TWI563557B - - Google Patents
Info
- Publication number
- TWI563557B TWI563557B TW103101549A TW103101549A TWI563557B TW I563557 B TWI563557 B TW I563557B TW 103101549 A TW103101549 A TW 103101549A TW 103101549 A TW103101549 A TW 103101549A TW I563557 B TWI563557 B TW I563557B
- Authority
- TW
- Taiwan
Links
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310017593.8A CN103943447B (en) | 2013-01-17 | 2013-01-17 | Plasma processing device and processing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201438091A TW201438091A (en) | 2014-10-01 |
| TWI563557B true TWI563557B (en) | 2016-12-21 |
Family
ID=51191062
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103101549A TW201438091A (en) | 2013-01-17 | 2014-01-16 | Plasma processing apparatus and processing method thereof |
| TW105120430A TWI623034B (en) | 2013-01-17 | 2014-01-16 | Plasma processing device and processing method thereof |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105120430A TWI623034B (en) | 2013-01-17 | 2014-01-16 | Plasma processing device and processing method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103943447B (en) |
| TW (2) | TW201438091A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107546141B (en) * | 2016-06-28 | 2020-12-04 | 中微半导体设备(上海)股份有限公司 | Apparatus and method for monitoring plasma process |
| CN107546094B (en) * | 2016-06-28 | 2019-05-03 | 中微半导体设备(上海)股份有限公司 | Monitor the plasma processing apparatus and method of plasma process processing procedure |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1379458A (en) * | 2001-04-09 | 2002-11-13 | 华邦电子股份有限公司 | Frequency modulation endpoint detecting method and programming device using it |
| CN101174082A (en) * | 2006-10-30 | 2008-05-07 | 应用材料股份有限公司 | Endpoint detection for photomask etching |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1150273A (en) * | 1997-08-05 | 1999-02-23 | Olympus Optical Co Ltd | End point detector for plasma etcher |
| US5964980A (en) * | 1998-06-23 | 1999-10-12 | Vlsi Technology, Inc. | Fitted endpoint system |
| US6160621A (en) * | 1999-09-30 | 2000-12-12 | Lam Research Corporation | Method and apparatus for in-situ monitoring of plasma etch and deposition processes using a pulsed broadband light source |
| US8728587B2 (en) * | 2011-06-24 | 2014-05-20 | Varian Semiconductor Equipment Associates, Inc. | Closed loop process control of plasma processed materials |
-
2013
- 2013-01-17 CN CN201310017593.8A patent/CN103943447B/en active Active
-
2014
- 2014-01-16 TW TW103101549A patent/TW201438091A/en unknown
- 2014-01-16 TW TW105120430A patent/TWI623034B/en active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1379458A (en) * | 2001-04-09 | 2002-11-13 | 华邦电子股份有限公司 | Frequency modulation endpoint detecting method and programming device using it |
| CN101174082A (en) * | 2006-10-30 | 2008-05-07 | 应用材料股份有限公司 | Endpoint detection for photomask etching |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103943447B (en) | 2017-02-08 |
| CN103943447A (en) | 2014-07-23 |
| TW201707082A (en) | 2017-02-16 |
| TW201438091A (en) | 2014-10-01 |
| TWI623034B (en) | 2018-05-01 |