TWI560729B - - Google Patents

Info

Publication number
TWI560729B
TWI560729B TW100116218A TW100116218A TWI560729B TW I560729 B TWI560729 B TW I560729B TW 100116218 A TW100116218 A TW 100116218A TW 100116218 A TW100116218 A TW 100116218A TW I560729 B TWI560729 B TW I560729B
Authority
TW
Taiwan
Application number
TW100116218A
Other languages
Chinese (zh)
Other versions
TW201230098A (en
Inventor
Kazuhisa Hayakawa
Hiroshi Kuki
Original Assignee
Murata Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co filed Critical Murata Manufacturing Co
Publication of TW201230098A publication Critical patent/TW201230098A/en
Application granted granted Critical
Publication of TWI560729B publication Critical patent/TWI560729B/zh

Links

TW100116218A 2010-05-13 2011-05-09 Laminated electronic component manufacturing device and method for manufacturing laminated electronic components TW201230098A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010111341 2010-05-13
JP2011091597A JP5585784B2 (en) 2010-05-13 2011-04-15 Multilayer electronic component manufacturing apparatus and multilayer electronic component manufacturing method

Publications (2)

Publication Number Publication Date
TW201230098A TW201230098A (en) 2012-07-16
TWI560729B true TWI560729B (en) 2016-12-01

Family

ID=45474731

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100116218A TW201230098A (en) 2010-05-13 2011-05-09 Laminated electronic component manufacturing device and method for manufacturing laminated electronic components

Country Status (2)

Country Link
JP (1) JP5585784B2 (en)
TW (1) TW201230098A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5796610B2 (en) * 2013-08-14 2015-10-21 株式会社村田製作所 Ceramic laminate manufacturing apparatus and manufacturing method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002170737A (en) * 2000-11-30 2002-06-14 Uht Corp Ceramic laminate manufacturing device
JP2005183429A (en) * 2003-12-16 2005-07-07 Matsushita Electric Ind Co Ltd Method and apparatus for manufacturing laminated body of laminated electronic component

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2629857B2 (en) * 1988-07-27 1997-07-16 松下電器産業株式会社 Manufacturing method of multilayer ceramic electronic component
JPH0669066A (en) * 1992-08-19 1994-03-11 Tdk Corp Manufacture of ceramic electronic component
JP3166693B2 (en) * 1997-12-22 2001-05-14 松下電器産業株式会社 Manufacturing method of multilayer ceramic electronic component
JP3166694B2 (en) * 1997-12-22 2001-05-14 松下電器産業株式会社 Manufacturing method of multilayer ceramic electronic component
JP3948288B2 (en) * 2002-01-21 2007-07-25 松下電器産業株式会社 Laminate manufacturing equipment for multilayer electronic components
JP4415554B2 (en) * 2003-03-26 2010-02-17 株式会社村田製作所 Manufacturing method of multilayer ceramic electronic component
JP4432450B2 (en) * 2003-10-22 2010-03-17 株式会社村田製作所 Manufacturing method of multilayer ceramic electronic component
JP2006168029A (en) * 2004-12-14 2006-06-29 Matsushita Electric Ind Co Ltd Method and apparatus for manufacturing ceramic green sheet
JP2006302932A (en) * 2005-04-15 2006-11-02 Matsushita Electric Ind Co Ltd Manufacturing method of laminated electronic component
JP5267260B2 (en) * 2008-08-08 2013-08-21 株式会社村田製作所 Multilayer ceramic electronic component manufacturing apparatus and method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002170737A (en) * 2000-11-30 2002-06-14 Uht Corp Ceramic laminate manufacturing device
JP2005183429A (en) * 2003-12-16 2005-07-07 Matsushita Electric Ind Co Ltd Method and apparatus for manufacturing laminated body of laminated electronic component

Also Published As

Publication number Publication date
JP5585784B2 (en) 2014-09-10
TW201230098A (en) 2012-07-16
JP2011258933A (en) 2011-12-22

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