TWI561372B - - Google Patents

Info

Publication number
TWI561372B
TWI561372B TW103119488A TW103119488A TWI561372B TW I561372 B TWI561372 B TW I561372B TW 103119488 A TW103119488 A TW 103119488A TW 103119488 A TW103119488 A TW 103119488A TW I561372 B TWI561372 B TW I561372B
Authority
TW
Taiwan
Application number
TW103119488A
Other languages
Chinese (zh)
Other versions
TW201504038A (en
Inventor
Tomota Nagaura
Terumasa Moriyama
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of TW201504038A publication Critical patent/TW201504038A/en
Application granted granted Critical
Publication of TWI561372B publication Critical patent/TWI561372B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
TW103119488A 2013-06-04 2014-06-04 Copper foil with carrier, copper-clad laminate, printed wiring board, electric appliance, resin layer, production method for copper foil with carrier, and production method for printed wiring board TW201504038A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013129985 2013-06-04

Publications (2)

Publication Number Publication Date
TW201504038A TW201504038A (en) 2015-02-01
TWI561372B true TWI561372B (en) 2016-12-11

Family

ID=52008210

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103119488A TW201504038A (en) 2013-06-04 2014-06-04 Copper foil with carrier, copper-clad laminate, printed wiring board, electric appliance, resin layer, production method for copper foil with carrier, and production method for printed wiring board

Country Status (3)

Country Link
JP (1) JP6591893B2 (en)
TW (1) TW201504038A (en)
WO (1) WO2014196576A1 (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6099778B1 (en) * 2015-01-21 2017-03-22 Ｊｘ金属株式会社 A copper foil with a carrier, a laminate, a printed wiring board, a printed wiring board manufacturing method, and an electronic device manufacturing method.
KR20160093555A (en) * 2015-01-29 2016-08-08 제이엑스금속주식회사 Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, laminate, printed circuit board, electronic device and method of manufacturing printed circuit board
CN107429417B (en) * 2015-03-31 2019-11-22 三井金属矿业株式会社 Roughening treatment copper foil, band carrier copper foil, copper-clad laminated board and printed circuit board
JP6782561B2 (en) 2015-07-16 2020-11-11 Ｊｘ金属株式会社 Copper foil with carrier, laminate, manufacturing method of laminate, manufacturing method of printed wiring board and manufacturing method of electronic equipment
JP6006445B1 (en) 2015-07-27 2016-10-12 Ｊｘ金属株式会社 Copper foil with carrier, laminate, printed wiring board manufacturing method and electronic device manufacturing method
JP6058182B1 (en) 2015-07-27 2017-01-11 Ｊｘ金属株式会社 Copper foil with carrier, laminate, printed wiring board manufacturing method and electronic device manufacturing method
JP6190500B2 (en) 2015-08-06 2017-08-30 Ｊｘ金属株式会社 Copper foil with carrier, laminate, printed wiring board manufacturing method and electronic device manufacturing method
JP6339636B2 (en) * 2015-08-06 2018-06-06 Ｊｘ金属株式会社 Copper foil with carrier, laminate, printed wiring board manufacturing method and electronic device manufacturing method
JP6200042B2 (en) 2015-08-06 2017-09-20 Ｊｘ金属株式会社 Copper foil with carrier, laminate, printed wiring board manufacturing method and electronic device manufacturing method
JP2017088943A (en) * 2015-11-06 2017-05-25 Ｊｘ金属株式会社 Copper foil with carrier, laminate, manufacturing method of laminate, manufacturing method of printed wiring board and manufacturing method of electronic device
JP6570430B2 (en) * 2015-11-12 2019-09-04 Ｊｘ金属株式会社 Method for producing copper foil with carrier, method for producing printed wiring board, and method for producing electronic device
CN110832120B (en) * 2017-03-30 2022-01-11 古河电气工业株式会社 Surface-treated copper foil, and copper-clad plate and printed circuit board using the same
JP6550196B2 (en) * 2017-07-24 2019-07-24 古河電気工業株式会社 Surface-treated copper foil, and copper-clad laminate and printed wiring board using the same
WO2019111914A1 (en) * 2017-12-05 2019-06-13 古河電気工業株式会社 Surface-treated copper foil, and copper-clad laminate and printed wiring board each using same
JP7166335B2 (en) * 2018-03-27 2022-11-07 三井金属鉱業株式会社 Roughened copper foil, copper foil with carrier, copper clad laminate and printed wiring board
WO2022244826A1 (en) * 2021-05-20 2022-11-24 三井金属鉱業株式会社 Roughened copper foil, copper foil with carrier, copper-cladded laminate board, and printed wiring board
CN114603946B (en) * 2022-05-12 2022-09-06 广州方邦电子股份有限公司 Metal foil, copper-clad laminate, wiring board, semiconductor, negative electrode material, and battery
CN114603945B (en) * 2022-05-12 2023-03-21 广州方邦电子股份有限公司 Metal foil, copper-clad laminate, wiring board, semiconductor, negative electrode material, and battery

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013031913A1 (en) * 2011-08-31 2013-03-07 Jx日鉱日石金属株式会社 Copper foil with carrier

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0397891A (en) * 1989-09-11 1991-04-23 Nippon Mining Co Ltd Production of material with formed patina
JPH0813191A (en) * 1994-06-29 1996-01-16 Kawasaki Steel Corp Production of zinc-chromium-carbon alloy plated steel sheet excellent in plating adhesion
JP2002069691A (en) * 2000-08-31 2002-03-08 Nippon Denkai Kk Method for manufacturing copper foil for printed circuit board

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013031913A1 (en) * 2011-08-31 2013-03-07 Jx日鉱日石金属株式会社 Copper foil with carrier

Also Published As

Publication number Publication date
JP6591893B2 (en) 2019-10-16
JPWO2014196576A1 (en) 2017-02-23
WO2014196576A1 (en) 2014-12-11
TW201504038A (en) 2015-02-01

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