 39a, 39b and the surface of the substrate, so that the chips can be smoothly discharged.

[特徵] [feature]

(1)由於在第1刀38a與第2刀38b之間設置有退避部39,因此即使各刀38a、38b之傾斜角度、即工具之擺動角度較小,亦可使退避部39之各退避面39a、39b之傾斜角度較大從而可使切削屑之排出性良好。因此,可使工具之移動方向切換時之加工品質降低之部分變短,且可良好地排出切削屑從而可提高加工品質。 (1) Since the relief portion 39 is provided between the first blade 38a and the second blade 38b, even if the inclination angle of each of the blades 38a and 38b, that is, the swing angle of the tool is small, each of the escape portions 39 can be retracted. The inclination angles of the faces 39a and 39b are large, so that the discharge of the chips can be made good. Therefore, the portion where the processing quality at the time of switching the moving direction of the tool is lowered can be shortened, and the chips can be discharged favorably, and the processing quality can be improved.

(2)藉由使第1刀38a及第2刀38b傾斜擺動角度,而當工具擺動時使各刀之整個面與基板抵接,從而可有效率地進行加工。 (2) By tilting the first blade 38a and the second blade 38b by the swing angle, the entire surface of each blade is brought into contact with the substrate when the tool is swung, so that the machining can be efficiently performed.

(3)由於各刀38a、38b傾斜,且於第1刀38a與第2刀38b 之間形成有退避部39,因此即使各刀38a、38b磨耗亦可使刀之狀態之變化較小。 (3) Since the respective blades 38a and 38b are inclined, and the first blade 38a and the second blade 38b are Since the relief portion 39 is formed between them, even if the respective blades 38a and 38b are worn out, the change in the state of the blade can be made small.

(4)由於退避部39之移動方向之長度比各刀38a、38b之長度長,因此切削屑之排出變得更加順利。 (4) Since the length of the moving direction of the retracting portion 39 is longer than the length of each of the blades 38a and 38b, the discharge of the chips is more smoothly performed.

(5)刀尖部37係以前端較細,且越離開前端越變粗之方式形成。因此,可抑制強度之降低,並且可抑制因磨耗而導致之寬度變化從而可實現長壽命化。 (5) The tip end portion 37 is formed such that the tip end is thinner and becomes thicker as it goes away from the tip end. Therefore, it is possible to suppress a decrease in strength, and it is possible to suppress a change in width due to abrasion and to achieve a long life.

[其他實施形態] [Other Embodiments]

本發明並不限定於如以上之實施形態,可於不脫離本發明之範圍之情形時進行各種變形或修正。 The present invention is not limited to the above embodiments, and various modifications and changes can be made without departing from the scope of the invention.

舉例說明刀尖部之規格之一例,但此僅為一例,可進行各種變更。例如,亦可按如以下之規格形成工具。又,於α2之值為負之情形時,表示以刀尖37朝向前端變寬之方式形成。 An example of the specification of the tip end portion will be described by way of example, but this is merely an example and various modifications are possible. For example, tools can be formed according to the specifications below. Further, when the value of α2 is negative, it means that the blade edge 37 is widened toward the tip end.

α1:50~120°。 11: 50~120°.

a2:-60~80° A2: -60~80°

β1:1~7° 1:11:1~7°

β2:10~20° 22:10~20°

W1:0.005~0.1mm W1: 0.005~0.1mm

W2:0.09~0.5mm W2: 0.09~0.5mm

W3:0.03~0.5mm W3: 0.03~0.5mm

於上述實施形態中,第1刀38a及第2刀38b分別為設置於去向移動側之側面37a與退避面39a所成之角部、及來向移動側之側面37b與退避面39b所成之角部之面,但亦可代替於此,將去向移動側之側面37a與退避面39a所成之角部、及來向移動側之側面37b與退避面39b所成之角部直接用作第1刀38a及第2刀38b。於該情形時,不存在角度β1,擺動 構件之擺動角度於1~7°左右之範圍內設定為任意之值即可。 In the above-described embodiment, the first blade 38a and the second blade 38b are the corners formed by the side surface 37a and the retracting surface 39a on the side of the outward movement, and the angle formed by the side surface 37b and the retracting surface 39b on the moving side. Instead of this, the corner portion formed by the side surface 37a and the retracting surface 39a on the moving side and the corner portion formed by the side surface 37b and the retracting surface 39b on the moving side are directly used as the first blade. 38a and second knife 38b. In this case, there is no angle β1, swing The swing angle of the member can be set to an arbitrary value within a range of about 1 to 7 degrees.

再者,亦可不使本發明之溝槽加工工具擺動,而以固定姿勢來進行使用。變更工具之姿勢而可使用兩個刀因此較為經濟。 Further, the groove processing tool of the present invention may be used in a fixed posture without swinging the groove processing tool of the present invention. It is economical to use two knives to change the posture of the tool.

37‧‧‧刀尖部 37‧‧‧The tip of the knife

37a、37b‧‧‧側面 37a, 37b‧‧‧ side

38a、38b‧‧‧刀 38a, 38b‧‧‧ knife

39‧‧‧退避部 39‧‧‧Retreating Department

39a、39b‧‧‧退避面 39a, 39b‧‧‧ retreating surface

β1、β2‧‧‧傾斜角度 1、1, β2‧‧‧ tilt angle

β3‧‧‧擺動角度 33‧‧‧ swing angle

Claims (9)

一種基板之溝槽加工工具,其係由保持具擺動自如地保持,且用於在作為加工對象之基板上與該保持具共同相對地往返移動而於基板上之薄膜形成溝槽之溝槽加工工具,且具備:工具本體,其由該保持具保持;及刀尖部,具有:第1刀,其形成於該工具本體之前端部,且形成於移動方向之去向移動側之前端;第2刀,其形成於來向移動側之前端;及退避部,其形成於該第1刀與該第2刀之間,且向該工具本體側凹陷;在去向移動時,以該第1刀抵接於該基板上之薄膜之傾斜姿勢移動;在來向移動時,以該第2刀抵接於該基板上之薄膜之傾斜姿勢移動。 A groove processing tool for a substrate, which is held by a holder in a swingable manner, and is used for groove processing of a film formed on a substrate by reciprocating relative to the holder on a substrate to be processed. And a tool body: the tool body is held by the holder; and the blade tip portion has: a first blade formed at a front end portion of the tool body and formed at a front end of the moving direction on the moving side; 2nd a knife formed on the moving side front end; and a retracting portion formed between the first blade and the second blade and recessed toward the tool body side; and in the outward movement, the first blade abuts The film is moved in an inclined posture on the substrate; when moving in the downward direction, the film is moved in an inclined posture in which the film is abutted on the substrate. 如申請專利範圍第1項之基板之溝槽加工工具,其中,該第1刀及該第2刀均相對於與該工具本體之長度方向之軸正交之基準面,以朝向移動方向離開該基準面之方式傾斜。 The groove processing tool for a substrate according to claim 1, wherein the first blade and the second blade are separated from each other with respect to a reference plane orthogonal to an axis of a longitudinal direction of the tool body. The way the datum is tilted. 如申請專利範圍第2項之基板之溝槽加工工具,其中,該退避部具有:第1退避面,其形成於該第1刀之該第2刀側,且相對於該基準面以朝向該第2刀側離開該基準面之方式傾斜;及第2退避面,其形成於該第2刀之該第1刀側,且相對於該基準面以朝向該第1刀側離開該基準面之方式傾斜。 The groove processing tool for a substrate according to the second aspect of the invention, wherein the retracting portion has a first retracting surface formed on the second blade side of the first blade, and facing the reference surface The second blade side is inclined away from the reference surface; and the second relief surface is formed on the first blade side of the second blade, and is separated from the reference surface toward the first blade side with respect to the reference surface The way is tilted. 如申請專利範圍第3項之基板之溝槽加工工具,其中,該退避部之傾斜角度大於該各刀之傾斜角度。 The groove processing tool for a substrate according to the third aspect of the invention, wherein the angle of inclination of the retracting portion is greater than an inclination angle of the respective blades. 如申請專利範圍第2至4項中任一項之基板之溝槽加工工具,其中,該退避部之沿該基準面之方向之長度比該第1刀及該第2刀之沿該基準面之長度長。 The groove processing tool for a substrate according to any one of claims 2 to 4, wherein a length of the relief portion in a direction along the reference surface is longer than a distance between the first blade and the second blade The length is long. 如申請專利範圍第2至4項中任一項之基板之溝槽加工工具,其中,該工具本體由擺動自如地支承於該保持具之擺動構件支承; 該第1刀及該第2刀之傾斜角度與該擺動構件之擺動角度相等。 The groove processing tool for a substrate according to any one of claims 2 to 4, wherein the tool body is supported by a swinging member supported by the holder in a swingable manner; The inclination angle of the first blade and the second blade is equal to the swing angle of the swinging member. 如申請專利範圍第1至4項中任一項之基板之溝槽加工工具,其中,該刀尖部以移動方向之寬度越朝向前端越變窄之方式,傾斜且對稱地形成有相對向之去向移動側之側面與來向移動側之側面。 The groove processing tool for a substrate according to any one of claims 1 to 4, wherein the blade tip portion is formed obliquely and symmetrically in such a manner that the width of the blade edge portion becomes narrower toward the front end in the moving direction. Go to the side of the moving side and the side of the moving side. 如申請專利範圍第1至4項中任一項之基板之溝槽加工工具,其中,該刀尖部之與移動方向正交之方向之寬度較該工具本體之該方向之寬度窄。 The groove processing tool for a substrate according to any one of claims 1 to 4, wherein a width of the blade tip portion orthogonal to the moving direction is narrower than a width of the tool body in the direction of the tool body. 一種基板用溝槽加工裝置,其係用於在基板加工溝槽,且具備:載台,其載置基板;頭部,其配置於該載台之上方,且具有:安裝有申請專利範圍第1至8項中任一項之溝槽加工工具之保持具、及用於使該保持具移動於上下方向之驅動部;及移動機構,其使該頭部於與該載台之載置面平行之面內,相對於該載台相對地移動。 A groove processing apparatus for a substrate for processing a groove on a substrate, comprising: a stage on which a substrate is placed; and a head portion disposed above the stage and having a patent application scope a holder for a groove processing tool according to any one of items 1 to 8, and a driving unit for moving the holder in an up-and-down direction; and a moving mechanism for placing the head on a mounting surface of the stage In the parallel plane, it moves relative to the stage.
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