TWI562484B - - Google Patents
Info
- Publication number
- TWI562484B TWI562484B TW104116486A TW104116486A TWI562484B TW I562484 B TWI562484 B TW I562484B TW 104116486 A TW104116486 A TW 104116486A TW 104116486 A TW104116486 A TW 104116486A TW I562484 B TWI562484 B TW I562484B
- Authority
- TW
- Taiwan
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Lasers (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014188369A JP6355496B2 (en) | 2014-09-17 | 2014-09-17 | Laser processing apparatus and pulse laser beam output method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201613212A TW201613212A (en) | 2016-04-01 |
| TWI562484B true TWI562484B (en) | 2016-12-11 |
Family
ID=55493525
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104116486A TW201613212A (en) | 2014-09-17 | 2015-05-22 | Laser processing device and output method of pulsed laser beam |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6355496B2 (en) |
| KR (1) | KR101746921B1 (en) |
| CN (1) | CN105414749B (en) |
| TW (1) | TW201613212A (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6732613B2 (en) * | 2016-09-07 | 2020-07-29 | 住友重機械工業株式会社 | Laser light source and laser processing apparatus using the same |
| JP6831270B2 (en) * | 2017-03-02 | 2021-02-17 | 住友重機械工業株式会社 | Power control device for high frequency power supply, control method for high frequency power supply, and light source for laser machining system |
| BE1025957B1 (en) | 2018-01-26 | 2019-08-27 | Laser Engineering Applications | Method for determining laser machining parameters and laser machining device using said method |
| JP6957113B2 (en) * | 2018-01-30 | 2021-11-02 | 住友重機械工業株式会社 | Laser control device |
| JP7084759B2 (en) * | 2018-03-29 | 2022-06-15 | 住友重機械工業株式会社 | Laser processing equipment |
| JP7189674B2 (en) * | 2018-04-20 | 2022-12-14 | 住友重機械工業株式会社 | Laser processing machine and its power supply |
| JP7045250B2 (en) * | 2018-04-20 | 2022-03-31 | 住友重機械工業株式会社 | Laser device and its power supply |
| US11070026B2 (en) | 2019-07-19 | 2021-07-20 | Analog Devices International Unlimited Company | High current nanosecond laser driver circuit with wide pulse-width adjustment range |
| US11075502B2 (en) | 2019-08-29 | 2021-07-27 | Analog Devices, Inc. | Laser diode driver circuit techniques |
| KR20220106205A (en) * | 2019-12-31 | 2022-07-28 | 사이머 엘엘씨 | Undercut Electrodes for Gas Discharge Laser Chambers |
| JP2022140405A (en) * | 2021-03-12 | 2022-09-26 | 大船企業日本株式会社 | Laser processing method for printed circuit board and laser processing machine for printed circuit board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201112604A (en) * | 2009-07-27 | 2011-04-01 | Mitsubishi Electric Corp | High frequency power source |
| TW201433393A (en) * | 2012-11-20 | 2014-09-01 | Univ Kyushu Nat Univ Corp | Laser processing apparatus and laser processing method |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3945951B2 (en) * | 1999-01-14 | 2007-07-18 | 日立ビアメカニクス株式会社 | Laser processing method and laser processing machine |
| JP4647372B2 (en) * | 2005-04-11 | 2011-03-09 | 住友重機械工業株式会社 | Laser processing equipment |
| JP5159355B2 (en) * | 2008-02-12 | 2013-03-06 | 三菱電機株式会社 | Laser power supply |
| CN102593702B (en) * | 2011-01-04 | 2013-11-13 | 李俊豪 | Laser device with homenergic pulse waves and synchronized motion |
| WO2014110276A1 (en) * | 2013-01-11 | 2014-07-17 | Electro Scientific Industries, Inc. | Laser pulse energy control systems and methods |
| KR101425337B1 (en) * | 2013-02-14 | 2014-08-04 | 미쓰비시덴키 가부시키가이샤 | Laser processing apparatus, processing control apparatus, and pulse frequency control method |
| CN203621730U (en) * | 2013-11-12 | 2014-06-04 | 西安中科麦特电子技术设备有限公司 | High-power laser spot control system |
-
2014
- 2014-09-17 JP JP2014188369A patent/JP6355496B2/en active Active
-
2015
- 2015-05-22 TW TW104116486A patent/TW201613212A/en unknown
- 2015-05-25 CN CN201510270811.8A patent/CN105414749B/en active Active
- 2015-05-28 KR KR1020150074548A patent/KR101746921B1/en active IP Right Grant
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201112604A (en) * | 2009-07-27 | 2011-04-01 | Mitsubishi Electric Corp | High frequency power source |
| TW201433393A (en) * | 2012-11-20 | 2014-09-01 | Univ Kyushu Nat Univ Corp | Laser processing apparatus and laser processing method |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20160033022A (en) | 2016-03-25 |
| JP6355496B2 (en) | 2018-07-11 |
| CN105414749A (en) | 2016-03-23 |
| CN105414749B (en) | 2018-02-16 |
| KR101746921B1 (en) | 2017-06-14 |
| JP2016059932A (en) | 2016-04-25 |
| TW201613212A (en) | 2016-04-01 |