TWI561572B - - Google Patents

Info

Publication number
TWI561572B
TWI561572B TW101117406A TW101117406A TWI561572B TW I561572 B TWI561572 B TW I561572B TW 101117406 A TW101117406 A TW 101117406A TW 101117406 A TW101117406 A TW 101117406A TW I561572 B TWI561572 B TW I561572B
Authority
TW
Taiwan
Application number
TW101117406A
Other languages
Chinese (zh)
Other versions
TW201307470A (zh
Inventor
Naoyuki Koike
Arata Endo
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of TW201307470A publication Critical patent/TW201307470A/zh
Application granted granted Critical
Publication of TWI561572B publication Critical patent/TWI561572B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
TW101117406A 2011-05-27 2012-05-16 熱硬化性樹脂組成物、乾燥膜及印刷配線板 TW201307470A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011119639 2011-05-27
JP2011119640 2011-05-27

Publications (2)

Publication Number Publication Date
TW201307470A TW201307470A (zh) 2013-02-16
TWI561572B true TWI561572B (ko) 2016-12-11

Family

ID=47195668

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101117406A TW201307470A (zh) 2011-05-27 2012-05-16 熱硬化性樹脂組成物、乾燥膜及印刷配線板

Country Status (3)

Country Link
KR (2) KR101464038B1 (ko)
CN (1) CN102796348A (ko)
TW (1) TW201307470A (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105593261A (zh) * 2013-09-30 2016-05-18 东丽株式会社 纤维强化复合材料用双组分型环氧树脂组合物及纤维强化复合材料
CN105499069B (zh) * 2014-10-10 2019-03-08 住友重机械工业株式会社 膜形成装置及膜形成方法
JP2016080803A (ja) * 2014-10-14 2016-05-16 太陽インキ製造株式会社 ドライフィルムおよびフレキシブルプリント配線板
CN105517648B (zh) 2014-12-10 2017-06-20 互应化学工业株式会社 液体阻焊剂组合物和被覆印刷线路板
CN105802129B (zh) * 2014-12-31 2019-05-03 太阳油墨（苏州）有限公司 印刷电路板的填孔用热固化性树脂组合物、固化物、以及印刷电路板
JP6910112B2 (ja) * 2016-07-13 2021-07-28 京セラ株式会社 光半導体用樹脂組成物及びその製造方法、並びに光半導体装置
CN109774330A (zh) * 2019-03-20 2019-05-21 江苏天顺印业有限公司 一种激光感应变色热转印膜的制备方法及装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101410007A (zh) * 2007-10-17 2009-04-15 太阳油墨（苏州）有限公司 印刷电路板的外观检查方法
TW201030082A (en) * 2009-02-06 2010-08-16 Taiyo Ink Mfg Co Ltd Thermoharding resin composition, dry film and printed circuit board and manufacturing method thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4666332B2 (ja) * 2001-06-29 2011-04-06 イビデン株式会社 多層プリント配線板の製造方法
SG157958A1 (en) 2003-05-22 2010-01-29 Asahi Kasei Chemicals Corp Epoxy resin composition
JP5325462B2 (ja) * 2008-05-29 2013-10-23 太陽ホールディングス株式会社 熱硬化性樹脂組成物及びプリント配線板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101410007A (zh) * 2007-10-17 2009-04-15 太阳油墨（苏州）有限公司 印刷电路板的外观检查方法
TW201030082A (en) * 2009-02-06 2010-08-16 Taiyo Ink Mfg Co Ltd Thermoharding resin composition, dry film and printed circuit board and manufacturing method thereof

Also Published As

Publication number Publication date
TW201307470A (zh) 2013-02-16
KR20120132414A (ko) 2012-12-05
KR101464038B1 (ko) 2014-11-20
CN102796348A (zh) 2012-11-28
KR20140081773A (ko) 2014-07-01
KR101442459B1 (ko) 2014-09-22

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