TWI562410B - Packaging Substrate and LED Flip Chip Packaging structure - Google Patents

Packaging Substrate and LED Flip Chip Packaging structure

Info

Publication number
TWI562410B
TWI562410B TW104140307A TW104140307A TWI562410B TW I562410 B TWI562410 B TW I562410B TW 104140307 A TW104140307 A TW 104140307A TW 104140307 A TW104140307 A TW 104140307A TW I562410 B TWI562410 B TW I562410B
Authority
TW
Taiwan
Prior art keywords
flip chip
led flip
packaging
substrate
packaging structure
Prior art date
Application number
TW104140307A
Other languages
Chinese (zh)
Other versions
TW201721912A (en
Inventor
Yi Ching Su
Yung-Chih Chen
Steve Meng-Yuan Hong
Original Assignee
Kaistar Lighting Xiamen Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaistar Lighting Xiamen Co Ltd filed Critical Kaistar Lighting Xiamen Co Ltd
Priority to TW104140307A priority Critical patent/TWI562410B/en
Application granted granted Critical
Publication of TWI562410B publication Critical patent/TWI562410B/en
Publication of TW201721912A publication Critical patent/TW201721912A/en

Links

TW104140307A 2015-12-02 2015-12-02 Packaging Substrate and LED Flip Chip Packaging structure TWI562410B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW104140307A TWI562410B (en) 2015-12-02 2015-12-02 Packaging Substrate and LED Flip Chip Packaging structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW104140307A TWI562410B (en) 2015-12-02 2015-12-02 Packaging Substrate and LED Flip Chip Packaging structure

Publications (2)

Publication Number Publication Date
TWI562410B true TWI562410B (en) 2016-12-11
TW201721912A TW201721912A (en) 2017-06-16

Family

ID=58227350

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104140307A TWI562410B (en) 2015-12-02 2015-12-02 Packaging Substrate and LED Flip Chip Packaging structure

Country Status (1)

Country Link
TW (1) TWI562410B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10615321B2 (en) 2017-08-21 2020-04-07 Seoul Semiconductor Co., Ltd. Light emitting device package

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050067177A1 (en) * 2003-09-29 2005-03-31 Ryuichi Saito Module and method of manufacturing module
TW201336121A (en) * 2012-01-03 2013-09-01 Ｌｇ伊諾特股份有限公司 Light emitting device
US20140332839A1 (en) * 2013-05-07 2014-11-13 Lg Innotek Co., Ltd. Light emitting device package

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050067177A1 (en) * 2003-09-29 2005-03-31 Ryuichi Saito Module and method of manufacturing module
TW201336121A (en) * 2012-01-03 2013-09-01 Ｌｇ伊諾特股份有限公司 Light emitting device
US20140332839A1 (en) * 2013-05-07 2014-11-13 Lg Innotek Co., Ltd. Light emitting device package

Also Published As

Publication number Publication date
TW201721912A (en) 2017-06-16

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