TWI570861B - Package structure and method of manufacture - Google Patents

Description

Package structure and its manufacturing method

The invention relates to a package structure, in particular to a package structure of a single layer circuit layer and a preparation method thereof.

With the evolution of semiconductor packaging technology, semiconductor devices (Semiconductor devices) have developed different package types in smart phones, tablets, networks, notebook computers, etc., for example, Ball grid array , referred to as BGA), quad flat package (QFP) or quad flat nonlead package (QFN) semiconductor package.

As shown in FIG. 1A, the conventional QFP package structure 1 includes a carrier 10, a plurality of pins 11 around the carrier 10, and is bonded to the carrier 10 and electrically connected to the plurality of bonding wires 120. The electronic component 12 of the leg 11 and the insulating layer 13 encapsulating the electronic component 12, the carrier 10, the bonding wire 120 and the lead 11 are encapsulated, and the guiding pin 11 protrudes from the insulating layer 13.

However, in the conventional method of manufacturing the QFP package structure 1, the carrier 10 and the leads 11 are derived from the lead frame, so that the wiring cannot be arbitrarily arranged, that is, the design of the line and the contact is restricted. For example, a conventional lead frame has one row of guide pins 11 The total length is about 400um, and the total length of the carrier 10 is about 125um, so the number and pitch of the I/O of the lead 11 has been limited.

Moreover, when the package is packaged, it is limited by the fixed size of the lead frame and the height of the bonding wire 120. Therefore, the conventional QFP package structure 1 has a thick overall thickness and is difficult to be thinned.

Moreover, in the conventional QFP package structure 1, limited by the design of the lead frame, the number of the lead pins 11 is small, that is, the number of contacts is small, so that it is difficult to achieve the number of high contacts and thinning.

As shown in Fig. 1B, the conventional BGA package structure 1' can accommodate more I/O connections on a package substrate of the same unit area to meet the requirements of a highly integrated wafer. The package structure 1 ′ includes: a carrier layer 10 ′ having a circuit layer 11 a , 11 b on the upper side 10 a and the lower side 10 b , and an upper side 10 a of the carrier board 10 ′ and electrically connected by a plurality of conductive bumps 120 ′ The electronic component 12 of the circuit layer 11a, the insulating layer 13 covering the conductive bumps 120', and the circuit layer 11b disposed on the lower side 10b of the carrier 10' are electrically conductive, such as solder balls. The component 14 has a conductive post 100 electrically connected to the circuit layer 11a, 11b. Therefore, the electronic component 12 is electrically connected to the carrier board 10' by wire bonding or flip chip bonding, and the conductive component is implanted on the circuit layer 11b of the lower side 10b of the carrier board 10'. 14 and electrical external connection, in order to achieve the goal of high number of feet.

However, in the conventional BGA package structure 1', when the signal is transmitted at a higher frequency or at a high speed, the signal transmission path is too long (ie, the conductive element 14, the circuit layers 11a, 11b and the conductive pillar 100) cannot improve the electrical performance. So that the seal The performance of the mounting structure 1' is limited.

Furthermore, the conventional BGA package structure 1' needs to fabricate at least two circuit layers 11a, 11b and a conductive pillar 100 (such as a drilling process, and a copper material is plated in the via hole as a layer-to-layer connection). The overall structure is not only difficult to meet the thinning requirements, but it is difficult to reduce the manufacturing cost due to the complicated production process and long process.

Moreover, the conventional BGA package structure 1' needs to make more connection interfaces (such as between the two circuit layers 11a, 11b and the conductive pillars 100), and it is necessary to use the composite carrier board 10' with different material layers, so not only It is prone to delamination and greatly increases manufacturing costs.

In addition, since the carrier plate 10' is composed of a composite material having a thermal expansion coefficient (CTE) which is composed of a plurality of layers (a plurality of materials) and an electrical property mismatch, in particular, the CTE between the materials does not match, so Warpage is prone to occur in the process.

Therefore, how to avoid all kinds of defects in the prior art has become a problem that is currently being solved.

In view of the above-mentioned various deficiencies of the prior art, the present invention provides a package structure comprising: an insulating layer having opposite first and second surfaces; and a plurality of conductive pillars embedded in the insulating layer and having end faces thereof Exposed on the first surface of the insulating layer; a circuit layer is embedded on the second surface of the insulating layer and electrically connected to the conductive pillars; at least one electronic component is disposed on the circuit layer and electrically And connecting the circuit layer; and a cladding layer formed on the circuit layer and the second surface of the insulating layer and covering the electronic component.

The invention provides a method for fabricating a package structure, comprising: forming a plurality of conductive pillars on a conductor layer; forming an insulating layer on the conductor layer and the conductive pillars, wherein the insulating layer has a first surface opposite to the first surface And a second surface, wherein the end faces of the conductive pillars are exposed on the first surface of the insulating layer; part of the material of the conductor layer is removed, and the conductor layer is used as a circuit layer; at least one electronic component is disposed on the circuit layer And the electronic component is electrically connected to the circuit layer; and a cladding layer is formed on the circuit layer and the second surface of the insulating layer, so that the cladding layer covers the electronic component.

The invention further provides a method for fabricating a package structure, comprising: forming a plurality of conductive pillars on a conductor layer; forming an insulating layer on the conductor layer and the conductive pillars, and completely covering the conductive pillars The insulating layer has a first surface and a second surface opposite to each other; a portion of the insulating layer is removed, the end surfaces of the conductive pillars are exposed on the first surface of the insulating layer; and a part of the material of the conductive layer is removed The conductor layer is used as a circuit layer; at least one electronic component is disposed on the circuit layer, and the electronic component is electrically connected to the circuit layer; and a cladding layer is formed on the circuit layer and the second surface of the insulating layer The cladding is coated with the electronic component.

It can be seen from the above that the package structure of the present invention and the method for manufacturing the same are achieved by only making one layer of the circuit layer and designing the conductive column as an external pad, so that the circuit layer is combined with the electronic component, and the conductive column is combined with the solder ball to shorten The signal transmission path can reduce signal loss and improve electrical characteristics.

Furthermore, the package structure of the present invention is formed by forming a plurality of conductive pillars on a single circuit layer, so that the end faces of the conductive pillars are used as external pads, so that it is not necessary to make another layer of wiring, so that the conventional drilling process and filling can be omitted. Hole process, The fabrication of the second circuit layer and the like not only greatly reduces the thickness of the package structure to meet the demand for thinning, but also greatly reduces the manufacturing cost.

Moreover, the package structure of the present invention has a connection interface between the single circuit layer and the conductive pillars, so that the number of connection interfaces is less than the number of connection interfaces of the prior art, thereby avoiding the delamination problem, and The conductive layer is patterned into the wiring layer, so that the manufacturing cost can be greatly reduced.

In addition, the insulating layer of the present invention is a single material, rather than a composite material of the conventional carrier plate, so that the problem of warpage of the unevenness of the stress distribution of the insulating layer can be avoided.

1, 1', 2‧‧‧ package structure

10‧‧‧Hosting

10’‧‧‧Bearing board

10a‧‧‧Upper side

10b‧‧‧ underside

100‧‧‧conductive column

11‧‧‧ lead

11a, 11b, 20’‧‧‧ circuit layer

12, 22‧‧‧ Electronic components

120‧‧‧welding line

120', 220‧‧‧ conductive bumps

13, 25‧‧‧ insulation

14, 24‧‧‧ conductive components

20‧‧‧Conductor layer

21‧‧‧conductive column

21a‧‧‧ end face

23‧‧‧Cladding

25a‧‧‧ first surface

20b‧‧‧second surface

200‧‧‧ concave

S‧‧‧ cutting path

1A is a cross-sectional view showing a conventional QFP package structure; FIG. 1B is a cross-sectional view showing a conventional BGA package structure; and FIGS. 2A to 2H are cross-sectional views showing a method of manufacturing the package structure of the present invention.

The other embodiments of the present invention will be readily understood by those skilled in the art from this disclosure.

It is to be understood that the structure, the proportions, the size, and the like of the present invention are intended to be used in conjunction with the disclosure of the specification, and are not intended to limit the invention. The conditions are limited, so it is not technically meaningful. Any modification of the structure, change of the proportional relationship or adjustment of the size should remain in this book without affecting the effects and the objectives that can be achieved by the present invention. Technology disclosed by the invention The content can be covered. In the meantime, the terms "upper", "first", "second" and "one" are used in the description, and are not intended to limit the scope of the invention. Changes or adjustments in the relative relationship are considered to be within the scope of the present invention.

2A to 2G are schematic cross-sectional views showing the manufacturing method of the package structure 2 of the present invention.

As shown in FIG. 2A, a conductor layer 20 is provided. In the present embodiment, the conductor layer 20 is a metal material such as copper, but is not limited thereto.

As shown in FIG. 2B, a plurality of conductive pillars 21 are formed on the conductor layer 20.

As shown in FIG. 2C, an insulating layer 25 is formed on the conductive layer 20 and the conductive pillars 21, and the insulating layer 25 is completely covered with the conductive pillars 21, wherein the insulating layer 25 has opposite phases. The first surface 25a and the second surface 25b.

In the present embodiment, the material forming the insulating layer 25 is a primer or a dielectric material.

As shown in FIG. 2D, part of the material of the first surface 25a of the insulating layer 25 is removed, so that the end faces 21a of the conductive pillars 21 are exposed on the first surface 25a of the insulating layer 25.

Moreover, in other embodiments, a flattening process (such as grinding the insulating layer 25) may be utilized to make the end faces of the conductive pillars flush the first surface of the insulating layer.

As shown in FIG. 2E, part of the material of the conductor layer 20 is removed by patterning The portion of the second surface 25b of the insulating layer 25 is made of the conductor layer 20 as the wiring layer 20', and the second surface 25b of the insulating layer 25 is exposed to a part of the surface of the wiring layer 20'.

In this embodiment, the circuit layer 20' is electrically connected to the conductive pillars 21.

Further, the patterning is performed by etching, so that the side surface of the wiring layer 20' will have a concave shape 200.

As shown in Fig. 2F, at least one electronic component 22 is disposed on the wiring layer 20', and the electronic component 22 is electrically connected to the wiring layer 20'.

In this embodiment, the electronic component 22 is an active component, a passive component, or a combination thereof, and the active component is, for example, a semiconductor component (such as a wafer), and the passive component is, for example, a resistor, a capacitor, and an inductor.

Moreover, the electronic component 22 is electrically connected to the conductive pillars 21 via the circuit layer 20' by a plurality of conductive bumps 220.

As shown in FIG. 2G, a cladding layer 23 is formed on the circuit layer 20' and the second surface 25b of the insulating layer 25, so that the cladding layer 23 covers the electronic component 22 and the conductive bumps 220. .

In the present embodiment, the coating layer 23 is formed on the carrier plate 20 by molding, coating, or pressing, and the material of the coating layer 23 is a mold compound (Molding Compound). ), Primer, or a dielectric material such as Epoxy.

Furthermore, in another embodiment, the upper surface of the electronic component 22 may also be exposed on the upper surface of the cladding layer 23.

Moreover, in other embodiments, the primer (not shown) may be formed first. The conductive bumps 220 are covered, and the cladding layer 23 is formed.

As shown in FIG. 2H, a plurality of conductive elements 24 such as solder balls are formed on the first surface 25a of the insulating layer 25, and a singulation process is performed along the cutting path S as shown in FIG. 2G to obtain a plurality of package structures. 2.

In this embodiment, the conductive elements 24 are bonded and electrically connected to the end faces 21a of the conductive pillars 21 to be combined with other electronic devices (not shown) by the conductive components 24.

In the manufacturing method of the package structure 2, the wiring layer 20' is bonded to the electronic component 22 by using only one wiring layer 20', and the conductive pillar 21 is used as an external pad, and the conductive pillars 21 are combined. The conductive elements 24 are used to shorten the signal transmission path, thereby reducing signal loss and thereby improving electrical characteristics.

Furthermore, the package structure 2 of the present invention has the design of the plurality of conductive pillars 21 formed on the single circuit layer 20', so that the end faces 21a of the conductive pillars 21 are used as external pads, so that it is not necessary to make another layer of wiring, so that the description can be omitted. Knowing the drilling process, the hole filling process, the fabrication of the second circuit layer, and the like, thereby not only greatly reducing the overall thickness of the package structure 2 to meet the demand for thinning, but also greatly reducing the manufacturing cost.

Moreover, the package structure 2 of the present invention has a connection interface between the single circuit layer 20' and the conductive pillars 21, and the number of connection interfaces is less than the number of connection interfaces of the prior art, thereby reducing the risk of delamination. Therefore, the reliability is improved, and the conductor layer 20 is directly patterned to form the wiring layer 20', so that the manufacturing cost can be greatly reduced.

In addition, the insulating layer 25 of the present invention is a single material, rather than a conventional The composite material of the carrier plate can avoid the problem of warpage caused by uneven stress distribution of the insulating layer 25.

The present invention further provides a package structure 2 comprising: an insulating layer 25, a plurality of conductive pillars 21, a wiring layer 20', at least one electronic component 22, and a cladding layer 23.

The insulating layer 25 has opposite first and second surfaces 25a, 25b.

The conductive pillar 21 is embedded in the insulating layer 25 and its end surface 21a is exposed on the first surface 25a of the insulating layer 25.

The circuit layer 20' is embedded on the second surface 25b of the insulating layer 25 and electrically connected to the conductive pillars 21.

The electronic component 22 is disposed on the circuit layer 20' and electrically connected to the circuit layer 20'. For example, the electronic component 22 is an active component, a passive component, or a combination thereof, and the electronic component 22 is electrically connected to the wiring layer 20' in a flip chip manner.

The cladding layer 23 is formed on the wiring layer 20' and the second surface 25b of the insulating layer 25 and covers the electronic component 22.

In one embodiment, the circuit layer 20' defines a power supply connection to the electronic component 22, and the end faces 21a of the conductive pillars 21 are defined as external pads.

In one embodiment, the end surface of the conductive post is flush with the first surface of the insulating layer (not shown).

In one embodiment, the package structure 2 includes a plurality of conductive elements 24 bonded to the first surface 25a of the insulating layer 25 and electrically connected to the end faces 21a of the conductive pillars 21.

The above embodiments are intended to illustrate the principles of the invention and its effects, and are not intended to limit the invention. Any of the above-described embodiments may be modified by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be as set forth in the appended claims.

2‧‧‧Package structure

20’‧‧‧Line layer

21‧‧‧conductive column

21a‧‧‧ end face

22‧‧‧Electronic components

220‧‧‧Electrical bumps

23‧‧‧Cladding

24‧‧‧Conducting components

25‧‧‧Insulation

25a‧‧‧ first surface

25b‧‧‧second surface

Claims (13)

A package structure includes: an insulating layer having opposite first and second surfaces; a plurality of conductive pillars embedded in the insulating layer and having an end surface exposed on a first surface of the insulating layer An external pad; a circuit layer is embedded on the second surface of the insulating layer and covers the conductive posts to electrically connect the conductive posts, wherein the side of the circuit layer is concave; at least one electronic component, The circuit layer is electrically connected to the circuit layer; and a cladding layer is formed on the circuit layer and the second surface of the insulating layer and covers the electronic component. The package structure of claim 1, wherein the circuit layer is electrically connected to the electronic component. The package structure of claim 1, wherein the end surface of the conductive post is flush with the first surface of the insulating layer. The package structure of claim 1, wherein the electronic component is an active component, a passive component, or a combination thereof. The package structure of claim 1, wherein the electronic component is electrically connected to the circuit layer in a flip chip manner. The package structure of claim 1, further comprising a plurality of conductive elements formed on the first surface of the insulating layer and electrically connected to the conductive pillars. A method of manufacturing a package structure includes: Forming a plurality of conductive pillars on a conductor layer; forming an insulating layer on the conductor layer and the conductive pillars, wherein the insulating layer has opposite first and second surfaces, and the end faces of the conductive pillars The first surface of the insulating layer is exposed as an external pad; a part of the material of the conductive layer is removed, and the conductive layer is used as a circuit layer, wherein the circuit layer covers the conductive pillars to electrically connect the conductive pillars. And the side of the circuit layer is concave; at least one electronic component is disposed on the circuit layer, and the electronic component is electrically connected to the circuit layer; and a coating is formed on the circuit layer and the second surface of the insulating layer a layer that causes the cladding to encapsulate the electronic component. A method for fabricating a package structure includes: forming a plurality of conductive pillars on a conductor layer; forming an insulating layer on the conductor layer and the conductive pillars, and completely covering the conductive pillars, wherein the conductive pillars The insulating layer has opposite first and second surfaces; the insulating layer is removed, and the end faces of the conductive pillars are exposed on the first surface of the insulating layer as an external pad; part of the material of the conductive layer is removed The conductive layer is used as a circuit layer, wherein the circuit layer covers the conductive pillars to electrically connect the conductive pillars, and the side of the circuit layer is concave; at least one electronic component is disposed on the circuit layer, and The electronic component is electrically connected to the circuit layer; Forming a cladding layer on the circuit layer and the second surface of the insulating layer, so that the cladding layer covers the electronic component. The method of fabricating a package structure according to claim 7 or 8, wherein the circuit layer is electrically connected to the electronic component. The method of fabricating a package structure according to claim 7 or 8, wherein the end surface of the conductive post is flush with the first surface of the insulating layer. The method of manufacturing a package structure according to claim 7 or 8, wherein the electronic component is an active component, a passive component, or a combination thereof. The method of fabricating a package structure according to claim 7 or 8, wherein the electronic component is electrically connected to the circuit layer in a flip chip manner. The method for manufacturing a package structure according to claim 7 or 8, further comprising forming a plurality of conductive elements on the first surface of the insulating layer, and the conductive elements are electrically connected to the conductive pillars.