TWI561791B - Heat dissipating structure and manufacturing method of same - Google Patents

Heat dissipating structure and manufacturing method of same

Info

Publication number
TWI561791B
TWI561791B TW104101002A TW104101002A TWI561791B TW I561791 B TWI561791 B TW I561791B TW 104101002 A TW104101002 A TW 104101002A TW 104101002 A TW104101002 A TW 104101002A TW I561791 B TWI561791 B TW I561791B
Authority
TW
Taiwan
Prior art keywords
manufacturing
same
heat dissipating
dissipating structure
heat
Prior art date
Application number
TW104101002A
Other languages
Chinese (zh)
Other versions
TW201623902A (en
Inventor
xian-qin Hu
Fu-Yun Shen
Cong Lei
Ming-Jaan Ho
Original Assignee
Zhen Ding Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhen Ding Technology Co Ltd filed Critical Zhen Ding Technology Co Ltd
Publication of TW201623902A publication Critical patent/TW201623902A/en
Application granted granted Critical
Publication of TWI561791B publication Critical patent/TWI561791B/en

Links

TW104101002A 2014-12-19 2015-01-12 Heat dissipating structure and manufacturing method of same TWI561791B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410791259.2A CN105764299B (en) 2014-12-19 2014-12-19 Radiator structure and preparation method thereof

Publications (2)

Publication Number Publication Date
TW201623902A TW201623902A (en) 2016-07-01
TWI561791B true TWI561791B (en) 2016-12-11

Family

ID=56340438

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104101002A TWI561791B (en) 2014-12-19 2015-01-12 Heat dissipating structure and manufacturing method of same

Country Status (2)

Country Link
CN (1) CN105764299B (en)
TW (1) TWI561791B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107846810A (en) * 2016-09-18 2018-03-27 鹏鼎控股(深圳)股份有限公司 Radiator structure and preparation method thereof and electronic equipment
CN111212547B (en) * 2018-11-22 2022-04-19 宏达国际电子股份有限公司 Manufacturing method of heat dissipation module, heat dissipation module and electronic device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1383204A (en) * 2001-04-09 2002-12-04 古河电气工业株式会社 Plate-type thermotube and its mfg. method
CN1949486A (en) * 2005-10-12 2007-04-18 索尼计算机娱乐公司 Semiconductor device, method for assembling semiconductor device
TW200817646A (en) * 2006-07-28 2008-04-16 Fuchigami Micro Co Heat pipe and method of manufacturing it
US20110261539A1 (en) * 2010-04-21 2011-10-27 Rolston Kevin C Adhesive reinforced open hole interconnect
CN103318838A (en) * 2013-05-24 2013-09-25 厦门大学 Vacuum packaging method for micro-electro-mechanical system devices

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101137280B (en) * 2007-07-17 2011-07-27 中国南车集团株洲电力机车研究所 High-power element heat radiator manufacturing method
CN201787855U (en) * 2010-07-30 2011-04-06 索士亚科技股份有限公司 Supporting structure of temperature-uniforming plate and temperature-uniforming plate employing same
CN201805671U (en) * 2010-09-29 2011-04-20 游明郎 Uniform temperature plate having capillary structure
CN103157964B (en) * 2011-12-13 2016-02-10 国研高能（北京）稳态传热传质技术研究院有限公司 A kind of preparation method of aluminum sinter temperature-uniforming plate
CN102854667B (en) * 2012-09-20 2017-05-17 京东方科技集团股份有限公司 Liquid crystal device and manufacture method thereof
JP6031373B2 (en) * 2013-02-13 2016-11-24 日立コンシューマエレクトロニクス株式会社 Optical component fixing structure, optical component fixing method, optical pickup device manufacturing method, and RGB three primary color light source module device manufacturing method
CN203454876U (en) * 2013-08-29 2014-02-26 讯强电子(惠州)有限公司 Temperature-uniforming plate

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1383204A (en) * 2001-04-09 2002-12-04 古河电气工业株式会社 Plate-type thermotube and its mfg. method
CN1949486A (en) * 2005-10-12 2007-04-18 索尼计算机娱乐公司 Semiconductor device, method for assembling semiconductor device
TW200817646A (en) * 2006-07-28 2008-04-16 Fuchigami Micro Co Heat pipe and method of manufacturing it
US20110261539A1 (en) * 2010-04-21 2011-10-27 Rolston Kevin C Adhesive reinforced open hole interconnect
CN103318838A (en) * 2013-05-24 2013-09-25 厦门大学 Vacuum packaging method for micro-electro-mechanical system devices

Also Published As

Publication number Publication date
CN105764299B (en) 2018-09-25
TW201623902A (en) 2016-07-01
CN105764299A (en) 2016-07-13

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