TWI562247B - - Google Patents
Info
- Publication number
- TWI562247B TWI562247B TW104133482A TW104133482A TWI562247B TW I562247 B TWI562247 B TW I562247B TW 104133482 A TW104133482 A TW 104133482A TW 104133482 A TW104133482 A TW 104133482A TW I562247 B TWI562247 B TW I562247B
- Authority
- TW
- Taiwan
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW104133482A TW201714227A (en) | 2015-10-12 | 2015-10-12 | Processing method of electric packaging structure by discharging bubbles from periphery of adhesive member to greatly enhance reliability and quality of electric packaging structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW104133482A TW201714227A (en) | 2015-10-12 | 2015-10-12 | Processing method of electric packaging structure by discharging bubbles from periphery of adhesive member to greatly enhance reliability and quality of electric packaging structure |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI562247B true TWI562247B (en) | 2016-12-11 |
TW201714227A TW201714227A (en) | 2017-04-16 |
Family
ID=58227340
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104133482A TW201714227A (en) | 2015-10-12 | 2015-10-12 | Processing method of electric packaging structure by discharging bubbles from periphery of adhesive member to greatly enhance reliability and quality of electric packaging structure |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW201714227A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112533379A (en) * | 2020-11-18 | 2021-03-19 | 安徽四创电子股份有限公司 | Manufacturing method of PCB resin plug hole |
CN113345810A (en) * | 2020-02-18 | 2021-09-03 | 朋程科技股份有限公司 | Method for manufacturing power diode |
CN115586048A (en) * | 2022-08-31 | 2023-01-10 | 南京屹立芯创半导体科技有限公司 | Detection test piece and preparation method thereof |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109534281B (en) * | 2018-10-19 | 2021-06-18 | 潍坊歌尔微电子有限公司 | Bubble removing method and bubble removing device for glue injection part |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW541671B (en) * | 2000-08-21 | 2003-07-11 | Advanced Semiconductor Eng | Semiconductor chip package method |
TW201206702A (en) * | 2010-07-30 | 2012-02-16 | Du Pont | Multilayer structures containing a fluorinated copolymer resin layer and an ethylene terpolymer layer |
TW201214584A (en) * | 2010-09-23 | 2012-04-01 | Walton Advanced Eng Inc | Flip-chip bonding method to reduce voids in underfill material |
TW201218317A (en) * | 2010-09-23 | 2012-05-01 | Walton Advanced Eng Inc | Method of multi-chip stacking for decreasing void between chips |
TW201224097A (en) * | 2010-10-04 | 2012-06-16 | Hitachi Chemical Co Ltd | Resin paste for die bonding, semiconductor device and fabricating method thereof |
TW201232674A (en) * | 2011-01-20 | 2012-08-01 | Walton Advanced Eng Inc | Method and apparatus of compression molding for reducing viods in molding compound |
-
2015
- 2015-10-12 TW TW104133482A patent/TW201714227A/en unknown
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW541671B (en) * | 2000-08-21 | 2003-07-11 | Advanced Semiconductor Eng | Semiconductor chip package method |
TW201206702A (en) * | 2010-07-30 | 2012-02-16 | Du Pont | Multilayer structures containing a fluorinated copolymer resin layer and an ethylene terpolymer layer |
TW201214584A (en) * | 2010-09-23 | 2012-04-01 | Walton Advanced Eng Inc | Flip-chip bonding method to reduce voids in underfill material |
TW201218317A (en) * | 2010-09-23 | 2012-05-01 | Walton Advanced Eng Inc | Method of multi-chip stacking for decreasing void between chips |
TW201224097A (en) * | 2010-10-04 | 2012-06-16 | Hitachi Chemical Co Ltd | Resin paste for die bonding, semiconductor device and fabricating method thereof |
TW201232674A (en) * | 2011-01-20 | 2012-08-01 | Walton Advanced Eng Inc | Method and apparatus of compression molding for reducing viods in molding compound |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113345810A (en) * | 2020-02-18 | 2021-09-03 | 朋程科技股份有限公司 | Method for manufacturing power diode |
CN112533379A (en) * | 2020-11-18 | 2021-03-19 | 安徽四创电子股份有限公司 | Manufacturing method of PCB resin plug hole |
CN115586048A (en) * | 2022-08-31 | 2023-01-10 | 南京屹立芯创半导体科技有限公司 | Detection test piece and preparation method thereof |
Also Published As
Publication number | Publication date |
---|---|
TW201714227A (en) | 2017-04-16 |