TWI560823B - Heat radiation structure, method for making the same, and device using the same - Google Patents
Heat radiation structure, method for making the same, and device using the sameInfo
- Publication number
- TWI560823B TWI560823B TW104100619A TW104100619A TWI560823B TW I560823 B TWI560823 B TW I560823B TW 104100619 A TW104100619 A TW 104100619A TW 104100619 A TW104100619 A TW 104100619A TW I560823 B TWI560823 B TW I560823B
- Authority
- TW
- Taiwan
- Prior art keywords
- same
- making
- heat radiation
- radiation structure
- heat
- Prior art date
Links
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410786714.XA CN105764298A (en) | 2014-12-18 | 2014-12-18 | Heat dissipation structure, manufacturing method therefor, and device employing heat dissipation structure |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201624647A TW201624647A (en) | 2016-07-01 |
TWI560823B true TWI560823B (en) | 2016-12-01 |
Family
ID=56340085
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104100619A TWI560823B (en) | 2014-12-18 | 2015-01-09 | Heat radiation structure, method for making the same, and device using the same |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN105764298A (en) |
TW (1) | TWI560823B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10541156B1 (en) | 2018-10-31 | 2020-01-21 | International Business Machines Corporation | Multi integrated circuit chip carrier package |
CN110494016B (en) * | 2019-08-06 | 2020-10-23 | 华为技术有限公司 | Heat dissipation device and terminal electronic equipment |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200516736A (en) * | 2003-11-05 | 2005-05-16 | Siliconware Precision Industries Co Ltd | Semiconductor package with heat sink |
TW200936028A (en) * | 2008-02-05 | 2009-08-16 | Thermoshuttle Co Ltd | Thermal module and system applied the phase-change metal thermal interface material |
TW201426919A (en) * | 2012-11-02 | 2014-07-01 | Nvidia Corp | Open solder mask and or dielectric to increase lid or ring thickness and contact area to improve package coplanarity |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2758975Y (en) * | 2004-12-14 | 2006-02-15 | 业强科技股份有限公司 | Improvement of soaking plate structure |
CN201894031U (en) * | 2010-11-09 | 2011-07-06 | 讯凯国际股份有限公司 | Vapor chamber |
CN103476223A (en) * | 2012-06-08 | 2013-12-25 | 富瑞精密组件(昆山)有限公司 | Phase change heat dissipation device |
CN203454876U (en) * | 2013-08-29 | 2014-02-26 | 讯强电子(惠州)有限公司 | Temperature-uniforming plate |
-
2014
- 2014-12-18 CN CN201410786714.XA patent/CN105764298A/en active Pending
-
2015
- 2015-01-09 TW TW104100619A patent/TWI560823B/en active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200516736A (en) * | 2003-11-05 | 2005-05-16 | Siliconware Precision Industries Co Ltd | Semiconductor package with heat sink |
TW200936028A (en) * | 2008-02-05 | 2009-08-16 | Thermoshuttle Co Ltd | Thermal module and system applied the phase-change metal thermal interface material |
TW201426919A (en) * | 2012-11-02 | 2014-07-01 | Nvidia Corp | Open solder mask and or dielectric to increase lid or ring thickness and contact area to improve package coplanarity |
Also Published As
Publication number | Publication date |
---|---|
CN105764298A (en) | 2016-07-13 |
TW201624647A (en) | 2016-07-01 |
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