CN115911228A

CN115911228A - Simple one-time packaging and processing preparation process for MiniLED thermoplastic optical adhesive

Info

Publication number: CN115911228A
Application number: CN202211393710.6A
Authority: CN
Inventors: 陈波; 涂芳
Original assignee: Shenzhen Yixin New Materials Co ltd
Current assignee: Shenzhen Yixin New Materials Co ltd
Priority date: 2022-11-08
Filing date: 2022-11-08
Publication date: 2023-04-04

Abstract

The invention discloses a simple processing and preparation process for one-time packaging of MiniLED thermoplastic optical cement, and relates to the technical field of LED packaging; the method comprises the following steps: s10, mounting a plurality of M i n i LEDs on an M i n i LED substrate; s20, attaching a composite film to the Mi n i LED substrate to form an Mi n i LED module, wherein the composite film comprises thermoplastic optical cement and an attaching film, the thermoplastic optical cement is arranged on one side surface of the attaching film, and the composite film is attached to the Mi n i LED substrate through one surface provided with the thermoplastic optical cement; s30, placing the Mi n i LED module in a closed environment and continuously pressurizing to enable the Mi n i LED module to be defoamed and filled with glue; s40, curing the M i n i LED module. The invention has the beneficial effects that: according to the invention, the thermoplastic optical adhesive is attached to the attaching film, then one surface of the thermoplastic optical adhesive is attached to the M i n i LED, the M i n i LED is placed in a closed environment for continuous pressurization after being initially attached, the attaching film is gradually and closely attached to the M i n i LED through continuous pressurization, the gap filling between the M i n i LED is easily met, and the thermoplastic optical adhesive and the attaching film are more closely attached to the M i n i LED.

Description

Simple one-time packaging and processing preparation process for MiniLED thermoplastic optical adhesive

Technical Field

The invention relates to the technical field of LED packaging, in particular to a simple processing and preparation process for one-time packaging of MiniLED thermoplastic optical adhesive.

Background

At present, the traditional miniLED packaging method is filled with glue between miniLEDs, a protective film is coated on the surface of the miniLED after the filling of the glue is finished, the protective film needs to be compressed during film coating, but because a gap exists between the miniLEDs, the compressed protective film cannot be completely adapted to the shape of the gap between the miniLEDs when the protective film is compressed through a jig, the problem that the film coating is not in place exists, and the problem that the protective film tilts up can occur in the later stage.

Disclosure of Invention

In order to overcome the defects of the prior art, the invention provides a simple processing and preparation process for one-time packaging of MiniLED thermoplastic optical cement with tightly attached protective film.

The technical scheme adopted by the invention for solving the technical problem is as follows: the improvement of a simple processing and preparation process for one-time packaging of MiniLED thermoplastic optical cement is that the simple processing and preparation process comprises the following steps:

s10, mounting a plurality of MiniLED on a MiniLED substrate;

s20, attaching a composite film to the MiniLED substrate to form a MiniLED module, wherein the composite film comprises thermoplastic optical cement and an attaching film, the thermoplastic optical cement is arranged on one side surface of the attaching film, the composite film is attached to the MiniLED substrate through the side provided with the thermoplastic optical cement, and the composite film is attached to the MiniLED;

s30, placing the MiniLED module in a closed environment and continuously pressurizing to enable the MiniLED module to be defoamed and filled with glue;

and S40, curing the MiniLED module.

In the above technical solution, the composite film in the step 40 is further cut according to the size of the MiniLED substrate to be packaged.

In the technical scheme, the attaching film is an AG film, an electrostatic film or a diffusion film.

In the above technical solution, the curing manner in the step S40 is UV curing.

In the above technical solution, the attaching manner in step S20 is: the MiniLED substrate and the composite film are placed in a vacuum environment, one surface of the composite film with the thermoplastic optical adhesive is attached to the MiniLED on the MiniLED substrate, and then the composite film is tightly attached to the MiniLED by rolling on the composite film through a heatable roller.

In the above technical solution, in the step S30, the MiniLED module is placed in the sealed space, and then the sealed space is inflated to pressurize, wherein the inflating and pressurizing step is as follows: the MiniLED module is placed in the upward direction of the composite film, and the air inflation direction is from top to bottom.

The beneficial effects of the invention are: according to the invention, the thermoplastic optical adhesive is firstly attached to the attaching film, then one surface of the thermoplastic optical adhesive is attached to the MiniLED, the MiniLED is placed in a closed environment for continuous pressurization after primary attachment, the attaching film is gradually and tightly attached to the MiniLED through continuous pressurization, and compared with a jig adopted by a pressure compaction mode, the gap filling between the MiniLED is easily met, so that the thermoplastic optical adhesive and the attaching film are more tightly attached to the MiniLED.

Drawings

Fig. 1 is a flow chart of a simple one-time packaging and processing preparation process of a MiniLED thermoplastic optical adhesive.

Detailed Description

The invention is further illustrated with reference to the following figures and examples.

The conception, the specific structure, and the technical effects produced by the present invention will be clearly and completely described below in conjunction with the embodiments and the accompanying drawings to fully understand the objects, the features, and the effects of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and those skilled in the art can obtain other embodiments without inventive effort based on the embodiments of the present invention, and all embodiments are within the protection scope of the present invention. In addition, all the connection/connection relations referred to in the patent do not mean that the components are directly connected, but mean that a better connection structure can be formed by adding or reducing connection auxiliary components according to specific implementation conditions. All technical characteristics in the invention can be interactively combined on the premise of not conflicting with each other.

Referring to fig. 1, as shown in the figure, the invention provides a simple processing and preparation process for one-time packaging of MiniLED thermoplastic optical cement, which comprises the following steps:

s10, mounting the six MiniLED on a MiniLED substrate, wherein the substrate is made of glass.

S20, attach the complex film and form miniLED module in on miniLED base plate, the complex film includes that the optics of heat moulds glues and attaches the membrane, and it is one of them that AG membrane, electrostatic film and diffusion barrier are attached to the membrane, perhaps these several membranes pile up the combined film that forms, play the effect of preventing scratching, and heat moulds the optics and glues and set up on one side of attaching the membrane, and the complex film is attached on miniLED through the one side that is equipped with the optics of heat moulding glue and miniLED base plate, and the complex film is attached on miniLED.

And S30, placing the MiniLED module in a closed environment and continuously pressurizing to ensure that the MiniLED module is defoamed and filled with glue.

And S40, curing the MiniLED module in a UV (ultraviolet) curing mode to enable the thermoplastic optical adhesive in the MiniLED module to perform chemical reaction to achieve a final pasting state, and the MiniLED module leaves the factory as a finished product.

And in the step 40, the composite film is further required to be cut according to the size of the MiniLED substrate packaged as required, and the cutting size is required to be cut according to the size of the MiniLED substrate, so that the composite film corresponds to the MiniLED substrate in size and can cover the MiniLED substrate.

The attaching method in step S20 is: placing the MiniLED substrate and the composite film in a vacuum environment, attaching one surface of the composite film with the thermoplastic optical adhesive to the MiniLED on the MiniLED substrate, then rolling on the composite film through a heatable roller to enable the composite film to be tightly attached to the MiniLED, heating the temperature of the roller to enable the thermoplastic optical adhesive to be softened, enabling the softened thermoplastic optical adhesive to be easily filled between the MiniLED in a flowing mode, adapting to the gap between the MiniLED, and enabling the attached film to be easily deformed at a certain temperature and to be more adapted to the shape of the gap between the MiniLED; the step can be completed by adopting a screen printer with a vacuumizing cavity, firstly, the vacuum adsorption composite film of the screen printer does not have one surface with thermoplastic optical adhesive, a protective film on the thermoplastic optical adhesive is removed to expose the thermoplastic optical adhesive, the thermoplastic optical adhesive is attached to the prepared MiniLED substrate by using a turnover or other mode (in the attaching process, after the protective film of the thermoplastic optical adhesive is removed, the upper cavity and the lower cavity of the vacuumizing cavity of the screen printer are closed after a platform is turned over, vacuumizing is carried out after the closing, the vacuum is more than 0.05Mpa, whether vacuum delay is carried out or not is determined according to the size of a product after the vacuum delay is reached, the delay time depends on the size and the shape of the product, a heating roller starts to work after the delay time is reached, the composite film and the MiniLED substrate are compressed by rolling on the composite film through the heating roller, but the compressing step can only be primarily compressed, and gaps among the MiniLEDs need to be further filled.

After the step S20 is completed, further pressing is needed, if step S30 is performed, the MiniLED module is placed in the closed space, and then the closed space is inflated to continuously pressurize, the inflation direction can be set above the composite film, so that the pressure application direction faces the MiniLED substrate, the composite film can be better attached to the MiniLED substrate, bubbles between the composite film and the MiniLED substrate can be extruded in the pressing process, bubbles are generated in the subsequent process of placement, and the air pressure is stronger than that of a pressing mode of a jig, so that the composite film can be fully attached to gaps between the minileds, pressing is more tightly attached, and the effect is better.

While the preferred embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. A simple processing and preparation process for one-time packaging of MiniLED thermoplastic optical cement is characterized by comprising the following steps:

s10, mounting a plurality of MiniLED on a MiniLED substrate;

s20, attaching a composite film to a MiniLED substrate to form a MiniLED module, wherein the composite film comprises thermoplastic optical glue and an attachment film, the thermoplastic optical glue is arranged on one side face of the attachment film, the composite film is attached to the MiniLED substrate through the side provided with the thermoplastic optical glue, and the composite film is attached to the MiniLED;

s40, curing the MiniLED module.

2. The simple processing and preparation process for one-time packaging of MiniLED thermoplastic optical cement of claim 1, which is characterized in that: in the step 40, the composite film is further cut according to the size of the MiniLED substrate to be packaged.

3. The simple processing and preparation process for one-time packaging of MiniLED thermoplastic optical cement of claim 1, which is characterized in that: the attaching film is an AG film, an electrostatic film or a diffusion film.

4. The simple processing and preparation process for one-time packaging of MiniLED thermoplastic optical adhesive according to claim 1, characterized in that: the curing mode in step S40 is UV curing.

5. The simple processing and preparation process for one-time packaging of MiniLED thermoplastic optical adhesive according to claim 1, wherein the attaching manner in the step S20 is as follows: the MiniLED substrate and the composite film are placed in a vacuum environment, one side of the composite film with the thermoplastic optical adhesive is attached to the MiniLED on the MiniLED substrate, and then the composite film and the MiniLED are tightly attached by rolling on the composite film through a heatable roller.

6. The simple processing and preparation process for one-time packaging of MiniLED thermoplastic optical cement of claim 1, which is characterized in that: in the step S30, the MiniLED module is placed in the sealed space, and then the sealed space is inflated to pressurize.

7. The simple processing and preparation process for one-time packaging of MiniLED thermoplastic optical cement according to claim 6, wherein the steps of inflating and pressurizing are as follows: the MiniLED module is placed in the upward direction of the composite film, and the air inflation direction is from top to bottom.