TWI560521B - - Google Patents

Info

Publication number
TWI560521B
TWI560521B TW103119547A TW103119547A TWI560521B TW I560521 B TWI560521 B TW I560521B TW 103119547 A TW103119547 A TW 103119547A TW 103119547 A TW103119547 A TW 103119547A TW I560521 B TWI560521 B TW I560521B
Authority
TW
Taiwan
Application number
TW103119547A
Other versions
TW201506545A (zh
Inventor
Shinobu Kondo
Shigeru Matsumoto
Akio Norikoshi
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of TW201506545A publication Critical patent/TW201506545A/zh
Application granted granted Critical
Publication of TWI560521B publication Critical patent/TWI560521B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW103119547A 2013-07-26 2014-06-05 印刷配線板製造用光硬化性組成物、其硬化物及印刷配線板 TW201506545A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013156015 2013-07-26
JP2014020589A JP5523642B1 (ja) 2013-07-26 2014-02-05 プリント配線板製造用光硬化性組成物、その硬化物およびプリント配線板

Publications (2)

Publication Number Publication Date
TW201506545A TW201506545A (zh) 2015-02-16
TWI560521B true TWI560521B (zh) 2016-12-01

Family

ID=51175677

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103119547A TW201506545A (zh) 2013-07-26 2014-06-05 印刷配線板製造用光硬化性組成物、其硬化物及印刷配線板

Country Status (4)

Country Link
JP (1) JP5523642B1 (zh)
KR (1) KR101473614B1 (zh)
CN (1) CN104345564B (zh)
TW (1) TW201506545A (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108948232B (zh) * 2017-05-24 2022-03-15 深圳有为技术控股集团有限公司 新型光引发剂混合物
JP6861282B2 (ja) * 2018-03-09 2021-04-21 Ｄｉｃグラフィックス株式会社 活性エネルギー線硬化型インキ、インキ硬化物の製造方法及び印刷物
TW202031811A (zh) * 2018-12-05 2020-09-01 日商迪愛禧油墨股份有限公司 活性能量線硬化型印墨、印墨硬化物之製造方法及印刷物
JP2021038330A (ja) * 2019-09-04 2021-03-11 Ｄｉｃグラフィックス株式会社 平版オフセット印刷用活性エネルギー線硬化型インキ、インキ硬化物の製造方法及び印刷物

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5629356A (en) * 1987-03-26 1997-05-13 Ciba Geigy Corporation A-aminoacetophenones as photoinitiators

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3471486D1 (de) * 1983-08-15 1988-06-30 Ciba Geigy Ag Photocurable compositions
JPS6370210A (ja) * 1986-09-12 1988-03-30 Hitachi Cable Ltd 被覆光フアイバ
JP2764967B2 (ja) * 1988-12-05 1998-06-11 住友電気工業株式会社 被覆光ファイバ
JP3807108B2 (ja) * 1998-08-03 2006-08-09 Ｊｓｒ株式会社 カラーフィルタ用感放射線性組成物
TW200728379A (en) * 2005-09-06 2007-08-01 Taiyo Ink Mfg Co Ltd Resin composition, cured product of the same, and printed circuit board made of the same
CN102924630A (zh) * 2011-08-09 2013-02-13 陈婷 含有胺基酮化合物1-([1,1’-联苯基]-4-基)-2-甲基-2-吗啉基丙烷-1-酮的uv光固化应用体系

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5629356A (en) * 1987-03-26 1997-05-13 Ciba Geigy Corporation A-aminoacetophenones as photoinitiators

Also Published As

Publication number Publication date
JP2015043060A (ja) 2015-03-05
CN104345564B (zh) 2016-08-24
TW201506545A (zh) 2015-02-16
CN104345564A (zh) 2015-02-11
KR101473614B1 (ko) 2014-12-16
JP5523642B1 (ja) 2014-06-18

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