TWI567844B - Layout structure of electronic element and testing method of the same thereof - Google Patents

Layout structure of electronic element and testing method of the same thereof Download PDF

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Publication number
TWI567844B
TWI567844B TW102102050A TW102102050A TWI567844B TW I567844 B TWI567844 B TW I567844B TW 102102050 A TW102102050 A TW 102102050A TW 102102050 A TW102102050 A TW 102102050A TW I567844 B TWI567844 B TW I567844B
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TW
Taiwan
Prior art keywords
same
testing method
electronic element
layout structure
layout
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Application number
TW102102050A
Other versions
TW201430979A (en
Inventor
Chun Ming Chang
Chun Liang Hou
Wen Jung Liao
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United Microelectronics Corp
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Publication date
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Priority to TW102102050A priority Critical patent/TWI567844B/en
Publication of TW201430979A publication Critical patent/TW201430979A/en
Application granted granted Critical
Publication of TWI567844B publication Critical patent/TWI567844B/en

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TW102102050A 2013-01-18 2013-01-18 Layout structure of electronic element and testing method of the same thereof TWI567844B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW102102050A TWI567844B (en) 2013-01-18 2013-01-18 Layout structure of electronic element and testing method of the same thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW102102050A TWI567844B (en) 2013-01-18 2013-01-18 Layout structure of electronic element and testing method of the same thereof

Publications (2)

Publication Number Publication Date
TW201430979A TW201430979A (en) 2014-08-01
TWI567844B true TWI567844B (en) 2017-01-21

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW102102050A TWI567844B (en) 2013-01-18 2013-01-18 Layout structure of electronic element and testing method of the same thereof

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TW (1) TWI567844B (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5508631A (en) * 1994-10-27 1996-04-16 Mitel Corporation Semiconductor test chip with on wafer switching matrix
TW200933760A (en) * 2007-08-16 2009-08-01 Micron Technology Inc Microelectronic die packages with leadframes, including leadframe-based interposer for stacked die packages, and associated systems and methods
TW201128742A (en) * 2010-02-12 2011-08-16 Cyntec Co Ltd Electronic package structure
US20120155049A1 (en) * 2010-12-17 2012-06-21 Tessera Research Llc Enhanced stacked microelectronic assemblies with central contacts

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5508631A (en) * 1994-10-27 1996-04-16 Mitel Corporation Semiconductor test chip with on wafer switching matrix
TW200933760A (en) * 2007-08-16 2009-08-01 Micron Technology Inc Microelectronic die packages with leadframes, including leadframe-based interposer for stacked die packages, and associated systems and methods
TW201128742A (en) * 2010-02-12 2011-08-16 Cyntec Co Ltd Electronic package structure
US20120155049A1 (en) * 2010-12-17 2012-06-21 Tessera Research Llc Enhanced stacked microelectronic assemblies with central contacts

Also Published As

Publication number Publication date
TW201430979A (en) 2014-08-01

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