TWI572062B - Light emitting device and display apparatus - Google Patents
Light emitting device and display apparatus Download PDFInfo
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- TWI572062B TWI572062B TW103130244A TW103130244A TWI572062B TW I572062 B TWI572062 B TW I572062B TW 103130244 A TW103130244 A TW 103130244A TW 103130244 A TW103130244 A TW 103130244A TW I572062 B TWI572062 B TW I572062B
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- 235000012431 wafers Nutrition 0.000 claims description 81
- 239000008393 encapsulating agent Substances 0.000 claims description 39
- 239000000758 substrate Substances 0.000 claims description 19
- 230000001154 acute effect Effects 0.000 claims description 4
- 238000009826 distribution Methods 0.000 description 14
- 230000003287 optical effect Effects 0.000 description 9
- 239000003086 colorant Substances 0.000 description 4
- 239000007795 chemical reaction product Substances 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/04—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of a single character by selection from a plurality of characters, or by composing the character by combination of individual elements, e.g. segments using a combination of such display devices for composing words, rows or the like, in a frame with fixed character positions
- G09G3/06—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of a single character by selection from a plurality of characters, or by composing the character by combination of individual elements, e.g. segments using a combination of such display devices for composing words, rows or the like, in a frame with fixed character positions using controlled light sources
- G09G3/12—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of a single character by selection from a plurality of characters, or by composing the character by combination of individual elements, e.g. segments using a combination of such display devices for composing words, rows or the like, in a frame with fixed character positions using controlled light sources using electroluminescent elements
- G09G3/14—Semiconductor devices, e.g. diodes
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Electroluminescent Light Sources (AREA)
Description
本發明是有關於一種光學元件及光學裝置,且特別是有關於一種發光元件及顯示裝置。 The present invention relates to an optical component and an optical device, and more particularly to a light emitting device and a display device.
發光二極體晶片具有壽命長、體積小以及低功率消耗等優點,因此已廣泛地被應用於各種發光元件中。近年來,發光元件已朝多色彩及高亮度發展,因此發光元件的應用領域已擴展至顯示裝置,例如:大型戶外看板、交通號誌燈等。 The light-emitting diode wafer has advantages such as long life, small volume, and low power consumption, and thus has been widely applied to various light-emitting elements. In recent years, light-emitting elements have developed toward multiple colors and high brightness, and thus the field of application of light-emitting elements has been extended to display devices such as large outdoor billboards, traffic lights, and the like.
習知的發光元件包括紅光發光二極體晶片、綠光發光二極體晶片、藍光發光二極體晶片以及封裝膠體。紅光發光二極體晶片以及藍光發光二極體晶片分別配置在綠光發光二極體晶片的相對二側。封裝膠體覆蓋紅光發光二極體晶片、綠光發光二極體晶片以及藍光發光二極體晶片。由於紅光發光二極體晶片以及藍光發光二極體晶片分別配置在綠光發光二極體晶片的相對二側,因此,一般而言,紅光、綠光及藍光在穿過封裝膠體後會分佈在三個不盡相同的光分佈範圍。詳言之,紅光的分佈範圍以及藍光 的分佈範圍會偏離綠光的分佈範圍。這樣一來,當發光元件應用於顯示裝置中時,顯示裝置便容易發生色不均的問題。 Conventional light-emitting elements include a red light-emitting diode chip, a green light-emitting diode chip, a blue light-emitting diode chip, and an encapsulant. The red light emitting diode chip and the blue light emitting diode chip are respectively disposed on opposite sides of the green light emitting diode chip. The encapsulant covers the red light emitting diode chip, the green light emitting diode chip, and the blue light emitting diode chip. Since the red light emitting diode chip and the blue light emitting diode chip are respectively disposed on opposite sides of the green light emitting diode chip, generally, red light, green light, and blue light will pass through the encapsulant. Distributed over three different light distribution ranges. In detail, the distribution of red light and blue light The distribution range will deviate from the distribution of green light. As a result, when the light-emitting element is applied to a display device, the display device is liable to cause color unevenness.
本發明提供一種發光元件,其光學特性佳。 The present invention provides a light-emitting element which has excellent optical characteristics.
本發明提供一種顯示裝置,其不易發生色不均的問題。 The present invention provides a display device which is less prone to color unevenness.
本發明提供一種發光元件包括第一發光晶片、第二發光晶片、第三發光晶片以及封裝膠體。第一發光晶片用以發出第一色光。第二發光晶片用以發出第二色光。第三發光晶片用以發出第三色光。第一發光晶片、第二發光晶片與第三發光晶片沿著排列方向依序排列。封裝膠體覆蓋第一發光晶片、第二發光晶片以及第三發光晶片且具有出光面。封裝膠體係具有弧形體及連接部,而弧形體係具有單軸曲率變化。 The invention provides a light emitting element comprising a first light emitting chip, a second light emitting chip, a third light emitting chip and an encapsulant. The first illuminating wafer is configured to emit a first color light. The second illuminating wafer is configured to emit a second color light. The third illuminating wafer is used to emit a third color light. The first luminescent wafer, the second luminescent wafer, and the third luminescent wafer are sequentially arranged along the arrangement direction. The encapsulant covers the first luminescent wafer, the second luminescent wafer, and the third luminescent wafer and has a light emitting surface. The encapsulant system has an arcuate body and a joint, while the arcuate system has a uniaxial curvature change.
本發明提供一種顯示裝置包括如上述的多個發光元件。這些發光元件係陣列排列。 The present invention provides a display device comprising a plurality of light emitting elements as described above. These light emitting elements are arranged in an array.
在本發明一實施例中,上述的弧形體在第一參考平面上的正投影為弓形。第一參考平面的法線方向與排列方向垂直。連接部在第一參考平面上的正投影為第一矩形。 In an embodiment of the invention, the orthographic projection of the arcuate body on the first reference plane is arcuate. The normal direction of the first reference plane is perpendicular to the alignment direction. The orthographic projection of the connecting portion on the first reference plane is a first rectangle.
在本發明一實施例中,上述的第一矩形具有第一直線。第一直線位於第一發光晶片在第一參考平面上的正投影旁。第一直線與弓形的弧線交會於一參考點。此參考點與第一發光晶片在第一參考平面上的正投影連成一參考直線。此參考直線與第一直 線夾有一銳角θ,其中20度≦θ≦70度。 In an embodiment of the invention, the first rectangle has a first straight line. The first line is located next to the orthographic projection of the first luminescent wafer on the first reference plane. The first line intersects the arc of the arc at a reference point. The reference point is connected to the orthographic projection of the first illuminating wafer on the first reference plane as a reference line. This reference line and the first straight The clip has an acute angle θ, where 20 degrees ≦ θ ≦ 70 degrees.
在本發明一實施例中,上述的弓形具有一弧頂垂線。弧頂垂線與弧頂及第二發光晶片之連線的夾角係介於0度至20度。 In an embodiment of the invention, the arcuate shape has an arc top perpendicular. The angle between the vertical line of the arc and the line connecting the top of the arc and the second illuminating chip is between 0 and 20 degrees.
在本發明一實施例中,上述的弓形具有弧頂垂線。弧頂垂線與弧頂及第一發光晶片之連線之夾角以及弧頂垂線與弧頂及第三發光晶片之連線之夾角係分別小於70度。 In an embodiment of the invention, the arcuate shape has an arc top perpendicular. The angle between the vertical line of the arc and the line connecting the top of the arc and the first illuminating chip and the line connecting the vertical line of the arc to the line connecting the arc top and the third illuminating chip are respectively less than 70 degrees.
在本發明一實施例中,上述的弧形體的曲率半徑係介於2釐米至5釐米。 In an embodiment of the invention, the arcuate body has a radius of curvature of between 2 cm and 5 cm.
在本發明一實施例中,上述的發光元件更包括基板。基板具有承載面。第一發光晶片、第二發光晶片以及第三發光晶片配置於基板的承載面上。承載面的法線方向以及排列方向位於第一參考平面上。 In an embodiment of the invention, the light emitting element further includes a substrate. The substrate has a bearing surface. The first luminescent wafer, the second luminescent wafer, and the third luminescent wafer are disposed on a bearing surface of the substrate. The normal direction of the bearing surface and the arrangement direction are located on the first reference plane.
在本發明一實施例中,上述的基板包括吸光層。第一發光晶片、第二發光晶片以及第三發光晶片裸露於吸光層外。 In an embodiment of the invention, the substrate comprises a light absorbing layer. The first luminescent wafer, the second luminescent wafer, and the third luminescent wafer are exposed outside the light absorbing layer.
在本發明一實施例中,上述的第一發光晶片、第二發光晶片及第三發光晶片彼此電性獨立。 In an embodiment of the invention, the first light emitting chip, the second light emitting chip, and the third light emitting chip are electrically independent of each other.
基於上述,本發明一實施例之發光元件透過特殊設計的封裝膠體,第一發光晶片發出之第一色光以及第三發光晶片發出之第三色光能夠向第二發光晶片的光軸偏折。藉此,第一色光、第二色光及第三色光大致上能夠分佈在相同的指定範圍內。當發光元件應用於顯示裝置時,由於每一發光元件均能夠將第一色光、第二色光及第三色光投射至指定的範圍內,因此習知技術中 顯示裝置色不均的問題能夠獲得改善。 Based on the above, the light-emitting element according to an embodiment of the present invention transmits the first color light emitted by the first light-emitting chip and the third color light emitted by the third light-emitting chip to the optical axis of the second light-emitting chip through the specially designed encapsulant. Thereby, the first color light, the second color light, and the third color light can be distributed substantially within the same specified range. When the light-emitting element is applied to a display device, since each of the light-emitting elements can project the first color light, the second color light, and the third color light into a specified range, in the prior art, The problem of uneven color of the display device can be improved.
為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。 The above described features and advantages of the invention will be apparent from the following description.
100、200‧‧‧發光元件 100,200‧‧‧Lighting elements
112‧‧‧第一發光晶片 112‧‧‧First light-emitting chip
114‧‧‧第二發光晶片 114‧‧‧Second light-emitting chip
116‧‧‧第三發光晶片 116‧‧‧ Third illuminating chip
120‧‧‧封裝膠體 120‧‧‧Package colloid
120A‧‧‧弧形體 120A‧‧‧Arc
120B‧‧‧連接部 120B‧‧‧Connecting Department
120a、220a‧‧‧出光面 120a, 220a‧‧‧ shiny surface
122‧‧‧弧線 122‧‧‧Arc
124‧‧‧弓形 124‧‧‧ bow
124a‧‧‧弧頂 124a‧‧‧Arc top
126、128、129‧‧‧矩形 126, 128, 129‧‧‧ rectangle
128a、128b‧‧‧直線 128a, 128b‧‧‧ straight line
130‧‧‧基板 130‧‧‧Substrate
130a‧‧‧承載面 130a‧‧‧ bearing surface
131‧‧‧第一電極 131‧‧‧First electrode
132‧‧‧吸光層 132‧‧‧Light absorbing layer
133‧‧‧第二電極 133‧‧‧second electrode
134‧‧‧絕緣層 134‧‧‧Insulation
135‧‧‧第三電極 135‧‧‧ third electrode
136‧‧‧第四電極 136‧‧‧fourth electrode
137‧‧‧第五電極 137‧‧‧ fifth electrode
212‧‧‧第四發光晶片 212‧‧‧fourth light-emitting chip
214‧‧‧第五發光晶片 214‧‧‧Film light-emitting chip
216‧‧‧第六發光晶片 216‧‧‧6th illuminating chip
1000‧‧‧顯示裝置 1000‧‧‧ display device
A-A’、B-B’‧‧‧剖線 A-A’, B-B’‧‧‧ cut line
L1‧‧‧弧頂垂線 L1‧‧‧ arc top perpendicular
L2、L3‧‧‧連線 L2, L3‧‧‧ connection
P‧‧‧參考點 P‧‧‧ reference point
S1~S6‧‧‧曲線 S1~S6‧‧‧ Curve
X‧‧‧光軸 X‧‧‧ optical axis
x‧‧‧第一參考平面的法線方向 X‧‧‧ normal direction of the first reference plane
y‧‧‧排列方向 y‧‧‧Arranged direction
z‧‧‧方向 Z‧‧‧direction
θ‧‧‧銳角 Θ‧‧‧ acute angle
θ 1、θ 2‧‧‧夾角 θ 1, θ 2‧‧‧ angle
圖1A為本發明一實施例之發光元件的立體示意圖。 1A is a schematic perspective view of a light-emitting element according to an embodiment of the present invention.
圖1B為根據圖1A的剖線A-A’所繪的發光元件的剖面示意圖。 Fig. 1B is a schematic cross-sectional view of a light-emitting element taken along line A-A' of Fig. 1A.
圖1C為根據圖1A的剖線B-B’所繪的發光元件的剖面示意圖。 Fig. 1C is a schematic cross-sectional view of a light-emitting element taken along line B-B' of Fig. 1A.
圖2為一比較例之發光元件的立體示意圖。 2 is a schematic perspective view of a light-emitting element of a comparative example.
圖3A、圖3B及圖3C分別示出圖1之第一發光晶片發出的第一色光、第二發光晶片發出的第二色光、第三發光晶片發出的第三色光在通過封裝膠體後的光強度分佈。 3A, 3B, and 3C show the first color light emitted by the first light-emitting chip of FIG. 1, the second color light emitted by the second light-emitting chip, and the third color light emitted by the third light-emitting chip, respectively, after passing through the encapsulant. Light intensity distribution.
圖4A、圖4B及圖4C分別示出圖2之第四發光晶片發出的第四色光、第五發光晶片發出的第五色光、第六發光晶片發出的第六色光在通過封裝膠體後的光強度分佈。 4A, 4B, and 4C show the fourth color light emitted by the fourth light-emitting chip of FIG. 2, the fifth color light emitted by the fifth light-emitting chip, and the sixth color light emitted by the sixth light-emitting chip, respectively, after passing through the encapsulant. Light intensity distribution.
圖5為本發明一實施例之顯示裝置的示意圖。 FIG. 5 is a schematic diagram of a display device according to an embodiment of the present invention.
圖1A為本發明一實施例之發光元件的立體示意圖。圖 1B為根據圖1A的剖線A-A’所繪的發光元件的剖面示意圖。圖1C為根據圖1A的剖線B-B’所繪的發光元件的剖面示意圖。請參照圖1A、圖1B及圖1C,發光元件100包括第一發光晶片112、第二發光晶片114、第三發光晶片116及封裝膠體120。第一發光晶片112、第二發光晶片114、第三發光晶片116為發光二極體晶片。第一發光晶片112、第二發光晶片114及第三發光晶片116沿著排列方向y依序排列,且分別用以發出第一色光、第二色光及第三色光。第一色光的顏色、第二色光的顏色與第三色光的顏色係無特殊限制,且可彼此相同或不相同。較佳地,係第一色光、第二色光與第三色光中之一者為白光、或兩者混成白光、或者三者混成白光。封裝膠體120為透光材料。封裝膠體120覆蓋第一發光晶片112、第二發光晶片114及第三發光晶片116且具有出光面120a。第一色光、第二色光及第三色光自出光面120a離開封裝膠體120。在本發明中,封裝膠體120係具有一弧形體120A及一連接部120B,其中弧形體120A係具有單軸曲率變化。 1A is a schematic perspective view of a light-emitting element according to an embodiment of the present invention. Figure 1B is a schematic cross-sectional view of the light-emitting element according to the line A-A' of Fig. 1A. Fig. 1C is a schematic cross-sectional view of a light-emitting element taken along line B-B' of Fig. 1A. Referring to FIG. 1A , FIG. 1B and FIG. 1C , the light emitting device 100 includes a first light emitting chip 112 , a second light emitting chip 114 , a third light emitting chip 116 , and an encapsulant 120 . The first luminescent wafer 112, the second luminescent wafer 114, and the third luminescent wafer 116 are luminescent diode wafers. The first light-emitting chip 112, the second light-emitting chip 114, and the third light-emitting chip 116 are sequentially arranged along the arrangement direction y, and are respectively used to emit the first color light, the second color light, and the third color light. The color of the first color light, the color of the second color light, and the color of the third color light are not particularly limited, and may be the same or different from each other. Preferably, one of the first color light, the second color light, and the third color light is white light, or both are mixed into white light, or the three are mixed into white light. The encapsulant 120 is a light transmissive material. The encapsulant 120 covers the first illuminating wafer 112, the second illuminating wafer 114, and the third illuminating wafer 116 and has a light emitting surface 120a. The first color light, the second color light, and the third color light exit the encapsulant 120 from the light exit surface 120a. In the present invention, the encapsulant 120 has an arcuate body 120A and a connecting portion 120B, wherein the arcuate body 120A has a uniaxial curvature change.
在本實施例中,第一發光晶片112發出的第一色光可為紅光,第二發光晶片114發出的第二色光可為綠光,而第三發光晶片116發出的第三色光可為藍光。然而,本發明不限於此,在其他實施例中,第一色光可為紅光,第二色光可為藍光,而第三色光可為綠光;第一色光可為綠光,第二色光可為藍光,而第三色光可為紅光;第一色光可為綠光,第二色光可為紅光,而第三色光可為藍光;第一色光可為藍光,第二色光可為綠光,而第三 色光可為紅光;或第一色光可為藍光,第二色光可為紅光,而第三色光可為綠光。此外,本發明亦不限制第一色光的顏色、第二色光的顏色以及第三色光的顏色必需為紅色、綠色、藍色的組合,在其他實施例中,第一色光的顏色、第二色光的顏色或第三色光的顏色亦可選自紅色、綠色、藍色以外的顏色,亦可為白色。該等變化均在本發明所欲保護的範疇內。 In this embodiment, the first color light emitted by the first light emitting chip 112 may be red light, the second color light emitted by the second light emitting chip 114 may be green light, and the third color light emitted by the third light emitting chip 116 may be Blu-ray. However, the present invention is not limited thereto. In other embodiments, the first color light may be red light, the second color light may be blue light, and the third color light may be green light; the first color light may be green light, and the second color light may be green light, second The color light may be blue light, and the third color light may be red light; the first color light may be green light, the second color light may be red light, and the third color light may be blue light; the first color light may be blue light, and the second color light may be blue light, second color light Can be green, and third The color light may be red light; or the first color light may be blue light, the second color light may be red light, and the third color light may be green light. In addition, the present invention also does not limit the color of the first color light, the color of the second color light, and the color of the third color light to be a combination of red, green, and blue. In other embodiments, the color of the first color light, The color of the two-color light or the color of the third color light may also be selected from colors other than red, green, and blue, or may be white. Such variations are within the scope of the invention as intended.
第一參考平面的法線方向x與排列方向y垂直。方向z與第一參考平面的法線方向x以及排列方向y垂直。第一參考平面例如為:排列方向y與方向z所在的yz平面,如圖1B的紙面。值得注意的是,封裝膠體120的出光面120a在第一參考平面(例如:yz平面)上的正投影為弧線122(標示於圖1B)。弧線122朝向遠離第一發光晶片112、第二發光晶片114以及第三發光晶片116的方向z凸起。換言之,封裝膠體120具有弧形體120A(標示於圖1A)及連接部120B。弧形體120A在第一參考平面(例如:yz平面)上的正投影為具有弧線122的弓形124(標示於圖1B)。在本實施例中,弧形體120A的曲率半徑例如是介於2釐米至5釐米,但本發明不以此為限,弧形體120A的曲率半徑可視實際的需求而定。另外,在本實施例中,第一參考平面可選擇性地為第二發光晶片114所在的yz平面,而封裝膠體120可選擇性地對第一參考平面呈鏡面對稱,但本發明不以此為限。 The normal direction x of the first reference plane is perpendicular to the alignment direction y. The direction z is perpendicular to the normal direction x of the first reference plane and the alignment direction y. The first reference plane is, for example, a yz plane in which the direction y and the direction z are arranged, as shown in the paper plane of FIG. 1B. It should be noted that the orthographic projection of the light exiting surface 120a of the encapsulant 120 on the first reference plane (eg, the yz plane) is an arc 122 (shown in FIG. 1B). The arc 122 is convex toward the direction z away from the first illuminating wafer 112, the second illuminating wafer 114, and the third illuminating wafer 116. In other words, the encapsulant 120 has an arcuate body 120A (shown in FIG. 1A) and a connecting portion 120B. The orthographic projection of the arcuate body 120A on the first reference plane (e.g., the yz plane) is an arcuate 124 having an arc 122 (shown in Figure IB). In the present embodiment, the radius of curvature of the curved body 120A is, for example, between 2 cm and 5 cm, but the invention is not limited thereto, and the radius of curvature of the curved body 120A may be determined according to actual needs. In addition, in this embodiment, the first reference plane may be selectively the yz plane where the second illuminating wafer 114 is located, and the encapsulant 120 may be selectively mirror symmetrical to the first reference plane, but the present invention does not Limited.
在本發明一實施例中,弓形124具有一弧頂124a。在末端產品係呈現水平直視的情況下,封裝膠體120之出光中心較佳 係與第二發光晶片114中心大致重合,即弧頂垂線L1與與弧頂124a至第二發光晶片114連線係大致重合。然而,考量到末端產品高於使用者直視水平時,可使封裝膠體120之出光中心較佳係與第二發光晶片114略為偏離。較佳地,弧頂垂線L1與弧頂124a至第二發光晶片114連線之夾角可介於0度至20度,以適當修正高度差所帶來的偏離差異。 In an embodiment of the invention, the arcuate 124 has an arcuate top 124a. In the case where the end product is horizontally oriented, the light-emitting center of the encapsulant 120 is preferably It is substantially coincident with the center of the second illuminating wafer 114, that is, the arc top perpendicular line L1 and the arc top 124a to the second illuminating wafer 114 are substantially coincident with each other. However, it is preferable that the light-emitting center of the encapsulant 120 is slightly offset from the second light-emitting wafer 114 when the end product is higher than the user's direct viewing level. Preferably, the angle between the arc top perpendicular line L1 and the arc top 124a to the second light emitting chip 114 may be between 0 degrees and 20 degrees to appropriately correct the difference in deviation caused by the height difference.
此外,弧頂124a與第一發光晶片112之偏離角度應適當調配,以在晶片散熱以及角度偏離間取得較佳的協配。特定言之,在本發明一實施例中,弧頂垂線L1與弧頂124a至第一發光晶片112連線L2之夾角θ 1以及弧頂垂線L1與弧頂124a至第三發光晶片116連線L3之夾角θ 1可分別小於70度。 In addition, the angle of deviation of the arc top 124a from the first illuminating wafer 112 should be properly tuned to achieve better coordination between heat dissipation and angular deviation of the wafer. Specifically, in an embodiment of the invention, the angle θ 1 between the arc top perpendicular line L1 and the arc top 124a to the first light emitting chip 112 line L2 and the arc top perpendicular line L1 are connected to the arc top 124a to the third light emitting chip 116. The angle θ 1 of L3 can be less than 70 degrees, respectively.
在本發明中,弧形體120A係具有單軸曲率變化。特定言之,可移動的一參考平面與第一參考平面(例如:yz平面)平行或重合。當此參考平面(例如:yz平面或與yz平面平行的一平面)沿著法線方向x連續地平移時,封裝膠體120的出光面120a被此參考平面截出相同的多個弧線(例如:圖1B所示的弧線122)。特別是,這些弧線在第一參考平面(例如:yz平面)上的多個正投影會相重合,而不會彼此錯開。換言之,封裝膠體120的出光面120a是在排列方向y上彎曲,而不在方向z上彎曲。 In the present invention, the arcuate body 120A has a uniaxial curvature change. In particular, a movable reference plane is parallel or coincident with the first reference plane (eg, the yz plane). When the reference plane (eg, the yz plane or a plane parallel to the yz plane) is continuously translated along the normal direction x, the light exiting surface 120a of the encapsulant 120 is cut by the same plane by the same plane (for example: The arc 122) shown in Fig. 1B. In particular, the plurality of orthographic projections of the arcs on the first reference plane (eg, the yz plane) may coincide without being staggered from each other. In other words, the light-emitting surface 120a of the encapsulant 120 is curved in the alignment direction y without being bent in the direction z.
第二參考平面與第一參考平面垂直。第二參考平面例如為:法線方向x以及方向z所在的xz平面,如圖1C的紙面。值得注意的是,如本發明之弧形體120A係具有單軸曲率變化的情況 下,弧形體120A在第二參考平面(例如:xz平面)上的正投影為矩形126(標示於圖1C)。從另一角度而言,可移動的另一參考平面與第二參考平面(例如:xz平面)平行或重合。當此參考平面(例如:xz平面或與xz平面平行的一平面)沿著排列方向y連續地平移時,封裝膠體120的出光面120a會被此參考平面截出的多個直線。在本實施例中,第二參考平面可選擇性地為第二發光晶片114所在的xz平面上,而封裝膠體120可選擇性地對第二參考平面呈鏡面對稱,但本發明不以此為限。 The second reference plane is perpendicular to the first reference plane. The second reference plane is, for example, the normal direction x and the xz plane where the direction z is located, as in the paper plane of FIG. 1C. It is worth noting that the arc body 120A of the present invention has a uniaxial curvature change. Next, the orthographic projection of the arcuate body 120A on the second reference plane (e.g., the xz plane) is a rectangle 126 (shown in Figure 1C). From another perspective, another movable reference plane is parallel or coincident with the second reference plane (eg, the xz plane). When the reference plane (for example, the xz plane or a plane parallel to the xz plane) is continuously translated along the arrangement direction y, the light exiting surface 120a of the encapsulant 120 is a plurality of straight lines intercepted by the reference plane. In this embodiment, the second reference plane may be selectively on the xz plane where the second illuminating wafer 114 is located, and the encapsulant 120 may be selectively mirror symmetrical to the second reference plane, but the present invention does not limit.
在本實施例中,封裝膠體120可進一步性地包括連接部120B(標示於圖1A)。連接部120B連接弧形體120A與基板130,且直接地覆蓋第一發光晶片112、第二發光晶片114與第三發光晶片116。連接部120B在第一參考平面(例如:yz平面)上的正投影例如為與弓形124連接的矩形128(標示於圖1B)。連接部120B在第二參考平面(例如:xz平面)上的正投影例如為與矩形126連接的矩形129(標示於圖1C)。換言之,封裝膠體120的連接部120B可為長方體。然而,本發明不限於此,在其他實施例中,連接部120B亦可為其他適當形式的立體物。意即,連接部120B在第一參考平面(例如:yz平面)及第二參考平面(例如:xz平面)上的正投影不必需為矩形,而可為其他適當形狀。 In the present embodiment, the encapsulant 120 may further include a connection portion 120B (shown in FIG. 1A). The connecting portion 120B connects the curved body 120A and the substrate 130 and directly covers the first light emitting chip 112, the second light emitting chip 114, and the third light emitting wafer 116. The orthographic projection of the connecting portion 120B on the first reference plane (eg, the yz plane) is, for example, a rectangle 128 (shown in FIG. 1B) coupled to the arcuate 124. The orthographic projection of the connecting portion 120B on the second reference plane (e.g., the xz plane) is, for example, a rectangle 129 (shown in Figure 1C) that is coupled to the rectangle 126. In other words, the connection portion 120B of the encapsulant 120 may be a rectangular parallelepiped. However, the present invention is not limited thereto, and in other embodiments, the connecting portion 120B may also be a three-dimensional object of other suitable forms. That is, the orthographic projection of the connecting portion 120B on the first reference plane (eg, the yz plane) and the second reference plane (eg, the xz plane) need not be a rectangle, but may be other suitable shapes.
請參照圖1B,矩形128具有相對的直線128a以及直線128b。直線128a以及直線128b分別位於第一發光晶片112、第二發光晶片114以及第三發光晶片116之集合的二側。直線128a較 直線128b接近第一發光晶片112,而位於第一發光晶片112在第一參考平面(例如:yz平面)上的正投影旁。直線128a與弧線122交會於參考點P。參考點P與第一發光晶片112在第一參考平面(例如:yz平面)上的正投影連成參考直線L。參考直線L與直線128a例如是夾有銳角θ,其中20度≦θ≦70度,但本發明不以此為限。 Referring to FIG. 1B, the rectangle 128 has opposing straight lines 128a and straight lines 128b. The straight line 128a and the straight line 128b are respectively located on two sides of the set of the first light emitting wafer 112, the second light emitting wafer 114, and the third light emitting wafer 116. Straight line 128a The line 128b is adjacent to the first illuminating wafer 112 and is located next to the orthographic projection of the first illuminating wafer 112 on the first reference plane (eg, the yz plane). The straight line 128a intersects the arc 122 at the reference point P. The reference point P is connected to the front projection L of the first illuminating wafer 112 on the first reference plane (for example, the yz plane). The reference line L and the straight line 128a are, for example, sandwiched by an acute angle θ, where 20 degrees ≦ θ ≦ 70 degrees, but the invention is not limited thereto.
請參照圖1A、圖1B及圖1C。本實施例的發光元件100可選擇性地包括具有承載面130a的基板130。第一發光晶片112、第二發光晶片114以及第三發光晶片116配置於承載面130a上。,基板130亦可選擇性地包括吸光層132及/或被吸光層132覆蓋的絕緣層134。承載面130a面向第一發光晶片112、第二發光晶片114以及第三發光晶片116。第一發光晶片112、第二發光晶片114以及第三發光晶片116配置於承載面130a上,並裸露於吸光層132外。在本實施例中,吸光層132可呈黑色,但本發明不以此為限,在其他實施例中,吸光層132亦可呈其他適當顏色。值得一提的是,若發光元件100用以做為顯示裝置的其中一個畫素,則當第一發光晶片112、第二發光晶片114以及第三發光晶片116不發光而欲使此畫素呈現暗態時,基板130不易反射外界光線。藉此,做為顯示裝置之畫素的發光元件100能夠具有極低的亮度,進而提升顯示裝置的顯示品質。 Please refer to FIG. 1A, FIG. 1B and FIG. 1C. The light emitting element 100 of the present embodiment may optionally include a substrate 130 having a bearing surface 130a. The first luminescent wafer 112, the second luminescent wafer 114, and the third luminescent wafer 116 are disposed on the carrying surface 130a. The substrate 130 can also optionally include a light absorbing layer 132 and/or an insulating layer 134 covered by the light absorbing layer 132. The bearing surface 130a faces the first light emitting wafer 112, the second light emitting wafer 114, and the third light emitting wafer 116. The first luminescent wafer 112, the second luminescent wafer 114, and the third luminescent wafer 116 are disposed on the carrying surface 130a and exposed outside the light absorbing layer 132. In this embodiment, the light absorbing layer 132 may be black, but the invention is not limited thereto. In other embodiments, the light absorbing layer 132 may also be in other suitable colors. It is worth mentioning that if the light-emitting element 100 is used as one of the pixels of the display device, the first light-emitting chip 112, the second light-emitting chip 114, and the third light-emitting chip 116 are not illuminated, and the pixel is intended to be rendered. In the dark state, the substrate 130 is less likely to reflect external light. Thereby, the light-emitting element 100 which is a pixel of the display device can have extremely low brightness, thereby improving the display quality of the display device.
在本實施例中,基板130可進一步包括第一電極131、第二電極133、第三電極135、第四電極136以及第五電極137。第二電極133及第三電極135之集合與第四電極136及第五電極137 之集合可分別位於第一電極131之相對二側。第一發光晶片112、第二發光晶片114以及第三發光晶片116可固定於第一電極131上。第一發光晶片112與第一電極131以及第二電極133電性連接。第二發光晶片114可與第三電極135以及第四電極136電性連接。第三發光晶片116可與第三電極135以及第五電極137電性連接。 In the embodiment, the substrate 130 may further include a first electrode 131, a second electrode 133, a third electrode 135, a fourth electrode 136, and a fifth electrode 137. The second electrode 133 and the third electrode 135 are combined with the fourth electrode 136 and the fifth electrode 137 The set may be located on opposite sides of the first electrode 131, respectively. The first luminescent wafer 112, the second luminescent wafer 114, and the third luminescent wafer 116 may be fixed to the first electrode 131. The first light emitting chip 112 is electrically connected to the first electrode 131 and the second electrode 133. The second luminescent wafer 114 can be electrically connected to the third electrode 135 and the fourth electrode 136. The third light emitting chip 116 can be electrically connected to the third electrode 135 and the fifth electrode 137.
另外,在本實施例中,第一發光晶片112、第二發光晶片114及第三發光晶片116可是彼此電性獨立的。藉此,發光元件100能夠分別控制第一色光的光強度、第二色光的光強度及第三色光的光強度,進而視實際需求提供特定顏色。需說明的是,上述之第一發光晶片112、第二發光晶片114與第三發光晶片116的電性關係、第一電極131、第二電極133、第三電極135、第四電極136以及第五電極137的具體樣態以及其與第一、二、三發光晶片112、114、116之間的相對關係是用以舉例說明本發明而非用以限制本發明。在其他實施例中,第一發光晶片112、第二發光晶片114及第三發光晶片116亦可是彼此電性連接,舉例而言,第一發光晶片112、第二發光晶片114及第三發光晶片116可以並聯或串聯;第一電極131、第二電極133、第三電極135、第四電極136以及第五電極137的樣態以及其與第一、二、三發光晶片112、114、116之間的相對關係亦可做其他適當設計。 In addition, in the embodiment, the first illuminating wafer 112, the second illuminating wafer 114, and the third illuminating wafer 116 may be electrically independent of each other. Thereby, the light-emitting element 100 can separately control the light intensity of the first color light, the light intensity of the second color light, and the light intensity of the third color light, thereby providing a specific color depending on actual needs. It should be noted that the electrical relationship between the first light-emitting chip 112, the second light-emitting chip 114 and the third light-emitting chip 116, the first electrode 131, the second electrode 133, the third electrode 135, the fourth electrode 136, and the first The particular state of the five electrodes 137 and its relative relationship to the first, second, and third illuminating wafers 112, 114, 116 are intended to illustrate the invention and are not intended to limit the invention. In other embodiments, the first luminescent wafer 112, the second luminescent wafer 114, and the third luminescent wafer 116 may also be electrically connected to each other, for example, the first luminescent wafer 112, the second luminescent wafer 114, and the third luminescent wafer. 116 may be connected in parallel or in series; the states of the first electrode 131, the second electrode 133, the third electrode 135, the fourth electrode 136, and the fifth electrode 137, and the first, second, and third light emitting chips 112, 114, 116 The relative relationship between the two can also be appropriately designed.
請參照圖1A,值得一提的是,發光元件100透過特殊設計的封裝膠體120,第一發光晶片112發出的第一色光以及第三發 光晶片116發出的第三色光能夠向第二發光晶片114的光軸X偏折。藉此,第一色光分佈範圍與第二色光分佈範圍的重疊區域以及第三色光分佈範圍與第二色光分佈範圍的重疊區域便能夠增加,進而改善習知技術中多個色光的分佈範圍彼此過於偏離的問題。以下透過圖2及圖3A~圖3C、圖4A~圖4C所示數據佐證之。 Referring to FIG. 1A , it is worth mentioning that the light-emitting element 100 transmits the first color light emitted by the first light-emitting chip 112 and the third light through the specially designed encapsulant 120 . The third color light emitted by the optical wafer 116 can be deflected toward the optical axis X of the second light emitting wafer 114. Thereby, the overlapping area of the first color light distribution range and the second color light distribution range and the overlapping area of the third color light distribution range and the second color light distribution range can be increased, thereby improving the distribution range of the plurality of color lights in the prior art. Too much deviation from the problem. The following is evidenced by the data shown in FIG. 2 and FIG. 3A to FIG. 3C and FIG. 4A to FIG. 4C.
圖2為一比較例之發光元件的立體示意圖。圖2的發光元件200包括第四發光晶片212、第五發光晶片214、第六發光晶片216及封裝膠體220。第四發光晶片212、第五發光晶片214及第六發光晶片216沿著排列方向y依序排列。第四發光晶片212、第五發光晶片214以及第六發光晶片216分別用以發出第四色光、第五色光以及第六色光。第四色光的顏色、第五色光的顏色以及第六色光的顏色互不相同。第四色光、第五色光以及第六色光能夠混成白光。封裝膠體220覆蓋第四發光晶片212、第五發光晶片214以及第六發光晶片216。圖2的發光元件200與圖1的發光元件100的差異在於:圖2之封裝膠體220不具像圖1的封裝膠體120般具有特殊設計,而封裝膠體220的出光面220a為平面。 2 is a schematic perspective view of a light-emitting element of a comparative example. The light-emitting element 200 of FIG. 2 includes a fourth light-emitting chip 212, a fifth light-emitting chip 214, a sixth light-emitting chip 216, and an encapsulant 220. The fourth light-emitting chip 212, the fifth light-emitting chip 214, and the sixth light-emitting chip 216 are sequentially arranged along the arrangement direction y. The fourth illuminating wafer 212, the fifth illuminating wafer 214, and the sixth illuminating wafer 216 are respectively configured to emit fourth color light, fifth color light, and sixth color light. The color of the fourth color light, the color of the fifth color light, and the color of the sixth color light are different from each other. The fourth color light, the fifth color light, and the sixth color light can be mixed into white light. The encapsulant 220 covers the fourth luminescent wafer 212, the fifth luminescent wafer 214, and the sixth luminescent wafer 216. The difference between the illuminating element 200 of FIG. 2 and the illuminating element 100 of FIG. 1 is that the encapsulating body 220 of FIG. 2 does not have a special design like the encapsulant 120 of FIG. 1, and the light emitting surface 220a of the encapsulant 220 is planar.
圖3A~圖3C分別示出圖1之第一發光晶片發出的第一色光、第二發光晶片發出的第二色光、第三發光晶片發出的第三色光在通過封裝膠體後的光強度分佈。特別是,圖3A的曲線S1、圖3B的曲線S2、圖3C的曲線S3分別示出第一、二、三色光在通過封裝膠體220後在位於yz平面上之各視角方向上的光強度。圖4A~圖4C分別示出圖2之第四發光晶片發出的第四色光、第五 發光晶片發出的第五色光、第六發光晶片發出的第六色光在通過封裝膠體後的光強度分佈。特別是,圖4A的曲線S4、圖4B的曲線S5、圖4C的曲線S6分別示出第四、五、六色光在通過封裝膠體220後在位於yz平面上之各視角方向上的光強度。 3A to 3C respectively show light intensity distributions of the first color light emitted by the first light-emitting chip of FIG. 1 , the second color light emitted by the second light-emitting chip, and the third color light emitted by the third light-emitting chip after passing through the encapsulant. . In particular, the curve S1 of FIG. 3A, the curve S2 of FIG. 3B, and the curve S3 of FIG. 3C respectively show the light intensities in the respective viewing directions on the yz plane after the first, second, and third colors of light pass through the encapsulant 220. 4A to 4C respectively show the fourth color light and the fifth color emitted by the fourth light emitting chip of FIG. The light intensity distribution of the fifth color light emitted by the light-emitting chip and the sixth color light emitted by the sixth light-emitting chip after passing through the encapsulant. In particular, the curve S4 of FIG. 4A, the curve S5 of FIG. 4B, and the curve S6 of FIG. 4C respectively show the light intensities of the fourth, fifth, and sixth color lights in the respective viewing angle directions on the yz plane after passing through the encapsulant 220.
比較圖4A與圖4B可發現,曲線S4圍出的範圍較曲線S5圍出的範圍往左偏移。比較圖4C與圖4B可發現,曲線S6圍出的範圍較曲線S5圍出的範圍往右偏移。意即,第四色光及第六色光在通過封裝膠體220後無法充分地與第五色光混合,而第四色光的一大部份及第六色光的一大部份是落在第五色光分佈的範圍以外。因此,若發光元件200做為顯示裝置的畫素,則易使顯示裝置發生色不均的問題。 Comparing FIG. 4A with FIG. 4B, it can be seen that the range enclosed by the curve S4 is shifted to the left from the range enclosed by the curve S5. Comparing Fig. 4C with Fig. 4B, it can be seen that the range enclosed by the curve S6 is shifted to the right from the range enclosed by the curve S5. That is, the fourth color light and the sixth color light cannot be sufficiently mixed with the fifth color light after passing through the encapsulant 220, and a large portion of the fourth color light and a large portion of the sixth color light fall in the fifth color. Outside the range of light distribution. Therefore, if the light-emitting element 200 is used as a pixel of the display device, the display device is liable to cause color unevenness.
反觀本發明一實施例之發光元件100,比較圖3A與圖3B可發現,曲線S1圍出的範圍大部分是與曲線S2圍出的範圍重疊。比較圖3C與圖3B可發現,曲線S3圍出的範圍大部分是與曲線S2圍出的範圍重疊。意即,透過封裝膠體120的偏折作用,第一色光、第二色光及第三色光大致上能夠分佈在相同的指定範圍內。藉此,若發光元件100做為顯示裝置的畫素,則顯示裝置不易發生色不均的問題。 In contrast, the light-emitting element 100 according to an embodiment of the present invention, as compared with FIG. 3A and FIG. 3B, can be found that the range enclosed by the curve S1 mostly overlaps with the range enclosed by the curve S2. Comparing Fig. 3C with Fig. 3B, it can be found that the range enclosed by the curve S3 mostly overlaps with the range enclosed by the curve S2. That is, the first color light, the second color light, and the third color light can be distributed substantially within the same specified range by the deflection of the encapsulant 120. Therefore, if the light-emitting element 100 is used as a pixel of the display device, the display device is less likely to cause color unevenness.
圖5為本發明一實施例之顯示裝置的示意圖。請參照圖5,顯示裝置1000包括陣列排列的多個發光元件100。每一發光元件100可做為顯示裝置1000的其中一個畫素使用。由於每一發光元件100均能夠將第一色光、第二色光及第三色光投射至指定的 範圍內,因此顯示裝置1000不易發生色不均的問題。 FIG. 5 is a schematic diagram of a display device according to an embodiment of the present invention. Referring to FIG. 5, the display device 1000 includes a plurality of light emitting elements 100 arranged in an array. Each of the light emitting elements 100 can be used as one of the pixels of the display device 1000. Since each of the light emitting elements 100 is capable of projecting the first color light, the second color light, and the third color light to a specified Within the range, the display device 1000 is less prone to color unevenness.
綜上所述,本發明一實施例之發光元件透過特殊設計的封裝膠體,第一發光晶片發出之第一色光以及第三發光晶片發出之第三色光能夠向第二發光晶片的光軸偏折。藉此,第一色光、第二色光及第三色光大致上能夠分佈在相同的指定範圍內。當發光元件應用於顯示裝置時,由於每一發光元件均能夠將第一色光、第二色光及第三色光投射至指定的範圍內,因此習知技術中顯示裝置色不均的問題能夠獲得改善。 In summary, the light-emitting element of the embodiment of the present invention transmits the first color light emitted by the first light-emitting chip and the third color light emitted by the third light-emitting chip to the optical axis of the second light-emitting chip through a specially designed encapsulant. fold. Thereby, the first color light, the second color light, and the third color light can be distributed substantially within the same specified range. When the light-emitting element is applied to a display device, since each of the light-emitting elements can project the first color light, the second color light, and the third color light into a specified range, the problem of color unevenness of the display device in the prior art can be obtained. improve.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,故本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.
100‧‧‧發光元件 100‧‧‧Lighting elements
112‧‧‧第一發光晶片 112‧‧‧First light-emitting chip
114‧‧‧第二發光晶片 114‧‧‧Second light-emitting chip
116‧‧‧第三發光晶片 116‧‧‧ Third illuminating chip
120‧‧‧封裝膠體 120‧‧‧Package colloid
120A‧‧‧弧形體 120A‧‧‧Arc
120B‧‧‧連接部 120B‧‧‧Connecting Department
120a‧‧‧出光面 120a‧‧‧Glossy
130‧‧‧基板 130‧‧‧Substrate
130a‧‧‧承載面 130a‧‧‧ bearing surface
131‧‧‧第一電極 131‧‧‧First electrode
132‧‧‧吸光層 132‧‧‧Light absorbing layer
133‧‧‧第二電極 133‧‧‧second electrode
134‧‧‧絕緣層 134‧‧‧Insulation
135‧‧‧第三電極 135‧‧‧ third electrode
136‧‧‧第四電極 136‧‧‧fourth electrode
137‧‧‧第五電極 137‧‧‧ fifth electrode
A-A’、B-B’‧‧‧剖線 A-A’, B-B’‧‧‧ cut line
X‧‧‧光軸 X‧‧‧ optical axis
x‧‧‧第一參考平面的法線方向 X‧‧‧ normal direction of the first reference plane
y‧‧‧排列方向 y‧‧‧Arranged direction
z‧‧‧方向 Z‧‧‧direction
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