TWI563562B - Showerhead insulator and etch chamber liner - Google Patents
Showerhead insulator and etch chamber linerInfo
- Publication number
- TWI563562B TWI563562B TW103119762A TW103119762A TWI563562B TW I563562 B TWI563562 B TW I563562B TW 103119762 A TW103119762 A TW 103119762A TW 103119762 A TW103119762 A TW 103119762A TW I563562 B TWI563562 B TW I563562B
- Authority
- TW
- Taiwan
- Prior art keywords
- showerhead
- insulator
- etch chamber
- chamber liner
- liner
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
- H01J37/32633—Baffles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
- H01J37/32449—Gas control, e.g. control of the gas flow
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US2022908P | 2008-01-10 | 2008-01-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201440143A TW201440143A (zh) | 2014-10-16 |
TWI563562B true TWI563562B (en) | 2016-12-21 |
Family
ID=40849648
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103119762A TWI563562B (en) | 2008-01-10 | 2009-01-10 | Showerhead insulator and etch chamber liner |
TW098100874A TWI445078B (zh) | 2008-01-10 | 2009-01-10 | 噴氣頭絕緣器及蝕刻室襯墊 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW098100874A TWI445078B (zh) | 2008-01-10 | 2009-01-10 | 噴氣頭絕緣器及蝕刻室襯墊 |
Country Status (3)
Country | Link |
---|---|
US (2) | US20090178763A1 (zh) |
TW (2) | TWI563562B (zh) |
WO (1) | WO2009089244A1 (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6544902B2 (ja) * | 2014-09-18 | 2019-07-17 | 東京エレクトロン株式会社 | プラズマ処理装置 |
US9790582B2 (en) * | 2015-04-27 | 2017-10-17 | Lam Research Corporation | Long lifetime thermal spray coating for etching or deposition chamber application |
US10233543B2 (en) * | 2015-10-09 | 2019-03-19 | Applied Materials, Inc. | Showerhead assembly with multiple fluid delivery zones |
US9953843B2 (en) * | 2016-02-05 | 2018-04-24 | Lam Research Corporation | Chamber for patterning non-volatile metals |
KR102206515B1 (ko) * | 2016-03-25 | 2021-01-22 | 어플라이드 머티어리얼스, 인코포레이티드 | 고온 프로세싱을 위한 챔버 라이너 |
CN107437490A (zh) * | 2016-05-25 | 2017-12-05 | 北京北方华创微电子装备有限公司 | 内衬、反应腔室及半导体加工设备 |
US11004662B2 (en) * | 2017-02-14 | 2021-05-11 | Lam Research Corporation | Temperature controlled spacer for use in a substrate processing chamber |
RU180256U1 (ru) * | 2017-12-27 | 2018-06-07 | Федеральное государственное автономное образовательное учреждение высшего образования "Национальный исследовательский технологический университет "МИСиС" | Камера для динамического химического протравливания спеченных металлических пеноматериалов в форме трубы и определения их проницаемости жидкостям |
US11239060B2 (en) | 2018-05-29 | 2022-02-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Ion beam etching chamber with etching by-product redistributor |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6063441A (en) * | 1997-12-02 | 2000-05-16 | Applied Materials, Inc. | Processing chamber and method for confining plasma |
US20030019428A1 (en) * | 2001-04-28 | 2003-01-30 | Applied Materials, Inc. | Chemical vapor deposition chamber |
US20070256785A1 (en) * | 2006-05-03 | 2007-11-08 | Sharma Pamarthy | Apparatus for etching high aspect ratio features |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5628829A (en) * | 1994-06-03 | 1997-05-13 | Materials Research Corporation | Method and apparatus for low temperature deposition of CVD and PECVD films |
US6106625A (en) * | 1997-12-02 | 2000-08-22 | Applied Materials, Inc. | Reactor useful for chemical vapor deposition of titanium nitride |
US5997649A (en) * | 1998-04-09 | 1999-12-07 | Tokyo Electron Limited | Stacked showerhead assembly for delivering gases and RF power to a reaction chamber |
US6364949B1 (en) * | 1999-10-19 | 2002-04-02 | Applied Materials, Inc. | 300 mm CVD chamber design for metal-organic thin film deposition |
US6403491B1 (en) * | 2000-11-01 | 2002-06-11 | Applied Materials, Inc. | Etch method using a dielectric etch chamber with expanded process window |
US20030198754A1 (en) * | 2001-07-16 | 2003-10-23 | Ming Xi | Aluminum oxide chamber and process |
JP4666912B2 (ja) * | 2001-08-06 | 2011-04-06 | エー・エス・エムジニテックコリア株式会社 | プラズマで補強した原子層蒸着装置及びこれを利用した薄膜形成方法 |
US6837966B2 (en) * | 2002-09-30 | 2005-01-04 | Tokyo Electron Limeted | Method and apparatus for an improved baffle plate in a plasma processing system |
US20060108069A1 (en) * | 2004-11-19 | 2006-05-25 | Samsung Electronics Co., Ltd. | Plasma reaction chamber and captive silicon electrode plate for processing semiconductor wafers |
US20060172542A1 (en) * | 2005-01-28 | 2006-08-03 | Applied Materials, Inc. | Method and apparatus to confine plasma and to enhance flow conductance |
TWI331770B (en) * | 2005-11-04 | 2010-10-11 | Applied Materials Inc | Apparatus for plasma-enhanced atomic layer deposition |
US20070113783A1 (en) * | 2005-11-19 | 2007-05-24 | Applied Materials, Inc. | Band shield for substrate processing chamber |
US20080110567A1 (en) * | 2006-11-15 | 2008-05-15 | Miller Matthew L | Plasma confinement baffle and flow equalizer for enhanced magnetic control of plasma radial distribution |
US7780866B2 (en) * | 2006-11-15 | 2010-08-24 | Applied Materials, Inc. | Method of plasma confinement for enhancing magnetic control of plasma radial distribution |
US7981262B2 (en) * | 2007-01-29 | 2011-07-19 | Applied Materials, Inc. | Process kit for substrate processing chamber |
-
2008
- 2008-12-30 US US12/345,821 patent/US20090178763A1/en not_active Abandoned
-
2009
- 2009-01-07 WO PCT/US2009/030266 patent/WO2009089244A1/en active Application Filing
- 2009-01-10 TW TW103119762A patent/TWI563562B/zh active
- 2009-01-10 TW TW098100874A patent/TWI445078B/zh active
-
2012
- 2012-10-11 US US13/649,913 patent/US9196462B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6063441A (en) * | 1997-12-02 | 2000-05-16 | Applied Materials, Inc. | Processing chamber and method for confining plasma |
US20030019428A1 (en) * | 2001-04-28 | 2003-01-30 | Applied Materials, Inc. | Chemical vapor deposition chamber |
US20070256785A1 (en) * | 2006-05-03 | 2007-11-08 | Sharma Pamarthy | Apparatus for etching high aspect ratio features |
Also Published As
Publication number | Publication date |
---|---|
TW200952063A (en) | 2009-12-16 |
US20130327480A1 (en) | 2013-12-12 |
TW201440143A (zh) | 2014-10-16 |
WO2009089244A1 (en) | 2009-07-16 |
TWI445078B (zh) | 2014-07-11 |
US9196462B2 (en) | 2015-11-24 |
US20090178763A1 (en) | 2009-07-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI563562B (en) | Showerhead insulator and etch chamber liner | |
SG10201401262UA (en) | Multifrequency capacitively coupled plasma etch chamber | |
EP2030226A4 (en) | plasma etching | |
GB0717430D0 (en) | Atmospheric pressure plasma | |
HK1142844A1 (en) | Showerhead | |
GB201011327D0 (en) | Plasma enhanced compressor | |
EP2178350A4 (en) | CONTROLLER OF A PLASMA TRAINING REGION AND PLASMA PROCESSOR | |
EP2194569A4 (en) | plasma etching | |
GB2451175B (en) | Plasma coating of footwear | |
EP2495757A4 (en) | PLASMA ETCHING PROCESS | |
GB201000729D0 (en) | Plasma depositon apparatus | |
PT2268408T (pt) | Cabeça de chuveiro | |
GB0813170D0 (en) | Insulating liner | |
EP2645497A4 (en) | HIGH FREQUENCY PLASMA IGNITION CANDLE | |
TWI369475B (en) | Vapor chamber and manufacturing method thereof | |
GB0809396D0 (en) | Method of etching | |
AU2009901633A0 (en) | Showerhead assembly | |
GB0804172D0 (en) | Showerhead | |
GB0804294D0 (en) | Insulating liner | |
AU2009903184A0 (en) | Chamber condition | |
AU2010901644A0 (en) | Showerhead Assembly | |
GB0715612D0 (en) | Showerhead | |
AU2008900469A0 (en) | Improved methold of blasting | |
HU0700326D0 (en) | Plasma throner | |
ZA201102877B (en) | Electroimmunisation chamber |