TWI560123B - Disk-like semiconductor package structure and combination thereof with tray - Google Patents

Disk-like semiconductor package structure and combination thereof with tray

Info

Publication number
TWI560123B
TWI560123B TW105117420A TW105117420A TWI560123B TW I560123 B TWI560123 B TW I560123B TW 105117420 A TW105117420 A TW 105117420A TW 105117420 A TW105117420 A TW 105117420A TW I560123 B TWI560123 B TW I560123B
Authority
TW
Taiwan
Prior art keywords
tray
disk
combination
semiconductor package
package structure
Prior art date
Application number
TW105117420A
Other languages
Chinese (zh)
Other versions
TW201742802A (en
Inventor
Tzu-Sheng Wu
Original Assignee
Chipmos Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipmos Technologies Inc filed Critical Chipmos Technologies Inc
Priority to TW105117420A priority Critical patent/TWI560123B/en
Priority to CN201610585978.8A priority patent/CN107464787B/en
Application granted granted Critical
Publication of TWI560123B publication Critical patent/TWI560123B/en
Publication of TW201742802A publication Critical patent/TW201742802A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Lead Frames For Integrated Circuits (AREA)
TW105117420A 2016-06-02 2016-06-02 Disk-like semiconductor package structure and combination thereof with tray TWI560123B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW105117420A TWI560123B (en) 2016-06-02 2016-06-02 Disk-like semiconductor package structure and combination thereof with tray
CN201610585978.8A CN107464787B (en) 2016-06-02 2016-07-25 Cake-shaped semiconductor packaging structure and combination of wafer-shaped semiconductor packaging structure and carrying disc

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW105117420A TWI560123B (en) 2016-06-02 2016-06-02 Disk-like semiconductor package structure and combination thereof with tray

Publications (2)

Publication Number Publication Date
TWI560123B true TWI560123B (en) 2016-12-01
TW201742802A TW201742802A (en) 2017-12-16

Family

ID=58227129

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105117420A TWI560123B (en) 2016-06-02 2016-06-02 Disk-like semiconductor package structure and combination thereof with tray

Country Status (2)

Country Link
CN (1) CN107464787B (en)
TW (1) TWI560123B (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201613028A (en) * 2014-09-25 2016-04-01 Nippon Electric Glass Co Supporting glass substrate and laminate using same
TWM521376U (en) * 2015-12-02 2016-05-11 Libo Cosmetics Co Ltd Magnetic button positioned powder case

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4068336B2 (en) * 2001-11-30 2008-03-26 株式会社東芝 Semiconductor device
US7615836B2 (en) * 2005-03-07 2009-11-10 Sensormatic Electronics Corporation Magnetic self-assembly for integrated circuit packages
JP5606021B2 (en) * 2009-07-31 2014-10-15 日置電機株式会社 Manufacturing method of current sensor
DE102010061770A1 (en) * 2010-11-23 2012-05-24 Robert Bosch Gmbh Method for the production of semiconductor chips, mounting method and semiconductor chip for vertical mounting on circuit boards

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201613028A (en) * 2014-09-25 2016-04-01 Nippon Electric Glass Co Supporting glass substrate and laminate using same
TWM521376U (en) * 2015-12-02 2016-05-11 Libo Cosmetics Co Ltd Magnetic button positioned powder case

Also Published As

Publication number Publication date
TW201742802A (en) 2017-12-16
CN107464787B (en) 2019-10-11
CN107464787A (en) 2017-12-12

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