TWI560797B - Substrate processing apparatus - Google Patents

Substrate processing apparatus

Info

Publication number
TWI560797B
TWI560797B TW101129524A TW101129524A TWI560797B TW I560797 B TWI560797 B TW I560797B TW 101129524 A TW101129524 A TW 101129524A TW 101129524 A TW101129524 A TW 101129524A TW I560797 B TWI560797 B TW I560797B
Authority
TW
Taiwan
Prior art keywords
processing apparatus
substrate processing
substrate
processing
Prior art date
Application number
TW101129524A
Other languages
English (en)
Other versions
TW201344830A (zh
Inventor
Jong Hyun Yoo
Sa In Hong
Ju Hyun Cho
Hyung Kwon Seo
Min Ho Choi
Original Assignee
Top Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Top Eng Co Ltd filed Critical Top Eng Co Ltd
Publication of TW201344830A publication Critical patent/TW201344830A/zh
Application granted granted Critical
Publication of TWI560797B publication Critical patent/TWI560797B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
TW101129524A 2012-04-26 2012-08-15 Substrate processing apparatus TWI560797B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020120044064A KR101409752B1 (ko) 2012-04-26 2012-04-26 기판 이송 로봇을 이용한 멀티 챔버 기판 처리 장치

Publications (2)

Publication Number Publication Date
TW201344830A TW201344830A (zh) 2013-11-01
TWI560797B true TWI560797B (en) 2016-12-01

Family

ID=49462911

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101129524A TWI560797B (en) 2012-04-26 2012-08-15 Substrate processing apparatus

Country Status (3)

Country Link
KR (1) KR101409752B1 (zh)
CN (1) CN103377973B (zh)
TW (1) TWI560797B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101587807B1 (ko) * 2014-05-30 2016-01-22 (주)화신 부시용 이송장치
ES2568748B1 (es) * 2014-11-03 2017-02-08 BSH Electrodomésticos España S.A. Dispositivo de campo de cocción
CN108942021A (zh) * 2018-08-20 2018-12-07 合肥工业大学 一种具有多角度自动焊接的机器人
US11114329B2 (en) * 2019-04-08 2021-09-07 Semiconductor Components Industries, Llc Methods for loading or unloading substrate with evaporator planet
CN112216623B (zh) * 2019-07-10 2022-12-23 长鑫存储技术有限公司 刻蚀机台及其控制方法
CN117059543B (zh) * 2023-10-13 2024-01-26 泓浒(苏州)半导体科技有限公司 一种智能化高洁净度半导体晶圆装载设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05243363A (ja) * 1992-02-27 1993-09-21 Fujitsu Ltd 搬送装置及び搬送方法
JP2005243995A (ja) * 2004-02-27 2005-09-08 Shin Etsu Handotai Co Ltd 半導体ウエーハの搬送装置及び搬送方法並びに両面研磨装置及び両面研磨方法
TW201137532A (en) * 2009-09-30 2011-11-01 Nikon Corp Exposure apparatus and device manufacturing method
TW201209954A (en) * 2010-07-27 2012-03-01 Ulvac Inc Substrate transfer method and substrate transfer system

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11195690A (ja) * 1997-12-26 1999-07-21 Kashiwara Machine Mfg Co Ltd ウエーハ移載装置
US6257966B1 (en) * 1998-04-27 2001-07-10 Tokyo Seimitsu Co., Ltd. Wafer surface machining apparatus
JP3433930B2 (ja) * 2001-02-16 2003-08-04 株式会社東京精密 ウェーハの平面加工装置及びその平面加工方法
KR20100131055A (ko) * 2009-06-05 2010-12-15 그린스펙(주) 유기금속화학증착 공정용 웨이퍼 자동 반송 및 측정 장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05243363A (ja) * 1992-02-27 1993-09-21 Fujitsu Ltd 搬送装置及び搬送方法
JP2005243995A (ja) * 2004-02-27 2005-09-08 Shin Etsu Handotai Co Ltd 半導体ウエーハの搬送装置及び搬送方法並びに両面研磨装置及び両面研磨方法
TW201137532A (en) * 2009-09-30 2011-11-01 Nikon Corp Exposure apparatus and device manufacturing method
TW201209954A (en) * 2010-07-27 2012-03-01 Ulvac Inc Substrate transfer method and substrate transfer system

Also Published As

Publication number Publication date
KR20130120857A (ko) 2013-11-05
CN103377973B (zh) 2017-11-28
CN103377973A (zh) 2013-10-30
TW201344830A (zh) 2013-11-01
KR101409752B1 (ko) 2014-07-08

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