TWI569911B - Cutting path marker of circular saw - Google Patents
Cutting path marker of circular saw Download PDFInfo
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- TWI569911B TWI569911B TW103144062A TW103144062A TWI569911B TW I569911 B TWI569911 B TW I569911B TW 103144062 A TW103144062 A TW 103144062A TW 103144062 A TW103144062 A TW 103144062A TW I569911 B TWI569911 B TW I569911B
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Description
本發明與圓鋸機有關,特別是指一種用於圓鋸機之鋸切標示機構。The invention relates to a circular sawing machine, and in particular to a sawing and marking mechanism for a circular sawing machine.
為了方便操作人員對工件進行切割,目前的圓鋸機大多都會配備一雷射光產生器,藉由雷射光產生器之雷射光束所擴散形成之發光平面在工件表面形成一雷射標示線,讓鋸片能夠確實透過雷射標示線對準工件的切割線,以確保具有良好的鋸切精度。In order to facilitate the operator to cut the workpiece, most of the current circular sawing machines are equipped with a laser light generator, and a laser marking plane formed by the diffusion of the laser beam of the laser light generator forms a laser marking line on the surface of the workpiece, so that The saw blade can be aligned with the cutting line of the workpiece through the laser marking line to ensure good sawing accuracy.
就調整雷射模組的過程來說,目前常見的方式是將雷射模組之雷射光束所擴散形成之發光平面照射於鋸片之其中一側,使雷射標示線緊鄰於工件的切割線,這時候的操作人員如果沒有仔細判斷兩者之間的相對位置關係,很容易將工件裁切出錯誤的尺寸。雖然使用兩組雷射光產生器可以改善上述問題,但是兩組雷射光產生器在結構配置上會相對較為複雜,而且需要個別進行角度上的調整,所以在調整上會耗費比較多的時間,在鋸切精度上也可能會因此產生比較大的誤差。In the process of adjusting the laser module, the common way is to illuminate the light emitting plane formed by the laser beam of the laser module on one side of the saw blade, so that the laser marking line is adjacent to the cutting of the workpiece. Line, at this time the operator can easily cut the workpiece to the wrong size without carefully judging the relative positional relationship between the two. Although the use of two sets of laser light generators can improve the above problems, the two sets of laser light generators are relatively complicated in structure configuration, and need to be individually adjusted in angle, so it takes a lot of time to adjust. Saw cutting precision may also cause relatively large errors.
本發明之主要目的在於提供一種用於圓鋸機之鋸切標示機構,其結構簡單且能有效提升鋸切精度。The main object of the present invention is to provide a sawing and marking mechanism for a circular sawing machine, which has a simple structure and can effectively improve the cutting precision.
為了達成上述目的,本發明之鋸切標示機構包含有一工作台、一鋸片,以及一雷射模組。該工作台用以置放一工件,該鋸片設於該工作台的上方,該雷射模組設於該鋸片的上方且對該工作台發射至少一雷射光束,該雷射光束被該鋸片所局部遮蔽而在該工作台之表面形成一鋸路,該鋸路之寬度介於2.8mm~3.5mm之間。藉此,該鋸片便能沿著該鋸路對該工件進行鋸切作業。In order to achieve the above object, the sawing marking mechanism of the present invention comprises a work table, a saw blade, and a laser module. The workbench is configured to place a workpiece, the saw blade is disposed above the workbench, the laser module is disposed above the saw blade and emits at least one laser beam to the workbench, the laser beam is The saw blade is partially shielded to form a sawing path on the surface of the table, and the width of the sawing path is between 2.8 mm and 3.5 mm. Thereby, the saw blade can perform a sawing operation on the workpiece along the sawing path.
在本發明之第1實施例中,該雷射模組與該鋸片之間的距離介於20mm~25mm之間,而且,該雷射模組具有一雷射光產生器,該雷射光產生器對該工作台發射該雷射光束,該雷射光束在該鋸片之頂緣所形成的寬度介於4.8mm~5mm之間,且該雷射光束在該工作台之表面所形成的寬度介於6mm~6.5mm之間,如此即能讓該鋸路產生最佳的寬度。In the first embodiment of the present invention, the distance between the laser module and the saw blade is between 20 mm and 25 mm, and the laser module has a laser light generator. The laser light generator The laser beam is emitted from the worktable, and the width of the laser beam formed on the top edge of the saw blade is between 4.8 mm and 5 mm, and the width of the laser beam formed on the surface of the table is Between 6mm~6.5mm, this can make the sawing road produce the best width.
在本發明之第2實施例中,該雷射模組與該鋸片之間的距離介於20mm~25mm之間,而且,該雷射模組具有二呈並排設置之雷射光產生器,該二雷射光產生器分別對該工作台發射一該雷射光束,該二雷射光束在該鋸片之頂緣所形成的總寬度為4mm~5mm,且該二雷射光束在該工作台之表面所形成的總寬度為6mm~6.5mm,如此即能讓該鋸路產生最佳的寬度。In the second embodiment of the present invention, the distance between the laser module and the saw blade is between 20 mm and 25 mm, and the laser module has two laser light generators arranged side by side. The two laser light generators respectively emit a laser beam to the workbench, the total width of the two laser beams formed on the top edge of the saw blade is 4 mm to 5 mm, and the two laser beams are at the workbench The total width of the surface is 6mm~6.5mm, which allows the saw to produce the optimum width.
請先參閱第1圖,本發明第1實施例之鋸切標示調整機構10包含有一工作台20、一鋸片30,以及一雷射模組40。Referring to FIG. 1 , the sawing and marking adjustment mechanism 10 of the first embodiment of the present invention includes a work table 20 , a saw blade 30 , and a laser module 40 .
工作台20主要是用來固定一待加工工件。The table 20 is mainly used to fix a workpiece to be processed.
鋸片30位於工作台20的上方且安裝於一鋸臂(圖中未示),鋸臂樞設於工作台20,使得鋸片30可受鋸臂之帶動而相對工作台20上升或下降。The saw blade 30 is located above the table 20 and is mounted on a saw arm (not shown). The saw arm is pivotally mounted on the table 20 such that the saw blade 30 can be raised or lowered relative to the table 20 by the saw arm.
雷射模組40設於鋸片30的上方且與鋸片30之間的距離D1介於20mm~25mm之間(其中以20mm為最佳距離),而與工作台20之間的距離D2介於500mm~520mm之間(其中以500mm為最佳距離)。此外,雷射模組40具有一固定座42與一雷射光產生器44,雷射光產生器44設於固定座42內且朝工作台20的方向發射一雷射光束L,雷射光束L在鋸片30之頂緣(亦即在距離雷射模組40約20mm~25mm的位置)所形成的寬度W1介於4.8mm~5mm之間,同時在工作台20之表面(亦即在距離雷射模組40約500mm~520mm的位置)所形成的寬度W2介於6mm~6.5mm之間,另外利用光直線行進的原理,雷射光束L會被鋸片30所局部遮蔽而在工作台20之表面產生陰影,此一陰影即形成供鋸片30鋸切之一鋸路12,鋸路12之寬度W3介於2.8mm~3.5mm之間。The laser module 40 is disposed above the saw blade 30 and has a distance D1 between the saw blade 30 of 20 mm to 25 mm (in which the optimum distance is 20 mm), and the distance D2 from the table 20 is introduced. Between 500mm~520mm (500mm is the best distance). In addition, the laser module 40 has a fixing base 42 and a laser light generator 44. The laser light generator 44 is disposed in the fixing base 42 and emits a laser beam L in the direction of the table 20, and the laser beam L is in the The top edge of the saw blade 30 (i.e., at a position of about 20 mm to 25 mm from the laser module 40) has a width W1 of between 4.8 mm and 5 mm, and is at the surface of the table 20 (i.e., at a distance from the thunder). The width W2 formed by the firing module 40 at a position of about 500 mm to 520 mm is between 6 mm and 6.5 mm. In addition, the laser beam L is partially shielded by the saw blade 30 on the table 20 by the principle of straight traveling light. The surface is shaded, and this shadow forms a sawing path 12 for sawing the saw blade 30. The width W3 of the sawing path 12 is between 2.8 mm and 3.5 mm.
為了降低對單一雷射光產生器44在亮度等級與發射角度上的要求,在本發明之第2實施例中,雷射模組40之固定座42內以並排方式設置兩組雷射光產生器44,如第2及3圖所示,使兩組雷射光產生器44之雷射光束L可以彼此相鄰(但不一定要相接在一起),如此一來,每一道雷射光束L只要在鋸片30之頂緣(亦即在距離雷射模組40約20mm~25mm的位置)所形成的寬度為1.5mm~2.5mm,亦即形成的總寬度W4為4mm~5mm,且在工作台20之表面(亦即在距離雷射模組40約500mm~520mm的位置)所形成的總寬度為6mm~6.5mm,而產生寬度W5的陰影鋸路為3mm的狀況下,即可達到與前述實施例相同的效果。此外,雷射模組40具有一波浪鏡片46,波浪鏡片46設於該二雷射光束L之路徑上,亦即該二雷射光產生器44使用同一個波浪鏡片46,這樣一方面可以節省雷射模組40的體積 ,另一方面還可以避免因為要確保兩條雷射光束L之間的平行度而分別對兩組雷射光產生器44進行調整,以降低調整上的難度。In order to reduce the requirement of the brightness level and the emission angle of the single laser light generator 44, in the second embodiment of the present invention, two sets of laser light generators 44 are disposed side by side in the fixed seat 42 of the laser module 40. As shown in Figures 2 and 3, the laser beams L of the two sets of laser light generators 44 can be adjacent to each other (but not necessarily connected together), so that each of the laser beams L is only The top edge of the saw blade 30 (that is, at a position of about 20 mm to 25 mm from the laser module 40) has a width of 1.5 mm to 2.5 mm, that is, a total width W4 of 4 mm to 5 mm is formed, and is on the workbench. The total width formed by the surface of 20 (i.e., at a position of about 500 mm to 520 mm from the laser module 40) is 6 mm to 6.5 mm, and the shadow sawing path having a width W5 is 3 mm. The same effect as the embodiment. In addition, the laser module 40 has a wave lens 46, and the wave lens 46 is disposed on the path of the two laser beams L, that is, the two laser light generators 44 use the same wave lens 46. The volume of the firing module 40, on the other hand, can also avoid adjusting the two sets of laser light generators 44 separately to ensure the parallelism between the two laser beams L to reduce the difficulty of adjustment.
綜上所陳,本發明之鋸切標示機構10將雷射模組40設置在特定的距離,同時配合鋸片30對雷射光束L所造成的遮蔽效果,使雷射光束L能夠在工作台20產生具有高精確度的鋸路12,就算雷射模組40受到外力影響而有些許的位移或者因更換鋸片30所產生的厚度差異,仍然能夠讓鋸路12保持相當良好的準確性,以達到提高鋸切精度的目的。In summary, the sawing and marking mechanism 10 of the present invention sets the laser module 40 at a specific distance while cooperating with the shielding effect of the saw blade 30 on the laser beam L, so that the laser beam L can be placed on the workbench. 20 Producing a saw 12 having high precision, even if the laser module 40 is affected by an external force and has a slight displacement or a difference in thickness due to the replacement of the saw blade 30, the saw 12 can still maintain a fairly good accuracy. In order to achieve the purpose of improving the precision of sawing.
10‧‧‧鋸切標示機構
12‧‧‧鋸路
20‧‧‧工作台
30‧‧‧鋸片
40‧‧‧雷射模組
42‧‧‧固定座
44‧‧‧雷射光產生器
L‧‧‧雷射光束
D1、D2‧‧‧距離
W1~W5‧‧‧寬度
46‧‧‧波浪鏡片10‧‧‧ sawing and marking mechanism
12‧‧‧Saw Road
20‧‧‧Workbench
30‧‧‧Saw blade
40‧‧‧Laser module
42‧‧‧ fixed seat
44‧‧‧Laser light generator
L‧‧‧Laser beam
D1, D2‧‧‧ distance
W1~W5‧‧‧Width
46‧‧‧ Wave lenses
第1圖為本發明第1實施例之結構示意圖。 第2圖為本發明第2實施例之結構示意圖。 第3圖為本發明第2實施例之雷射模組的立體圖。Fig. 1 is a schematic view showing the structure of a first embodiment of the present invention. Fig. 2 is a schematic view showing the structure of a second embodiment of the present invention. Fig. 3 is a perspective view of a laser module according to a second embodiment of the present invention.
10‧‧‧鋸切標示機構 10‧‧‧ sawing and marking mechanism
12‧‧‧鋸路 12‧‧‧Saw Road
20‧‧‧工作台 20‧‧‧Workbench
30‧‧‧鋸片 30‧‧‧Saw blade
40‧‧‧雷射模組 40‧‧‧Laser module
42‧‧‧固定座 42‧‧‧ fixed seat
44‧‧‧雷射光產生器 44‧‧‧Laser light generator
L‧‧‧雷射光束 L‧‧‧Laser beam
D1、D2‧‧‧距離 D1, D2‧‧‧ distance
W1~W5‧‧‧寬度 W1~W5‧‧‧Width
46‧‧‧波浪鏡片 46‧‧‧ Wave lenses
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TW103144062A TWI569911B (en) | 2014-12-17 | 2014-12-17 | Cutting path marker of circular saw |
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TW103144062A TWI569911B (en) | 2014-12-17 | 2014-12-17 | Cutting path marker of circular saw |
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TW201622855A TW201622855A (en) | 2016-07-01 |
TWI569911B true TWI569911B (en) | 2017-02-11 |
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Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM261905U (en) * | 2004-09-27 | 2005-04-11 | Sean & Stephen Corp | Laser module with parallel output beams |
TWM265150U (en) * | 2004-09-24 | 2005-05-21 | Lecc Technology Co Ltd | Unsophisticated dual beam laser apparatus |
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM265150U (en) * | 2004-09-24 | 2005-05-21 | Lecc Technology Co Ltd | Unsophisticated dual beam laser apparatus |
TWM261905U (en) * | 2004-09-27 | 2005-04-11 | Sean & Stephen Corp | Laser module with parallel output beams |
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