TWI560800B - - Google Patents

Info

Publication number
TWI560800B
TWI560800B TW104132689A TW104132689A TWI560800B TW I560800 B TWI560800 B TW I560800B TW 104132689 A TW104132689 A TW 104132689A TW 104132689 A TW104132689 A TW 104132689A TW I560800 B TWI560800 B TW I560800B
Authority
TW
Taiwan
Application number
TW104132689A
Other languages
Chinese (zh)
Other versions
TW201714243A (en
Inventor
zhi-ming Deng
shao-yu Chen
Original Assignee
Els System Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Els System Technology Co Ltd filed Critical Els System Technology Co Ltd
Priority to TW104132689A priority Critical patent/TW201714243A/en
Priority to CN201610242234.6A priority patent/CN106560914A/en
Application granted granted Critical
Publication of TWI560800B publication Critical patent/TWI560800B/zh
Publication of TW201714243A publication Critical patent/TW201714243A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
TW104132689A 2015-10-05 2015-10-05 Carrying device capable of carrying and moving a wafer upward and downward for providing more usage flexibility TW201714243A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW104132689A TW201714243A (en) 2015-10-05 2015-10-05 Carrying device capable of carrying and moving a wafer upward and downward for providing more usage flexibility
CN201610242234.6A CN106560914A (en) 2015-10-05 2016-04-19 Bearing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW104132689A TW201714243A (en) 2015-10-05 2015-10-05 Carrying device capable of carrying and moving a wafer upward and downward for providing more usage flexibility

Publications (2)

Publication Number Publication Date
TWI560800B true TWI560800B (en) 2016-12-01
TW201714243A TW201714243A (en) 2017-04-16

Family

ID=58227198

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104132689A TW201714243A (en) 2015-10-05 2015-10-05 Carrying device capable of carrying and moving a wafer upward and downward for providing more usage flexibility

Country Status (2)

Country Link
CN (1) CN106560914A (en)
TW (1) TW201714243A (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200302545A (en) * 2002-01-28 2003-08-01 Samsung Electronics Co Ltd Centering mechanism, centering unit, semiconductor manufacturing apparatus, and centering method
TWI233657B (en) * 2004-07-09 2005-06-01 Chung Shan Inst Of Science Wafer carrying device
US20090110521A1 (en) * 2007-10-25 2009-04-30 Kabushiki Kaisha Topcon Wafer holder
US20130336753A1 (en) * 2011-01-26 2013-12-19 Nabtesco Corporation Wafer handling robot

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102213920A (en) * 2010-04-01 2011-10-12 亿力鑫系统科技股份有限公司 Carrying device and exposure machine equipped with same
CN201812806U (en) * 2010-07-13 2011-04-27 上海技美电子科技有限公司 Wafer bearing device
CN101916739B (en) * 2010-07-13 2012-08-01 上海技美电子科技有限公司 Wafer carrying device
CN103576464B (en) * 2012-07-20 2016-03-09 上海微电子装备有限公司 A kind of penetrating mechanism and there is the lithographic equipment of this penetrating mechanism
KR102111183B1 (en) * 2012-08-31 2020-05-14 세미컨덕터 테크놀로지스 앤드 인스트루먼츠 피티이 엘티디 Multifunction wafer and film frame handling system
CN104752290B (en) * 2013-12-31 2017-10-20 北京北方华创微电子装备有限公司 Jacking system and plasma processing device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200302545A (en) * 2002-01-28 2003-08-01 Samsung Electronics Co Ltd Centering mechanism, centering unit, semiconductor manufacturing apparatus, and centering method
TWI233657B (en) * 2004-07-09 2005-06-01 Chung Shan Inst Of Science Wafer carrying device
US20090110521A1 (en) * 2007-10-25 2009-04-30 Kabushiki Kaisha Topcon Wafer holder
US20130336753A1 (en) * 2011-01-26 2013-12-19 Nabtesco Corporation Wafer handling robot

Also Published As

Publication number Publication date
CN106560914A (en) 2017-04-12
TW201714243A (en) 2017-04-16

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