CN105773312A - Sawing marking mechanism for circular sawing machine - Google Patents
Sawing marking mechanism for circular sawing machine Download PDFInfo
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- CN105773312A CN105773312A CN201410802334.0A CN201410802334A CN105773312A CN 105773312 A CN105773312 A CN 105773312A CN 201410802334 A CN201410802334 A CN 201410802334A CN 105773312 A CN105773312 A CN 105773312A
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- laser
- sawing
- workbench
- saw blade
- marking mechanism
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Abstract
The invention discloses a sawing marking mechanism for a circular sawing machine. The sawing marking mechanism comprises a workbench, a saw blade and a laser module, wherein the saw blade is arranged on the workbench; and the laser module is arranged above the saw blade and transmits a laser beam towards the workbench, the laser beam can be partially shielded by the saw blade to form a sawing route on the surface of the workbench so that the saw blade can be used for sawing a workpiece along the sawing route, and furthermore the aim of improving the sawing precision can be achieved.
Description
Technical field
The present invention is relevant with circular sawing machine, particularly relates to a kind of sawing marking mechanism for circular sawing machine.
Background technology
In order to facilitate operator that workpiece is cut, current circular sawing machine all can be equipped with a laser light generator mostly, the luminous flat diffuseed to form by the laser beam of laser light generator forms a laser marker line at surface of the work, saw blade is allowed can really to pass through the line of cut of laser marker line alignment pieces, to guarantee to have good sawing precision.
Just adjust the process of laser module, mode common at present is that the luminous flat that the laser beam of laser module diffuses to form is irradiated in the wherein side of saw blade, laser marker line is made to be in close proximity to the line of cut of workpiece, operator at this time are without the relative position relation carefully judged between the two, it is easy to workpiece cuts out the size of mistake.Although using two groups of laser light generators can improve the problems referred to above, but two groups of laser light generators can be relatively complicated on structure configures, and need the adjustment carrying out individually in angle, so relatively more time can be expended on adjusting, sawing precision is likely to and can therefore produce relatively larger error.
Summary of the invention
It is an object of the invention to provide a kind of sawing marking mechanism for circular sawing machine, its simple in construction and can effectively promote sawing precision.
For achieving the above object, sawing marking mechanism provided by the invention includes a workbench, a saw blade and a laser module.This workbench is in order to put a workpiece, this saw blade is located at the top of this workbench, this laser module is located at the top of this saw blade and this workbench is launched at least one laser beam, this laser beam by this saw blade local cover and form a swage set on the surface of this workbench, the width of this swage set is between 2.8mm～3.5mm.Thus, this workpiece just can be carried out sawing operation along this swage set by this saw blade.
In the first embodiment of the present invention, distance between this laser module and this saw blade is between 20mm～25mm, and, this laser module has a laser light generator, this workbench is launched this laser beam by this laser light generator, the width that this laser beam is formed at the apical margin of this saw blade is between 4.8mm～5mm, and the width that this laser beam is formed on the surface of this workbench is between 6mm～6.5mm, and this swage set so can be allowed to produce best width.
In the second embodiment of the present invention, distance between this laser module and this saw blade is between 20mm～25mm, and, this laser module has two in the laser light generator being arranged side by side, this workbench is launched this laser beam by this dual-laser photogenerator respectively, the overall width that this dual-laser bundle is formed at the apical margin of this saw blade is 4mm～5mm, and the overall width that this dual-laser bundle is formed on the surface of this workbench is 6mm～6.5mm, and this swage set so can be allowed to produce best width.
Accompanying drawing explanation
Fig. 1 is the structural representation of first embodiment of the invention.
Fig. 2 is the structural representation of second embodiment of the invention.
Fig. 3 is the axonometric chart of the laser module of second embodiment of the invention.
Symbol description in accompanying drawing
10 sawing marking mechanisms；12 swage sets；20 workbench；30 saw blades；40 laser modules；42 fixing seats；44 laser light generators；L laser beam；D1, D2 distance；W1～W5 width；46 wave eyeglasses.
Detailed description of the invention
Please referring initially to Fig. 1, the sawing of first embodiment of the invention indicates guiding mechanism 10 and includes workbench 20, saw blade 30 and a laser module 40.
Workbench 20 is primarily used to fix a workpiece to be processed.
Saw blade 30 is positioned at the top of workbench 20 and is installed on a saw arm (not shown), and saw arm is hubbed at workbench 20 so that saw blade 30 can be risen or fallen by relative workbench 20 by the drive of saw arm.
Laser module 40 be located at saw blade 30 top and and saw blade 30 between distance D1 between 20mm～25mm (wherein with 20mm for optimum distance), and and distance D2 between workbench 20 between 500mm～520mm (wherein with 500mm for optimum distance).nullIn addition，Laser module 40 has fixing seat 42 and a laser light generator 44，Laser light generator 44 is located at interior and towards workbench 20 the direction of fixing seat 42 and is launched a laser beam L，Laser beam L at apical margin (that is in position of distance laser module 40 about 20mm～25mm) the width W1 that formed of saw blade 30 between 4.8mm～5mm，The width W2 simultaneously formed on the surface (that is in position of distance laser module 40 about 500mm～520mm) of workbench 20 is between 6mm～6.5mm，Furthermore with the principle that light straight line is advanced，Laser beam L can by saw blade 30 local cover and the surface of workbench 20 produce shade，Namely this shade forms the swage set 12 for saw blade 30 sawing，The width W3 of swage set 12 is between 2.8mm～3.5mm.
nullIn order to reduce single laser light generator 44 in brightness degree and the requirement launched in angle，In the second embodiment of the present invention，Two groups of laser light generators 44 are set in the fixing seat 42 of laser module 40 in a side-by-side fashion，As shown in Figures 2 and 3，Make the laser beam L of two groups of laser light generators 44 can (but be not necessarily intended to and be connected together) adjacent one another are，Thus，As long as every one laser beam L is 1.5mm～2.5mm at apical margin (that is in position of the distance laser module 40 about 20mm～25mm) width that formed of saw blade 30，That is the overall width W4 formed is 4mm～5mm，And be 6mm～6.5mm at surface (that is in position of the distance laser module 40 about 500mm～520mm) overall width that formed of workbench 20，And produce under the situation that shade swage set is 3mm of width W5，The effect identical with previous embodiment can be reached.In addition, laser module 40 has a wave eyeglass 46, wave eyeglass 46 is located on the path of this dual-laser bundle L, that is this dual-laser photogenerator 44 uses same wave eyeglass 46, the volume of laser module 40 can be saved so on the one hand, can also avoid respectively two groups of laser light generators 44 being adjusted because to guarantee the depth of parallelism between two laser beam L on the other hand, to reduce the difficulty on adjusting.
To sum up institute is old, laser module 40 is arranged on specific distance by the sawing marking mechanism 10 of the present invention, coordinate saw blade 30 to the laser beam L screening effect caused simultaneously, laser beam L is enable to produce the swage set 12 with pinpoint accuracy at workbench 20, even if laser module 40 is subject to external force impact and has a little displacement or because changing difference in thickness produced by saw blade 30, remain able to allow swage set 12 keep quite good accuracy, to reach to improve the purpose of sawing precision.
Claims (6)
1., for a sawing marking mechanism for circular sawing machine, include:
One workbench；
One saw blade, is located at the top of this workbench；And
One laser module, is located at the top of this saw blade and this workbench is launched at least one laser beam, and this laser beam is covered by this saw blade local and forms a swage set on the surface of this workbench, and the width of this swage set is between 2.8mm～3.5mm.
2. according to claim 1 for the sawing marking mechanism of circular sawing machine, wherein, this laser module has a laser light generator, this workbench is launched this laser beam by this laser light generator, the width that this laser beam is formed at the apical margin of this saw blade is between 4.8mm～5mm, and the width that this laser beam is formed on the surface of this workbench is between 6mm～6.5mm.
3., according to claim 2 for the sawing marking mechanism of circular sawing machine, wherein, the distance between this laser module and this saw blade is between 20mm～25mm.
4. according to claim 1 for the sawing marking mechanism of circular sawing machine, wherein, this laser module has two in the laser light generator being arranged side by side, this workbench is launched this laser beam by this dual-laser photogenerator respectively, the overall width that this dual-laser bundle is formed at the apical margin of this saw blade is 4mm～5mm, and the overall width that this dual-laser bundle is formed on the surface of this workbench is 6mm～6.5mm.
5., according to claim 4 for the sawing lane marking mechanism of circular sawing machine, wherein, the distance between this laser module and this saw blade is between 20mm～25mm.
6., according to claim 5 for the sawing lane marking mechanism of circular sawing machine, wherein, this laser module has a wave eyeglass, and this wave eyeglass is located on the path of this dual-laser bundle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410802334.0A CN105773312A (en) | 2014-12-22 | 2014-12-22 | Sawing marking mechanism for circular sawing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410802334.0A CN105773312A (en) | 2014-12-22 | 2014-12-22 | Sawing marking mechanism for circular sawing machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105773312A true CN105773312A (en) | 2016-07-20 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410802334.0A Pending CN105773312A (en) | 2014-12-22 | 2014-12-22 | Sawing marking mechanism for circular sawing machine |
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| CN (1) | CN105773312A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1494979A (en) * | 2002-06-19 | 2004-05-12 | 德尔塔国际机械公司 | Cutter with optical alignment system |
| US20060265206A1 (en) * | 2001-09-07 | 2006-11-23 | Hitachi Koki Co., Ltd. | Portable circular power saw with optical alignment |
| CN200948516Y (en) * | 2006-07-17 | 2007-09-19 | 王骥 | Electric cutting machine having laser indicator |
| CN201058385Y (en) * | 2005-04-13 | 2008-05-14 | 布莱克和戴克公司 | Saw for cutting |
| CN101852611A (en) * | 2009-03-30 | 2010-10-06 | 南京德朔实业有限公司 | Homologous double-laser line marking device applied to tool and line marking method thereof |
| CN102233596A (en) * | 2010-04-28 | 2011-11-09 | 罗伯特·博世有限公司 | Laser alignment system for saw |
-
2014
- 2014-12-22 CN CN201410802334.0A patent/CN105773312A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060265206A1 (en) * | 2001-09-07 | 2006-11-23 | Hitachi Koki Co., Ltd. | Portable circular power saw with optical alignment |
| CN1494979A (en) * | 2002-06-19 | 2004-05-12 | 德尔塔国际机械公司 | Cutter with optical alignment system |
| CN201058385Y (en) * | 2005-04-13 | 2008-05-14 | 布莱克和戴克公司 | Saw for cutting |
| CN200948516Y (en) * | 2006-07-17 | 2007-09-19 | 王骥 | Electric cutting machine having laser indicator |
| CN101852611A (en) * | 2009-03-30 | 2010-10-06 | 南京德朔实业有限公司 | Homologous double-laser line marking device applied to tool and line marking method thereof |
| CN102233596A (en) * | 2010-04-28 | 2011-11-09 | 罗伯特·博世有限公司 | Laser alignment system for saw |
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| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160720 |