TWI563580B - - Google Patents

Info

Publication number
TWI563580B
TWI563580B TW103119855A TW103119855A TWI563580B TW I563580 B TWI563580 B TW I563580B TW 103119855 A TW103119855 A TW 103119855A TW 103119855 A TW103119855 A TW 103119855A TW I563580 B TWI563580 B TW I563580B
Authority
TW
Taiwan
Application number
TW103119855A
Other languages
Chinese (zh)
Other versions
TW201511150A (zh
Inventor
Michitaka Mikami
Bin Liu
Hiroyuki Amano
takuya Hamamoto
Yoshiyuki Imaizumi
Yuka Nagae
Tsutomu Yamashita
Original Assignee
Tanaka Electronics Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Electronics Ind filed Critical Tanaka Electronics Ind
Publication of TW201511150A publication Critical patent/TW201511150A/zh
Application granted granted Critical
Publication of TWI563580B publication Critical patent/TWI563580B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/43—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H01L2224/438—Post-treatment of the connector
    • H01L2224/43848—Thermal treatments, e.g. annealing, controlled cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45014—Ribbon connectors, e.g. rectangular cross-section
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45015—Cross-sectional shape being circular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/4554—Coating
    • H01L2224/45565—Single coating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H01L2224/85207—Thermosonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
TW103119855A 2013-06-13 2014-06-09 超聲波焊接用鍍覆銅線之結構 TW201511150A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013124903A JP5546670B1 (ja) 2013-06-13 2013-06-13 超音波接合用コーティング銅ワイヤの構造

Publications (2)

Publication Number Publication Date
TW201511150A TW201511150A (zh) 2015-03-16
TWI563580B true TWI563580B (fr) 2016-12-21

Family

ID=51409577

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103119855A TW201511150A (zh) 2013-06-13 2014-06-09 超聲波焊接用鍍覆銅線之結構

Country Status (4)

Country Link
JP (1) JP5546670B1 (fr)
CN (1) CN104241237B (fr)
SG (1) SG10201403091UA (fr)
TW (1) TW201511150A (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6167227B2 (ja) 2014-04-21 2017-07-19 新日鉄住金マテリアルズ株式会社 半導体装置用ボンディングワイヤ
WO2016189752A1 (fr) * 2015-05-26 2016-12-01 日鉄住金マイクロメタル株式会社 Fil de connexion pour dispositif à semi-conducteur
WO2016189758A1 (fr) * 2015-05-26 2016-12-01 日鉄住金マイクロメタル株式会社 Fil de connexion pour dispositif à semi-conducteur
EP3131113B1 (fr) 2015-06-15 2023-11-29 Nippon Micrometal Corporation Fil de connexion pour dispositif à semi-conducteur
JP5893230B1 (ja) 2015-07-23 2016-03-23 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
CN106463495B (zh) * 2015-08-12 2020-09-04 日铁新材料股份有限公司 半导体装置用接合线
JP6410692B2 (ja) * 2015-08-28 2018-10-24 田中電子工業株式会社 銅合金ボンディングワイヤ
WO2017221434A1 (fr) * 2016-06-20 2017-12-28 日鉄住金マイクロメタル株式会社 Fil de connexion pour dispositif à semi-conducteurs

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06151497A (ja) * 1992-11-10 1994-05-31 Tanaka Denshi Kogyo Kk 半導体素子のボンディング用ワイヤ並びにその製造方法
JP2009088132A (ja) * 2007-09-28 2009-04-23 Tanaka Electronics Ind Co Ltd ボンディングワイヤ
US20120104613A1 (en) * 2007-07-24 2012-05-03 Nippon Micrometal Corporation Bonding wire for semiconductor device
WO2013018238A1 (fr) * 2011-08-01 2013-02-07 タツタ電線株式会社 Fil de soudage par boule

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0750720B2 (ja) * 1989-11-08 1995-05-31 株式会社東芝 ボンディングワイヤ及びこれを有する半導体装置
JPH06283565A (ja) * 1993-03-29 1994-10-07 Nippon Steel Corp 高周波用ボンディングワイヤー
JPH09246310A (ja) * 1996-03-04 1997-09-19 Hitachi Ltd 半導体装置
KR100280084B1 (ko) * 1998-12-29 2001-03-02 마이클 디. 오브라이언 반도체 장치용 와이어
TW200414453A (en) * 2002-03-26 2004-08-01 Sumitomo Electric Wintec Inc Bonding wire and IC device using the bonding wire
JP2005129603A (ja) * 2003-10-22 2005-05-19 Mitsumi Electric Co Ltd 半導体集積回路装置
JP5381816B2 (ja) * 2010-03-03 2014-01-08 三菱電機株式会社 ワイヤボンディング方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06151497A (ja) * 1992-11-10 1994-05-31 Tanaka Denshi Kogyo Kk 半導体素子のボンディング用ワイヤ並びにその製造方法
US20120104613A1 (en) * 2007-07-24 2012-05-03 Nippon Micrometal Corporation Bonding wire for semiconductor device
JP2009088132A (ja) * 2007-09-28 2009-04-23 Tanaka Electronics Ind Co Ltd ボンディングワイヤ
WO2013018238A1 (fr) * 2011-08-01 2013-02-07 タツタ電線株式会社 Fil de soudage par boule

Also Published As

Publication number Publication date
CN104241237A (zh) 2014-12-24
TW201511150A (zh) 2015-03-16
CN104241237B (zh) 2017-04-12
JP5546670B1 (ja) 2014-07-09
SG10201403091UA (en) 2015-01-29
JP2015002213A (ja) 2015-01-05

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees