TWI563244B - - Google Patents
Info
- Publication number
- TWI563244B TWI563244B TW104121564A TW104121564A TWI563244B TW I563244 B TWI563244 B TW I563244B TW 104121564 A TW104121564 A TW 104121564A TW 104121564 A TW104121564 A TW 104121564A TW I563244 B TWI563244 B TW I563244B
- Authority
- TW
- Taiwan
Links
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410323157.8A CN105441909B (zh) | 2014-07-08 | 2014-07-08 | 一种探测温度的系统和方法及设有该系统的mocvd设备 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201602534A TW201602534A (zh) | 2016-01-16 |
| TWI563244B true TWI563244B (ja) | 2016-12-21 |
Family
ID=55552527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104121564A TW201602534A (zh) | 2014-07-08 | 2015-07-02 | 探測溫度的系統和方法及設有該系統的mocvd設備 |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN105441909B (ja) |
| TW (1) | TW201602534A (ja) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105928625B (zh) * | 2016-06-20 | 2023-04-07 | 中国工程物理研究院流体物理研究所 | 基于反射率变化的金属表面动态温度点测量方法 |
| CN111155073A (zh) * | 2019-12-30 | 2020-05-15 | 中国电子科技集团公司第十三研究所 | Mocvd外延设备的温度校准方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100111511A1 (en) * | 2008-10-31 | 2010-05-06 | Nir Merry | Use of infrared camera for real-time temperature monitoring and control |
| EP2372752A1 (en) * | 2008-12-26 | 2011-10-05 | Y Systems Ltd. | Method and device for measuring temperature during deposition of semiconductor |
| TW201243955A (en) * | 2011-03-11 | 2012-11-01 | Applied Materials Inc | Apparatus for monitoring and controlling substrate temperature |
| TW201351529A (zh) * | 2012-05-07 | 2013-12-16 | Advanced Micro Fab Equip Inc | 真空處理裝置的基片溫度測量方法和裝置 |
| TW201419383A (zh) * | 2012-06-26 | 2014-05-16 | Veeco Instr Inc | 基於ＧａＮ材料之溫度控制 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11190670A (ja) * | 1997-12-26 | 1999-07-13 | Toshiba Corp | 表面温度測定装置及び表面温度測定方法 |
| US7734439B2 (en) * | 2002-06-24 | 2010-06-08 | Mattson Technology, Inc. | System and process for calibrating pyrometers in thermal processing chambers |
| US8254767B2 (en) * | 2008-08-29 | 2012-08-28 | Applied Materials, Inc. | Method and apparatus for extended temperature pyrometry |
| CN102183316B (zh) * | 2010-12-10 | 2013-04-24 | 中国科学院安徽光学精密机械研究所 | 可调谐半导体激光吸收光谱温度实时监测仪 |
| JP5964626B2 (ja) * | 2012-03-22 | 2016-08-03 | 株式会社Ｓｃｒｅｅｎホールディングス | 熱処理装置 |
| CN103884449B (zh) * | 2014-03-04 | 2016-08-17 | 中国空间技术研究院 | 一种基于光纤传输的喷口电弧温度非接触测量系统 |
-
2014
- 2014-07-08 CN CN201410323157.8A patent/CN105441909B/zh active Active
-
2015
- 2015-07-02 TW TW104121564A patent/TW201602534A/zh unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100111511A1 (en) * | 2008-10-31 | 2010-05-06 | Nir Merry | Use of infrared camera for real-time temperature monitoring and control |
| EP2372752A1 (en) * | 2008-12-26 | 2011-10-05 | Y Systems Ltd. | Method and device for measuring temperature during deposition of semiconductor |
| TW201243955A (en) * | 2011-03-11 | 2012-11-01 | Applied Materials Inc | Apparatus for monitoring and controlling substrate temperature |
| TW201351529A (zh) * | 2012-05-07 | 2013-12-16 | Advanced Micro Fab Equip Inc | 真空處理裝置的基片溫度測量方法和裝置 |
| TW201419383A (zh) * | 2012-06-26 | 2014-05-16 | Veeco Instr Inc | 基於ＧａＮ材料之溫度控制 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201602534A (zh) | 2016-01-16 |
| CN105441909B (zh) | 2018-06-26 |
| CN105441909A (zh) | 2016-03-30 |