CN115586048A - Detection test piece and preparation method thereof - Google Patents

Detection test piece and preparation method thereof Download PDF

Info

Publication number
CN115586048A
CN115586048A CN202211052324.0A CN202211052324A CN115586048A CN 115586048 A CN115586048 A CN 115586048A CN 202211052324 A CN202211052324 A CN 202211052324A CN 115586048 A CN115586048 A CN 115586048A
Authority
CN
China
Prior art keywords
pressure
temperature
closed chamber
preset
treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202211052324.0A
Other languages
Chinese (zh)
Inventor
张景南
彭俊昇
万航
巫碧勤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanjing Yili Xinchuang Semiconductor Technology Co ltd
Original Assignee
Nanjing Yili Xinchuang Semiconductor Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanjing Yili Xinchuang Semiconductor Technology Co ltd filed Critical Nanjing Yili Xinchuang Semiconductor Technology Co ltd
Priority to CN202211052324.0A priority Critical patent/CN115586048A/en
Publication of CN115586048A publication Critical patent/CN115586048A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00Sampling; Preparing specimens for investigation
    • G01N1/28Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00Sampling; Preparing specimens for investigation
    • G01N1/28Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/286Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00Sampling; Preparing specimens for investigation
    • G01N1/28Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/44Sample treatment involving radiation, e.g. heat

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The invention discloses a detection test piece and a preparation method thereof. The preparation method of the detection test piece comprises the following steps: providing an untreated test piece which comprises at least two overlapped flat plates, wherein a rubber material is coated between every two adjacent flat plates, and bubbles are arranged in the rubber material and/or a joint interface between the rubber material and the flat plates; placing an untreated test strip in a closed chamber; carrying out heating treatment and pressure regulation treatment on the closed chamber to obtain a detection test piece; the temperature raising treatment includes: heating the closed chamber to a first preset temperature, wherein the first preset temperature is higher than the room temperature and lower than the curing temperature of the rubber material; the pressure adjustment process includes: boosting pressure: pressurizing the closed chamber to a first preset pressure, wherein the first preset pressure is higher than the normal pressure; and (3) pressure reduction treatment: depressurizing the closed chamber to a second preset pressure, wherein the second preset pressure is less than or equal to the normal pressure; and repeating the pressure increasing process and the pressure decreasing process until the bubbles are eliminated. The preparation method can reduce the bubble residue in the rubber material and on the joint interface.

Description

Detection test piece and preparation method thereof
Technical Field
The invention relates to the technical field of biochemical detection, in particular to a detection test piece and a preparation method thereof.
Background
The detection test piece is composed of two flat plates, at least one detection chamber is formed between the two flat plates through the adhesion of the adhesive material, in the production process, due to the fact that the stirring and flowing of the adhesive material or the adhesion flatness of an adhesive film are insufficient, bubbles are easily generated in the adhesive material and the adhesion interface of the adhesive material and the flat plates, the bubbles can affect the appearance and the adhesion effect of a product, seriously and possibly affect the flow path of a biochemical reagent in the detection chamber and the accuracy of optical detection, and therefore the adhesive material in the detection test piece needs to be defoamed.
The traditional method for defoaming the rubber material comprises plate pressing and roller pressing. However, the plate pressure and the roller pressure may cause the flat plate to be damaged due to stress concentration, and some tiny bubbles remain after the test strip is processed by the conventional gel deaeration method, which is not suitable for application.
Disclosure of Invention
Accordingly, it is desirable to provide a test strip and a method for preparing the same, which can reduce the residual air bubbles in the test strip.
A preparation method of a detection test piece comprises the following steps:
providing an untreated test piece, wherein the untreated test piece comprises at least two overlapped flat plates, a rubber material is coated between the two adjacent flat plates, and air bubbles are arranged in the rubber material and/or a joint interface of the rubber material and the flat plates;
placing the untreated test piece in a closed chamber;
step three, carrying out temperature rise treatment and pressure regulation treatment on the closed chamber to obtain a detection test piece;
wherein the temperature raising treatment comprises the following steps: heating the closed chamber to a first preset temperature, wherein the first preset temperature is higher than the room temperature and lower than the curing temperature of the rubber material;
wherein the pressure adjustment process comprises the steps of:
boosting pressure: pressurizing the closed chamber to a first preset pressure, wherein the first preset pressure is higher than the normal pressure;
and (3) pressure reduction treatment: depressurizing the closed chamber to a second preset pressure, wherein the second preset pressure is less than or equal to the normal pressure; and
the steps of the pressure increasing process and the pressure decreasing process are repeated until the bubbles are eliminated.
In each of the above steps, the temperature raising treatment may reduce the solubility of the bubbles in the rubber material, so that the bubbles are gradually precipitated from the rubber material. The pressure adjusting treatment comprises pressure increasing treatment and pressure reducing treatment, wherein the pressure increasing treatment can extrude bubbles out of the interior of the rubber material or the fit interface between the rubber material and the flat plate; the pressure reduction treatment can generate pressure difference between the bubbles and the closed chamber, so that the bubbles expand and extend to the surface of the rubber material, and in the process, the bubbles gather and move to the surface of the rubber material, and part of the bubbles are discharged out of the rubber material; by repeating the pressure increasing treatment and the pressure reducing treatment, the colloid can be kneaded, so that bubbles are gradually eliminated. The temperature rise treatment and the pressure regulation treatment are mutually matched, and compared with a traditional detection test piece preparation method and a rubber material defoaming method, the method can reduce the bubble residue in the rubber material and on a joint interface between the rubber material and a flat plate.
In addition, the adhesive property of the adhesive material can be improved and the bonding strength between the flat plates can be improved by applying pressure and raising the temperature to the sealed cavity.
In a possible implementation, the operation of pressurizing the closed chamber to a first preset pressure is: applying gas to the closed chamber to enable the pressure of the closed chamber to reach the first preset pressure;
the operation of reducing the pressure of the closed chamber to a second preset pressure is as follows: and pumping the gas in the closed chamber to enable the pressure of the closed chamber to reach the second preset pressure.
In a possible implementation manner, in the step-up processing operation, the first preset pressure is 0.1MPa-2MPa, and the pressure is maintained at the first preset pressure for 10min-30min.
In a feasible implementation manner, in the operation of the pressure reduction treatment, the second preset pressure is 0.001MPa to 0.09MPa, and the pressure is maintained at the second preset pressure for 10min to 30min.
In a possible implementation manner, the operation of raising the temperature of the sealed chamber to the first preset temperature is: and (3) keeping the temperature of the closed chamber for 5-30 min at the temperature when the temperature of the closed chamber rises by 20-60 ℃, and repeating the operation of temperature rising and heat preservation until the temperature of the closed chamber reaches a first preset temperature.
In a possible implementation manner, after the temperature raising process and the pressure adjusting process are performed on the sealed chamber, the method further includes the fourth step of:
and heating the closed chamber to a second preset temperature, wherein the second preset temperature is greater than or equal to the curing temperature of the rubber material and is less than the decomposition temperature of the rubber material.
In a possible implementation manner, after the heating the sealed chamber to the second preset temperature, the method further includes the step five:
and standing to fully solidify the rubber material, then maintaining the pressure of the closed cavity and cooling to room temperature, and then removing the pressure to obtain the detection test piece.
In a possible implementation manner, the first preset temperature is 50 ℃ to 100 ℃ lower than the curing temperature of the glue material.
In a feasible implementation manner, the glue material is an epoxy resin glue material, and the first preset temperature is 50 ℃ to 120 ℃.
In a feasible implementation manner, the pressure regulation treatment is realized by applying or removing gas into the closed chamber, so that the condition that the flat plate of the detection test piece is damaged due to stress concentration in the process of pressing can be avoided.
A test strip is prepared by the preparation method of the test strip.
The detection test piece has less bubbles, is not easy to deflect light when used for biochemical detection, and does not influence the flow path of liquid to be detected, so the detection precision and accuracy are higher.
Drawings
FIG. 1 is a schematic view of a rubber material and air bubbles in an untreated test strip;
FIG. 2 is a schematic view of a rubber material and air bubbles after pressure boosting treatment in the preparation process of a test strip according to an embodiment of the present invention;
FIG. 3 is a schematic view of a rubber material and air bubbles during a pressure reduction process in a preparation process of a test strip according to an embodiment of the present invention;
FIG. 4 is a schematic view of a test strip prepared by the method for preparing a test strip according to an embodiment of the present invention;
FIG. 5 (a) is a photograph of an untreated test strip in the method for preparing a test strip according to example 1 of the present invention;
FIG. 5 (b) is a photograph of a test strip prepared by the method of preparing a test strip in example 1 of the present invention;
FIG. 6 (a) is a photograph of an untreated test strip in the method for preparing a test strip in example 2 of the present invention;
FIG. 6 (b) is a photograph of a test strip prepared by the method of preparing a test strip in example 2 of the present invention;
FIG. 7 (a) is a photograph of an untreated test strip in the method for preparing a test strip in example 3 of the present invention;
fig. 7 (b) is a photograph of a test strip prepared by the method of preparing a test strip in example 3 of the present invention.
Reference numerals: 1-glue material, 2-air bubble.
Detailed Description
The present invention will be described in detail with reference to the following embodiments in order to make the aforementioned objects, features and advantages of the invention more comprehensible. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
A method for preparing a test strip according to an embodiment includes the steps of:
step one, providing an untreated test piece, wherein the untreated test piece comprises at least two overlapped flat plates, a glue material is coated between the two adjacent flat plates, and bubbles are arranged inside the glue material and/or on a joint interface between the glue material and the flat plates.
Referring to fig. 1, in the untreated test strip, air bubbles 2 are provided inside the adhesive material 1 between two adjacent flat plates. At this time, the area occupied by the bubble 2 is large, indicating that the bubble 2 is large.
And step two, placing the untreated detection test piece in the closed chamber.
And step three, performing temperature rise treatment and pressure regulation treatment on the closed chamber to obtain the detection test piece.
Wherein the temperature raising treatment comprises the following steps: and heating the closed chamber to a first preset temperature, wherein the first preset temperature is higher than the room temperature and lower than the curing temperature of the adhesive material.
Wherein the pressure adjustment process comprises the steps of:
boosting pressure: pressurizing the closed chamber to a first preset pressure, wherein the first preset pressure is higher than the normal pressure;
and (3) pressure reduction treatment: depressurizing the closed chamber to a second preset pressure, wherein the second preset pressure is less than or equal to the normal pressure; and
the steps of the pressure increasing process and the pressure decreasing process are repeated until the bubbles are eliminated.
In the third step, the temperature of the closed chamber is raised to reduce the solubility of the bubbles in the rubber material, so that the bubbles are gradually separated out from the rubber material.
In the third step, the pressure regulation includes two operations of pressure increasing treatment and pressure reducing treatment, wherein the pressure increasing treatment can extrude the bubbles 2 out of the inside of the rubber material 1 or the bonding interface between the rubber material and the flat plate, so that the bubbles 2 are reduced, as shown in fig. 2; the pressure reduction treatment generates pressure difference between the air bubbles 2 and the closed chamber, so that the air bubbles 2 expand and extend towards the surface of the rubber material 1, in the process, part of the air bubbles are discharged out of the rubber material, and the air bubbles 2 which are not discharged are gathered and move towards the surface of the rubber material, as shown in fig. 3; by repeating the above-mentioned pressure increasing and pressure reducing processes, the gel can be "kneaded" to gradually eliminate the bubbles, so that the test strip of the present embodiment is obtained, and almost no bubbles remain in the interior of the gel material 1 and the bonding interface between the gel material and the flat plate, as shown in fig. 4.
In the third step, the temperature-raising treatment and the pressure-adjusting treatment may be performed simultaneously, or the temperature-raising treatment may be performed first and then the pressure-adjusting treatment may be performed, or the pressure-adjusting treatment may be performed first and then the temperature-raising treatment may be performed. Most of bubbles in the detection test piece can be eliminated by the mutual matching of the temperature rise step and the pressure regulation step.
In one possible implementation, the operation of pressurizing the closed chamber to the first preset pressure is: applying gas to the closed chamber to enable the pressure of the closed chamber to reach a first preset pressure;
the operation of reducing the pressure of the closed chamber to a second preset pressure is as follows: and pumping the gas in the closed chamber to enable the pressure of the closed chamber to reach a second preset pressure.
In one possible implementation, the pressure adjustment process further includes the steps of: and after the primary pressure boosting treatment and the primary pressure reducing treatment are finished, judging the first preset pressure, and if the first preset pressure is lower than 2MPa, assigning the first preset pressure to increase the first preset pressure by 0.1-0.3 MPa. Through the increase to first preset pressure, can increase the intensity of extruding to gluing material bubble.
In a feasible implementation manner, the first preset pressure is 0.1MPa to 2MPa in the pressure increasing treatment operation, the pressure is maintained for 10min to 30min under the first preset pressure, and the second preset pressure is 0.001MPa to 0.09MPa in the pressure reducing treatment operation, and the pressure is maintained for 10min to 30min under the second preset pressure.
In a possible implementation manner, the step of raising the temperature of the sealed chamber to the first preset temperature further includes the following operations: and (3) keeping the temperature of the closed chamber for 5-30 min at the temperature when the temperature of the closed chamber rises by 20-60 ℃, and repeating the operation of temperature rise and heat preservation until the temperature of the closed chamber reaches a first preset temperature.
In one possible implementation, the first predetermined temperature is 50 ℃ to 100 ℃ lower than the curing temperature of the glue material.
In a feasible implementation manner, the glue material is an epoxy resin glue material, and the first preset temperature is 50-120 ℃. Wherein, the epoxy resin glue materials include but are not limited to: bisphenol a type epoxy resin, bisphenol F type epoxy resin, aliphatic glycidyl ether epoxy resin, heterocyclic type epoxy resin, and urethane-modified epoxy adhesive film.
In the above implementation manner, the pressure and/or heat preservation is performed at the first preset pressure, the second preset pressure and the first preset temperature, so that time can be reserved for deformation and movement of the bubbles, and the bubbles can be eliminated more effectively.
In the combination of the above-described embodiments, the bubbles can be effectively eliminated by the continuous stepwise temperature rise and the periodic air pressure adjustment. Compared with the traditional preparation method of the detection test piece, the method can reduce bubbles in the colloid and at the joint interface between the rubber material and the flat plate, improve the bonding effect of the product, avoid damage to the flat plate due to stress concentration and improve the yield.
In a possible implementation manner, the operation of evacuating the gas in the sealed chamber to make the gas pressure of the sealed chamber reach the second preset pressure is as follows: setting a third preset pressure, wherein the value of the third preset pressure is between the first preset pressure and the second preset pressure; and pumping the gas in the closed chamber to enable the gas pressure of the closed chamber to reach a third preset pressure, and pumping the gas in the closed chamber again to enable the gas pressure of the closed chamber to reach a second preset pressure. Through setting up the third preset pressure, can prevent to take out the too big device work load of gas to the life of extension device.
Through applying or discharging gas and changing pressure, compare in the mode of traditional board pressure and gyro wheel pressurization, the flat board can not be because of stress concentration and breakage, and compare in the high pressure of long-time maintenance, carry out many times periodic air pressure and adjust and can make the bubble fully appear.
In the method, the temperature rise treatment and the pressure regulation treatment are two mutually independent processes, and can be carried out sequentially or simultaneously. Most of bubbles in the inside of the rubber material and on the bonding interface between the rubber material and the flat plate are eliminated by the temperature rise treatment and the pressure regulation treatment.
In a possible implementation manner, after the temperature raising process and the pressure adjusting process are performed on the sealed chamber, the method further includes the fourth step: and heating the closed chamber to a second preset temperature, wherein the second preset temperature is greater than or equal to the curing temperature of the adhesive material and is less than the decomposition temperature of the adhesive material.
In the process of discharging the air bubbles from the rubber material, pore channels are left in the rubber material, and the rubber material flows in the process of heating, so that the pore channels are filled with the rubber material again. And when the temperature reaches the second preset temperature, the glue material is cured, so that the flat plate is bonded.
In a feasible implementation manner, after the sealed chamber is heated to the second preset temperature, the method further includes the fifth step of: and standing to fully solidify the rubber material, then maintaining the pressure of the closed cavity, cooling to room temperature, and then removing the pressure to obtain the detection test piece. Compared with the simultaneous pressure relief and temperature reduction, the pressure maintaining and temperature reduction operation can reduce the risk of cracking of the flat plate and the colloid in the composite sample caused by severe pressure change in a high-temperature environment.
In the preparation method of the detection test piece, the temperature rise treatment can reduce the solubility of the bubbles in the rubber material, so that the bubbles are gradually precipitated from the rubber material. The pressure adjusting treatment comprises pressure increasing treatment and pressure reducing treatment, wherein the pressure increasing treatment can extrude bubbles out of the inside of the rubber material or the fit interface between the rubber material and the flat plate; the pressure reduction treatment can generate pressure difference between the bubbles and the closed chamber, so that the bubbles expand and extend to the surface of the rubber material, and in the process, the bubbles gather and move to the surface of the rubber material, and part of the bubbles are discharged out of the rubber material; by repeating the pressure increasing treatment and the pressure reducing treatment, the colloid can be kneaded, so that the bubbles are gradually eliminated. The temperature rise treatment and the pressure regulation treatment are mutually matched, and compared with a traditional detection test piece preparation method and a rubber material defoaming method, the method can reduce the bubble residue in the rubber material and on a joint interface of the rubber material and a flat plate.
In addition, the adhesive property of the adhesive material can be improved and the bonding strength between the flat plates can be improved by applying pressure and raising the temperature to the sealed cavity.
Correspondingly, the invention also provides a test strip prepared by the preparation method of the test strip. The detection test piece provided by the invention has less bubbles in the rubber material and the joint interface of the rubber material and the flat plate.
The detection test piece has less bubbles, and when the detection test piece is used for biochemical detection, the detection test piece has higher detection precision and accuracy because the detection test piece contains less bubbles and is not easy to deflect light.
With reference to the above implementation contents, in order to make the technical solution of the present invention more specific, clear and easy to understand, the technical solution of the present invention is exemplified, but it should be noted that the contents to be protected by the present invention are not limited to the following embodiment 1 to embodiment 3.
The apparatus used in the following examples included: a vacuum pressure bubble removing system is provided, the model is PIS, and a manufacturer creates a semiconductor technology limited company for erecting core from Nanjing.
The raw materials used in the following examples included: polyurethane modified epoxy adhesive film, PEM-6740, was manufactured by Feelm photoelectricity.
Example 1
The preparation method of the test strip of example 1 includes the following steps:
step one, providing an untreated test strip, which includes two overlapped flat plates, wherein a polyurethane modified epoxy adhesive film is coated between the two flat plates, and bubbles are present inside the polyurethane modified epoxy adhesive film and at a bonding interface between the polyurethane modified epoxy adhesive film and the flat plates, as shown in fig. 5 (a).
And step two, placing the detection test piece in a closed chamber of vacuum pressure bubble removing equipment.
And step three, performing heating treatment and pressure regulation treatment on the closed chamber.
Wherein the temperature raising treatment comprises the following steps: and heating the closed chamber to 60 ℃ at a heating rate of 10 ℃/min, wherein in the step-by-step heating process, the temperature of the closed chamber is kept at the temperature for 10min every 30 ℃.
Wherein the pressure adjustment process comprises the steps of:
boosting pressure: and applying dry compressed air to the closed chamber to enable the pressure of the closed chamber to reach 0.5MPa, and keeping the pressure for 20min.
And (3) pressure reduction treatment: and (5) pumping out the gas in the closed cavity to enable the pressure of the closed cavity to reach 0.014MPa, and keeping the pressure for 5min.
The above pressure increasing treatment and pressure decreasing treatment were repeated 3 times.
Step four, heating the closed chamber to 90 ℃.
And step five, standing for 30min to fully cure the polyurethane modified epoxy adhesive film, then maintaining the pressure of the closed chamber and cooling to room temperature, and then removing the pressure to obtain the test piece of the embodiment 1, wherein the interior of the polyurethane modified epoxy adhesive film and the bonding interface of the polyurethane modified epoxy adhesive film and the flat plate almost have no bubble residue, as shown in fig. 5 (b).
Example 2
Example 2 differs from example 1 in that the first predetermined temperature is 90 ℃ and in step four the temperature of the closed chamber is raised to 120 ℃.
Photographs of the sample before and after the treatment of the test strip of example 2 are shown in FIG. 6 (a) and FIG. 6 (b), respectively. As can be seen from fig. 6 (a) and 6 (b), the number of bubbles in the untreated test strip is large, and the test strip obtained by the preparation method of example 2 has almost no bubble residue, indicating that the preparation method of the test strip of example 2 can reduce the bubble residue in the adhesive material.
Example 3
Example 3 differs from example 1 in that the first predetermined temperature is 90 ℃ and in step four the temperature of the closed chamber is raised to 180 ℃.
As shown in fig. 7 (a) and 7 (b), the photographs of the sample before and after the treatment of the test strip of example 3 show that, as can be seen from fig. 7 (a) and 7 (b), the amount of bubbles in the untreated test strip is large, and almost no bubbles remain in the test strip obtained by the preparation method of example 3, indicating that the preparation method of the test strip of example 3 can reduce the bubble residue in the adhesive material.
All possible combinations of the technical features in the above embodiments may not be described for the sake of brevity, but should be considered as being within the scope of the present disclosure as long as there is no contradiction between the combinations of the technical features.
The above examples only show some embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that various changes and modifications can be made by those skilled in the art without departing from the spirit of the invention, and these changes and modifications are all within the scope of the invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. A method for preparing a test strip is characterized by comprising the following steps:
providing an untreated test piece, wherein the untreated test piece comprises at least two overlapped flat plates, a glue material is coated between every two adjacent flat plates, and bubbles are arranged in the glue material and/or a joint interface between the glue material and the flat plates;
placing the untreated test piece in a closed chamber;
step three, carrying out temperature rise treatment and pressure regulation treatment on the closed chamber to obtain a detection test piece;
wherein the temperature raising treatment comprises the following steps: heating the closed chamber to a first preset temperature, wherein the first preset temperature is higher than the room temperature and lower than the curing temperature of the adhesive material;
wherein the pressure adjustment process comprises the steps of:
boosting pressure: pressurizing the closed chamber to a first preset pressure, wherein the first preset pressure is higher than the normal pressure;
and (3) pressure reduction treatment: depressurizing the closed chamber to a second preset pressure, wherein the second preset pressure is less than or equal to the normal pressure; and
repeating the steps of the pressure increasing process and the pressure decreasing process until the bubbles are eliminated.
2. The method for preparing a test strip according to claim 1, wherein the step of pressurizing the sealed chamber to a first predetermined pressure comprises: applying gas to the closed chamber to enable the pressure of the closed chamber to reach the first preset pressure;
the operation of reducing the pressure of the closed chamber to a second preset pressure is as follows: and pumping the gas in the closed chamber to enable the pressure of the closed chamber to reach the second preset pressure.
3. The method for preparing a test strip according to claim 1, wherein the first predetermined pressure is 0.1MPa to 2MPa, and the pressure is maintained at the first predetermined pressure for 10min to 30min during the operation of the pressure increasing treatment.
4. The method for preparing a test strip according to claim 1, wherein the second predetermined pressure is 0.001MPa to 0.09MPa, and the pressure is maintained at the second predetermined pressure for 10min to 30min during the operation of the pressure reduction treatment.
5. The method for preparing a test strip according to claim 1, wherein the step of raising the temperature of the sealed chamber to a first predetermined temperature comprises: and (3) keeping the temperature of the closed chamber for 5-30 min at the temperature when the temperature of the closed chamber rises by 20-60 ℃, and repeating the operation of temperature rising and heat preservation until the temperature of the closed chamber reaches a first preset temperature.
6. The method for preparing a test strip according to claim 1, wherein after the temperature-raising treatment and the pressure-regulating treatment of the closed chamber, the method further comprises a fourth step of:
and heating the closed chamber to a second preset temperature, wherein the second preset temperature is greater than or equal to the curing temperature of the rubber material and is less than the decomposition temperature of the rubber material.
7. The method for preparing a test strip according to claim 6, wherein the step of heating the sealed chamber to the second predetermined temperature further comprises the step of:
and standing to fully solidify the rubber material, then maintaining the pressure of the closed cavity and cooling to room temperature, and then removing the pressure to obtain the detection test piece.
8. The method for preparing a test strip according to claim 1, wherein the first predetermined temperature is 50 ℃ to 100 ℃ lower than the curing temperature of the adhesive material.
9. The method for preparing a test strip according to claim 1, wherein the adhesive is an epoxy resin adhesive, and the first predetermined temperature is 50 ℃ to 120 ℃.
10. A test strip produced by the method for producing a test strip according to any one of claims 1 to 9.
CN202211052324.0A 2022-08-31 2022-08-31 Detection test piece and preparation method thereof Pending CN115586048A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202211052324.0A CN115586048A (en) 2022-08-31 2022-08-31 Detection test piece and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211052324.0A CN115586048A (en) 2022-08-31 2022-08-31 Detection test piece and preparation method thereof

Publications (1)

Publication Number Publication Date
CN115586048A true CN115586048A (en) 2023-01-10

Family

ID=84771795

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202211052324.0A Pending CN115586048A (en) 2022-08-31 2022-08-31 Detection test piece and preparation method thereof

Country Status (1)

Country Link
CN (1) CN115586048A (en)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201232674A (en) * 2011-01-20 2012-08-01 Walton Advanced Eng Inc Method and apparatus of compression molding for reducing viods in molding compound
TW201538981A (en) * 2014-04-02 2015-10-16 Cubic Res Co Ltd K Manufacturing method and structure of biological inspection test piece
TWI562247B (en) * 2015-10-12 2016-12-11 Yu-Mian Zhuang
JP2016219509A (en) * 2015-05-15 2016-12-22 富士電機株式会社 Heating-cooling method and heating-cooling device
CN108654708A (en) * 2018-05-07 2018-10-16 江苏康尚生物医疗科技有限公司 Micro-fluidic chip, its production method and application method
CN109534281A (en) * 2018-10-19 2019-03-29 歌尔股份有限公司 A kind of the bubble removal method and bubble removal device of injecting glue part
CN109849278A (en) * 2019-04-01 2019-06-07 孙炎权 Improve the method for intelligent power semiconductor module product warpage using mold
CN112571910A (en) * 2020-11-13 2021-03-30 广东南亮艺术玻璃科技股份有限公司 Method for manufacturing multilayer laminated glass
CN114551253A (en) * 2022-04-28 2022-05-27 至芯半导体(杭州)有限公司 Packaging method and packaging device

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201232674A (en) * 2011-01-20 2012-08-01 Walton Advanced Eng Inc Method and apparatus of compression molding for reducing viods in molding compound
TW201538981A (en) * 2014-04-02 2015-10-16 Cubic Res Co Ltd K Manufacturing method and structure of biological inspection test piece
JP2016219509A (en) * 2015-05-15 2016-12-22 富士電機株式会社 Heating-cooling method and heating-cooling device
TWI562247B (en) * 2015-10-12 2016-12-11 Yu-Mian Zhuang
CN108654708A (en) * 2018-05-07 2018-10-16 江苏康尚生物医疗科技有限公司 Micro-fluidic chip, its production method and application method
CN109534281A (en) * 2018-10-19 2019-03-29 歌尔股份有限公司 A kind of the bubble removal method and bubble removal device of injecting glue part
CN109849278A (en) * 2019-04-01 2019-06-07 孙炎权 Improve the method for intelligent power semiconductor module product warpage using mold
CN112571910A (en) * 2020-11-13 2021-03-30 广东南亮艺术玻璃科技股份有限公司 Method for manufacturing multilayer laminated glass
CN114551253A (en) * 2022-04-28 2022-05-27 至芯半导体(杭州)有限公司 Packaging method and packaging device

Similar Documents

Publication Publication Date Title
CN110136581B (en) Thermoplastic optical adhesive attaching method and application and display
CN104039087B (en) Organic silica gel die-free encapsulation method for circuit board assembly
CN103935050B (en) A kind of sandwich structure moulding technique preventing thick honeycomb sliding from subsiding
CN104441631B (en) A kind of easy-abrasion silicone rubber ring and metal-to-metal adhesive fitting manufacture method
US11135824B2 (en) Multi-stage debulk and compaction of thick composite repair laminates
CN103847096B (en) Heating in vacuum pressurization building mortion and heating in vacuum pressurization manufacturing process
EP2594388A1 (en) Method for producing resin matrix composite material
CN109823005B (en) Solid optical adhesive full-lamination method
CN107139503A (en) The forming method of composite cylinder component partial honeycomb sandwich construction
CN109593481A (en) A kind of low temperature thermoplasticity optical adhesive film dual cure attaching process and display
CN103946006A (en) Lamination method and laminating apparatus
CN115586048A (en) Detection test piece and preparation method thereof
CN108274759A (en) A kind of method and pressure apparatus for 3D printing sample surfaces reparation
CN107914453A (en) A kind of plate construction and its applying method and electronic equipment
CN107107489A (en) Prepolymerized thermosetting composite part and its manufacture method
CN106393944A (en) Technological method for normal temperature cementing of cellular board for satellite
CN109656321A (en) A kind of display heat cure attaching process and display
CN110884168B (en) Non-autoclave liquid forming device
CN108932072A (en) The preparation method and abutted equipment of touch display screen
CN104325636A (en) Vacuum bag forming and manufacturing method of nitrile rubber metal adhesion elements
JPH08156099A (en) Method and apparatus for adhering
US20100258235A1 (en) In-Situ, Multi-Stage Debulk, Compaction, and Single Stage Curing of Thick Composite Repair Laminates
CN117565416B (en) Method for preparing adhesive structure by adopting secondary adhesive process and composite adhesive structure
CN113232325B (en) Method for controlling thickness of composite material workpiece
CN115911228A (en) Simple one-time packaging and processing preparation process for MiniLED thermoplastic optical adhesive

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination