TWI562247B - - Google Patents

Info

Publication number
TWI562247B
TWI562247B TW104133482A TW104133482A TWI562247B TW I562247 B TWI562247 B TW I562247B TW 104133482 A TW104133482 A TW 104133482A TW 104133482 A TW104133482 A TW 104133482A TW I562247 B TWI562247 B TW I562247B
Authority
TW
Taiwan
Application number
TW104133482A
Other languages
Chinese (zh)
Other versions
TW201714227A (en
Inventor
Yu-Mian Zhuang
Original Assignee
Yu-Mian Zhuang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yu-Mian Zhuang filed Critical Yu-Mian Zhuang
Priority to TW104133482A priority Critical patent/TW201714227A/en
Application granted granted Critical
Publication of TWI562247B publication Critical patent/TWI562247B/zh
Publication of TW201714227A publication Critical patent/TW201714227A/en

Links

TW104133482A 2015-10-12 2015-10-12 Processing method of electric packaging structure by discharging bubbles from periphery of adhesive member to greatly enhance reliability and quality of electric packaging structure TW201714227A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW104133482A TW201714227A (en) 2015-10-12 2015-10-12 Processing method of electric packaging structure by discharging bubbles from periphery of adhesive member to greatly enhance reliability and quality of electric packaging structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW104133482A TW201714227A (en) 2015-10-12 2015-10-12 Processing method of electric packaging structure by discharging bubbles from periphery of adhesive member to greatly enhance reliability and quality of electric packaging structure

Publications (2)

Publication Number Publication Date
TWI562247B true TWI562247B (en) 2016-12-11
TW201714227A TW201714227A (en) 2017-04-16

Family

ID=58227340

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104133482A TW201714227A (en) 2015-10-12 2015-10-12 Processing method of electric packaging structure by discharging bubbles from periphery of adhesive member to greatly enhance reliability and quality of electric packaging structure

Country Status (1)

Country Link
TW (1) TW201714227A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112533379A (en) * 2020-11-18 2021-03-19 安徽四创电子股份有限公司 Manufacturing method of PCB resin plug hole
CN113345810A (en) * 2020-02-18 2021-09-03 朋程科技股份有限公司 Method for manufacturing power diode
CN115586048A (en) * 2022-08-31 2023-01-10 南京屹立芯创半导体科技有限公司 Detection test piece and preparation method thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109534281B (en) * 2018-10-19 2021-06-18 潍坊歌尔微电子有限公司 Bubble removing method and bubble removing device for glue injection part

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW541671B (en) * 2000-08-21 2003-07-11 Advanced Semiconductor Eng Semiconductor chip package method
TW201206702A (en) * 2010-07-30 2012-02-16 Du Pont Multilayer structures containing a fluorinated copolymer resin layer and an ethylene terpolymer layer
TW201214584A (en) * 2010-09-23 2012-04-01 Walton Advanced Eng Inc Flip-chip bonding method to reduce voids in underfill material
TW201218317A (en) * 2010-09-23 2012-05-01 Walton Advanced Eng Inc Method of multi-chip stacking for decreasing void between chips
TW201224097A (en) * 2010-10-04 2012-06-16 Hitachi Chemical Co Ltd Resin paste for die bonding, semiconductor device and fabricating method thereof
TW201232674A (en) * 2011-01-20 2012-08-01 Walton Advanced Eng Inc Method and apparatus of compression molding for reducing viods in molding compound

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW541671B (en) * 2000-08-21 2003-07-11 Advanced Semiconductor Eng Semiconductor chip package method
TW201206702A (en) * 2010-07-30 2012-02-16 Du Pont Multilayer structures containing a fluorinated copolymer resin layer and an ethylene terpolymer layer
TW201214584A (en) * 2010-09-23 2012-04-01 Walton Advanced Eng Inc Flip-chip bonding method to reduce voids in underfill material
TW201218317A (en) * 2010-09-23 2012-05-01 Walton Advanced Eng Inc Method of multi-chip stacking for decreasing void between chips
TW201224097A (en) * 2010-10-04 2012-06-16 Hitachi Chemical Co Ltd Resin paste for die bonding, semiconductor device and fabricating method thereof
TW201232674A (en) * 2011-01-20 2012-08-01 Walton Advanced Eng Inc Method and apparatus of compression molding for reducing viods in molding compound

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113345810A (en) * 2020-02-18 2021-09-03 朋程科技股份有限公司 Method for manufacturing power diode
CN112533379A (en) * 2020-11-18 2021-03-19 安徽四创电子股份有限公司 Manufacturing method of PCB resin plug hole
CN115586048A (en) * 2022-08-31 2023-01-10 南京屹立芯创半导体科技有限公司 Detection test piece and preparation method thereof

Also Published As

Publication number Publication date
TW201714227A (en) 2017-04-16

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